Lenovo today launched its latest effort to eliminate slow boot up times with Lenovo Enhanced Experience 3 (EE3) for Windows 7. As the third version of an exclusive certification only available on Lenovo Think and Idea-branded PCs, EE3 certified products feature supreme Windows start-up performance and other optimization features. Lenovo EE3 will come standard on a wide range of Think and Idea-branded PCs shipping beginning in April.

Customers using traditional spinning disk hard drive (HDD) Lenovo PCs can start their PC on average 40 percent faster than typical Windows 7 PC1 users, thanks to Lenovo's RapidBoot technology, featured on all EE3 certified Lenovo PCs. RapidBoot uses optimized processes and hardware settings to allow Lenovo PCs to boot up faster.

With its 22 nm "Ivy Bridge" CPU and 7-series "Panther Point" platform turning into a reality, Intel is moving on to development of the new 22 nm "Haswell" architecture. Entry-thru-performance segment Core "Haswell" processors will be built on the new LGA1150 package, and will be driven by a new series of platform controller hubs, codenamed "Lynx Point". We already know a tiny bit about the way Haswell+Lynx Point platform is structured, and the features that could come standard with it. A new VR-Zone report lists out all the chipset models Intel will carve out using the silicon.

The lineup is quite predictable. At the top of the pile is the feature-rich Z87, which has all the features of the platform, plus overclocking features. This is followed by Z85, which apart from features such as Rapid Storage Technology, could lack RAID for its SATA ports (could only feature AHCI and IDE modes). Then there's H87, which has all the features of Z87, except platform overclocking features. Q87 and Q85 are for large business desktops, and feature various client management features. Then there's B85, for small businesses. Lynx Point could feature as many as six SATA 6 Gb/s ports. Rapid Storage Technology will be updated to present users with a level of customization. Then there's Fast Boot, which speeds up system startup, provided an Intel SSD is used for caching.

PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that nickel-plated copper plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.

In comparison, Intel used flux-less solder to bind the IHS to the die on previous-generation Sandy Bridge Core processors in the LGA1155 package. Attempting to remove IHS off a chip with flux-less solder won't end well, as it could rip the die off the package. On the other hand, the idea behind use of flux-less solder in CPU packages is to improve heat transfer between the die and the IHS. Using thermal paste to do the job results in slightly inferior heat transfer, but removing IHS is safer. One can be sure that making it safe for IHS removal couldn't have been the issue behind switching back to conventional thermal paste, as everything under the IHS isn't user-serviceable anyway, and off limits for them. Perhaps Intel kept extreme overclockers in mind.

HP's China online store listed out the company's new Envy 4 series that spans across six models occupying key price points starting at 5,499 RMB (US $872), and going up to 6,299 RMB (US $1000). The six models include relatively entry-level 1005tx and 1019tx, followed by 1004tx and 1021tx in the middle, ending with somewhat high-end 1006tx and 1021tx Ultrabooks. The slower models among these are driven by Intel Core i3-2367M, while the faster ones by Core i5-2467M. All six models are slim-category 14-inch notebooks.

DisplayLink, the leading provider of technology for virtual graphics and USB-connected computing, today announced its support for 3rd generation Intel Core processors and supporting mobile Intel HM76 and Intel B75 express chipsets with SuperSpeed USB 3.0.

DisplayLink's DL-3000 chip platform with USB 3.0 is shipping today in adapters, monitors and docking stations from leading vendors. The broad availability of onboard USB 3.0 in systems using 3rd generation Intel Core processors means that a huge new segment of the market now has access to easy-to-use docking, and multi-display possibilities.

MSI announces that its Intel-based H61 (G3) series now offers the latest ME8 BIOS and Driver with support for 3rd generation Intel 22nm processors. Its Intel H61 motherboards are also the fastest in the world, with DDR3 memory support up to 2400MHz. With its solid R&D ability, MSI has created H61 motherboards with superior efficiency that is the best choice for users wishing to upgrade to next-generation 22nm processors from Intel.

As a commitment to long-time MSI users, MSI releases the ME8 upgrade package and related upgrade guide for the most robust update solution, allowing consumers of MSI H61 (G3) / Z68 (G3) motherboards to easily adopt the latest Intel 22nm processor. This solution offers amazing DDR3 memory speeds of up to 2400MHz, efficiency never seen before.

