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Hua Hong Semiconductor Recruits Veteran Logic Chip Designer, Formerly of Intel

Hua Hong Semiconductor (HHS) is China's second-largest chip manufacturer; trailing just behind its main rival: Semiconductor Manufacturing International Corporation (SMIC)—a recent recruitment drive has signalled the company's desire to advance further. Nikkei Asia believes that the recruitment of a former Intel executive—Bai Peng—will boost the development of logic chips, and in turn generate greater revenue. A late 2024 reshuffling of leadership positions produced a notable vacancy: company president—Bai Peng assumed this role, effective January 1. His career at Intel spanned three decades—by 2015 he became Team Blue's corporate vice president, although his tenure ended at some point in 2022 (according to a LinkedIn profile).

Industry watchdogs reckon that Hua Hong Semiconductor's freshly established chief will be tasked with advancing semiconductor production technologies. Peng's experience—being a former co-director of Logic Technology Development at the Intel Technology and Manufacturing Group—is cited as a crucial factor in diversifying the firm's product portfolio. HHS foundries produce a lot of 100+ nm-based designs—mostly in the fields of power semiconductors, analog chips, and embedded memory—but two locations are capable of churning out relatively complex silicon via a 40 nm process node. A new plant—based in Wuxi—is supposedly ready to push into sub-forty digits. The latest industry reports suggest that Peng and his colleagues will be focused on improving HSS's manufacturing processes—targeted advancements could open up new product lines: high-end enterprise and AI processors.

ASUS Announces Next-Generation Chromebook CR Series

ASUS today announced the next-generation ASUS Chromebook CR series of laptops, tailored to meet the needs of K-12 students. The ASUS Chromebook CR series stands out as the ideal companion for students, whether engaged in in-person classroom learning or remote education. The rugged and modular design, featuring replaceable internal parts, guarantees both durability and longevity. With 11.6-inch or 12.2-inch Corning Gorilla Glass touchscreens and a 180° lay-flat or 360°-flippable hinge, the laptops offer flexibility for enriched educational experiences. This design fosters the adventurous mindset of modern students, ensuring an enjoyable and secure learning journey, whether they're engaging in online courses or in-class sessions - ready for every learning journey.

A trusted study partner
For K-12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CR series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning Gorilla Glass to protect the touchscreen from scratches. Additionally, the spill-resistant keyboard can cope with minor water spills without harm, so minor splashes on the desk or at the dinner table can be easily drained, cleaned, and dried. Finally, the special fingerprint-resistant finish keeps the laptop cleaner for longer.

ASUS Unveils Next-Generation Education Laptops at BETT 2025

ASUS today announced the global launch of its latest education-focused laptops, the BR and CR series, at BETT 2025. Designed to address the evolving needs of modern classrooms, these devices combine upgraded performance, rugged durability and innovative features to empower K-12 students and educators in both in-classroom and hybrid learning environments.

ASUS BR series (BR1204CTA, BR1204FTA, BR1104CTA and BR1104FTA) and CR series (CR1104CTA, CR1104FTA, CR1204CTA, and CR1204FTA) are designed specifically for the needs of K-12 students, educators and IT administrators. Built with reliability and versatility in mind, these laptops enhance classroom learning by supporting diverse teaching methods, streamlining IT management, and empowering students with tools for creativity and collaboration. With new Intel processors, AI-powered features like Microsoft Copilot and thoughtful, student-centered designs, they are set to upgrade digital learning for the next generation.

ONIX Arc B580 Odyssey OC & Lumi OC Models Appear on Newegg

ONIX has quietly added Intel Arc B580 GPU-based models to its Newegg brand store—signalling the brand's arrival on North American's e-tail landscape. TechPowerUp first picked up on this new manufacturer's existence during Team Blue's introduction of Arc B-series "Battlemage" graphics cards—soon followed up with an updated version of TechPowerUp GPU-Z; adding "PCI vendor detection for ONIX." The emerging Chinese manufacturer's Odyssey OC and Lumi OC models are currently "out of stock" on the Newegg store, but compelling pricing ($10 above Intel's baseline MSRP) has attracted press coverage.

