Intel Corporation announced today the Intel Solid-State Drive 525 Series (Intel SSD 525 Series) in a small mSATA form factor with 6-gigabit-per-second (Gb/s) performance. The Intel SSD 525 Series gives OEM customers, channel and tech enthusiasts an ultra-portable, low-power storage solution in one-eighth the space of a traditional 2.5-inch hard disk drive (HDD) to drive innovative Ultrabook, tablet and embedded applications.

The Intel SSD 525 is the latest entry to the Intel 500 Series SSD Family aimed at higher-performance, enthusiast solutions. Measuring 3.7 mm x 50.8 mm x 29.85 mm and weighing 10 grams, the mSATA with PCI Express (PCIe) mini-connector delivers the performance of the company's Intel SSD 520 Series client drive. This makes the Intel SSD 525 suitable for All-in-One desktops, notebooks, Ultrabooks and workstation upgrades, as well as automotive, digital signage, embedded video and retail solutions.

Intel Corporation today announced that its board of directors promoted five corporate officers and elected three new corporate vice presidents. William M. Holt, 60, was elevated from senior vice president to executive vice president. He is general manager of the Technology and Manufacturing Group and jointly oversees all technology development and manufacturing activities across the company. Holt joined Intel in 1974, was named a senior vice president in 2006, and is based in Hillsboro, Ore.

Thomas M. Kilroy, 55, was promoted from senior vice president to executive vice president. He is general manager of Intel's Sales and Marketing Group and is responsible for all of the company's sales and marketing efforts worldwide. Kilroy joined Intel in 1990, was named a senior vice president in 2010, and is based in Hillsboro, Ore.

Intel's performance-segment mSATA SSDs, the SSD 525 series, started selling in Japan under OEM packaging, although freely available in ground stores (much like bare hard drives). Based on the LSI-SandForce SF-2281 processor and Intel's own 25 nm MLC NAND flash chips, the SSD 525 is available in four capacities: 30 GB, 120 GB, 180 GB, and 240 GB. The 240 GB variant stands out, with speeds of up to 550 MB/s reads with 500 MB/s writes; while the others max out at 500 MB/s reads with 275 MB/s writes. The 30, 120, 180, and 240 GB variants are priced at 5,180¥ ($57), 14,480¥ ($160), 20,800¥ ($228), and 26,980¥ ($295), respectively.

Intel Corporation's board of directors has declared a 22.5 cents-per-share (90 cents-per-share on an annual basis) quarterly dividend on the company's common stock. The dividend will be payable on March 1, 2013 to stockholders of record on Feb. 7, 2013.

"With the payout of this quarterly dividend, Intel's dividend and stock buyback program will have returned approximately $119 billion to stockholders since the program's inception," said Intel president and CEO Paul Otellini. "This is a testament to our commitment to return cash to our stockholders as we continue to generate strong cash flow driven by the combination of new products and design wins from the lowest power portable devices to the most powerful data center servers."

According to a new market research report, "Global Micro Servers Market (2013 - 2018), By Processor Type (Intel, Arm, Amd), Component (Hardware, Software, Operating System), Application (Media Storage, Data Centers, Analytics, Cloud Computing) & Geography (North America, Europe, Asia Pacific, Row)", published by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018.

In a simpler terminology, micro servers can be termed as servers that multiple mobile processor chips, consume low power, use less space and are specifically used by small to medium - sized businesses. Micro servers find their major application in media storage and internet data centre especially for applications like lightweight web serving, simple content delivery nodes and low end dedicated hosting. It was identified that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in the next five years it is expected to reach 25 to 30% per cent of the global server market.

We've known for a while that Intel's 4th generation Core "Haswell" line of processors are going to miss the 2013 International CES. It turns out the new line of processors will be launched in June, in fact right on the backdrops of the 2013 Computex, the year's biggest PC hardware expo. A few days ahead of Computex, Intel will host a press-conference announcing the processors with downstream partners. The processors, and related products (motherboards, coolers), will be exhibited at Computex, and market availability will soon follow. The company is optimistic about the new chips, estimating them to make up 14-16 percent of its CPU shipments by the end of Q3 2013 (September).

Keeping up with an updated launch roadmap for Q1 2013 posted last November, Intel rolled out entry-level Celeron and Pentium dual-core processors based on its 22 nm "Ivy Bridge" silicon. All of the seven desktop and four mobile chips announced occupy price-points under $100. The desktop lineup begins with the Celeron G1610 (2.60 GHz, dual-core, 55W TDP), priced at US $42; Celeron G1610T (2.30 GHz, dual-core, 35W TDP) at $42; followed by Celeron G1620 (2.70 GHz), priced significantly higher at $52; Pentium G2010 (2.80 GHz, dual-core, 55W TDP) and G2020 (2.90 GHz), and G2020T (2.50 GHz, 35W TDP) at $64; and Pentium G2130 (3.20 GHz, dual-core, 55W TDP) at $86.

