Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its newest All-in-One Desktop PCs, the 21.5-inch LX815 and 23-inch LX835, which perfectly blend high performance, style and affordable pricing. These All-in-One computers serve as all-purpose devices ideal for the kitchen, family room and dorm room for effective multitasking and HD entertainment.

ZOTAC International, a global innovator and manufacturer of graphics cards, mainboards and mini-PCs, today debuts the ZOTAC Intel 7-series powered mainboards for the latest 3rd Generation Intel Core family processors. The new ZOTAC Z77-ITX WiFi and H77-ITX WiFi mainboards pack support for Intel LGA1155 processors into a mini-ITX form factor without sacrificing expansion capabilities.

"ZOTAC is the global innovator when it comes to mini-ITX mainboards. We continue to push the performance envelope with mini-ITX to rival much larger systems," says Carsten Berger, marketing director, ZOTAC International. "The latest Intel Ivy Bridge processors paired with our ZOTAC Intel 7-series mini-ITX mainboards make an unbeatable performance combination without sacrificing energy-efficiency."

AMD's upcoming "Trinity" family of desktop and mobile accelerated processing units (APUs) will use up to four x86-64 cores based on the company's newest CPU architecture, codenamed "Piledriver". AMD conservatively estimated performance/clock improvements over current-generation "Bulldozer" architecture, with Piledriver. Citavia put next-generation A10-5800K, and A8-4500M "Trinity" desktop and notebook APUs, and pitted them against several currently-launched processors, from both AMD and Intel.

It found integer and floating-point performance increases clock-for-clock, against Bulldozer-based FX-8150. The benchmark is not multi-threaded, and hence gives us a fair idea of the per core performance. On a rather disturbing note, the performance-per-GHz figures of Piledriver are trailing far behind K12 architecture (Llano, A8-3850), let alone competitive architectures from Intel.

The new Intel 7-series Chipset family is now available and shipping in mobile and desktop OEM systems and motherboards worldwide. These new chipsets provide the companion logic to the 2nd Generation Intel Core processors today and will support the 3rd Generation Intel Core processor family (codenamed Ivy Bridge) later in Q2.

The new Intel 7-series Chipset family also integrates USB 3.0 and enables responsiveness technologies like Intel Smart Response, Intel Smart Connect, and Intel Rapid Start in desktop and mobile platforms. Intel is also introducing several desktop motherboards that feature the new Intel 7-series Express Chipset.

ORIGIN PC announced today the availability of their completely overhauled EON17-S and EON15-S high-performance laptops. Featuring the next generation Intel HM77 chipset, overclocked NVIDIA GeForce GTX 675M graphics cards, and NVIDIA Optimus Technology. These amazing new EON laptops are ideal for gamers, artists, enthusiasts, and professionals. They debut with the exclusive ORIGIN PC design available in silver, matte black, matte red, or with custom paint jobs.

Elitegroup Computer Systems (ECS), the world's top 3 motherboard maker, today reveals their first production of Z77 Black Extreme Series - Golden Limited Edition. Available in two models, Z77H2-AX and Z77H2-A2X, they are the top-of-the-line motherboards in the ECS Black Extreme Series, which enriches the series' themed slogan -- 'My Game, My Rules'.

The ECS Z77 Black Extreme Series - Golden Limited Edition features triple-thickness gold plated connectors and has passed the strictest quality tests, giving power users the security that the gold plating won't wear out after extensive component upgrades, safe guarding the board from the threat of corrosion.

MSI, the manufacturer of World's fastest mainboard and graphics card is happy to announce the availability of the new MSI Intel 7 Series mainboards for the LGA1155 socket, powered by MSI's renowned Military Class III components.

The new Intel Z77, H77 and B75 chipset based mainboards support both 2nd Generation Intel Core CPUs as well as the upcoming 3rd Generation Intel Core CPUs. Built on this basis of Quality components and technology the MSI Intel 7 series mainboards have overclocking features to match with OC Genie II. Not only does OC Genie II enhance CPU, Memory and hard-drive speed but now, in combination with Lucid Virtu MVP, also Discrete DirectX 11 Graphics performance can be boosted! Well-known for its power saving hardware features such as Active Phase Switching (APS) and DrMOS II, MSI Intel 7 series mainboards can combine its performance with best-in-class power saving. MSI's Intel 7 series mainboards are truly one of the most well-rounded mainboards ever created and will surely find its way in many PC builds.