It is not clear whether initial supplies of the two ONIX cards were snapped up quickly, but Newegg states on both listings: "this product is temporarily out of stock because of high demand, we will replenish it as soon as possible." Currently, the Arc B580 Odyssey OC 12 GB (black) model is priced at $259.99, while its Lumi OC (white) sibling goes for $269.99—note: Newegg demands a $9.99 fee for shipping. VideoCardz reckons that ONIX is competing closely with Sparkle—a veteran Intel GPU board partner—and charging less than GUNNIR for equivalent specs/fittings. ONIX's official website features a product page for an Odyssey B570 10 GB model—not listed by Newegg, but we expect it to turn up soon. Intel and its AIBs declared B570's retail availability last week.

Report: Intel Could Face Acquisition, Units to Remain Together

Multiple sources say an unidentified corporation is exploring the complete acquisition of Intel Corporation, according to tech publication SemiAccurate. The report points to an internal memo shared among a small group of top executives at the unnamed firm. A high-level insider confirmed the memo's legitimacy last week, reinforcing speculation that a purchase of Intel may be under serious consideration. SemiAccurate's report indicates that the prospective buyer has enough financial resources to acquire Intel outright, considering the company's current market valuation. Notably, this potential buyer has not been publicly identified in previous discussions about Intel's future, suggesting that planning has occurred behind closed doors. The memo's limited circulation hints that executives treat the proposal cautiously rather than engaging in casual exploratory talks.

Any attempt to purchase Intel would require extensive regulatory review, given the company's role in producing semiconductors for both commercial and government applications. Regulators would likely evaluate issues related to national security, supply chain stability, and competitive impact in the global chip market. While neither Intel nor the unidentified acquirer has issued an official statement on the rumor, we are watching for any signals of formal negotiations. Intel has long been a strategic source of the US semiconductor sector, and its potential ownership change would have to be domestic. If a deal does materialize, it would stand among the largest transactions in the technology field.

Intel Foundry Adds New Customers to RAMP-C Project for US Defense

Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD (R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry's leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD).

"We are very excited to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to the RAMP-C project we are engaged in with the DoD. The collaboration will drive cutting-edge, secure semiconductor solutions essential for our nation's security, economic growth and technological leadership. We are proud of the pivotal role Intel Foundry plays in supporting U.S. national defense and look forward to working closely with our newest DIB customers to enable their innovations with our leading-edge Intel 18A technology," said Kapil Wadhera, vice president of Intel Foundry and general manager of Aerospace, Defense and Government Business Group.

GMK G9 Mini PC Unveiled With 4x M.2 2280 Slots and Dual 2.5G LAN

The newly unveiled GMK G9 is not here to set any records in terms of raw performance. However, it does pack a different trick up its sleeve - impressive storage capabilities, allowing for its use as an affordable NAS. GMK has not revealed any price or availability details as of now, although Liliputing did manage to dig up a retailer listing which reveals that the G1 mini PC will start at an affordable $289 for the base variant with 12 GB of memory and no SSD storage, whereas the same unit with 512 GB of storage will command an extra $30.

The GMK G9 is powered by Intel's N150 processor - a slightly higher-clocked version of the N100, which packs a total of four cores and four threads, a boost clock of 3.6 GHz, and a modest 6-watt TDP. As mentioned previously, the G1 is by no means a performance system, and packs just enough computing grunt to function as a lightweight daily driver or a NAS. The system can be equipped with up to 12 GB of LPDDR5-4800 memory and 64 GB of eMMC storage. To justify its NAS credentials, the G1 packs a whopping four M.2 2280 slots, allowing for a maximum of 32 TB of SSD storage. The port selection is plenty decent as well, including a USB-C port, triple USB-A ports, dual HDMI ports, a 3.5 mm audio jack, and of course, dual 2.5G RJ-45 LAN ports. For the price and the features offered, the G1 sure does like a commendable choice for a nifty little home server.

Intel Arc GPU Graphics Drivers 101.6458 WHQL Released

Intel today released the latest version of the Arc GPU Graphics Drivers. Version 101.6458 WHQL comes with support for the new Arc B570 graphics card the company launched today. The drivers also add support for the Xe-LPG iGPU of Core Ultra 200H series "Arrow Lake-H" mobile processors. For Core Ultra 200-series iGPUs, the drivers add an up to 6.8% performance uplift in "Call of Duty: Black Ops 6." The drivers address an issue with "Indiana Jones and the Great Circle" where the game exhibits inconsistent performance and memory usage. "Shadow of the Tomb Raider" saw an intermittent application crash and display corruption in the game menu with XeSS enabled, which has been fixed. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6458 WHQL

