Lenovo recently announced its latest ThinkPad P52 mobile workstation designed for 3D rendering, content creation, and AI simulations. The laptop can be equipped with a 8th generation Intel Core or Xeon hexa-core processor. What's amazing with the Lenovo ThinkPad P52 is its ability to house up to 128 GB of DDR4 memory and 6 TB of storage. The P52 flaunts a 15.6-inch 4K display with a 10-bit color depth, 100% Adobe color gamut, and 400 nits of brightness. The laptop's graphics duties are delegated to a mobile high-end NVIDIA Quadro P3200 GPU with 6 GB of GDDR5 memory.

The ThinkPad P52 comes with two Thunderbolt 3 ports alongside three USB-A 3.1 Gen 1 ports, a HDMI 2.0 port, and a mini DisplayPort 1.4. It also comes with a Smart Card and an integrated 4-in-1 card reader. Internet connectivity includes a conventional RJ45 Gigabit Ethernet port, Intel Wireless-AC 9560 802.11ac adapter with integrated Bluetooth 5.0, and a Fibocomm 4G LTE (Cat 9) modem. The ThinkPad P52 isn't only fast, but it's probably one of the most secure mobile workstations to date. Lenovo implemented various security measures into the P52 such as TPM 2.0, IR camera, fingerprint reader, and ThinkShutter. The manufacturer didn't disclose the pricing of the ThinkPad P52. However, we'll find out soon as the laptop should be available by late June.

Security researchers have discovered a vulnerability affecting all modern Intel Core and Xeon processors, which is an exploit of a performance optimization feature called "lazy FP state restore," which can be exploited to sniff out sensitive information, including cryptographic keys used to protect sensitive data. The flaw affects all x86 micro-architectures by Intel, "Sandy Bridge" and later.

The "lazy FP state restore" feature is a set of commands used to temporarily store or restore the FPU states of applications running "lazily" (as opposed to "eagerly"). Red Hat put out an advisory stating that numbers held in FPU registers could be used to access sensitive information about the activities of other applications, including encryption keys. Intel began working with popular OS vendors to quickly roll out software patches against the vulnerability.

ASUS today introduced the WS X299 SAGE/10G, a step up variant of the WS X299 SAGE it launched back in Q4-2017. As you can tell from the model name, this board's star-attraction is 10 Gbps Ethernet. It features not one, but two 10 GbE interfaces, replacing the dual 1 GbE interfaces of the original. These interfaces aren't backed by low-cost controllers, but the Intel X550-AT2 "Sageville," which is an $80 chip by itself, and drives both interfaces.

ASUS also used the opportunity to improve the CPU VRM a bit. Although it's still the same combination of chokes and MOSFETs, pulling power from two 8-pin EPS connectors, ASUS improved the secondary VRM heatsink, which pulls heat from the main heatsink over a flattened heat-pipe. This heatsink is now made of a dense aluminium fin-stack like the main heatsink, a section of which protrudes all the way to the rear I/O shield. The rear I/O now consists of four USB 3.1 gen 1 ports, two USB 3.1 gen 2 ports (including a type-C port), and the 8-channel HD audio cluster, besides the two 10 GbE ports. The rest of the board's feature-set is unchanged from the original. We expect a $100 premium over the original's price.

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

Intel researchers are taking new steps toward quantum computers by testing a tiny new "spin qubit" chip. The new chip was created in Intel's D1D Fab in Oregon using the same silicon manufacturing techniques that the company has perfected for creating billions of traditional computer chips. Smaller than a pencil's eraser, it is the tiniest quantum computing chip Intel has made.

The new spin qubit chip runs at the extremely low temperatures required for quantum computing: roughly 460 degrees below zero Fahrenheit - 250 times colder than space. The spin qubit chip does not contain transistors - the on/off switches that form the basis of today's computing devices - but qubits (short for "quantum bits") that can hold a single electron. The behavior of that single electron, which can be in multiple spin states simultaneously, offers vastly greater computing power than today's transistors, and is the basis of quantum computing.