Intel has two kinds of Celeron mobile processors, targeting the mainstream and Ultrabook-like notebook form-factors. Among the mainstream notebook processors are the Celeron 1000M (1.80 GHz, dual-core, 35W TDP) and Celeron 1020M (2.10 GHz, dual-core, 35W TDP). Among the Ultrabook-like form-factor models are the Celeron 1007U (1.50 GHz, dual-core, 17W TDP), and Celeron 1037U (1.80 GHz, dual-core, 17W TDP). Interestingly, all four mobile Celeron "Ivy Bridge" CPU models are priced at $86, in 1000-unit tray quantities.

In addition to the industry's first fully-patterned 450 mm wafer, Intel announced that its 14 nanometer silicon fabrication node at three of its fabs will begin this year. The next leap forward from 22 nm, on which two of the company's CPU generations "Ivy Bridge" and "Haswell" are based, the 14 nm node will eventually facilitate production of the company's 5th generation Core "Broadwell" processors, which are due to arrive in 2014. Given the pace at which the 14 nm node is being developed, some of the first Broadwell Core chips, at least engineering samples, will be released to the industry within 2013. Among the three Intel facilities with 14 nm nodes are D1X, located in Oregon; Fab 42, located in Arizona; and Fab 24, located in Ireland.

At the SEMI Industry Strategy Symposium (ISS) held late last week, Intel unveiled the pride of its fabs, the industry's first fully-patterned (ready to slice) 450 mm wafer. Major semiconductor fabs around the world are locked in a race for who gets volume-production on 450 mm wafers going first. Among the contenders are Taiwan's TSMC, UAE's GlobalFoundries, and Korea's Samsung, and with the unveiling of the first fully-patterned wafer, Intel appears to have announced its lead. The 450 mm (diameter), thanks to its large surface area, significantly increases yields.

"[This] is an important step forward and it indicates that there will soon be substantial volume of patterned test wafers for use by suppliers in developing their 450 mm tools," stated Chuck Mulloy, a spokesperson for Intel. As for what Intel etched on the wafer, a report claims it could be large dies of simple (highly-patterned) devices such as flash. The fab reportedly used Impints' J-Fil imprint lithography technology that demonstrated 24 nm patterning with line edge roughness of less than 2 nm to 3Σ and critical dimension uniformity to 1.2 nm 3Σ, offering the prospect of 10 nm patterning with single-step process.

Intel Corporation today reported full-year revenue of $53.3 billion, operating income of $14.6 billion, net income of $11.0 billion and EPS of $2.13. The company generated approximately $18.9 billion in cash from operations, paid dividends of $4.4 billion, and used $4.8 billion to repurchase 191 million shares of stock.

For the fourth quarter, Intel posted revenue of $13.5 billion, operating income of $3.2 billion, net income of $2.5 billion and EPS of 48 cents. The company generated approximately $6 billion in cash from operations, paid dividends of $1.1 billion and used $1.0 billion to repurchase 47 million shares of stock.

Lenovo today announced the ThinkPad X131e Chromebook -- a fast booting, highly customizable ThinkPad built with rugged features for the daily rigors of K-12 education. The ThinkPad X131e Chromebook simplifies software and security management for school administrators and provides students and teachers with quick access to thousands of apps, education resources and storage.

Throughout the course of a typical school day, students' laptops are often subject to extreme wear and tear. To help school-proof them, the ThinkPad X131e has rugged features including a rubber bumper around the top cover and stronger corners to protect the system in the case of an accidental drop. The hinges and hinge brackets are also strengthened to last more than 50,000 open and close cycles.

Intel Corporation announced a collaboration with Facebook to define the next generation of rack technologies used to power the world's largest data centers. As part of the collaboration, the companies also unveiled a mechanical prototype built by Quanta Computer* that includes Intel's new, innovative photonic rack architecture to show the total cost, design and reliability improvement potential of a disaggregated rack environment.

"Intel and Facebook are collaborating on a new disaggregated, rack-scale server architecture that enables independent upgrading of compute, network and storage subsystems that will define the future of mega-datacenter designs for the next decade," said Justin Rattner, Intel's chief technology officer during his keynote address at Open Computer Summit in Santa Clara, Calif. "The disaggregated rack architecture includes Intel's new photonic architecture, based on high-bandwidth, 100 Gbps Intel Silicon Photonics Technology, that enables fewer cables, increased bandwidth, farther reach and extreme power efficiency compared to today's copper based interconnects."

