Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion in 2024, growing 6.5% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast - OEM Perspective at SEMICON Japan 2024. Semiconductor manufacturing equipment growth is expected to continue in the following years, reaching new records of $121 billion in 2025 and $139 billion in 2026, supported by both the front-end and back-end segments.

"Three consecutive years of projected growth in investments in semiconductor manufacturing reflect the vital role our industry plays in underpinning the global economy and advancing technology innovation," said Ajit Manocha, SEMI president and CEO. "Since our July 2024 forecast, the outlook for 2024 semiconductor equipment sales has brightened, especially with stronger-than-expected investments from China and in AI-related sectors. Together with our forecast extension through 2026, it highlights the robust growth drivers across segments, applications, and regions."

The Biden administration is rolling out a third major export control package aimed at China's semiconductor industry, as per a report from Reuters. Estimated to affect 140 companies, including China's chip equipment maker Naura Technology Group, Piotek, and Huawei Technologies, the effort aims to limit China's access to advanced chip making technology. In particular, technology that could be used in military products and artificial intelligence. Important sanctions include export controls to specific chip equipment manufacturers, blocking the delivery of high-performance memory chips and the addition of several semiconductor investment companies to the list of export-restricted entities.

The package expands U.S. regulatory authority through foreign direct product rules. It regulates chip manufacturing equipment manufactured around the world with U.S. technology, Japan and the Netherlands are exempt. However, the rules could have an impact on manufacturers outside U.S. such as those based in Israel, Malaysia, Singapore, South Korea, Taiwan and non-U.S. firms (i.e. ASML) due to the complexity of the technological and supply chain. This continues the Biden administration's strategy to limit China's semiconductor capabilities and comes just weeks before the Trump administration made changes. When asked about US new restrictions Chinese Foreign Ministry spokesperson Lin Jian said at a regular press conference on Monday that such behavior undermines the international economic and trade system, and disrupts global supply chains. China will take measures to protect companies' rights and interests.

Acrosser Technology, a leader in edge computing platforms and embedded computers, is proud to announce the NSA-50A1 Desktop Network Appliance, an entry-level customer premises equipment (CPE) designed for growing businesses and network providers. Powered by the Intel Atom C3338R Processor, the NSA-50A1 addresses the rising demand for edge security computing driven by the widespread adoption of mobile devices and their diverse applications.

This user-friendly device is the perfect solution for LAN security gateways, firewalls, and data collection and processing, making it an ideal choice for work-from-home networks, retail point-of-sale systems, and edge computing deployments.

To address the growing demands for agile embedded networking, intelligent edge, and secure communication, Advantech, a leading provider of network security solutions, has launched a new series of x86 network appliances: FWA-6183, FWA-5082, and FWA-1081. Powered by AMD EPYC 9004 and 8004, and AMD Ryzen V3000 series processors, this series delivers advanced computing performance, high bandwidth, and lower TDP. These appliances are optimized for a wide range of workloads, from SMEs to larger-scale enterprise of network security applications, including edge computing, WAN optimization, DPI/IPS/IDS, SD-WAN/SASE, and NGFW/UTM.

Key AMD Embedded Network Advantages
AMD EPYC & Ryzen Series Processors:

• Breakthrough Performance
• Up to 96 cores/192 threads, ensuring scalable processing power.
• Expansive I/O Options
• PCIe Gen 5 with up to 128 lanes for high bandwidth and maximum I/O flexibility
• Optimized Power Efficiency

The EUV lithography machine from ASML ordered by Rapidus is expected to arrive in Japan in mid-December, according to information from Nikkei cited by TrendForce. This marks the first deployment of EUV technology in Japan, an important step for the country's semiconductor industry as it seeks to establish itself as a major player. Rapidus is currently building a factory in Chitose, Hokkaido, and plans to start mass production of 2 nm chips in 2027. The company also plans to purchase several EUV devices if the 2-nanometer chip production is successful, and intends to build a second production facility specifically for 1.4 nm chips. To support these operations, ASML will establish a service center in Chitose City.

NVIDIA CEO Jensen Huang hinted at the possibility of outsourcing AI chip production to Rapidus. As of October, construction progress on the Rapidus facility, which began in September 2023, is up to 63% and remains on track. In addition to Rapidus, Micron's Hiroshima plant is scheduled to install EUV equipment in 2025, allowing for mass production in 2026. JASM, a TSMC subsidiary in Japan, plans to integrate EUV lithography with a second wafer plant in 2027 that will have a 6 nm production line.

