During a recent earnings call, Co-CEO of CD Projekt Red (CDPR) Michal Nowakowski confirmed that thanks to the success of the Cyberpunk: Edgerunners, the development team will be looking at further animation projects.
"[The developer is] definitely planning to do more in terms of animation," says Nowakowski (on Gizmodo). "Expect to see more for sure, but that's as far as I can go right now."

Considering the fact that upcoming projects, The Witcher 4 (given the codename "Polaris") and Cyberpunk 2 (given the codename "Orion") are massive projects which would definitely take a lot of resources and focus, it will probably take a while to finish the animated series. But then again, considering the fact that CDPR will likely play a supervisory role for any project undertaken, a new animated series might not take a huge amount of time.

It's undoubtedly true that Itsuno is one of the key figures behind Capcom's best-in-class action and fighting games. Itsuno is notably known for his good work in the Devil May Cry series, created by Hideki Kamiya, but reaching its peak due to the fact that the Devil May Cry 3 was directed by him. Itsuno is also known for Dragon's Dogma, being his very own dream game, but the sequel turned out to be his last major project for Capcom.

Itsuno posted on Twitter, "At the end of August 2024, I will be leaving Capcom after 30 years and 5 months," "Thank you for your long-term support of the games and characters I have been responsible for. I hope you will continue to support Capcom's games and characters." He also added that he's not done with games yet, but is off to do his own thing. "From September, I will start developing a new game in a new environment. I hope to create fun, beautiful games that are as memorable as, or even more memorable than, the ones I have created so far."

Xiangdixian Computing Technology (XCT), once hailed as China's answer to NVIDIA at its peak, is now grappling with severe financial difficulties and legal challenges. The company, which has developed its own line of GPUs based on the Tianjun chips, recently admitted that its progress in "development of national GPU has not yet fully met the company's expectations and is facing certain market adjustment pressures." Despite producing two desktop and one workstation GPU model, XCT has been forced to address rumors of its closure. The company has undergone significant layoffs, but it claims to have retained key research and development staff essential for GPU advancement. Adding to XCT's woes, investors have initiated legal proceedings against the company's founder, Tang Zhimin, claiming he failed to deliver on his commitment to raising 500 million Yuan in Series B funding.

Among the complainants is the state-owned Jiangsu Zhongde Services Trade Industry Investment Fund, which has filed a lawsuit against three companies under Zhimin's control. Further complicating matters, Capitalonline Data Service is reportedly suing XCT for unpaid debts totaling 18.8 million Yuan. There are also claims that the company's bank accounts have been frozen, potentially impeding its ability to continue operations. The situation is further complicated by allegations of corruption within China's semiconductor sector, with reports of executives misappropriating investment funds. With XCT fighting for survival through restructuring efforts, its fate hangs in the balance. Without securing additional funding soon, the company may be forced to close its doors, which will blow China's GPU aspirations.

Remedy is thrilled (as thrilled as Finnish people can be) to announce that we are working together with Annapurna, who are co-financing the development of Control 2 and taking the Control and Alan Wake franchises to film, TV and beyond.

What does that mean for you, our dear fans? Above all it means Remedy is able to make Control 2 exactly the game we want it to be, while we now also have an incredible partner to extend our IPs to other mediums. We are also going to be publishing Control 2 ourselves. When I look at all the games we have in the pipeline, the future of Remedy is incredibly exciting. You can trust us to keep bringing you incredible video game experiences.

Simply NUC, a global leader in customized PC solutions, in collaboration with Intel, proudly announces the Intel AI PC Development Kit. This advanced kit is equipped with the powerful Core Ultra 7 (155H), 32 GB RAM, 512 GB storage, and Windows 11 Pro, making it ideal for developers and researchers focused on AI innovation. The configured PC features Intel Iris Xe graphics and the OpenVINO toolkit, enabling optimized AI performance for deep learning and computer vision tasks.

The Intel AI PC Development Kit is tailored for software developers, data scientists, and educators focused on AI and machine learning projects. With robust processing capabilities, users can efficiently create, test, and deploy AI models. Additionally, as part of the Intel AI Developer Program, users gain access to valuable resources such as tutorials, webinars, and community support. Program participants can also enjoy a $500 discount on the kit, making it an affordable and comprehensive solution for AI innovation.