World's top 3 motherboard manufacturer, ASRock Inc, unveils its latest Intel 7-series motherboard at 2012 Annual Global Tour. The latest 7-Series motherboard supports 2nd and 3rd Generation Intel Core i7 / i5 / i3 Processors. Featuring unique XFast 555 technology (XFast RAM, XFast LAN, XFast USB), ASRock 7-Series motherboard allows users to experience "REAL" performance boost (up to 5X better) in terms of PC's overall performance, LAN speed and USB transfer speed. ASRock has built up a reputation for building bulletproof mobos with very competitive price tag. In 2012 Global Tour, ASRock will be showcasing the long-awaited motherboards based on Intel 7-series chipsets.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today launched their long awaited 7 series motherboards designed to deliver the ultimate performance for 3rd generation Intel Core processors. Combining the world's first Dual UEFI BIOS, a new and unique All Digital power design, and the latest GIGABYTE Ultra Durable 4 technologies, GIGABYTE 7 series motherboards offer an extremely compelling case for a system upgrade.

"The new GIGABYTE 7 series motherboards are designed to offer a seamless upgrade for enthusiast PC DIYers by providing specifications and features that will be compatible with future CPUs, VGA cards, memory, SSDs, and wireless protocols for years to come," commented Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. "It makes sense then for us to aggressively transition to GIGABYTE Z77 and H77 motherboards so that enthusiasts can purchase them in anticipation for the release of Intel's highly sought after 3rd Gen Core processors."

Memory overclocking feats over 3000 MHz, aren't new. Last month, we've seen G.Skill and and GIGABYTE achieve a whopping 3736 MHz on the dual-channel AMD "Llano" platform. The duo has now cracked the 3000 MHz mark with four modules, achieving 3077 MHz. The record (>3000 MHz with four modules) was set by Coolaler, using an Intel Core i7-3770K "Ivy Bridge" processor, and GIGABYTE Z77X-UD5H motherboard. The memory of course was four 4 GB G.Skill DDR3-2600 MHz modules. The entire setup was air-cooled.A video of the feat follows.

First unveiled this January, Reeven's extreme-cooling pot (model: RECC-01) launched in various markets. In Japan, it is being marketed by Scythe. Measuring 70 x 70 x 160 mm (WxDxH), and weighing 900 g, the RECC-01 is a liquid nitrogen or dry-ice evaporator. Aluminum makes up most of its body, while nickel-plated copper makes up its base. Its base dissipation surface has 18 circular pits. An AEROFLEX polymer insulation sleeve is included. Also included are a retention module supporting Intel sockets LGA2011, LGA1155/LGA1156, LGA1366 and LGA775; and AMD sockets FM1/AM3+/AM3/AM2+/AM2; and a thermal probe port. It is priced at 19,980 JPY (US $242).

The computing industry will see its next transition to a new memory standard only by 2014, and enterprise processors based on the "Haswell" microarchitecture will drive the change, according to a VR-Zone report. While client processors based on the Haswell architecture will retain current DDR3 memory standard with a possibility of higher DDR3 clock speeds, enterprise processors under the "Haswell-EX" family will feature the industry's first DDR4 memory controllers for x86. Following that, DDR4 will filter down to future client platforms. Pictured below, is a DDR4 UDIMM by Samsung.

Intel Corporation's biggest marketing campaign in nearly a decade kicks off this week with television commercials, online experiences and print ads that the company is hailing as "cinematic and epic."

The multi-faceted global campaign, called "A New Era of Computing," is aimed at marketing the Ultrabook experience in exciting and innovative ways to consumers. Valued at hundreds of millions of dollars, the campaign is the largest marketing spend for the company since launching Intel Centrino in 2003.