Today, HP is introducing the new HP ProBook x360 440 G1 laptop PC designed to adapt to the way growing businesses and on-the-go professionals work. Business owners and mobile professionals want a powerful convertible PC that delivers the business performance features required to help address their company needs - both in and outside the office. These are users with passion for business that need a versatile device which combines style, powerful processing, and "built for business" features to deliver enhanced business experiences that typically cannot be achieved with a consumer PC.

Powered by Windows 10 and high-performance 8th Gen Intel Core processors, the ultra-slim ProBook x360 440 delivers the power, security, and durability growing businesses demand in a versatile 360° design. Users can quickly turn thoughts into action with the optional HP Active Pen, and easily transition to desktop productivity with a single cable that supports docking via USB-C .

ASUS today announced VivoBook Flip 14 (TP412), a stylish new addition to the VivoBook Flip Series of convertible laptops featuring a 360°-flippable display that allows this versatile device to be used in laptop, stand, tent and tablet modes - or anything in between.

VivoBook Flip 14 features an ASUS NanoEdge touchscreen with a 6.15mm-thin bezel for more immersive viewing. Powered by up to an 8th Generation Intel Core i7 processor with 16GB memory for powerful and energy-efficient performance, VivoBook Flip 14 is also equipped with up to a 1TB SSD and a touchpad-mounted fingerprint sensor for one-touch login via Window Hello. VivoBook Flip 14 also supports the ASUS Pen active stylus for accurate input and writing with a natural, responsive feel.

ASUS today announced the new ZenBook Pro 15 with ScreenPad (UX580), a high-performance professional-grade laptop that innovates how the touchpad is used. The ZenBook Pro 15 with ScreenPad is built for demanding professionals who value power, top-end specifications, and innovation in an elegant design. The ZenBook Pro 15 provides compelling performance thanks to up to an 8th generation Intel Core i9 processor, NVIDIA GeForce GTX 1050 Ti discrete graphics, ultra-fast PCI Express -based storage, high-speed 2400MHz DDR4 RAM, 802.11ac Wave 2 gigabit-class Wi-Fi and Thunderbolt 3 USB Type-C ports. The ZenBook 15 Pro with ScreenPad also features a built-in fingerprint reader for fast, convenient and secure one-touch Windows Hello login.

The ZenBook 15 Pro with ScreenPad's beautiful up to 4K display provides professional-level visuals covering 100% of the Adobe RGB color space and 132% of sRGB, and providing guaranteed color accuracy with a Delta-E (ΔE) color difference of less than 2.0. The ZenBook 15 Pro with ScreenPad also features ASUS' ultra-slim NanoEdge bezels for an immersive 83% screen-to-body ratio.

MSI, world's leading brand in gaming hardware, has lifted the curtain for its two brand new laptops at Computex 2018, the GF63 and the PS42. Respectively tailored for gamers and professionals, both models feature the ever-so-popular thin bezel design. The near edge-to-edge aesthetics are not only lighter in weight but also smaller in dimension. Together with the previously-announced GS65, MSI has set a new standard for portability with the "Thin Bezel Gaming" genre.

GF63: Bringing thin and light gaming to the mainstream.
The brand new GF63 debuts in Computex with its 15.6" ultra slim footprint and thin bezel with measuring less than 2 kg in weight. Continuing MSI's gaming DNA and powerful performance, the GF63 carries up to 8th Gen. Intel Core i7 processor and NVIDIA GeForce GTX 1050 Ti graphics, while lasting over 7 hours in battery life. The GF63 provides gamers a new choice of "portable gaming firepower!"

Lenovo, at Intel's Computex presser, revealed a product that could put Apple design to shame. The new Yoga Book Generation 2 is a notebook+tablet convertible, with two displays on the opposite sides of the conventional clam-shell. In the notebook mode, the bottom half converts to a keyboard, with actuators providing tactile feedback. Since the bottom half's screen is a touchscreen as much the top half, you can configure the keyboard layout and "trackpad" position any which way you want. When not typing, the bottom half becomes an extended screen of the top half. Under the hood is a "new generation" processor (very likely the 10 nm Core M3-8114Y).