Intel Arc B570 Graphics Card Available from Today

Intel today formally launched its second graphics card from the Arc "Battlemage" family, the Arc B570. This card is being launched at $220, or $30 cheaper than the Arc B580 from last month. With it, the company is looking to disrupt several products around the $200-mark, and probably even wage price wars below that mark. The card is designed to offer a 1080p AAA gaming experience enhanced with ray tracing, and the XeSS 2 feature set (super resolution, frame generation, and low-latency). Given that there is no RTX 3050 successor from NVIDIA, or anything from AMD around this price point, except older generation RX 6600-series products, the B570 could be poised to grab a chunk of the value-ended gaming PC market share.

The Arc B570 is based on the same 5 nm "BMG-G21" silicon that also powers the B580. It has 18 Xe cores enabled across five Render Slices, giving it 112 EU (execution units), or 2,240 unified shaders. Other key specs include 144 XMX cores for AI acceleration, 18 ray tracing units, 144 TMUs, and 60 ROPs. Perhaps the biggest differentiator between the B570 and B580 is memory, the B570 gets 10 GB of it, over a 160-bit wide GDDR6 memory bus, on which it runs 19 Gbps memory to yield 380 GB/s of memory bandwidth. With a total board power of 150 W compared to the 190 W of the B580, the B570 makes do with a single 8-pin PCIe power connector on even the factory overclocked parts. Intel has set a $220 baseline price, however, there is no reference design card, and the cheapest custom design cards start at $230, with an included factory overclock. We reviewed two such cards today, you can find them in the links below.

Read the TechPowerUp Reviews of the ASRock Arc B570 Challenger OC and the Sparkle Arc B570 Guardian OC.

Alphacool Unveils New Apex 1 CPU Cooler for AMD AM5 and Intel LGA 1700/1851 Sockets

Alphacool presents the Apex 1, the first CPU water cooler in the Apex series. It combines maximum cooling performance, exceptional design, and a high-quality selection of materials. The Apex 1 integrates the proven cross-slot technology with the new 3D-Jetplate 2.0, ensuring optimal cooling performance for both AMD and Intel processors of the latest generation. A pre-chamber in front of the 3D-Jetplate 2.0 smooths the incoming water flow and evenly distributes it across the Jetplate and the copper base's cooling fins. Both the copper base and the brass connector part are precisely CNC-machined to guarantee top-notch manufacturing quality.

Alphacool offers two versions of the cooler. The AMD AM5 version features an offset cooler base, which does not sit centrally on the CPU. Instead, it is positioned to direct the water injection right above the CPU hotspot. The Intel version has a centrally positioned cooler base that covers the entire CPU. Both versions ensure outstanding cooling performance. The cooler's design is made to fully cover the CPU socket and mounting holes. This does not affect the installation, which remains incredibly simple. Additionally, the coolers come equipped with aRGB lighting, positioned both on the top and on the side towards the RAM, perfectly complementing the design.

ASUS Announces ExpertBook B3 Series Laptops

ASUS today announced the ExpertBook B3 series, an all-new lineup of AI-powered laptops that offers extensive customization to empower daily business needs. Equipped with up to the latest Intel Core Ultra 7 processor (Series 2) with Intel vPro, Intel AI Boost NPU and Intel Arc graphics, ExpertBook B3 delivers solid performance to tackle a wide range of tasks seamlessly. These new laptops also feature powerful AI tools such as ASUS AI ExpertMeet], Microsoft Copilot and AI noise-canceling technology, delivering unmatched productivity experiences.

With a build that's as lightweight as 1.4 kg, a 180° lay-flat hinge, military-grade durability, comprehensive connectivity, and advanced security features, the latest ExpertBook B3-series AI PCs ensure flexibility and efficiency on the go. In addition, with long battery life, exceptional visuals and audio, and an eco-friendly design, ExpertBook B3 series supports streamlined workflows - keeping employees productive, wherever they work.

G.Skill Announces DDR5-6400 CL30 96GB (2x 48GB) Low-Latency Memory Kits

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of low latency DDR5-6400 CL30-39-39-102 memory specification in high-capacity kit configurations, up to 96 GB (2x 48 GB) kit capacity. This high performance memory kit specification will be available under the Trident Z5 RGB and Trident Z5 Royal series, with Intel XMP 3.0 memory overclock profile support.