Intel Corporation today announced it has entered into a definitive agreement with Cray Inc. to acquire certain assets related to its high-performance computing (HPC) interconnect program. With the agreement, Intel gains access to Cray's world-class interconnect personnel and intellectual property.

The Cray interconnect team is responsible for the award-winning Gemini interconnect as well as the upcoming Aries interconnect, designed to work in Cray's next-generation supercomputer, codenamed "Cascade," which will integrate Intel Xeon processors. The transaction is expected to close before the end of the current quarter, subject to customary closing conditions being met.

BOXX Technologies, the leading authority on dedicated rendering and innovator in high-performance computing systems for product design, visualization, engineering, visual effects, and more, today introduced the 3DBOXX 4925, the industry's first single Intel Xeon processor workstation with support for up to four GPUs. The latest addition to the BOXX 4900 series workstation line, 4925 enables users of Autodesk Revit, Autodesk 3ds Max, SolidWorks, CATIA, and other professional software applications, to simultaneously design and render without bogging down the processes.

Extreme Engineering Solutions, Inc. (X-ES) is supporting the 3rd generation Intel Core i7 processor across eight industry-standard form factors -- COM Express, 3U VPX, 6U VPX, 3U CompactPCI, 6U CompactPCI, VME, air-cooled PrPMC/XMC, and conduction-cooled PrPMC/XMC. The XPedite7470 3U VPX Single Board Computer (SBC) and XCalibur4401 6U CompactPCI SBC are the first products available from X-ES to support the 3rd generation Intel Core i7 processor.

3rd generation Intel Core i7 processors provide higher performance and lower power compared to 2nd generation Intel Core i7 processors. 3rd generation Intel Core i7 processors also include Intel HD Graphics with DirectX 11, supporting OpenGL 3.1 and OpenCL 1.1.

TYAN, an industry-leading server platform manufacturer and subsidiary of MiTAC International Corp., announces new CPU support for the S5515 and S5517. These embedded motherboards now support the 3rd Generation Intel Core processor product family (codename: Ivy Bridge) with a quick bios update. These two platforms now deliver the benefits of Intel's 22 nm Core i3/i5/i7 processor architecture with stronger performance, consistent reliability, and low cost in small form factor that targets various applications in the embedded industry.

TYAN's S5515 and S5517 embedded motherboards now offer support for 3rd Generation Intel Core i3/i5/i7 Processors. Existing motherboards will only need a BIOS update to support the new processors. Intel's 3rd Generation Intel Core processors offer greater performance with multiple expansion options such as PCI-E x16 Gen.3 slots, SATA 6G/3G controllers, U-DDR3 1600/1333/1066 w/o ECC memory slots and USB 3.0 ports. These two products deliver enhanced computing performance, greater 3D (tri-gate) effect and more RAM support. This makes them the ideal platforms for customers with critical requirements from telecom, networking, storage, medical imaging, embedded severs, security and surveillance appliances.

Eurocom Corporation, a developer of long lifespan, fully upgradable Notebooks, high performance Mobile Workstations and Mobile Servers is now supporting the Intel Core i7-3920XM Processor Extreme along with the Intel Core i7-3820QM, Intel Core i7-3720QM and Intel Core i7-3610QM in the Eurocom line of Notebooks including: EUROCOM Neptune 2.0, Racer 2.0 and Monster.

Eurocom's line of high performance Mobile Workstations and Gaming Notebooks will be bolstered by the introduction of the Intel Ivy Bridge processors and complete line of Intel 22nm processors. The Eurocom notebooks will be some of the world's first Ivy Bridge notebooks with Intel HM77 and HM76 chipsets using the uFPGA988B socket. Eurocom Notebooks are ideal for professionals and teams who frequently travel and need access to high performance computing.

Acer's first desktop PCs with the 3rd Generation Intel Core Processors will be available immediately in several configurations ranging in price from $699.99 to $1,199.99. Both Acer and Gateway-branded desktop PCs will be equipped with the new processors. Below are two examples of systems that will be available from retailers this next week.