According to a recent report from Globes, Arm, the chip design giant and maker of the Arm ISA, is reportedly developing a new discrete GPU at its Ra'anana development center in Israel. This development signals Arm's intention to compete directly with industry leaders like Intel, AMD, and NVIDIA in the massive discrete GPU market. Sources close to the matter reveal that Arm has assembled a team of approximately 100 skilled chip and software development engineers at its Israeli facility. The team is focused on creating GPUs primarily aimed at the video game market. However, industry insiders speculate that this technology could potentially be adapted for AI processing in the future, mirroring the trajectory of NVIDIA, which slowly integrated AI hardware accelerators into its lineup.

The Israeli development center is playing a crucial role in this initiative. The hardware teams are overseeing the development of key components for these GPUs, including the flagship Immortalis and Mali GPU. Meanwhile, the software teams are creating interfaces for external graphics engine developers, working with both established game developers and startups. Arm is already entering the PC market through its partners like Qualcomm with Snapdragon X chips. However, these chips run an integrated GPU, and Arm wants to provide discrete GPUs and compete there. While details are still scarce, Arm could make GPUs to accompany Arm-based Copilot+ PCs and some desktop builds. The final execution plan still needs to be discovered, and we are still waiting to see which stage Arm's discrete GPU project is in.

Ola, an Indian automotive company, is venturing into AI chip development with its artificial intelligence branch, Krutrim, planning to launch India's first domestically designed AI chip by 2026. The company is leveraging ARM architecture for this initiative. CEO Bhavish Aggarwal emphasizes the importance of India developing its own AI technology rather than relying on external sources.

While detailed specifications are limited, Ola claims these chips will offer competitive performance and efficiency. For manufacturing, the company plans to partner with a global tier I or II foundry, possibly TSMC or Samsung. "We are still exploring foundries, we will go with a global tier I or II foundry. Taiwan is a global leader, and so is Korea. I visited Taiwan a couple of months back and the ecosystem is keen on partnering with India," Aggarwal said.

Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.

"The historic CHIPS Act is enabling more semiconductor manufacturing capacity in the U.S., making the semiconductor ecosystem stronger and more resilient," said Haviv Ilan, president and CEO of Texas Instruments. "Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300 mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we're building geopolitically dependable, 300 mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come."

Amidst escalating tensions in the U.S.-China semiconductor industry, Huawei is reportedly working on a new AI chip called the Ascend 910C. This development appears to be the Chinese tech giant's attempt to compete with NVIDIA's AI processors in the Chinese market. According to a Wall Street Journal report, Huawei has begun testing the Ascend 910C with various Chinese internet and telecom companies to evaluate its performance and capabilities. Notable firms such as ByteDance, Baidu, and China Mobile are said to have received samples of the chip.

Huawei has reportedly informed its clients that the Ascend 910C can match the performance of NVIDIA's H100 chip. The company has been conducting tests for several weeks, suggesting that the new processor is nearing completion. The Wall Street Journal indicates that Huawei could start shipping the chip as early as October 2024. The report also mentions that Huawei and potential customers have discussed orders for over 70,000 chips, potentially worth $2 billion.

Researchers at Fraunhofer IAF have made a significant advance in semiconductor materials by successfully fabricating aluminum yttrium nitride (AlYN) using metal-organic chemical vapor deposition (MOCVD). AlYN, known for its outstanding properties and compatibility with gallium nitride (GaN), shows great potential for energy-efficient, high-frequency electronics. Previously, AlYN could only be deposited via magnetron sputtering, but this new method opens the door to diverse applications. Dr. Stefano Leone from Fraunhofer IAF highlights AlYN's ability to enhance performance while reducing energy consumption, making it vital for future electronics.

In 2023, the team achieved a 600 nm thick AlYN layer with a record 30% yttrium concentration. They have since developed AlYN/GaN heterostructures with high structural quality and promising electrical properties, particularly for high-frequency applications. These structures demonstrate optimal two-dimensional electron gas (2DEG) properties and are highly suitable for high electron mobility transistors (HEMTs).

