GIGABYTE, a global leader in technology, today announced the availability of its flagship ultra-compact mini-PC, the New BRIX Mainstream series, accompanied by an exclusive product video release. This series is powered by the latest Intel Core Ultra processors (Series 2) and boasts an integrated GPU with a remarkable 20% performance increase over the previous generation. Furthermore, it unleashes exceptional AI performance, delivering up to 96 Tera Operations Per Second (TOPS), making it perfectly suited for demanding generative AI tasks and intensive multitasking scenarios.

⁠Designed to meet the growing needs of smart home solutions, commercial deployments, content creation, and edge computing, the BRIX Mainstream series packs this impressive performance into a remarkably compact 0.46-liter chassis with a sleek 3.5 cm profile. Despite its size, it offers top-tier computing power, flexible expansion options, and an eco-conscious, energy-efficient design - delivers performance that exceeds expectation.

MSI, a global leader in industrial computing solutions, proudly announces the release of the MS-C927, a highly compact and fanless embedded Box PC designed to meet the growing demand for power-efficient edge computing in harsh and space-constrained environments. Powered by Intel 's Meteor Lake-U and Arrow Lake-U series Core Ultra processors, the MS-C927 delivers high performance, reliable connectivity, AI acceleration, and rich I/O in an ultra-compact form factor.

Feature-Rich, Future-Ready
With a footprint of only 130 x 155 x 40 mm, the MS-C927 fits seamlessly into tight enclosures while offering exceptional processing power and industrial-grade durability. It features DDR5 memory up to 96 GB, dual 4K DisplayPort outputs, dual LAN including 2.5GbE, and multiple M.2 slots for NVMe storage, wireless connectivity, and cellular communication.

Die shots of Intel's "Arrow Lake" desktop processors have appeared online, confirming the chiplet design we have known about since the launch. The images annotated by the YouTube channel HighYield show a four‑tile arrangement mounted on a base die made with Intel's 22 nm FinFET process. The compute tile sits at the top left, built on TSMC's N3B node and covering 117.24 mm². To its right are the SoC tile on TSMC's N6 node measuring 86.65 mm², and the GPU tile, which houses four Xe cores alongside an Arc Alchemist render slice. The I/O tile, at 24.48 mm² on the same N6 node, completes the group at the bottom left. Intel has redesigned its hybrid core layout for Arrow Lake, moving away from separate P‑core and E‑core clusters. Four of the eight high‑performance P‑cores line the die's outer edges, with the remaining four in the center. In between these lie the four efficiency E‑core clusters, each sharing 3 MB of L2 cache. A unified 36 MB L3 cache ring bus connects to every core, allowing E‑cores to tap into that larger cache pool for the first time. Intel aims to spread heat more evenly and boost background task performance.

The I/O tile integrates Thunderbolt 4 controllers, PCIe buffers and PHYs. The SoC tile carries display engines, media accelerators and DDR5 memory controllers. All tiles are bonded to the base die via Intel's Foveros Omni stacking technology. Arrow Lake also reflects a shift in Intel's manufacturing strategy. Plans to use Intel's 20A node were dropped in favor of TSMC processes, making this the first desktop CPU from Intel that relies almost entirely on external foundries. On the software side, Intel has begun offering its IPO profiles in select prebuilt systems. These presets optimize CPU and memory settings for a hassle‑free performance boost that remains within warranty limits. Meanwhile, the native 200S Boost overclocking option is rolling out via BIOS updates. Early tests suggest that 200S Boost alone yields modest gains unless paired with very high-speed DDR5 modules, while IPO profiles deliver more consistent improvements with mainstream memory configurations.

Intel today released the latest version of the Arc GPU Graphics drivers. Version 101.6790 WHQL comes with a handful of fixes. To beign with, it fixes an issue where "Warhammer 40000: Darktide" shows display corruption and blacked-out textures with Arc B-series GPUs. The drivers also address an issue with "The Last of Us Part 2" where the game puts out flickering on shadows with Arc A-series GPUs. Lastly, a general software issue where Blender experiences compatibility issues when interacting with the camera gizmo on the iGPU of Core Ultra series 2 processors ("Lunar Lake") has been fixed. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6790 WHQL