Intel made its SSD 313 series official, its product page was activated, and ARK pages of its variants maintain the products are already launched. The SSD 313 series succeeds SSD 311 series, it consists of SSDs specifically designed for SSD-caching technologies such as Intel Smart Response Technology, and upcoming technologies that the upcoming "Ivy Bridge" platform brings with it, including "Rapid Start" and "Smart Connect". The SSD 313 Series is introduced in two variants, a 20 GB variant, and a 24 GB variant.

The 20 GB variant offers sequential performance up to 220 MB/s and 100 MB/s (read and write), while the 24 GB variant offers 160 MB/s and 115 MB/s, which might make one wonder about the need for a 24 GB variant, given that it's also slower at 4K random-seek performance 33,000 IOPS / 4,000 IOPS vs. 36,000 IOPS / 3,300 IOPS of the 20 GB. One reason behind the 24 GB variant's existence could be that a combination of different Intel technologies partition the SSD, taking away small amounts of capacity. The extra 4 GB of capacity might more than make up for the slightly lower performance. Both drives use SLC NAND flash chips, which are more durable than MLC NAND flash, and can take more rewrite cycles (something that factors in heavily for caching SSDs). Both drives are available in 2.5" SATA 3 Gb/s and mSATA 3 Gb/s form-factors. The 20 GB variant was earlier put to test.

A-Tech Fabrication, a company that specializes in hand-crafted HTPCs, unveiled the HeatSync 1200 fanless HTPC. The part that makes it fanless is the chassis itself, which is made of aluminum, with fins on the sides, that dissipate heat. Copper heat pipes transfer heat from key components such as the CPU and chipset to the sides of the chassis, which takes care of the rest. Although most of the chassis is anodized black, with its front-panel, you can choose between silver and black options.

The HeatSync 1200 internally packs an Intel DH61AG thin mini-ITX motherboard, which seats an Intel Core i3-2100T dual-core 35W processor, clocked at 2.50 GHz. 4 GB Corsair Vengeance SO-DIMM memory comes standard. Also standard is the Intel SSD 310 40 GB mSATA SSD. Considering there are no mechanical hard drives, or a PSU with active-cooling (a 160W power-brick does the job), the HeatSync 1200 is literally silent. A consumer IR (CIR) receiver with Windows Media Center remote, and Windows 7 Home Premium make for the rest of it.

Intel activated product pages of nearly all its upcoming Desktop Board products based on 7-series chipsets. Last week, we were treated to detailed pictures of Intel's Z77 chipset-based Desktop Board products. Now we move on to other Desktop Board Media Series motherboards, those based on Intel's other 7-series client chipset the H77. Pin-compatible with Z77, Intel's H77 chipset provides nearly all features of its sibling, with the exception of overclocking. So motherboard designers needn't dedicate resources to implementing strong VRM designs on their H77 products, and can instead focus on other features such as connectivity and expansion.

With 3rd generation Core "Ivy Bridge" processors, and 7-series "Panther Point" chipset, Intel will also release a new line of cache-SSDs to complement its Smart Response Technology (SRT) feature, which provides a decent performance middle-ground between HDDs, and expensive SSDs. The SSD 313 "Hawley Creek" family will replace SSD 310 "Larson Creek" family. It consists of drives that make use of relatively low amounts of SLC NAND flash memory (which have much higher endurance than MLC NAND flash, making them ideal for caching). Built in the 2.5" SATA and mSATA form-factors, the drives will be available in two variants; the 20 GB variant offers 220/100 MB/s (reads/writes), with 36,000 4K random read IOPS, while the 24 GB variant offers 160/115 MB/s (reads/writes), with 33,000 4K random read IOPS.

HWBOX.gr got to test the SSD 313 20 GB variant on a current generation Z68 motherboard (ASUS Maximus IV Extreme-Z), and post its findings. The Greek tech-site tested its performance in what it's meant to do: SSD caching using Intel SRT. Findings show a healthy boost in performance, with synthetic benchmarks, including synthetic read/write performance, random-access (IOPS), PCMark, and real-world tests such as Windows 7 boot-time, and startup of content-creation applications, but the performance-difference between SRT and plain-HDD narrowed as tests with data-loads grew, which is expected. SSD caching merely places "hot-data" (frequently-accessed data of the HDD on the SSD, for quicker access), and shunts data in and out of the SSD, as "heat" of data on the HDD changes competitively. Find a ton of more test results at the source link.