According to The Verge, Valve confirmed its intention to extend support for its Linux-based SteamOS to rival gaming handhelds, including the ASUS ROG Ally. This move marks a significant step towards realizing Valve's decade-old vision of a widespread "Steam Machine" ecosystem. Lawrence Yang, a designer at Valve, confirmed to The Verge that the company is actively working on adding support for additional handhelds to SteamOS. This revelation came after eagle-eyed observers spotted a curious line in Valve's latest SteamOS 3.6.9 Beta release notes mentioning the addition of "support for extra ROG Ally keys." While the development is still in progress, Yang emphasized that SteamOS isn't quite ready for out-of-the-box use on rival devices. However, he assured that the team is making "steady progress" towards this goal.

This initiative doesn't necessarily mean that manufacturers like ASUS will officially endorse Valve's installer or ship their devices with SteamOS preinstalled. Many companies, including ASUS, have cited various reasons for sticking with Windows, including Microsoft's dedicated validation teams that ensure compatibility across diverse hardware configurations. Other devices, such as Lenovo Legion Go, AYANEO, and GPD Pocket 4, ship with Windows, but it could be interesting to see with SteamOS. Alongside support for third-party handhelds, Valve is also working on a general release of SteamOS 3 for non-handheld PCs. Finally, Valve hasn't forgotten about its promise to enable dual-booting on Steam Deck devices. While there's no specific timeline, Mr. Yang confirmed that it remains a priority for the company. We remain to see how this will materialize, and with added bells and whistles to SteamOS, the adoption of Linux-based gaming could be pushed even further.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM. 3D X-AI can reduce the huge amount of data transferred between HBM and GPUs during AI workloads. NEO's innovation is set to revolutionize the performance, power consumption, and cost of AI Chips for AI applications like generative AI.

AI Chips with NEO's 3D X-AI technology can achieve:

• 100X Performance Acceleration: contains 8,000 neuron circuits to perform AI processing in 3D memory.
• 99% Power Reduction: minimizes the requirement of transferring data to the GPU for calculation, reducing power consumption and heat generation by the data bus.
• 8X Memory Density: contains 300 memory layers, allowing HBM to store larger AI models.

SK hynix is reportedly developing 400-layer NAND flash memory, with plans to begin mass production by late 2025. The company is collaborating with supply chain partners to develop the necessary process technologies and equipment for 400-layer and higher NAND chips. This information comes from a recent article by Korean media outlet etnews citing industry sources.

SK hynix intends to use hybrid bonding technology to achieve this, which is expected to bring new packaging materials and components suppliers into the supply chain. The development process involves exploring new bonding materials and various technologies for connecting different wafers, including polishing, etching, deposition, and wiring. SK hynix aims to have the technology and infrastructure ready by the end of next year.

Kioxia Corporation, a world leader in memory solutions, today announced that the building construction of Fab2 (K2) of its industry-leading Kitakami Plant was completed in July. K2 is the second flash memory manufacturing facility at the Kitakami Plant in the Iwate Prefecture of Japan. As demand is recovering, the company will gradually make capital investments while closely monitoring flash memory market trends. Kioxia plans to start operation at K2 in the fall of Calendar Year 2025.

In addition, some administration and engineering departments will move into a new administration building located adjacent to K2 beginning in November 2024 to oversee the operation of K2. A portion of investment for K2 will be subsidized by the Japanese government according to the plan approved in February 2024.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

NVIDIA today announced major advancements to Universal Scene Description, or OpenUSD, that will expand adoption of the universal 3D data interchange framework to robotics, industrial design and engineering, and accelerate developers' abilities to build highly accurate virtual worlds for the next evolution of AI.

Through new OpenUSD-based generative AI and NVIDIA-accelerated development frameworks built on the NVIDIA Omniverse platform, more industries can now develop applications for visualizing industrial design and engineering projects, and for simulating environments to build the next wave of physical AI and robots.