The G.SKILL DDR5-6400 CL30 memory kit at 96 GB (2x 48 GB) combines high-capacity and low-latency to enable higher performance for memory intensive platforms and uses. The screenshot below shows this 96 GB (2x 48 GB) memory kit operating at DDR5-6400 CL30-39-39-102 with the ASUS ROG Maximus Z890 Hero motherboard and Intel Core Ultra 7 265K desktop processor.

Supermicro Empowers AI-driven Capabilities for Enterprise, Retail, and Edge Server Solutions

Supermicro, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing the latest solutions for the retail industry in collaboration with NVIDIA at the National Retail Federation (NRF) annual show. As generative AI (GenAI) grows in capability and becomes more easily accessible, retailers are leveraging NVIDIA NIM microservices, part of the NVIDIA AI Enterprise software platform, for a broad spectrum of applications.

"Supermicro's innovative server, storage, and edge computing solutions improve retail operations, store security, and operational efficiency," said Charles Liang, president and CEO of Supermicro. "At NRF, Supermicro is excited to introduce retailers to AI's transformative potential and to revolutionize the customer's experience. Our systems here will help resolve day-to-day concerns and elevate the overall buying experience."

Simply NUC Launches NUC 14 Essential Mill Canyon

Simply NUC, a global leader in customized computing solutions, proudly announces the launch of the NUC 14 Essential - Mill Canyon, designed to deliver powerful yet affordable performance for everyday computing needs. Whether used in retail kiosks, collaborative workspaces, streaming environments, or digital signage, the Mill Canyon NUC offers the flexibility and reliability required for modern applications.

The NUC 14 Essential is powered by the latest Intel N-series processors with Twin Lake technology, offering a range of options ensuring top-tier performance across various workloads. Mill Canyon delivers the performance needed for day-to-day operations without breaking the budget, featuring up to 8-core Intel Core 3 processors, 16 GB DDR5 memory, and support for up to 8 TB of NVMe and 2 TB SATA storage.

Intel to Separate Intel Capital Into Standalone Investment Fund

Intel Corporation ("Intel") today announced its intention to separate Intel Capital, its global venture capital arm, into a standalone fund. The new fund will bring Intel Capital's corporate structure into alignment with other leading venture firms, enabling greater autonomy and the flexibility to attract external capital. Intel will remain an anchor investor in the new company.

"The separation of Intel Capital is a win-win scenario as it provides the fund with access to new sources of capital to expand its franchise while allowing both companies to continue benefiting from a productive long-term strategic partnership," said David Zinsner, interim co-chief executive officer and chief financial officer of Intel. "This step supports our broader strategy to maximize the value of our assets while driving greater focus and efficiency across the business."

Intel 12th Gen "Alder Lake" Mobile CPUs Face Retirement, HX-series Spared

Intel product change notification documents—published on January 6—have revealed the planned "End of Life" (EOL) phasing out of 12th Generation "Alder Lake" mobile processor models. Tom's Hardware has pored over the listed products/SKUs and concluded that the vast majority of Team Blue's mobile-oriented Alder Lake selection are destined for retirement. Team Blue's HX series is being kept alive for a little while longer. Two documents show differing "discontinuance timelines" for their respective inventories—including lower-end Celeron and Pentium Gold SKUs, as well as familiar higher-up Core i3, i5, i7, and i9 families. U, P, H and HK-affixed models are lined up for the chopping block.

Intel's 13th Generation "Raptor Lake" mobile processor selection—comprised of Core 100 (series 1) and Core 200 (series 2)—offers similar silicon makeup. Many equivalent alternatives to older generation "Alder Lake" chips reside here—Tom's Hardware presented a key example: "i5-1235U, which is designated for thin and lightweight laptops. OEMs can instead opt for the i5-1335U, the Core 5 120U, or the Core 5 220U, as they're just better bins of the 1235U on the same FCBGA1744 socket." A significant number of Alder Lake mobile SKUs will be available to OEMs for ordering up until 26 April, with final shipments heading out on 25 October. The rest have been assigned a July 25 order cut-off date, with final shipments scheduled on 26 January 2026.