As the popularity of outdoor pursuits and the demand for mobile working lifestyles soar, the market cries out for more proficient, convenient, and reliable power solutions. Through its meticulous market analysis, CE-LINK has discerned that most users aspire for an innovative solution that allows them to keep their electronic devices charged even while the portable power station is recharging.

Conventional portable power stations often disrupt the power flow to devices during charging, posing a hurdle for gadgets requiring an unwavering power supply. To tackle this predicament, CE-LINK boasts a bypass functionality that ensures a seamless power experience, without compromising on either convenience or reliability.

Neuranics has secured an £800,000 grant from Scottish Enterprise (SE) to support a £2.4 million project aimed at transforming how humans interact with machines through innovative wristband technology. Using Neuranics' patented magnetic sensors, the wristbands will detect muscle activity and precise gestures. This 18-month project will create ten high-tech jobs at the company's Glasgow headquarters and solidify Scotland's position as a leader in wearable technology.

The wristbands, leveraging magnetomyography (MMG) technology and machine learning, will interpret muscle movements through soft bands worn on the arms. Initially targeting extended reality (XR) applications, the device will enable seamless gesture recognition for immersive digital experiences.

Canon Inc. announced today that it will ship its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium. Canon became the first in the world to commercialize a semiconductor manufacturing system that uses NIL technology, which forms circuit patterns in a different method from conventional projection exposure technology, when it released the FPA-1200NZ2C on October 13, 2023.

In contrast to conventional photolithography equipment, which transfers a circuit pattern by projecting it onto the resist coated wafer, the new product does it by pressing a mask imprinted with the circuit pattern into the resist on the wafer like a stamp. Because its circuit pattern transfer process does not go through an optical mechanism, fine circuit patterns on the mask can be faithfully reproduced on the wafer. With reduced power consumption and cost, the new system enables patterning with a minimum linewidth of 14 nm, equivalent to the 5 nm node that is required to produce most advanced logic semiconductors currently available.

Elgato, a brand of CORSAIR, today shared new additions to its Wave audio line, expanding both hardware and software capabilities. Unveiled earlier today at TwitchCon, Wave Mic Arm Pro is an ultra-premium boom with smooth movement and a low profile, ideal for professional recording. Elgato also debuted Wave Desk Stand, a portable studio arm for mounting mics and accessories onto any flat surface, like podcasting tables. Together, they round out the brand's audio lineup, offering a versatile range of mounting options to fit any setup.

Additionally, Elgato revealed Wave Link 2.0, a major update to its flagship mixing app. Coming soon on PC and Mac, it introduces one-click audio routing and fast Stream Deck setup, making it easier than ever for creators to manage their sound.

Logitech G, a brand of Logitech and leading innovator of gaming technologies and gear, announced today at Logi Play the new Racing Series, marking an important milestone in Logitech G's simulation racing heritage. The Racing Series brings unprecedented innovation and customization to drivers, letting them fine-tune their gear setup and equipment levels to match their driving style.

"We've heard from numerous sim racers that their setup should mirror the car they're driving, whether it's tackling gravel in a rally car, drifting with burning rubber, or navigating an open-wheeler with precision," said Richard Neville, head of SIM product engineering, Logitech G. "Each of these disciplines requires distinct steering input styles to achieve peak performance and the best feel, which is why the steering wheel shapes in these vehicles vary greatly. We developed the RS system specifically for motorsport enthusiasts who want to play their way."

The Netherlands government announced additional export controls on advanced chipmaking equipment on Friday. This decision, which specifically targets ASML's DUV immersion lithography tools, has drawn sharp criticism from Beijing. The new regulations, aligning with similar restrictions imposed by the US last year, will require additional licensing for the export of ASML's 1970i and 1980i models. China's Commerce Ministry swiftly responded to the announcement, expressing dissatisfaction with what it perceives as unwarranted restrictions on trade. In a statement released Sunday, the ministry accused the United States of leveraging its global influence to pressure allies into tightening export controls, describing it as an attempt to maintain "global hegemony" in the semiconductor industry.

The Chinese government urged the Netherlands to reconsider its position, calling for a balance between security concerns and the preservation of mutually beneficial economic ties. Beijing emphasized the importance of safeguarding the "common interests" of businesses in both countries and warned against potential damage to Sino-Dutch cooperation in the semiconductor sector. Dutch Trade Minister Reinette Klever defended the decision, stating it was made "for our safety." However, this move could have significant implications for ASML, which has already faced restrictions on exporting its most advanced systems to China. ASML receives as much as 49% of its revenue from China, meaning that additional export regulations could significantly reduce revenues if licenses aren't approved.

E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers.