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announced the demonstration of high quality 300 mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/√ Hz at 1 Hz. In view of noise performance, the values obtained are the lowest charge noise values achieved on a 300 mm fab-compatible platform.

Such low noise values enable high-fidelity qubit control, as reducing the noise is critical for maintaining quantum coherence and high fidelity control. By demonstrating those values, repeatedly and reproducibly, on a 300 mm Si MOS quantum dot process, this work makes large-scale quantum computers based on Si quantum dots a realistic possibility.

Just a few months after hiring Ben Skeggs, a lead maintainer of the open-source NVIDIA GPU driver for Linux kernel, NVIDIA has announced a complete transition to open-source GPU kernel modules in its upcoming R560 driver release for Linux. This decision comes two years after the company's initial foray into open-source territory with the R515 driver in May 2022. The tech giant began focusing on data center compute GPUs, while GeForce and Workstation GPU support remained in the alpha stages. Now, after extensive development and optimization, NVIDIA reports that its open-source modules have achieved performance parity with, and in some cases surpassed, their closed-source counterparts. This transition brings a host of new capabilities, including heterogeneous memory management support, confidential computing features, and compatibility with NVIDIA's Grace platform's coherent memory architectures.

The move to open-source is expected to foster greater collaboration within the Linux ecosystem and potentially lead to faster bug fixes and feature improvements. However, not all GPUs will be compatible with the new open-source modules. While cutting-edge platforms like NVIDIA Grace Hopper and Blackwell will require open-source drivers, older GPUs from the Maxwell, Pascal, or Volta architectures must stick with proprietary drivers. NVIDIA has developed a detection helper script to guide driver selection for users who are unsure about compatibility. The shift also brings changes to NVIDIA's installation processes. The default driver version for most installation methods will now be the open-source variant. This affects package managers with the CUDA meta package, run file installations and even Windows Subsystem for Linux.

Tenstorrent is launching their next generation Wormhole chip featuring PCIe cards and workstations designed for developers who are interested in scalability for multi-chip development using Tenstorrent's powerful open-source software stacks.

These Wormhole-based cards and systems are now available for immediate order on tenstorrent.com:

• Wormhole n150, powered by a single processor
• Wormhole n300, powered by two processors
• TT-LoudBox, a developer workstation powered by four Wormhole n300s (eight processors)

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. Designed as an evolutionary step beyond the currently published HBM3 standard, HBM4 aims to further enhance data processing rates while maintaining essential features such as higher bandwidth, lower power consumption, and increased capacity per die and/or stack. These advancements are vital for applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), high-performance computing, high-end graphics cards, and servers.

HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint. To support device compatibility, the standard ensures that a single controller can work with both HBM3 and HBM4 if needed. Different configurations will require various interposers to accommodate the differing footprints. HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks. The committee has initial agreement on speeds bins up to 6.4 Gbps with discussion ongoing for higher frequencies.

Theorycraft Games has revealed SUPERVIVE (previously codenamed 'Project Loki') as the title of their first game, which will enter open beta in late 2024. SUPERVIVE is a neon-apocalyptic hero BR, set in an improvisational action sandbox where strategic, explosive shootouts meet a new era of storm chasing hunters - all with the aim of becoming the world's next "10,000-hour game" for competitive squads. In celebration, Theorycraft is hosting their largest public playtest from June 27 to July 4. Players can pre-register here.

SUPERVIVE, a free-to-play, squad-based hero battle royale, has players team up in groups of two or four to battle enemies across a vast, sky-bound map while a deadly storm encroaches upon them. Players engage in dynamic combat, complete objectives, and use unique powers and equipment to devise creative strategies to outplay other teams and be the last squad standing. SUPERVIVE will always be free-to-play and is designed to ensure that cosmetics are the only in-game purchases, with no pay-for-power elements, ever.

TSMC is working on a new advanced chip packaging technology that uses rectangular panel-like substrates instead of the traditional circular wafers, according to a Nikkei report citing sources. This new approach would allow more chips to be placed on a single substrate. TSMC is reportedly experimenting with rectangular substrates measuring 515 mm by 510 mm, providing more than three times the usable area compared to current 12-inch wafers. Using a rectangular-shaped wafer can potentially eliminate more of the incomplete chips found on the edges of current circular ones. While this may sound simple, it would actually require a radical change to the entire manufacturing process.