First Taste of Intel Arc B570: OpenCL Benchmark Reports Good Price-to-Performance

In the past few weeks, all eyes have on NVIDIA's and AMD's next-gen GPU offerings, and rightly so. Now, it's about time to turn our attention to what appears to be the third major player in the GPU industry - Intel. This is, of course, all thanks to the Blue Camp's wildly successful Arc B580 launch, which propelled the beleaguered chip giant to the favorable side of the GPU price-to-performance line.

Now, it appears that a fresh leak has revealed how its soon-to-be sibling, the Arc B570, is about to perform. The leaked performance data, courtesy of Geekbench OpenCL, reveals that the Arc B570 is right around 11% slower than the Arc B580 in the synthetic OpenCL benchmark, which makes complete sense, because the card is also expected to be around 12% cheaper than its more powerful sibling, as noted by Wccftech. With a score of 86,716, the Arc B570 is well ahead of the RX 7600 XT, which manages around 84000 points, and well behind the RTX 4060, which rakes in just above 100000.

ASUS Announces NUC 14 Essential

ASUS today announced ASUS NUC 14 Essential, an ultracompact, entry-level mini PC powered by the latest Intel Core N-series processor. Designed for exceptional performance and enhanced power efficiency, the capabilities of NUC 14 Essential are further boosted by a versatile array of ports including Bluetooth 5.3 and Intel Wi-Fi 6E (Gig+). Support for up to three 4K displays provides users with smooth multitasking experiences, allowing them to stream videos, create content, and analyze data with ease.

Energy-efficient performance in a compact package
The latest Intel Core N-series processor enables ASUS NUC 14 Essential to make light work of daily office tasks. Featuring up to eight E-core architectures, the processor offers a perfect balance of energy efficiency and performance, offering a 42% improvement over previous-generation processors. NUC 14 Essential lets users browse the web, attend videoconferences, stream videos, or create content with ease, making it ideal for office workers and students.

ENERMAX Launches LIQTECH XTR, Workstation-Level CPU AIO Cooler

ENERMAX is proud to be launching its new workstation-level CPU AIO cooler: LIQTECH XTR. Specifically designed for the AMD Ryzen Threadripper and Intel Xeon W series processors with a cooling capacity of over 550 W. LIQTECH XTR AIO cooler debuted at Computex 2024 with a live demo, achieving a cooling capacity of over 550 W. The LIQTECH XTR 360 mm CPU cooler features an enlarged cold plate design on its water block, fully covering the IHS area of both AMD Threadripper and Intel Xeon W series processors. Thanks to ENERMAX's high-efficient EP1 pump with a 450L/h flow rate and 3000 RPM radiator fans, LIQTECH XTR can provide more than 550 W cooling capacity on both AMD and Intel platforms.

LIQTECH XTR AIO cooler is also the first ENERMAX CPU cooler to implement the magnetic, fully rotatable, real-time status digital display. Users can manually adjust the LED screen on the water block to set their preferred digital direction. The additional software, ENERMAX's tuner, can further provide a real-time data showing on the water block. ENERMAX's LIQTECH XTR AIO cooler is the perfect cooling solution for workstations that need to perform heavy duty tasks such as 3D rendering, product visualization & simulation, artificial intelligence (AI), and machine learning acceleration. It fully supports AMD socket sTR5/SP6/sWRX8/sTRX4/TR4/SP3 and Intel socket LGA 4677.

Samsung Shows Galaxy Book5 Pro and Galaxy Book5 360 at CES 2025

Samsung has revealed two new laptop models at CES 2025: the Galaxy Book5 Pro and Galaxy Book5 360, both featuring Intel's latest processors and artificial intelligence capabilities. The Galaxy Book5 Pro comes in two sizes. The 16-inch version weighs 1.56 kg and includes a 76.1Wh battery, while the 14-inch model weighs 1.23 kg with a 63.1 Wh battery. Both laptops use AMOLED displays with 2880×1800 resolution and variable refresh rates from 48 to 120 Hz. Storage options reach 1 TB, with either 16 GB or 32 GB of memory available.

The Galaxy Book5 360 features a 15.6-inch touchscreen that can fold back 360 degrees, effectively turning the laptop into a tablet. It has a 1920×1080 resolution display and weighs 1.46 kg, with a 68.1 Wh battery. Both models use Intel's Core Ultra processors with built-in NPUs that Samsung uses for features like AI Select for searching and Photo Remaster for image enhancement. The laptops also integrate with other Samsung devices through features like Multi Control for unified device navigation and Quick Share for file transfers. The new laptops include standard connectivity options like Wi-Fi 7 and Bluetooth 5.4. Samsung claims the Pro models can achieve up to 25 hours of battery life, though real-world usage typically yields shorter durations.