Intel appears ready to broaden its Arc "Battlemage" lineup with a new, more powerful desktop graphics card likely to be called the Arc B770, potentially arriving as soon as next quarter. Until now, Team Blue has introduced only two Xe2 Battlemage models, the B570 (10 GB) and B580 (12 GB), both of which earned praise for solid performance at accessible price points. Enthusiasts have long speculated about successors like the B750, B770, and even a B780, but Intel shifted its public focus to upcoming AI PC processors after the B570 launch, leaving GPU fans uncertain which designs would materialize. Recent shipping manifests uncovered a "BMG‑G31" GPU die en route to Intel's Vietnam assembly plant, the same site that produced limited‑edition B570 and B580 cards, while insider Haze2K1's documents hint at a "B7XX" special‑edition series. Simultaneously, chatter about a 24 GB Developer Edition based on the earlier BMG‑G21 die suggests Intel is also eyeing workstation and creative‑professional markets.

A well-known tipster, OneRaichu, has further fueled excitement by reporting that the Arc B770 could pack between 24 and 32 Xe2 compute units, a 256‑bit memory interface, and 16 GB of GDDR6, positioning it squarely against rival xx60‑series models and promising a meaningful boost in gaming and compute workloads. Beyond Battlemage, Intel's next‑generation graphics architecture, Xe3 "Celestial," has reached pre‑silicon validation. According to Intel engineer Tom Petersen and corroborating industry leaks, Celestial's core media engines, Xe cores, XMX matrix units, and ray‑tracing hardware are fully designed and are now being tested in a hardware model to fine‑tune power consumption and clock speeds. With Computex 2025 kicking off in late May, Intel may at last clarify both its high‑end Battlemage refresh and the broader Celestial roadmap, potentially reshaping competition in the mainstream and next‑generation GPU markets.

GIGABYTE Technology, a global leader in computing innovation, will return to COMPUTEX 2025 from May 20 to 23 under the theme "Omnipresence of Computing: AI Forward." Demonstrating how GIGABYTE's complete spectrum of solutions spanning the AI lifecycle, from data center training to edge deployment and end-user applications reshapes the infrastructure to meet the next-gen AI demands.

⁠As generative AI continues to evolve, so do the demands for handling massive token volumes, real-time data streaming, and high-throughput compute environments. GIGABYTE's end-to-end portfolio - ranging from rack-scale infrastructure to servers, cooling systems, embedded platforms, and personal computing—forms the foundation to accelerate AI breakthroughs across industries.

Sparkle announced availability of its flagship custom-design Intel Arc B580 graphics card, the Sparkle B580 ROC Luna OC Ultra. The card derives its name from an all-white appearance, with white making up not just the cooler shroud and fan impellers, but also the PCB solder-mask underneath. The card's design appears to balance elements to appeal to both gamers and creators. It comes with a 2.5-slot thick design that's at least an inch taller than what constitutes full-height. It uses an aluminium fin-stack heatsink that's ventilated by a pair of 90 mm fans.

The Sparkle Arc B580 ROC Luna OC Ultra comes with the company's highest factory overclock for the B580, with a max boost frequency of 2800 MHz compared to 2670 MHz reference, and 2740 MHz of its Titan OC graphics card. It also comes with increased power limits of 210 W, compared to 190 W reference. It draws power from two 8-pin PCIe power connectors. The company didn't reveal pricing, but we expect it to be between the $250-300 mark.

ASUS today announced the arrival of TUF Gaming T500, a compact desktop with the power to drive the latest and greatest AAA and esports games. Powered by up to an Intel Core i7-13620H processor, up to an NVIDIA GeForce RTX 5060 Ti GPU, up to 64 GB of DDR5 RAM and 2 TB of PCIe 4.0 storage, T500 is a well-rounded machine for esports and AAA gamers alike. With a compact chassis that features classic TUF Gaming style, T500 is an excellent fit in bedrooms and dorm rooms anywhere.

High-performance components
Powered by up to an Intel Core i7-13620H processor with six Performance cores and eight Efficiency cores and a max boost of 5.0 GHz, T500 can drive incredible gaming experiences alongside a snappy desktop experience. T500 packs up to an NVIDIA GeForce RTX 5060 Ti GPU. Boasting the latest NVIDIA Blackwell architecture, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the GeForce RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4 featuring Super Resolution, Ray Reconstruction, and Multi Frame Generation. The GeForce RTX 5060 Ti is ready to power incredible performance in the games of today and tomorrow.