Intel today announced the Core i7-8086K six-core processor in the LGA1151(v2) package, compatible with 300-series chipset. This processor commemorates 40 years since the company's 8086 processor, which was the spiritual ancestor of the x86 architecture that dominates modern day computing. Based on the same 14 nm "Coffee Lake" silicon as the i7-8700K, this chip features high clock speeds of 4.00 GHz nominal, with a maximum Turbo Boost frequency of 5.00 GHz. Like the i7-8700K, it features 256 KB of dedicated L2 cache per core, and 12 MB of shared L3 cache. The processor will go on sale from 8th June, the company didn't reveal pricing, but it's rumored to be a conspicuous USD 486.

Latest leak confirms that Intel is preparing new Xeon processors targeted at the entry level market. These Xeon chips, which are based on Coffee Lake-S, have been rebranded from Xeon E3 to Xeon E. The Xeon E-2000 family consists of ten models featuring up to six cores. They differ from their consumer Coffee Lake counterparts in terms of features, memory support, operating frequencies, and TDP ratings. Seven of the ten processors come with iGPUs as denoted by the G suffix in the model number. The new Xeon E-2000 processors will be manufactured in Intel's Vietnam facility. The first batches of these processors are expected to ship sometime around June 25, 2018.

ASRock, a global leader in motherboard, graphics card, and small form factor PC, today announced that it will demonstrate its Intel and AMD series motherboard, Phantom Gaming series graphics card, and blockchain solution at COMPUTEX Taipei 2018, from June 5 to June 9, 2018.

The cutting edge computing solutions will be part of ASRock exhibit, showcasing its latest technologies and solutions addressing the demands of daily computing, gaming, and blockchain computing applications, including:

• Intel 300 series motherboard;
• AMD B450 series motherboard;
• Latest Phantom Gaming series graphics card;
• The world's leading solution for blockchain and high performance computing;
• Small Form Factor Solution equipped with Intel 300 series chipset and Mini-STX motherboard.

ZOTAC Technology, a global manufacturer of innovation, is proud to unveil a wide range of upcoming products and hardware in COMPUTEX 2018. At the forefront are the next generation of ZBOX Mini PCs featuring next-gen CPU and gaming-grade network hardware, never-before-seen gaming machines from ZOTAC GAMING, the latest VR GO backpack with an all-new design, and award-winning PCs. An exclusive showcase of ZOTAC's leading innovations in graphics card, as well as a grand stage set for the defuse-filled ZOTAC CUP MASTERS Asia Regional Finals are also the show-stoppers to invigorate the excitement.

Two ZBOX Mini PCs which won the COMPUTEX 2018 d&i award takes center stage. First is the ZBOX CI660 nano with an all-new passive cooling chassis design inspired by the honeycomb, one of nature's most recognized and strongest structures. The first Mini PC to be equipped with an 8th Gen Intel Core i7 processor, the ZBOX CI660 nano can handle up to a 25W TDP processor and delivers the most powerful performance from a ZBOX C Series Mini PC in complete silence.

MSI, the pioneer and global leader enabling Professional industry, introduces today the brand new All-in-One PC, PRO 24X Series, with an incredibly ultra-slim design measuring only 6.5 mm thick. As slender as a ballpoint pen, its simple metallic slim stand elegantly complements the Ultra-slim display while its brushed metal patterning on the rear cover provides a stylish and contemporary design. The PRO 24X Series is equipped with IPS Grade Panel which instantly optimizes the screen colors and brightness to ensure that users can enjoy every scene at its best, and with an incredibly narrow 2.2mm ultra-slim bezel, it blends seamlessly into any workspace and helps users to focus on their professional tasks.