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, HYAWEI OPTRONICS for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and other key component suppliers such as HIWIN, HIWIN MIKROSYSTEM, Keyence Taiwan, Mirle Group, ACE PILLAR CHYI DING), and Coherent.

Sony Electronics Inc. today announced the MDR-M1 Reference Closed Monitor Headphones, designed for music creators and sound engineers to produce music in any environment, heard as intended. The headphones host a closed acoustic structure with high sound isolation, exclusively developed driver, and a lightweight and comfortable design that allow users to create in their own environments, as if they were in the studio. The MDR-M1 headphones combine studio sound quality with extreme comfort and reliability, suitable for a wide range of music production and high-resolution audio applications.

Sound Characteristics
The MDR-M1 offers studio sound quality with a carefully tuned acoustic structure to support a wide range of music production, all while offering high-resolution audio. At the core of the sound quality is a uniquely developed driver unit that achieves ultra-wideband playback (5 Hz - 80 kHz), featuring a combination of a soft edge shape to reproduce low frequencies with sufficient volume and low distortion, and a hard dome shape to accurately reproduce ultra-high frequencies.

Airvine, the first company to develop a multi-Gigabit-speed wireless backhaul system for indoor connectivity, today announced the general availability of its WaveCore product line. Designed to eliminate the expensive and time-consuming drilling required when confronting concrete barriers (which includes labor, permitting and inspections) to link areas with Ethernet cabling, the WaveCore system consists of a simple point to point bridge with two nodes, measuring 10.1" x 2.7" x 10.3", that are installed one on each side of a concrete wall or floor / ceiling.

The WaveCore is a PTP (point-to-point) layer 2 Ethernet bridge that operates on PoE (power over Ethernet) or a 12 V DC input. Testing with select customers earlier this year has shown results such as a 3 Gbps connection through 8" of concrete in the middle of a 54-foot link and a 4 Gbps connection through a 12" concrete wall in a garage that was in the middle of a 6-foot link.

In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main models for introducing FOPLP packaging technology: Firstly, OSAT providers transitioning from traditional methods of consumer IC packaging to FOPLP. Secondly, foundries and OSAT providers packaging AI GPUs that are transitioning 2.5D packaging from wafer level to panel level. Thirdly, panel makers who are packaging consumer ICs.

On June 5th, Vanguard and NXP announced plans to jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a 12-inch wafer plant. TrendForce posits that this move reflects the trend of global supply chains shifting "Out of China, Out of Taiwan"(OOC/OOT), with Taiwanese companies accelerating their overseas expansion to improve regional capacity flexibility and competitiveness.

TrendForce noted that the semiconductor supply chain has been diversifying over the past two years to mitigate geopolitical and pandemic-related risks, forming two major segments: China's domestic supply chain and a non-China supply chain. Recent US tariff increases have accelerated this shift, leading to increased orders from American customers.

Last year, Micron unveiled plans to construct a cutting-edge DRAM factory in Hiroshima, Japan. However, the project has faced a significant two-year delay, pushing back the initial timeline for mass production of the company's most advanced memory products. Originally slated to begin mass production by the end of 2025, Micron now aims to have the new facility operational by 2027. The complexity of integrating extreme ultraviolet lithography (EUV) equipment, which enables the production of highly advanced chips, has contributed to the delay. The Hiroshima plant will produce next-generation 1-gamma DRAM and high-bandwidth memory (HBM) designed for generative AI applications. Micron expects the HBM market, currently dominated by rivals SK Hynix and Samsung, to experience rapid growth, with the company targeting a 25% market share by 2025.

The project is expected to cost between 600 and 800 billion Japanese yen ($3.8 to $5.1 billion), with Japan's government covering one-third of the cost. Micron has received a subsidy of up to 192 billion yen ($1.2 billion) for construction and equipment, as well as a subsidy to cover half of the necessary funding to produce HBM at the plant, amounting to 25 billion yen ($159 million). Despite the delay, the increased investment in the factory reflects Micron's commitment to advancing its memory technology and capitalizing on the growing demand for HBM. An indication of that is the fact that customers have pre-ordered 100% of the HBM capacity for 2024, not leaving a single HBM die unused.

On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

"The Earth is Blue," said Yuri Gagarin, the first human to journey into space. With two-thirds of its surface covered in water, Earth is a planet that exuberates its blue radiance in the dark space. However, today, the scarcity of water is a challenge that planet Earth is confronted with. For some, this may be hard to understand. What happened to our blue planet Earth? To put in numbers, more than 97% of the water on Earth consists of seawater, with another 2% locked in ice caps. That only leaves a mere 1% of water available for our daily use. The problem lies in the fact that this 1% of water is gradually becoming scarcer due to reasons such as climate change, environmental pollution, and population growth, leading to increased water stress. 'Water stress' is quantified by the proportion of water demand to the available water resources on an annual basis, indicating the severity of water scarcity as the stress index rises. Higher stress indexes signify experiencing severe water scarcity.