In the last few weeks, Intel rolled out two new performance‑enhancing presets for its Core Ultra 200S "Arrow Lake" processors: Intel Performance Optimizations (IPO) and the factory‑approved 200S Boost overclocking profile. Independent benchmarks shared by a BiliBili user reveal that IPO delivers a slightly stronger uplift in gaming performance compared with 200S Boost. Testing centered on a Core Ultra 7 265K paired with DDR5‑8000 memory and a GeForce RTX 5090D. Seven modern titles were measured at 4K with DLSS enabled where supported. Three system presets were compared: a baseline with XMP‑enabled DDR5‑8000, Intel's 200S Boost, and Intel IPO. Under 200S Boost, Intel ramps the chip's Die‑to‑Die (D2D) fabric from 2.1 GHz to 3.2 GHz and the Next‑Generation Uncore (NGU) fabric from 2.6 GHz to 3.2 GHz, while maintaining factory CPU clock speeds. By contrast, IPO takes a more holistic approach: P‑core and E‑core boost clocks rise to 5.4 GHz and 4.9 GHz (from 5.2 GHz/4.9 GHz), the ring bus ticks up to 4.0 GHz (from 3.8 GHz), and memory is overdriven to DDR5‑8400 with tightened timings.

IPO's D2D and NGU fabrics run at 3.1 GHz due to power-and-thermal headroom trade-offs. Across the board, IPO edged out 200S Boost by roughly 2% in average frame rates and 1% in the 1% lows. In Forza Horizon 5, IPO delivered 274 FPS versus 269 FPS on 200S Boost, with 1% lows of 198 FPS (+1 FPS). Cyberpunk 2077 saw a 3% jump to 297 FPS average and a 6% gain in 1% lows. Total War: Warhammer III's averages climbed 6%, while 1% lows rose 9% under IPO. The most pronounced advantage appeared in Counter‑Strike 2 (tested at 1080p), where IPO boosted averages by 16% and 1% lows by 20 %. Watch Dogs: Legion also benefited, with an 8% average and 9% low‑end uplift. These results suggest that IPO's balanced tuning of CPU cores, ring bus, interconnects, and memory yields consistent, measurable gains over the simpler fabric‑focused 200S Boost profile. Intel has yet to greenlight the IPO's broader rollout beyond its initial OEM launch in China, but these early figures hint at meaningful real‑world improvements for Arrow Lake gamers.

IBM is the first cloud service provider to make Intel Gaudi 3 AI accelerators available to customers, a move designed to make powerful artificial intelligence capabilities more accessible and to directly address the high cost of specialized AI hardware. For Intel, the rollout on IBM Cloud marks the first major commercial deployment of Gaudi 3, bringing choice to the market. By leveraging Intel Gaudi 3 on IBM Cloud, the two companies aim to help clients cost-effectively test, innovate and deploy GenAI solutions.

According to a recent forecast by research firm Gartner, worldwide generative AI (GenAI) spending is expected to total $644 billion in 2025, an increase of 76.4% from 2024. The research found "GenAI will have a transformative impact across all aspects of IT spending markets, suggesting a future where AI technologies become increasingly integral to business operations and consumer products."

Christoph Schell, Intel's chief commercial officer and executive vice president, plans to step down on June 30, according to a recent Securities and Exchange Commission filing. The notice filed on April 28 states Schell is leaving to "pursue another career opportunity" with Kuka Group where he'll take on the CEO role. "Since joining Intel in 2022, Christoph has poured his heart and soul into our business and worked tirelessly in service of our customers," Intel CEO Lip-Bu Tan wrote. "He has helped to steer our Sales and Marketing Group (SMG) through a challenging period and built a strong team along the way. I am grateful for his contributions and wish him success in his next role". Kuka Group stands out as a world leader in robotics offering robots, manufacturing cells, software, and cloud-based digital services. This exit comes after Intel reported another quarter of losses and more cost-cutting plans. However, it might not affect CEO Lip-Bu Tan's efforts to reshape the company, which include cutting jobs and simplifying management layers.