For a traditional All-in-One PC, it might be very difficult to upgrade the hardware, but with the MSI Easy Maintenance Design, maintaining or upgrading your 2.5" storage on the PRO 24X will not be a nightmare anymore. Furthermore, with Intel CoreTM i3 above processor, the PRO 24X supports Intel Optane technology which provides an unparalleled combination of high throughput, low latency, high quality of service, and high endurance. However, if users would like to enjoy a blazing fast system boot up and insanely quick loading of applications and data, this stylish model also supports one NVMe PCIe M.2 SSD.

Born to fulfill gamers' satisfaction, MSI and Intel team up to offer gamer a game software pack bundle which includes up to eight games available such as Warhammer: Vermintide II and X-Morph you must not be missing. By purchasing a selected Intel 300-series motherboards and desktops from MSI, we grant you a free $180 plus software pack. The bundle starts from May 1st to June 30th.

Jon Peddie Research, the industry's market research firm for the graphics industry, has updated it's quarterly Market Watch report. Overall, the report finds the crypto-currency market is continuing to influence the PC graphics market, though its influence is waning. Market watch found that year-to-year total GPU shipments increased 3.4%, desktop graphics increased 14%, notebooks decreased -3%. GPU shipments decreased -10% from last quarter: AMD decreased -6%, Nvidia decreased -10%, and Intel decreased -11%.

AMD increased its market share again this quarter benefiting from new products for workstations, and crypto-currency mining, Nvidia held steady, and Intel decreased. Over three million add-in boards (AIBs) were sold to cryptocurrency miners worth $776 million in 2017, and an additional 1.7 million were sold in the quarter.

GIGABYTE has released a compelling new choice in storage servers with a unique combination of performance, capacity and flexibility: the S451-3R0. Powered by dual Intel Xeon Scalable processors and with a capacity of 36 x 3.5" + 2 x 2.5" SSD / HDD, the S451-3R0 provides the best balance of throughput and density, making it extremely suitable for block or object storage, streaming media and big data.

Dual Intel Xeon Scalable Processors
The S451-3R0 features dual Intel Xeon Scalable processors, with up to 28 cores per CPU, making it extremely suitable for storage applications where high performance or heavy workloads are required. Each CPU socket supports the highest CPU thermal design power requirement of 205W, as well as Intel's Omni-Path connection technology to eliminate CPU to network latency. Six memory channels per CPU with two DIMM slots per channel are supported for DDR4 memory. Maximum memory capacity will depend on your CPU model with a maximum of 1.5TB per CPU.

Micron Technology Inc. and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology. Leveraging a proven 64-layer structure, the new 4bits/cell NAND technology achieves 1 terabit (Tb) density per die, the world's highest-density flash memory. The companies also announced development progress on the third-generation 96-tier 3D NAND structure, providing a 50 percent increase in layers. These advancements in the cell structure continue the companies' leadership in producing the world's highest Gb/mm2 areal density.

Both NAND technology advancements-the 64-layer QLC and 96-layer TLC technologies -utilize CMOS under the array (CuA) technology to reduce die sizes and deliver improved performance when compared to competitive approaches. By leveraging four planes vs the competitors' two planes, the new Intel and Micron NAND flash memory can write and read more cells in parallel, which delivers faster throughput and higher bandwidth at the system level. The new 64-layer 4bits/cell NAND technology enables denser storage in a smaller space, bringing significant cost savings for read-intensive cloud workloads. It is also well-suited for consumer and client computing applications, providing cost-optimized storage solutions.

Intel's woes with their 10 nm process have been well documented by now (and even if they hadn't, the absence of any real product on store shelves would be a dead giveaway). And as Intel struggles to get its process up and running - and is now ramping up production on comparatively simple Core i3 chips, which are smaller and less prone to costly silicon defects - AMD and other Intel rivals are gaining traction over the once too-slumbering giant.