While the research is still in its early stages and may take several years to reach mass production, it represents a major technological shift for TSMC. The company has responded to Nikkei's inquiry by stating that they are closely monitoring advancements in advanced packaging technologies, including panel-level packaging. This development could potentially give TSMC an edge in meeting future chip demands, however, Intel and Samsung are also testing this new approach.

OpenAI's co-founder and ex-chief scientist, Ilya Sutskever, has announced the formation of a new company promising a safe path to artificial superintelligence (ASI). Called Safe Superintelligence Inc. (SSI), the company has a simple mission: achieving ASI with safety at the front. "We approach safety and capabilities in tandem, as technical problems to be solved through revolutionary engineering and scientific breakthroughs. We plan to advance capabilities as fast as possible while making sure our safety always remains ahead," notes the SSI website, adding that "Our singular focus means no distraction by management overhead or product cycles, and our business model means safety, security, and progress are all insulated from short-term commercial pressures."

Interestingly, safety is a concern only a few frontier AI labs have. In recent history, OpenAI's safety team got the spotlight for being neglected, and the company's safety lead, Jan Leike, publically criticized safety practices before moving to Anthropic. Anthropic is focused on providing safe AI models, with its Claude Opus being one of the leading AI models to date. What is to come out of SSI? We still don't know. However, given the team of Ilya Sutskever, Daniel Gross, and Daniel Levy, we assume they attracted the best-in-class talent for developing next-generation AI models, focusing on safety. With offices in Palo Alto and Tel Aviv, SSI can tap a vast network of AI researchers and policymakers to establish safe ASI, free from short-term commercial pressure and focused on research and development. "Our team, investors, and business model are all aligned to achieve SSI," says the SSI website.

Apple has reportedly halted the development of its future Vision Pro 2 headset, opting instead to focus on a more affordable variant. The decision comes as the company grapples with the high production costs associated with the Vision Pro, which was released on February 2 in the US for $3,499 and will be released on July 12 in other countries. According to insiders familiar with the matter, Apple is not expected to manufacture more than 500,000 Vision Pro units this year, casting doubt on the device's ability to gain widespread adoption at such a premium price point. The tech giant's suppliers have already begun scaling back production, with one supplier reducing output by 50% in May due to forecasts of weaker-than-expected demand.

While the Vision Pro promised to deliver a groundbreaking mixed-reality experience, its excessive cost effectively priced it out of reach for the mass market. Recognizing this barrier, Apple has reportedly decided to abandon the development of the costlier "Pro 2" model and instead channel its efforts into creating a more budget-friendly "Vision" variant. The new device is expected to feature fewer cameras, simpler speaker systems, and a streamlined headband design, all aimed at reducing production costs. However, sources indicate that Apple is struggling to significantly lower the costs of key components, such as the display, which could further delay the launch of the successor model. Nevertheless, the company's goal is to create a mixed-reality headset priced around the level of a high-end iPhone, approximately $1,600, and launch the cheaper headset in late 2025.

The PC (desktops, notebooks, and workstations) market in Mainland China is forecast to contract by 1% in 2024 according to the latest Canalys data. The first quarter of the year already saw a sharp decline, with shipments down 12%, in contrast to the global market which returned to growth. Desktop shipments are expected to perform well in 2024, growing 10% annually as they benefit from commercial sector refresh demand, especially from large state-held enterprises and local governments. Notebook shipments are set to drop 5%, as demand from consumers and the private sector is anticipated to remain cautious on short-term expenditure such as PCs.

China's PC market trajectory is diverging from global trends in its recovery journey. In Q1 2024, the commercial sector bore the brunt of the market downturn, undergoing a 19% decline due to weak IT spending by large enterprises. The decline in consumer shipments was milder, with shipments dropping 8%. However, despite the muted performance in 2024, significant local developments point to a stronger market in 2025, in which PC shipments are expected to grow 12%.