G.Skill Demos DDR5-8133 2x24GB CSO-DIMM on ASRock DeskMini B860 System

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, demonstrates high-speed DDR5 CSO-DIMM memory operating at DDR5-8133 with 48 GB (2x24GB) kit capacity on the newly announced ASRock DeskMini B860 system. CSO-DIMM is a relatively new form factor that adds a clock driver (CKD) onto the compact SO-DIMM design, and is supported by the latest platform generation with Intel Core Ultra 200 series processors.

DDR5-8133 48 GB (2x24GB) Extreme Speed with CSO-DIMM Modules
Thanks to the ASRock DeskMini B860 system that implements DDR5 CSO-DIMM support and provides outstanding memory overclock performance, G.SKILL is able to unleash the ultimate overclock potential of the new high-speed CSO-DIMM memory kits. The screenshot below shows the G.SKILL CSO-DIMM memory kit with 48 GB (2x24GB) running at DDR5-8133 CL46-52-52-130 with the ASRock B860M-STX motherboard and the Intel Core Ultra 9 285 desktop processor.

Ventiva Showcases Fan-less Cooling Solution in Intel-powered PC Concept

Ventiva, the leader in thermal solutions, today announced that its Ventiva ICE9 thermal management suite is being featured in a fan-less proof-of-concept laptop design, powered by Intel Lunar Lake processors at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12 mm laptops.

"Ventiva ICE technology offers a revolutionary approach to help achieve thin, light, and silent laptop designs that offer great performance," said Josh Newman, Vice President, Client Computing Group, and General Manager, Product Marketing & Management, Intel. "Intel is excited about the result of the close co-engineering collaboration with Ventiva and Dell Technologies to help ready their technology for future Intel Core Ultra devices."

AAEON Breaks into the Graphics Card Market with the Intel Arc GPU-Powered GAR-A750E

AAEON, has today announced the release of the GAR-A750E, the company's first advanced graphics card. Built on Intel Arc A750E GPU architecture, the GAR-A750E features 28 Xe-Cores and supports a variety of advanced AI development frameworks in a discreet 236 mm x 109 mm x 42 mm form factor. Designed to handle intensive AI workloads, the GAR-A750E offers substantial raw computing power, with a graphics turbo frequency of 2400 MHz alongside the AI task acceleration capabilities of 448 Intel XMX Engines. Along with its high performance benchmark, the card's Intel Deep Link Technology support—which includes Hyper Compute, Hyper Encode, and Stream Assist - allows it to optimize the Intel Arc A750E GPU's capabilities while maximizing efficiency for efficient multi-tasking and accelerated workflows.

The GAR-A750E is easily integrated into a number of systems and motherboards via PCIe Gen 4 (x16) interface, with AAEON already having confirmed its suitability for use with a number of its own industrial motherboard platforms, including the ATX-Q670A, MAX-Q670A, and MIX-Q670A1, all supporting 13th Generation Intel Core CPUs and built on the Intel Q670E Chipset.

HP Shaping the Future of Play at CES 2025

Today's gamers are not just players; we are the innovators and leaders of tomorrow's workforce. As someone who recognizes the incredible potential within our gaming community, I'm committed to supporting your journey both in and out of the game. In our latest announcements focusing on the future of play and work, we've shared exciting updates across various fronts, including some major innovations in gaming. I'm thrilled to introduce even more gear designed to enhance your gaming experience. From the powerful OMEN 16 Laptop and the compact OMEN 16L Desktop to our stunning new OMEN displays and precise HyperX mice, I can't wait to dive into the details and show you how these products will elevate your play and keep you ahead of the curve. We're not just creating innovations; we're shaping the future of play.

Power and Performance for All: The OMEN 16 Laptop and OMEN 16L Desktop
At HP, your feedback is our guiding star. You told us you want smooth, immersive gameplay on machines that stay cool and quiet; we created the third-generation OMEN 16 to be our coolest and quietest version yet. The OMEN 16 elevates your gaming experience with cutting-edge technology and thoughtful design, keeping performance at its peak. Let's dive into the technical specifics.

Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."
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