Sapphire is ready with a high-end socket LGA1155 motherboard based on Intel Z77 chipset, the Pure Platinum Z77. This is Sapphire's second Z77 motherboard disclosed so far, after the Pure Black Z77 it showed us, at CES. Sapphire is offering 3-way multi-GPU support in a very unique way. Three of its four PCI-Express x16 (long) slots are wired to the CPU, all three of them PCI-Express Gen 3.0. The topmost slot is x16 and x8 capable (x8, if any of the other two slots are populated); the middle slot is x8 and x4 capable (x4, if the bottommost blue slot is populated); while the bottommost slot is x4 capable. PCI-Express 3.0 x4 offers bandwidth comparable to PCI-Express 2.0 x8 (or PCI-Express 1.1 x16), which doesn't heavily bottleneck today's graphics cards. An ingenious slot layout, made possible by inexpensive PCIe lane switches, instead of expensive bridges.

Intel's upcoming mainstream consumer SSD line, the SSD 330 series, could have attractive pricing, which could catalyze further proliferation of SSD technology, according to a LaptopReviews report, citing tease-listings by online retailers and other sources. The new lineup will embrace SATA rev. 3.0 (6 Gb/s) standard, and offer performance that takes advantage of it. The 120 GB variant of the SSD 330, for example, was listed for US $149, on MacMall.com, the listing is removed. This gives it a price/GB on par with other 120 GB SATA 6 Gb/s SSDs in the market, which underwent several rounds of price-adjustments to get there.

The SSD 330 series from Intel, will be available in three capacities, 60 GB, 120 GB, and 180 GB. The 120 GB and 180 GB variants offer sequential transfer-rates of up to 500 MB/s (read) and 450 MB/s (write); the 60 GB variant offers 500 MB/s (read), and 400 MB/s (write). These drives use IMFlash Technologies-made 25 nm MLC NAND flash, and offer standard feature-set that includes support for TRIM, NCQ, 256-bit AES data-encryption, and limited SMART attributes.

Intel is launching motherboards in its Desktop Board brand, based on its Z77 Express chipset this Sunday (April 8), sources told DigiTimes. The product-pages of many of these are already active, on the company website. Among the products launched, will be Extreme Series DZ77GA-70K, Media Series DZ77BH-55K, and Media Series DH77KC.

April 8 will also be the day the Z77, H77, Z75 and B75 chipsets will be formally launched, and it is expected that other PC motherboard vendors will follow Intel in launching their products based on these chips. Apart from out-of-the-box compatibility with 3rd Generation Core "Ivy Bridge" processors, 7-series chipset support new CPU features, native USB 3.0, and improved display output (select models). In related news, April 29 is still the date enthusiasts have to keep marked on their calendars, for that's when new processor models such as Core i7-3770K and Core i5-3570K, will be launched.

Intel silently enabled the product pages of several of its 7-series chipset-based LGA1155 motherboards, including three based on the Z77 Express. These include the Extreme Series DZ77GA-70K, Media Series DZ77BH-55K, and Media Series DZ77SL-50K. The DZ77GA-70K is a top-tier model that's built for built for heavily-overclocked gaming PCs. Intel paid due attention to areas such as a strong VRM, and a broad range of connectivity options. With power-delivery, we spy a 10+2 phase VRM backed by Intel's phase-shedding technology. Apart from four DDR3 DIMM slots, the LGA1155 socket is wired to two PCI-Express 3.0 x16 slots (x8/x8, when both are populated).

Other expansion slots on the DZ77GA-70K include one open-ended PCI-Express 2.0 x4, two PCI-Express 2.0 x1, and two legacy PCI. To ensure there are sufficient PCIe lanes for these slots, and the plethora of third-party onboard devices, Intel implemented a PLX PCI-Express bridge chip that increases the lane budget of the board. Storage connectivity includes four SATA 6 Gb/s (two from the PCH, two from third-party controller), four SATA 3 Gb/s, and one eSATA.

Recognizing standout marketing campaigns within the Intel Inside and Intel Brand Advantage programs, Intel Corporation feted a handful of companies with the first Intel Marketing Innovation Awards.

Fujitsu took the Grand Prix for its LIFEBOOK4Life campaign, being the best all-around entry among the various award categories. Fujitsu's campaign sought to increase brand relevance and drive sales for LIFEBOOK notebooks based on the second-generation Intel Core vPro processor family. The campaign targeted IT decision-makers in SMB, enterprise and the channel in 40 countries across Europe, the Middle East, Africa and India. The campaign resulted in a 65 percent sales increase by integrating innovative social media activities via LinkedIn, Facebook, word-of-mouth, augmented reality and viral videos with standard advertising.

inXtron showed off its newest small-business NAS server at Intel Storage Forum, the Akitio MyCloud Pro. As the venue might suggest, this 2-bay desktop NAS is powered by Intel x86 architecture. inXtron even put is logic board for display, which revealed it to be driven by an Intel Atom D425 single-core (HTT-enabled) processor, with its usual NM10 chipset. The board also revealed several interesting components, such as two 2-port USB 3.0 controllers, giving out two ports on the rear panel and two for the front-panel, via a standard header.

The primary storage controller is the Intel NM10 chipset itself, the NAS uses a USB DOM (disk-on-module) it boots from, to hold its operating system. The primary network interface is a 1 GbE, driven by a Realtek-made PHY. Interestingly, the board has a vacant mini-PCIe slot, on which WLAN cards can be installed. The MyCloud Pro supports two SATA 3 Gb/s hard drives in the 3.5" form-factor. It supports all modern NAS features, such as UPnP-AV, NFS, FTP, Samba, but DLNA wasn't mentioned. The OS also includes a Bit-torrent client, and Apple iTunes-compatible music server. inXtron has apps for Android and iOS smartphones, with which you can use the phone to control the NAS. inXtron is targeting a sweet price-point under US $200, with the Akitio MyCloud Pro NAS.

Wintel (slang for Windows+Intel architecture) tablets, which launch along with Microsoft's latest Windows 8 operating system, which grab a greater market-share than WoA (Windows on ARM) tablets by the end of 2012, DigiTimes research predicts. This, despite the fact that the x86 and ARM versions of the operating system will be released simultaneously. PC majors such as HP, Dell, Lenovo, Acer, ASUStek and Toshiba, have all pledged 1-3 models of Wintel tablets by the end of 2012. Although still an emerging market-segment, tablets will see a clash between x86 and ARM architectures, as they are wooing for the same exact class of devices for the first time in computing history. Intel has made a lot of progress in miniaturizing the Atom processor, while led by the likes of Qualcomm and NVIDIA, ARM processors are getting stronger.

Fueled by strong sales growth in its core chip businesses-and boosted by a major acquisition-leading semiconductor supplier Intel Corp. in 2011 attained its highest annual market share in more than 10 years, according to the IHS iSuppli Competitive Landscape Tool from information and analytics provider IHS (NYSE: IHS). Intel in 2011 increased its overall semiconductor market share to 15.6 percent, up 2.5 percentage points from 13.1 percent in 2010, according to the final IHS semiconductor estimate for the year. This represents the highest market share for Intel going back to at least 2001, when it reached 14.9 percent. Over the last five years, Intel's share of the market ranged from 11.9 percent to 13.9 percent.

"Intel in 2011 captured the headlines with its major surge in growth," said Dale Ford, head of electronics and semiconductor research for IHS. "The company's rise was spurred by soaring demand for its PC-oriented microprocessors, and for its NAND flash memory used in consumer and wireless products. Intel's revenue also was boosted by its acquisition of Infineon's wireless business unit. The company's strong rise helped it to stave off the rising challenge mounted by No. 2 semiconductor supplier Samsung Electronics Co. Ltd., which had been whittling away at Intel's lead in recent years." The table below presents the final 2011 semiconductor market share ranking from the IHS.