Since joining Intel in March 2022 from Hewlett-Packard, where he served seven years in senior management positions, Schell has witnessed Intel's continued financial challenges, including the recent first quarter results showing a net loss of US$800 million on revenue of US$12.7 billion. While the revenue met the upper threshold of previous guidance, Lip-Bu Tan acknowledged in the financial results statement that although "the first quarter was a step in the right direction, there are no quick fixes as we work to get back on a path to gaining market share and driving sustainable growth." Schell's tenure at Intel coincided with a period of leadership transition, having been appointed under former CEO Pat Gelsinger, who resigned in December 2024 after assuming the position in February 2021. Following Schell's departure, the head of America sales, Greg Ernst, is stepping in as the interim leader of Intel's Sales and Marketing Group.

Intel has only released two Arc Xe2 "Battlemage" desktop models: the B580 12 GB and B570 10 GB graphics cards. So far, these lower priced options have been warmly welcomed by reviewers and buyers alike—but gaming GPU enthusiasts are still actively clamoring for more potent second-gen "Battlemage" variants. The collective status of theorized "B750, B770, and (fancifully) B780" SKUs is frustratingly unclear. Intel has not generated any official new product noise since the launch of their B570 design, earlier this year—recent big announcements have focused on next-gen "AI PC" processor lines. A series of vague leaks have indicated cancelations and then revivals of speculated mid-to-high-end Arc Xe2 discrete cards.

As of late, a larger "BMG-G31" GPU identifier has appeared in shipping manifests—a previous leak pointed to "prototype" units being moved between company facilities. Yesterday, Haze2K1 shared another extract from NBD inventory documents—crucially, they believe that these items are heading to a crucial manufacturing plant in Vietnam. This location is/was tasked with the assembling of first-party B570 and B580 Limited Edition products. Fresh conjecture suggests that "B7XX" Limited Edition cards are in the pipeline, but current circumstances are still hazy. VideoCardz reckons that a "Developer Edition" 24 GB model is still in active development, but this rumored workstation/productivity-oriented card could be based on Intel's readily available "BMG-G21" GPU die.

Intel is preparing to launch its first "Panther Lake" mobile processor later this year, but only one configuration will arrive in 2025. This SKU features four high-performance P-cores paired with eight E-cores, leaves out the lower-power efficiency cores, and packs four Xe3 GPU cores. With a 45 W TDP, it is clearly aimed at mainstream gaming laptops rather than ultralight notebooks. Panther Lake fills the gap left by "Lunar Lake" with a higher power envelope and a more performance-oriented design. Lunar Lake ranged from 17 W to 28 W, while Panther Lake's 45 W shows Intel is targeting users who need more sustained compute and graphics throughput. Rumors indicate additional Panther Lake variants will arrive in Q1 of 2026, when Intel plans to have more SKUs shipping to OEMs from volume production.

One such SKU is expected to feature 12 Xe3 GPU cores for premium thin-and-light laptops without discrete graphics. All of Panther Lake processors combine "Cougar Cove" performance cores with "Darkmont" efficiency cores, following Intel's hybrid approach introduced with "Meteor Lake". Intel's decision to stagger the rollout reflects supply chain considerations and product segmentation by power and graphics capability. Gaming laptops that can rely on integrated Xe3 graphics will welcome this 45 W chip, while other form factors may wait for next year's lower-power or ultralight 15 W models. Qualification with OEM partners should begin later this year, with laptop shipments expected by late Q4 2025. Until Intel shares more details on the rest of the Panther Lake lineup, much remains speculative.

Intel is exploring a new way to cool its hottest chips by weaving tiny water channels into the processor package itself. At its Foundry Direct Connect showcase, via HardwareLuxx coverage, the company revealed working prototypes for LGA desktop CPUs, BGA servers, and AI modules. Rather than flood the bare silicon, a slim copper block sits on top of the package, its microchannels precisely etched to carry coolant directly over the hottest areas. Intel engineers cooled Core Ultra desktop chips and high-end Xeon processors in live demonstrations. The system moves standard liquid-cooling fluid through those channels at a rate fast enough to whisk away up to 1,000 watts of heat. In the lab, that level of thermal performance isn't standard for everyday PC use, but it matches the demands of AI training, scientific computing, and professional workstations.