With its 4th generation Core "Haswell" processor lineup not too far away, Intel is making efforts to clear inventories of its 2nd generation Core "Sandy Bridge" one. Usually, OEMs on the receiving end of such a move stand to score truckloads of chips at discounted prices. Samsung is one such OEM, which may have bagged a ton of "Sandy Bridge" Core i5-2450M dual-core chips clocked at 2.50 GHz, to deploy in its new premium Chromeboxes, which normally use entry-level Celeron B840 chips, because you can't exactly use Chrome OS to play Crysis, and so you don't need a faster CPU. The new, faster Chromebox is listed on Amazon for $423, bearing the SKU "Samsung Chromebox XE300M22-A01US."

Intel's spring cleaning began early, with the company discontinuing twelve processor models spanning across the Core and Celeron lines, based on the 32 nm "Sandy Bridge" silicon. The company issued a PDN (product discontinuation notice) to that effect. A majority of these are mobile parts, whose market lifetime is stretched to keep up with OEM orders. Among the chips are the Core i7-2960XM, i7-2860QM, i5-2557M, i7-2637M, and Celeron B710, and 857. According to the PDN, Intel will stop accepting orders for the chips from July 11, 2013, and the last orders will have shipped out by January 14, 2014.

At its 2013 International CES booth, Intel exhibited a side-by-side comparison of two systems, one running its next-generation Core "Haswell" processor's integrated graphics, the HD 4500 GT3 (all components enabled), and the other a discrete NVIDIA GeForce GTX 650 GPU. A highly forgiving DirectX 11-generation title, DiRT 3, was made to run on both GPUs. Visitors noted that even if not as smooth as the GTX 650, Intel's Haswell iGPU did produce playable frame-rates.

Sources close to the company have been claiming a significant, in fact, 100 percent performance lead of the Haswell iGPU over previous-generation HD 4000 iGPU featured in today's Core "Ivy Bridge" chips. If true, Intel's graphics may have come perilously close to, or even caught up with, AMD's A-Series "Trinity" line of APUs, which feature the fastest integrated graphics processor ever made.

With Intel's 2011-launched Core "Sandy Bridge" processors, Intel CPU overclocking as we know it changed. No longer could you overclock the CPU by stepping up BClk (base clock), a frequency that processors use to time various components, including the effective clock speed, and in some cases, memory, and uncore. Sandy Bridge left consumers with only one effective way of overclocking, stepping up an unlocked BClk multiplier, a feature only available with a handful expensive models.

According to a Hardcoreware report, when Intel took up the "one BClk to rule them all" approach with Sandy Bridge, it may have overlooked the possibility of the integrated GPU waking other components up from lower power states to use the L3 cache, affecting the chip's overall energy efficiency, which carried on to successive Core "Ivy Bridge" silicon. "Haswell" may present Intel with an opportunity to split core and uncore from sharing the same base clock, and as such it could be possible to crank up CPU clock speeds using BClk, without destabilizing the uncore. The author admits this is speculation on his part, but quite likely.

NCS Technologies Inc., a leading domestic computing systems manufacturer for government, enterprise and education, announced the availability of the NCS Altus XT mobile workstation, a powerful laptop PC featuring available Intel 3rd generation i3/i5/i7 Quad Core processor family technologies.

The NCS Altus XT and other advanced computing products are manufactured at a modern campus outside of Washington, D.C. At this headquarters NCS designs, manufactures, distributes and supports a wide range of computing products for customers worldwide.

Intel Media SDK 2013 now supports fixed-function hardware acceleration for video on Intel Atom processor-based tablets with Microsoft* Windows operating systems including video playback, editing and conversion.

The SDK, newly optimized for upcoming 4th generation Intel Core processors, codenamed "Haswell," includes enhanced support for Windows 8 including Microsoft DirectX 11, fully accelerated MPEG2 encode and MPEG/JPEG decode, and a Windows Store development sample. Use of Intel Media SDK 2013 also includes free licensing and source for integration with Open Source projects. The SDK is available as a free download.

Intel Corporation executives held a press conference today to outline a plan to accelerate new mobile device experiences across the company's growing portfolio of smartphone, tablet and Ultrabook offerings.

The announcements included a new smartphone platform for emerging markets, details on a forthcoming 22 nm quad-core SoC for tablets, and more personal and intuitive Ultrabook devices in innovative convertible designs were outlined by Mike Bell, vice president and general manager of the Mobile and Communications Group, and Kirk Skaugen, vice president and general manager of the PC Client Group at Intel.