The semiconductor ecosystem, unsustainable without water
Because water stress issues transcend national boundaries, various stakeholders including international organizations and governments work to negotiate water resource management strategies and promote collaboration. UN designates March 22nd as an annual "World Water Day" to raise awareness about the severity of water scarcity running various campaigns. Now, it's imperative for companies to also take responsibility for the water resources given and pursue sustainable management.

Ryan McCurdy, President of Lenovo North America, revealed ambitious forward-thinking product roadmap during an interview with CRN magazine. A hybrid strategic approach will create an anticipated AI fast lane on future hardware—McCurdy, a former Intel veteran, stated: "there will be a steady stream of product development to add (AI PC) hardware capabilities in a chicken-and-egg scenario for the OS and for the (independent software vendor) community to develop their latest AI capabilities on top of that hardware...So we are really paving the AI autobahn from a hardware perspective so that we can get the AI software cars to go faster on them." Lenovo—as expected—is jumping on the AI-on-device train, but it will be diversifying its range of AI server systems with new AMD and Intel-powered options. The company has reacted to recent Team Green AI GPU supply issues—alternative units are now in the picture: "with NVIDIA, I think there's obviously lead times associated with it, and there's some end customer identification, to make sure that the products are going to certain identified end customers. As we showcased at Tech World with NVIDIA on stage, AMD on stage, Intel on stage and Microsoft on stage, those industry partnerships are critical to not only how we operate on a tactical supply chain question but also on a strategic what's our value proposition."

McCurdy did not go into detail about upcoming Intel-based server equipment, but seemed excited about AMD's Instinct MI300X accelerator—Lenovo was (previously) announced as one of the early OEM takers of Team Red's latest CDNA 3.0 tech. CRN asked about the firm's outlook for upcoming MI300X-based inventory—McCurdy responded with: "I won't comment on an unreleased product, but the partnership I think illustrates the larger point, which is the industry is looking for a broad array of options. Obviously, when you have any sort of lead times, especially six-month, nine-month and 12-month lead times, there is interest in this incredible technology to be more broadly available. I think you could say in a very generic sense, demand is as high as we've ever seen for the product. And then it comes down to getting the infrastructure launched, getting testing done, and getting workloads validated, and all that work is underway. So I think there is a very hungry end customer-partner user base when it comes to alternatives and a more broad, diverse set of solutions."

3DMakerpro, a pioneer in consumer-friendly 3D scanning technology, announces the launch of the Moose Series, beginner-friendly 3D scanners with AI visual tracking technology. The Moose series is 3DMakerpro's latest consumer-grade 3D scanner line-up offering, designed to handle real-world medium-sized objects into 3D models with remarkable efficiency and precision. Powered by a set of AI features and in collaboration with Oqton, developers of Geomagic Wrap, 3DMakerpro aspires to make 3D scanning easier and more accessible to beginners and advanced users in the creative field.

"The Moose series brings consumer 3D scanning to new heights of accuracy and allows more users to benefit from the convenience of 3D scanning," said Tianshi Yuwen, Global Marketing Director of 3DMakerpro. "Our dedication to innovation empowers us to democratize high-precision 3D scanning and push beyond the boundaries of making all creative visions a reality."

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Yesterday, AMD announced that its cutting-edge adaptive computing technology was selected by Sony Semiconductor Solutions (SSS) for its newest automotive LiDAR reference design. SSS, a global leader in image sensor technology, and AMD joined forces to deliver a powerful and efficient LiDAR solution for use in autonomous vehicles. Using adaptive computing technology from AMD significantly extends the SSS LiDAR system capabilities, offering extraordinary accuracy, fast data processing, and high reliability for next-generation autonomous driving solutions.

In the rapidly evolving landscape of autonomous driving, the demand for precise and reliable sensor technology has never been greater. LiDAR (Light Detection and Ranging) technology plays a pivotal role in enabling depth perception and environmental mapping for various industries. LiDAR delivers image classification, segmentation, and object detection data that is essential for 3D vision perception enhanced by AI, which cannot be provided by cameras alone, especially in low-light or inclement weather. The dedicated LiDAR reference design addresses the complexities of autonomous vehicle development with a standardized platform to enhance safety in navigating diverse driving scenarios.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America's first fan-out wafer-level packaging (FOWLP) research and development center.

The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing.