Intel finally got the ball rolling on its third generation Core processor family codenamed "Ivy Bridge", which will go into making most of the company's client processor portfolio for 2012. These chips are characterized as being the world's first microprocessors built on the 22 nanometer silicon fabrication process. Intel aided miniaturization of circuits to such tiny scale thanks to 3D Transistor technology, a space-efficient nano-scale transistor design that enables chip-designers to achieve higher transistor densities, and come up with ever more powerful chips.

The third-generation Core processor family is based around a single die design (pictured below), from which it will carve out numerous SKUs in the client market in May-June, and enterprise market (under its Xeon brand, towards the end of June). These SKUs will be carved out by toggling the various parallel components (such as x86 cores, cache banks, processor graphics cores, and of course clock-speeds). The new Core processor family is expected to feature higher performance per clock-speed, and higher efficiency. Intel's Kirk Skaugen has been quoted by the BBC as saying "This is the world's first 22 nm product and we'll be delivering about 20% more processor performance using 20% less average power."

MSI is happy to announce that it's B75MA-P45 mainboard has passed Intel Small Business Advantage certification. This adds to an already impressive array of professional advantages of MSI's B75 mainboards. Intel Small Business Advantage ensures software and hardware stability and security and when combined with MSI's excellent Military Class based B75 mainboards provide the best overall quality and stability.

Intel Small Business Advantage Certified

The MSI B75MA-P45 is the first Intel B75 mainboard in the industry with Intel SBA Certification. Intel SBA (Small Business Advantage) enhances Security and Productivity without switching to a traditional corporate platform. By making traditional software features hardware based, it improves stability and doesn't reduce performance.

Acer America today announced a new commercial offering, the Acer AC100 micro-server. It delivers the latest server-class features and utilities in a compact form factor to suit the needs of small and medium businesses.

Featuring an easy to configure micro-tower enabling quick upgrades, the new Acer AC100 not only reduces the time and costs associated with maintenance, but also provides excellent expandability in its class. In addition to Energy Star certification, it boasts a high-efficiency 200W 80 PLUS power supply, which makes the AC100 more than 80 percent energy efficient at 20, 50 and 100 percent rated loads, reducing electricity use and bills.

Shuttle also launched a new line of slimline, fan-less XPC Mini PC barebones driven by the latest Intel Atom D2700 processor. The XS35V3 and XS36V launched today, succeed the XS35/V2 launched last September, which were based on previous-generation Atom D525 chips. Measuring 252 x 162 x 38.5 mm (WxDxH), the XS35V3 features a slimline optical drive bay apart from a 2.5" SATA drive bay to hold an HDD or SSD. It has two DDR3 SO-DIMM slots, supporting up to 4 GB of single-channel DDR3-1066 MHz memory. Front-panel includes a card-reader (supports SDHC/SD/MS/MS Pro), and a USB 2.0 port. Its rear-panel includes stereo line-out and mic-in audio jacks, four USB 2.0 ports, an Ethernet port, and display outputs that include HDMI 1.3 and D-sub (VGA). It also features wireless b/g/n LAN.

The XS36V has a slightly smaller chassis, measuring 200 x 160 x 36 mm. It lacks a slimline optical drive bay, its only drive bay is a 2.5" SATA. Most of its logic board is identical to that of its sibling. Apart from the a card-reader (SDHC/SD/MS/MS Pro) and a USB 2.0 port, the front-panel features two RS232 serial (COM) ports. Its rear-panel is identical to that of the XS35V3. Both models include a 40W external power brick. The XS35V3 is priced around US $149, while the XS36V is priced slightly higher.

Barebones mini PCs expert Shuttle Computer launched its first barebones featuring Intel Z77 Express chipset, ready for 3rd generation "Ivy Bridge" Core processors in the LGA1155 package, while retaining support for every LGA1155 "Sandy Bridge" processor launched till date. Shuttle also launched an Intel X79-based mini PC barebone, which supports Core i7 "Sandy Bridge-E" processors.

Called the SZ77R5, the Z77 barebone features four DDR3 DIMM slots supporting 32 GB of dual-channel DDR3-1600 MHz memory, expansion slots that include one PCI-Express 3.0 x16, one PCI-Express 2.0 x4 and one mPCIe; two SATA 6 Gb/s, two SATA 3 Gb/s ports, one eSATA 3 Gb/s, and one mSATA; four USB 3.0 ports, gigabit Ethernet, and 8-channel HD audio. Its chassis features two 5.25" and one 3.5" drive bays, front-panel that includes two of the four USB 3.0 ports, a USB 2.0 port with "fast charging" (high current), and front-panel HD audio. To power the machine, a 500W 80 Plus-compliant PSU is included. The SZ77R5 measures 332 x 216 x 198 mm (WxDxH). It will be priced around 32,800 JPY (US $404).

Although slated for June, Intel's budged 22 nm "Ivy Bridge" processors, under the Core i3 brand extension, matter a lot to system builders, small businesses, and enterprises. Three of its first models to be launched are priced. These include the Core i3-3220, priced at 113€ (US $149); Core i3-3225 at 130€ (US $172); and Core i3-3240 at 132€ (US $172).

The i3-3220 succeeds the current-generation Core i3-2100, it is clocked at 3.30 GHz. The i3-3225 has the same clock speed, but a faster integrated graphics (HD 4000 vs. HD 2500 on the i3-3220). The i3-3240 is clocked at 3.40 GHz, but retains the slower HD 2500 graphics from the i3-3220. All three chips are dual-core, lack Turbo Boost, but feature Hyper Threading. The PCI-Express root complex is thrown back to PCI-Express Gen 2.0, they lack Gen 3.0.

Team Group Inc., one of the leading memory storage manufacturers in the world, pronounces that all memory module series, including Xtreem and Elite, now provide complete supports for the latest Series 7 chipsets of Intel! Meticulous verification tests have proven that Team Group's modules are perfectly compatible with major motherboards available in the market. This is a major performance improvement, and brings out the best of the new generation Core processor.

iBUYPOWER, a leading innovator in gaming PCs, is excited to announce the availability of Intel's Performance Tuning Protection Plan on all new iBUYPOWER gaming systems. The plan offers iBUYPOWER customers a one-time replacement for a CPU that is internally damaged by operating the processor outside of Intel's published specifications.

The protection plan will be available at no additional charge with the order of any Intel Z68-based iBUYPOWER system featuring an Intel Core K Series processor. This includes iBUYPOWER's popular Chimera, LAN Warrior II and Erebus systems. The company also offers free liquid CPU cooling on all new desktop systems.

Intel is preparing to phase out six entry-level mobile processor models across its Core i3, Pentium, and Celeron brands. The phase-out is part of Intel's natural product development cycle, as scores of new processor models will be introduced this year. Intel announced the phase-out of the following six models in its latest product change notification: Celeron P4600 (PGA988, 2.00 GHz); Pentium P6100, P6200, P6300 (2.00, 2.13, 2.20 GHz, respectively); Core i3-370M, i3-390M (2.13, 2.20 GHz, respectively).

The PCN mentions that customers can continue to place orders for these chips with the option to cancel orders, till 10/16/2012, beyond which orders can't be cancelled, the last shipments of these chips will be out in 2013.

Intel is expected to start shipping Xeon E3 processors based on 22 nm "Ivy Bridge" silicon within June, according to a DigiTimes report. A key feature of the new Xeon chips driving its advent is support for PCI-Express 3.0, which could greatly increase bandwidth for compatible add-on cards and controllers. Ivy Bridge allows PCI-Express lanes from the processor root complex to be split into x16, x8, and even x4 links, which greatly increase bandwidth from previous-generation PCI-Express 2.0 bus. Built in the LGA1155 package, the new Xeon chips will be compatible with existing platforms that run Xeon Sandy Bridge processors, as well as new lines of server/workstation motherboards that feature PCI-Express 3.0 expansion. We know from a slightly older report that Intel will launch low-voltage Xeon processors around this time.

ASUS has plans to give several of its Z77 and H77 chipsets-based motherboards support for Thunderbolt I/O by means of an optional add-on card. Several of currently-launched ASUS 7-series chipset motherboards feature a header marked "TB_HEADER", which lets the motherboard interface with the Thunderbolt I/O add-on card. This header most likely transmits the motherboard's DisplayPort link (from the Flexible Display Interface) to the Thunderbolt I/O card. The card itself is likely based on Intel's 2-channel "Cactus Ridge" Thunderbolt controller, and connects to the system bus over PCI-Express 2.0 x4. ASUS motherboards supporting the optional Thunderbolt add-on card with the TB_HEADER include Maximus V Gene, P8Z77-V Deluxe, P8Z77-V Pro, P8Z77-V, Sabertooth Z77, P8H77-V, and P8H77-M Pro. The Thunderbolt I/O card should be available starting April 27.

Here are the first pictures of retail boxes of Intel's Core i7-3770K "Ivy Bridge" processors in the LGA1155 package. Pictured below are boxes sourced from a Chinese distributor. Regional branding aside, the box-art hasn't changed from that of the 2nd Generation Core processor family, even the die-shot CGI in the center hasn't changed, which is a missed opportunity. Intel could have used art inspired by the Ivy Bridge silicon, which could have helped identify the new chips easier. The box simply marks the model number "3770K" and socket type "LGA1155" on the key sticker.

The side sticker is where the action is. We know from countless earlier reports, including Intel's RetailEdge marketing material that the TDP rating of "Ivy Bridge" quad-core parts, including the i7-3770K, was rated to be 77W. The sticker on retail i7-3770K, however, tells a different story. The TDP is rated at 95W, on par with previous-generation parts such as i7-2700K. The S-spec number is revealed to be "SR0PL". Before such an important CPU launch as "Ivy Bridge", it's hard to control pre-launch proliferation of retail parts to people who are not NDA signatories. Such people have put the i7-3770K through overclocking, and voices are getting louder that the i7-3770K is a worse overclocker than previous-generation "Sandy Bridge". The chip was found to get too hot, too soon, when overclocking.

AMD and Google are locked in a race to buy out MIPS, an application processor architecture designer competitive to ARM. AMD comes from a decades old presence in the microprocessor industry, while Google is a satrap with smartphones, tablets, and other mobile computing devices thanks to its Android operating system. With Microsoft opening up to ARM architecture with Windows 8 RT, it is in Google's interests to hedge its bets on an alternative machine architecture to both x86 and ARM. The easiest way to that is buying out MIPS and funding development of powerful processors based on it. For AMD, it's a bid to stay competitive in the low-power processor market as Intel began making inroads to smartphone processor market.

Today at its annual partner conference, Cisco (NASDAQ: CSCO) announced Partner Plus, a new global channel program targeting mid-sized customers. Partners who participate in the program will receive increased preference, investment and support in the form of business accelerators such as incremental incentives, engineering support, marketing and demand generation, sales enablement, and customer intelligence.

Partner Plus is a key pillar of Cisco's Partner Led strategy, which is designed to empower and reward channel partners to lead the sale with small and mid-sized customers. This approach combines the power of the partner sales force and Cisco's sales force in an innovative way to go after these market segments. This is part of the $75 million investment that Cisco announced in 2011 for enablement, systems, and support capabilities.

Intel's upcoming Core "Ivy Bridge" processors for overclockers, namely the Core i7-3770K, and Core i5-3570K, feature multiplier values previously unavailable for Core "Sandy Bridge" series. Chinese proverclocker x-powerx800pro scraped 6.616 GHz utilizing a base clock multiplier value of 63.0x, a clock speed of 6584.86 MHz (104.52 x 63) was validated using the same setup. These clock speeds were backed by core voltages such as 1.056V, and cooled by extreme cooling. The test-bench included a GIGABYTE Z77X-UD5H, 2x 2 GB G.Skill DDR3-2133 MHz memory, and Corsair AX1200W PSU. These clock speeds were found to be Pi-stable, with 6.511 GHz yielding SuperPi 1M timing of 5.585s.

Intel Corporation today reported quarterly revenue of $12.9 billion, operating income of $3.8 billion, net income of $2.7 billion and EPS of $0.53. The company generated approximately $3.0 billion in cash from operations, paid dividends of $1.0 billion and used $1.5 billion to repurchase stock.

"The first quarter was a solid start to what's expected to be another growth year for Intel," said Paul Otellini, Intel president and CEO. "In the second quarter we'll see the first Intel-based smartphones in the market, ship products based on 22 nm tri-gate technology in high volume, and accelerate the ramp of our best server product ever, providing a tremendous foundation for growth in 2012 and beyond."

UBM TechInsights, the leader in technology and IP consulting, is pleased to recognize Intel - Micron for their collaboration on the Intel-Micron Flash Technologies (IMFT) 20 nm MLC NAND Flash and award them with the Insight Award for the 2011 Semiconductor of the Year.

UBM TechInsights' circuit analysis verified that Intel - Micron's latest Flash component was the first to be manufactured at the 20 nm process node. By using high-k dielectric to replace the silicon dioxide, that is traditionally used, Intel-Micron managed to reduce leakage while keeping power consumption low - a must for today's light weight portable electronics.

Intel Corporation announced today the Intel Solid-State Drive 330 Series (Intel SSD 330 Series), a SATA 6 gigabit-per-second (Gb/s) solid-state drive (SSD) that gives consumers a more affordable entry into the accelerated storage performance of SSDs.

Ideal for upgrading desktop or notebook PCs, the Intel SSD 330 Series offers the price-conscious PC enthusiast a brand-name SSD that blends performance, Intel quality and value. Offered in the most popular capacity points, 60 gigabytes (GB), 120 GB and 180 GB, the Intel SSD 330 Series boosts overall system performance and responsiveness for a broad range of applications.

With the 14 nm "Broadwell" architecture, Intel will take a new step towards integration of the platform-controller hub (PCH) with the CPU, by designing it to be a multi-chip module (with the CPU+northbridge in one die, and PCH on the other). This would make "Broadwell" a true System-on-chip (SoC), which allows over 90 percent of the system's I/O to be routed to the processor socket, including memory, PCI-Express, SATA, USB, etc. Although not the first to the industry with single-chip chipsets and integrated memory controllers, Intel rapidly reshaped the arrangement between CPU and core-logic, over the past four years.

It began with transfer of memory controller from northbridge to CPU die (45 nm "Bloomfield"), and transfer of the entire northbridge to the CPU die (45 nm "Lynnfield"). The graphics northbridge transferred a little more gradually, first as multi-chip module with a separate CPU die (32 nm "Clarkdale"), then complete integration with the CPU die (32 nm "Sandy Bridge"). All through, the southbridge, or I/O controller hub (ICH) remained outside the CPU package, with the addition of a display output logic, it transformed into a "platform controller hub" (PCH), which is still just a glorified southbridge. Naturally then, such a drastic relocation of system components will warrant a socket change.

With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.

Come 2013, and PC consumers could finally break the shackles of regressive PC resolution "standards" such as 1366x768 and 1920x1080, if Intel has its way. At a presentation at IDF Beijing, Intel expressed its desire to see much higher resolution displays for all computing devices, not just PCs, which could in true terms be "retina-matched" display resolutions. At an optimal (comfortable) viewing distance, the resolution of a computing device's screen should match that of your eyes.

If Intel has its way, a 21" all-in-one desktop PC, and a 15" notebook PC screen will have a resolution of 3840x2160 pixels; a 13" Ultrabook PC could have a resolution of 2800x1800 pixels, a 11" Ultrabook and 10" tablet with 2560x1440, and 5" handheld/smartphone with 1280x800. Compare these to the $500+ 27" 1920x1080 monitors that are still sold in the market! A very bold proposal, but one only a company with the industry prominence of Intel can pull off.

At IDF Beijing, Intel showed off an almost unique new class of Ultrabook devices which could be sold by various notebook OEMs in the future, codenamed "Letexo". This is a tablet + slider ultrabook, similar in form (albeit larger) to the ASUS EeePad Slider, except that it has an Intel processor inside, and runs Windows 8 (the EeePad Slider was NVIDIA Tegra 2 and Android 3.0 driven). When slid down, Letexo is almost as compact and functional as a tablet PC, with its multi-touch screen, letting you take advantage of Windows Metro UI; when slid up, a keyboard and trackpad are revealed, letting you use it as just another laptop. Perhaps Letexo is intended to be a large-scale effort by Intel to bring about a transition between laptops and tablets, by shaping people's usage patterns towards more touch-based interface.A video presentation follows.

Custodian of the Ultrabook specification, Intel pushed the storage industry to churn out slimmer devices to go with increasingly slimmer Ultrabooks sold by the various partner ODMs in the ecosystem. Even as HDD and SSD makers have only just come up with 7 mm-thick storage devices, Intel has a fresh list of changes it wishes to see with storage devices in the very near future, to be able to make it to the constantly-evolving Ultrabook specification. Intel wants near-future storage devices (SSDs and HDDs) to be no thicker than 5 mm.

Further, it wants to see the standard SATA host interface changed from "around" (out of) form, to "along" (inside) form host interface, which further slims down the drive compartment. These proposals were floated at IDF, Beijing. While coming up with slimmer SSDs was never really a tough task for SSD makers, as SSDs are essentially just millimeter-thick printed circuit boards with millimeter-thick components (controller logic, NAND flash memory, and ancillaries), it posed a huge technical challange to mechanical HDD designers, who have had to slim down key components that work to maintain inertial motion of spinning platters. This new proposal for 5 mm-thick HDDs could pose a newer, tougher desgin challenge.

With eager OEMs such as ASUSTek, HP, Acer, and Lenovo breathing down its neck, Intel is reportedly pulling forward the official launch date of its 3rd Generation Core processor family based on 22 nm "Ivy Bridge" silicon, to the 23rd of April, from its older date of 29th April. 23rd April will be the day Intel announces all its processor models originally slated for the 29th.

Notebook OEMs are expected to launch their products based on these chips at the earliest, by May. The date of market-availability of these chips in the retail channel, however, remains unclear. One possibility is that Intel will announce and make these chips available on the same day (23rd), while another possibility is that it announces these chips on the 23rd, allows the media to digest them (by posting reviews), and open them up for sale on the 29th. Two models every PC enthusiast and their cat are looking out for, are the Core i7-3770K and Core i5-3570K.

Intel is planning to launch a line of low-power Xeon processors in Q2-2012, which will be the company's first Xeon processors built on the 22 nm fab process, with 3D transistors. It is quite likely that these chips are built in the LGA1155 package, however Intel is only releasing low-power variants, which ensures performance-segment Xeon E3-1200 family isn't disturbed, and more importantly, it doesn't have to pull out the best bins of its 22 nm Ivy Bridge silicon just yet (for use in higher clock-speed Xeon parts).

Intel has another emerging problem. With the advent of "micro-servers" (low power independent servers in high-density data-centers, which provide better cost-performance and manageability than virtual servers), ARM processor architecture is making inroads to the enterprise computing market. Intel's answer to that is refining the same silicon that goes into making low-power Atom processors, and making it enterprise-grade. This part is codenamed "Centerton", and Intel expects an entire micro-server platform based on these chips to be out in the second half of 2012.