McAfee and Intel today announced their commitment to lead in delivering innovative security solutions aimed at protecting a consumer's entire digital life, reflecting the broad adoption and usage of personal devices. Together with Intel, McAfee is redefining the consumer security experience with a focus on safeguarding consumer devices, securing personal data and protecting identities online. This user-centric approach will deliver a comprehensive and valuable service offering that helps meet the evolving needs of consumers as they enjoy their digital lives, anywhere, from any device. The first of these personalized security offerings from McAfee is available in beta to partners, with a consumer version of the product available mid-year 2013.

The explosion in connected devices and the availability of online content and services has consumers spending more of their lives online. Always-connected consumers who are shopping, banking, and sharing information online have an unprecedented amount of their personal and financial information at risk to increasingly sophisticated attacks and scams. Because of these new usages and the resulting distribution of personal information, a more comprehensive approach to security is required to protect consumers.

Intel's next-generation SSD 530 series, which sees a single product line covering 2.5-inch and compact form-factors, arrives in the second quarter of 2013. The new series is being designed to offer high-performance even at smaller card form-factors, which is particularly important for the ultra-thin/Ultrabook ecosystem. The drive has been pictured in the newer NGFF (next generation form-factor), which is designed to be even smaller than mSATA.

While mSATA drives typically measure 51 x 30 mm, NGFF measures 42 x 22 mm. NGFF is a single interface featuring pins for both SATA and PCI-Express x2 or x4, and cards designed around its specification can either be SATA SSDs, or other bandwidth-heavy devices (such as 802.11ac WLAN controllers). Cards can even be designed to have an SATA SSD subunit on one side, and a PCI-Express device on the other, saving swathes of PCB real-estate in the process. The form-factor even supports double-sided SSDs such as this one from Lite-On, which features an independent SSD subunit on each side, which is striped in RAID 0. The NGFF Intel SSD 530 family will be introduced in Q2-2013, in two capacities - 80 GB and 180 GB.

The latest in a series of Intel Desktop Boards designed for overclocking K-series 2nd and 3rd gen Intel Core processors, the Intel DZ75ML-45K delivers flexible overclocking and Lucid* Virtu MVP at an affordable price. Additionally, Intel Desktop Boards has extended a Lucid MVP upgrade to existing Intel 7-series performance boards currently using Lucid Virtu Universal.

The Lucid MVP GPU Virtualization feature enables use of Intel QuickSync whether your monitor cable is connected to a discrete graphics card or you are using Intel HD graphics built in to the CPU. Visit the Intel Download Center to upgrade. To learn more about Lucid's enhanced gaming and visual performance offering, visit www.lucidlogix.com. Intel Desktop Boards is also the proud launch partner of Lucid Virtu MVP2.0 coming in 2013. For more information about the DZ75ML-45K, visit the product page.

It looks like Intel's Core "Haswell" processor family will miss its anticipated March-May launch window, with the company choosing Computex 2013 as its next launch-pad. According to a leaked document intended for distributors and large retailers, desktop Core "Haswell" processors will launch only after May 27, before June 7, and retailers are told to hold off advertising the launch till June 2nd.

Among the products featuring in the new May 27 - June 7 launch window are the Core i7-4770K flagship product, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430, and i5-4430S, all of which are quad-core parts. In addition, socket LGA1150 motherboards based on Intel Z87 (flagship, OC-ready), H87, Q87, Q85, and B85 chipsets, will be launched. In all likelihood, one piece of decoration the CES venue could miss, is the wall of LGA1150 motherboards, which is usually put up by Intel.

CPU cooler manufacturer Arctic (aka Arctic Cooling) may have inadvertently leaked a very long list of 4th generation Intel Core processors based on its LGA1150 socket. Longer than any currently posted lists of Core "Haswell" processors, the leak includes model numbers of nine Core i7, seventeen Core i5, five Core i3, and two Pentium models. Among the Core i7 models are already known i7-4770K flagship chip, i7-4770S, and a yet-unknown i7-4765T. The Core i5 processor list is exhaustive, and it appears that Intel wants to leave no price-point unattended. The Core i5-4570K could interest enthusiasts. In comparison to the Core i5 list, the LGA1150 Core i3 list is surprisingly short, indicating Intel is serious about phasing out dual-core chips. The Pentium LGA1150 list is even shorter.

The list of LGA1150 processor models appears to have been leaked in the data-sheets of one of its coolers, in the section that lists compatible processors. LGA1150 appears to have the same exact cooler mount-hole spacing as LGA1155 and LGA1156 sockets, and as such upgrading CPU cooler shouldn't be on your agenda. Intel's 4th generation Core processor family is based on Intel's spanking new "Haswell" micro-architecture, which promises higher performance per-core, and significantly faster integrated graphics over previous generation. The new chips will be built on Intel's now-mature 22 nm silicon fabrication process. The new chips will begin to roll out in the first-half of 2013.

It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.

The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.