This design stands out because of its attention to every layer between the chip and the coolant. Intel carefully controls the thickness of the silicon die, the solder or liquid-metal thermal interface material, the integrated heat spreader, and the water block itself. By reducing or removing traditional barriers, thermal resistance falls, and engineers report roughly 20% better cooling than a standard water block mounted on a delidded die. Those copper blocks measure only a few millimeters in height yet still deliver strong flow rates. During chip layout, teams space out power-hungry blocks or flag-tight clusters so the cooling channels can target critical hotspots. This co-design of package and cooler goes much deeper than any off-the-shelf solution. While the basic research dates back nearly two decades, Intel has been refining the method for years. Still, with processors growing more powerful and densely packed, package-level liquid cooling could move from laboratory demo to essential tool for data centers and enthusiast rigs.

ASUS today announced the latest version of the ASUS V16 (V3607) 16-inch gaming laptop, an entry level model that broadens the appeal of the innovative ASUS laptop portfolio. Featuring futuristic uber-cool design details and unparalleled performance from the new up to Intel Core 7 processor (Series 2) and NVIDIA GeForce RTX 50 Series Laptop GPU, ASUS V16 is built to win - or create - in distinctive style.Its fast 16-inch 16:10 144 Hz FHD IPS display, with an impressive 89% screen-to-body ratio, ensures fluid gaming visuals, while Dirac audio technology and ASUS Audio Booster provide powerful and immersive sound.

Offering an outstanding user experience, the laptop also includes a large touchpad and a comfortable ASUS ErgoSense keyboard. AI noise-cancelation technology and 3DNR for enhanced video conferencing. Designed to deliver an immersive gaming experience with an unparalleled blend of performance and affordability, ASUS V16 also offers military-grade durability, a 63Wh battery, superb power efficiency, and a bundled PC Game Pass Ultimate. It's reliable and cost-effective choice for gaming, creativity, and everyday tasks. Whether conquering virtual realms or unleashing newfound creativity, ASUS V16 is the gateway to limitless possibilities.

Intel today released the latest version of its Arc GPU Graphics Drivers. Version 101.6739 Beta comes with a fix for certain functional issues PyTorch 2.7 users on Arc B-series "Battlemage" discrete GPUs and Arc 100V-series iGPUs, with torch.compile operations and use of certain data precisions. This is the only issue fixed with this driver release. The company on Tuesday announced that its driver releases since 101.6734 include gaming performance enhancements for its Arc 100V-series iGPUs powering Core Ultra 200V "Lunar Lake" processors.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6739 Beta

Intel today announced that the latest Arc GPU Graphics Drivers update brings significant performance uplifts to the integrated graphics solution of the company's Core Ultra 200V "Lunar Lake" mobile processors. The processor comes with an iGPU based on the Xe2 "Battlemage" graphics architecture, and depending on the processor model, up to 8 Xe cores, the latest XMX AI accelerators, the company's 2nd generation Ray Tracing Unit, and an 8 MB dedicated last-level cache. When it launched, it was expected that the iGPU of "Lunar Lake" would perform in the league of at least the discrete Arc A380 GPU, but fell slightly behind, probably because the iGPU shares memory bandwidth with the CPU complex and the memory-intensive NPU.

With the latest driver updates, Intel is promising a 10% increase in FPS averaged over a test suite of 9 game titles, but more importantly, a significant 25% increase in 99th percentile performance. The test suite covers titles relevant to this performance class, including Counter-Strike 2, Fortnite, and Payday, but also certain AAA titles, such as Cyberpunk 2077 and Black Myth Wukong. Intel recommends the drivers for anyone with a Core Ultra 200V processor model that has either Arc 140V or Arc 130V iGPU models.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance computing and server solutions, proudly announces its participation in the OCP EMEA Regional Summit 2025, taking place in Dublin, Ireland. As an active contributor to the Open Compute Project (OCP), Giga Computing will showcase its latest data center solutions tailored to meet the demands of hyperscale infrastructure, high-density storage, and AI-centric workloads.

The OCP EMEA Summit serves as a platform where global technical leaders come together to address critical challenges in data center sustainability, energy efficiency, and heat reuse across the region. The summit focuses on how innovations pioneered by hyperscale data center operators can help tackle these issues and drive meaningful change. Additionally, the event spotlights real-world deployments of OCP-recognized equipment in the EMEA region.