As a result of Intel's 10 nm difficulties, analyst firm Susquehanna, who recently downgraded AMD and NVIDIA shares on the expected lowered demand for graphics products from these companies in the wake of the first ever Ethereum ASIC, has now revised AMD's share strategy. Previously set at "Sell", the firm now rates AMD's shares as "Neutral" - specifically citing Intel's difficulties in ramping up the new process as simply giving AMD more chances to catch-up and surpass its blue counterpart. Susquehanna's Christopher Rolland published a note to clients stating basically that - that "We believe Intel's delay will help to maintain/improve AMD's competitiveness for their next generation of EPYC and Ryzen products", adding that "(...) for the first time in memory, AMD will compete at a similar process technology as Intel, a strong multi-year tailwind".

Intel's Mobileye, the AI and self-driving feature the blue giant acquired last year for a cool $15.3 billion, has just announced, via an exclusive report to Reuters, that they've secured a contract to provide some 8 million self-driving systems to an European automaker. The deal is a future-focused one, and will see, by 2021, distribution for Intel's EyeQ5 chip, which is designed for fully autonomous driving - an upgrade to the EyeQ4 that will be rolled out in the coming weeks, Reuters reports, according to senior vice president for advanced development and strategy at Mobileye Erez Dagan.

Amnon Shashua, Mobileye's chief executive, said that "By the end of 2019, we expect over 100,000 Level 3 cars [where the car is self-driving but still allows for user intervention should the system be unable to progress for more than 10 seconds] with Mobileye installed." This deal is sure to make Intel even more of a player in the automotive space, where NVIDIA and a number of other high-profile companies have been making strides in recent years.

Intel updated the ARK information page for its stealthily launched 10 nm production chip, the Core i3-8121U "Cannon Lake," to confirm that the chip supports the new AVX-512 instruction-set. This is the first "mainstream" client-segment processor by the company to feature the extremely advanced instruction-set that, if implemented properly on the software side, can double performance/Watt compared to tasks that can take advantage of AVX2.

The instruction-set made its debut with the Xeon Phi "Knights Landing" HPC processor, and made its client-segment debut with the Core X "Skylake X" HEDT processors. It remains to be seen if the implementation of AVX-512 on "Cannon Lake" is complete, or if some instructions found on HPC processors such as the Xeon Phi are omitted due to irrelevance to the client platform.

The Israeli Government revealed that chipmaker Intel plans to expand its presence in the country for manufacturing and R&D. The company is reportedly preparing an ILS 18 billion (around USD $5 billion) investment toward expanding its Kiryat Gat manufacturing facility in southern Israel. The expansion will also include an ILS 3 billion expenditure by Intel on local suppliers. In return, Israel is giving Intel tax-breaks running up to 2027, where the company will be taxed at a reduced rate of 5 percent. The Government is also considering an ILS 700 million grant to the company. Intel is one of the largest employers and manufacturers in Israel. The company exported $3.5 billion worth goods and services from the country in 2017.

The potential impact of Artificial Intelligence (AI) has never been greater - but we'll only be successful if AI can deliver smarter and more intuitive answers. A key barrier to AI today is that natural data fed to a computer is largely unstructured and "noisy."

It's easy for humans to sort through natural data. For example: If you are driving a car on a residential street and see a ball roll in front of you, you would stop, assuming there is a small child not far behind that ball. Computers today don't do this. They are built to assist humans with precise productivity tasks. Making computers efficient at dealing with probabilities at scale is central to our ability to transform current systems and applications from advanced computational aids into intelligent partners for understanding and decision-making.

The White House today is hosting executives from 38 companies for a grueling, embattled day of trying to move through the as of yet murky waters of AI development. The meeting, which includes representatives from Microsoft, Intel, Google, Amazon, Pfizer, and Ford, among others, aims to gather thoughts and ideas on how to supercharge AI development in a sustainable, safe, and cost-effective way.

Fields such as agriculture, healthcare and transportation are being spearheaded as areas of interest (military applications, obviously, are being discussed elsewhere). The Washington Post quotes Michael Kratsios, deputy chief technology officer at the White House, as saying in a recent interview that "Whether you're a farmer in Iowa, an energy producer in Texas, a drug manufacturer in Boston, you are going to be using these techniques to drive your business going forward."