BIOSTAR, a leading manufacturer of Edge AI platform, IPC solutions, motherboards, graphics cards, and storage solutions, is excited to announce its participation at COMPUTEX Taipei 2025, set to take place from May 20 to May 23 at the Nangang Exhibition Center, Hall 2, 1F (Booth No. P0808) in Taipei, Taiwan. With the theme "Unlock the Future of Edge AI," BIOSTAR's booth will feature a wide array of innovative technologies designed to meet the evolving needs of modern computing. Visitors can expect a diverse showcase that spans industrial-grade edge AI platforms, EdgeComp embedded IPC systems, and the latest consumer PC motherboards, graphics cards, SSDs, and DDR memory for creators, gamers, and casual use, all presented in a sleek exhibition space that highlights sustainable living.

BIOSTAR's COMPUTEX 2025 booth will center around its latest edge AI computing solutions. Visitors will be able to experience real-world applications powered by the NVIDIA Jetson Orin Edge AI platform and collaborative AI solutions developed in partnership with DEEPX and MemryX. These systems are designed to meet the demands of industrial automation, smart city infrastructure, and advanced HMI applications, offering scalable, high-efficiency performance at the edge. As a major player in the IPC motherboard and industrial computer sector, BIOSTAR reinforces its position as a driving force in developing edge computing technologies.

Team, (yesterday) we reported our Q1 2025 results. It was a step in the right direction as we delivered revenue, gross margin and EPS (earnings per share) above our guidance, driven by Dave and Michelle's leadership. I want to thank them both, and all of you, for the good execution. We need to build on this progress—and it won't be easy. We are navigating an increasingly volatile and uncertain macroeconomic environment, which is reflected in our Q2 outlook. On top of that, there are many areas where we must improve. We need to confront our challenges head-on and take swift actions to get back on track. As I have said, this starts by revamping our culture. The feedback I have received from our customers and many of you has been consistent. We are seen as too slow, too complex and too set in our ways—and we need to change. Our flatter Executive Team (ET) structure that I shared last week was a first step. The next step is to drive greater simplicity, speed and collaboration across the entire company. To achieve these objectives, today I am announcing some important changes.

Becoming an Engineering-Focused Company
We need to get back to our roots and empower our engineers. That's why I elevated our core engineering functions to the ET. And many of the changes we will be driving are designed to make engineers more productive by removing burdensome workflows and processes that slow down the pace of innovation. To make necessary investments in our engineering talent and technology roadmaps, we need to find new ways to reduce our costs. While we have taken significant actions in the last year, our current cost structure is still well above competitive benchmarks. With that in mind, we have reduced our operating expense and capital spending targets going forward, which I will discuss during our investor call this afternoon.

As revealed during a recent Q1 earnings call, Intel leadership mentioned that "external clients are getting their ASICs designs tested." The company's foundry business is working towards the finalization of its much discussed 18A node process, with alleged trial samples receiving an "impressive performance rating." According to Ctee Taiwan, Team Blue's foundry service has submitted test subjects to the likes of NVIDIA, Broadcom and Faraday Technology. The latter organization has (reportedly) disclosed that the 18A platform tape-out was completed last October—since then, received samples have been "successfully connected." Industry moles believe that NVIDIA and Broadcom are in the middle of conducting manufacturing tests. Additional whispers suggest the delivery of 18A prototypes chez IBM and several other unnamed partner companies. Insiders have indicated impressive/good "verification results." Contrary to reports from other sources, Ctee has picked up on insider chatter about Intel's next-gen Nova Lake compute tile design being "not entirely outsourced." Further conjecture points to Team Blue becoming increasingly confident in its own manufacturing techniques.

MSI Japan has announced that the PRO Z890-S WiFi Project Zero motherboard with back-routed power connectors will go on sale in Japan on May 2 for ¥42,980 (tax included). It uses Intel's Z890 chipset on an LGA1851 socket and a 12+1+1+1-phase digital power design. The board comes in a white-silver finish and measures 243.84 × 304.8 mm in ATX form factor. Memory support consists of four DDR5-8800 slots (up to 256 GB). Storage options include four SATA 3.0 ports, one PCIe 5.0 × 4 M.2 slot and two PCIe 4.0 × 4 M.2 slots. Expansion slots are one PCIe 5.0 × 16, one PCIe 3.0 × 1 (in ×16 shape) and two PCIe 4.0 × 4 (in ×16 shape). On the networking side, it offers Wi-Fi 7 with up to 5.8 Gbps throughput (via an EZ Antenna) and a 2.5 GbE LAN port using the Realtek 8125D controller. A Thunderbolt 4 header supports up to 40 Gbps connections.

Audio is handled by a Realtek ALC897 codec. A key change from earlier PRO models is that all power, fan, storage and I/O connectors are located on the board's rear. This layout can make cable routing neater if the PC case allows access behind the motherboard tray. MSI has covered the front side of the PCB since there are no connectors there. Although the PRO series is not aimed at high-end overclocking, the BIOS includes one-click overclock presets for CPU and memory. The board also features an EZ PCIe Clip II on the first slot for simpler graphics card removal. In Europe, the PRO Z890-S WiFi PZ is expected to retail for around €365.

Intel's latest AI-focused laptop processors, "Lunar Lake" and "Meteor Lake," have encountered slower-than-anticipated uptake, leading device manufacturers to increase orders for the previous-generation "Raptor Lake" chips. As a result, Intel 7 manufacturing lines, originally intended to scale up production of its newest AI-ready CPUs and transition to newer nodes, are now running at full capacity on "Raptor Lake" output, limiting the availability of both the new and legacy models. In its first-quarter 2025 financial report, Intel recorded revenue of $12.7 billion, essentially flat year-over-year, and a net loss of $821 million. The results fell short of the industry's expectations, and the company's stock declined by more than 5% in after-hours trading.

Management attributed the shortfall to cautious buying patterns among OEMs, who seek to manage inventory in light of ongoing US-China tariff discussions, and to consumer hesitancy to pay higher prices for AI-enabled features that are still emerging in mainstream applications. CEO Lip-Bu Tan outlined plans to reduce operating expenses by $500 million and lower capital expenditures by approximately $2 billion to address these challenges in 2025. He also confirmed that workforce reductions are planned for the second quarter, though specific figures were not disclosed. Looking ahead, Intel intends to focus on strengthening its data-center business, where demand for Xeon processors remains robust, and to prepare for the late-2025 introduction of its Panther Lake platform. The company will also continue efforts to encourage software development that leverages on-device AI, aiming to support wider adoption of its AI-capable hardware.

Facing global challenges of energy conservation, carbon reduction, and sustainable development, Intel has been committed to pushing the industry toward higher performance and lower energy consumption product standards, actively leading the PC ecosystem toward a dual track of environmental protection and innovation. FSP Group, as Intel's long-term strategic development partner, shares the same philosophy and has continuously invested in power supply technology innovation with Intel's support, particularly focusing on 12VO architecture design that complies with the latest energy efficiency regulations.

At the Intel Client Ecosystem Symposium, FSP showcased its latest V3 version of TFX 12VO PSU, which not only helps brand customers build compliant PC systems but also contributes to carbon reduction and environmental protection with a design that balances high performance and energy efficiency.

At the 2025 Shanghai Auto Show, Intel revealed its next-generation automotive system-on-chip lineup, unveiling two ambitious platforms, "Frisco Lake" and "Grizzly Lake". The company described these new designs as key steps toward fully software-driven vehicles, where much of the intelligence is handled by high-performance processors instead of dedicated hardware circuits. Intel said these chips would support advanced driver assistance and richer multimedia features. Intel's second generation Software Defined Vehicle, or SDV, Frisco Lake, is built on the upcoming "Panther Lake" architecture. The first volumes are expected in the first half of 2026, and TDP options will be among 20-65 W to meet different use cases. Intel says Frisco Lake will deliver ten times more AI performance and sixty-one percent better energy efficiency compared to the current Raptor Lake-based platform.

The new graphics block is based on the third-generation Xe architecture, known as "Celestial", replacing the older Battlemage design. Frisco Lake also supports twelve simultaneous camera inputs and up to two hundred and eighty audio channels. Linux kernel patch analysis also shows Frisco Lake cores are based on Panther Lake, confirming Intel's adaptation of its client CPUs for automotive use. Looking further ahead, Intel shared an early roadmap for its third-generation SDV platform, Grizzly Lake, which should arrive in the first half of 2027. Codenamed Monument Peak, these chips will use "Nova Lake" cores and may offer up to 32 efficiency-optimized cores along with an integrated Xe GPU capable of about seven TeraFLOPS. Additional features include support for six independent displays, twelve camera interfaces, and compliance with automotive safety standards.