Several models of the Acer Predator AG3620 desktop line will be the first with the new processors. The Acer Predator delivers performance and graphics benefits for power-users who want an advanced PC for entertainment, gaming and digital media. The Acer Predator AG3620-UR21P is equipped with a 3rd Generation Intel Core i7 3770 processor running at 3.4GHz as well as NVIDIA GT 630 graphics to deliver blazing fast speed and realistic graphics. The system also has 16GB of memory and 2 TB of storage space. It has a manufacturer's suggested retail price of $1,199.99.

MSC Vertriebs GmbH presents the first COM Express modules based on the 3rd generation Intel Core processor family (formerly codenamed 'Ivy Bridge'). The 3rd generation Intel Core processor family utilizes Intel's advanced 22nm process technology with three-dimensional transistors for higher performance at lower power. The new COM Express modules feature a further leap forward in computing power, graphics and video performance in comparison to modules based on the previous generation Intel platform. Important innovations of this new product generation are lower power consumption at higher clock frequencies and improved graphics and video performance. For the first time, the new Intel platform supports DirectX 11.

MSI Computer Corp, a leading manufacturer of computer hardware products and solutions, uncages the GT70 and GT60, two mobile gaming beasts featuring Intel HM77 Chipset, NVIDIA GeForce GTX 670M graphics processing unit (GPU), Killer E2200 Game Networking, Steel Series backlit keyboard, and more. Designed with the serious gamer in mind, both units provide unmatched power while fortifying MSI's arsenal of award-winning G Series family of gaming notebooks.

Bringing a new standard to mobile gaming, the GT70 comes with 17.3-inches of Full HD anti-reflective display to maximize visual experience under all lighting conditions, Steel Series full color backlit programmable keyboard with 1000 customizable color combinations, amplified gold plated audio connections for crisper sounds, 12 GB of DDR3 for superb speed, and more. For gamers looking for even more power, the GT70 is also available with 16 GB of DDR3, BD Burner, and MSI's Super RAID 0 configuration, a unique combination of 128 GB (2 * 64 GB) of SSD RAID 0 and 750 GB at 7200 RPM for unprecedented storage capacity.

Intel finally got the ball rolling on its third generation Core processor family codenamed "Ivy Bridge", which will go into making most of the company's client processor portfolio for 2012. These chips are characterized as being the world's first microprocessors built on the 22 nanometer silicon fabrication process. Intel aided miniaturization of circuits to such tiny scale thanks to 3D Transistor technology, a space-efficient nano-scale transistor design that enables chip-designers to achieve higher transistor densities, and come up with ever more powerful chips.

The third-generation Core processor family is based around a single die design (pictured below), from which it will carve out numerous SKUs in the client market in May-June, and enterprise market (under its Xeon brand, towards the end of June). These SKUs will be carved out by toggling the various parallel components (such as x86 cores, cache banks, processor graphics cores, and of course clock-speeds). The new Core processor family is expected to feature higher performance per clock-speed, and higher efficiency. Intel's Kirk Skaugen has been quoted by the BBC as saying "This is the world's first 22 nm product and we'll be delivering about 20% more processor performance using 20% less average power."

MSI is happy to announce that it's B75MA-P45 mainboard has passed Intel Small Business Advantage certification. This adds to an already impressive array of professional advantages of MSI's B75 mainboards. Intel Small Business Advantage ensures software and hardware stability and security and when combined with MSI's excellent Military Class based B75 mainboards provide the best overall quality and stability.

Intel Small Business Advantage Certified

The MSI B75MA-P45 is the first Intel B75 mainboard in the industry with Intel SBA Certification. Intel SBA (Small Business Advantage) enhances Security and Productivity without switching to a traditional corporate platform. By making traditional software features hardware based, it improves stability and doesn't reduce performance.

Acer America today announced a new commercial offering, the Acer AC100 micro-server. It delivers the latest server-class features and utilities in a compact form factor to suit the needs of small and medium businesses.

Featuring an easy to configure micro-tower enabling quick upgrades, the new Acer AC100 not only reduces the time and costs associated with maintenance, but also provides excellent expandability in its class. In addition to Energy Star certification, it boasts a high-efficiency 200W 80 PLUS power supply, which makes the AC100 more than 80 percent energy efficient at 20, 50 and 100 percent rated loads, reducing electricity use and bills.

Shuttle also launched a new line of slimline, fan-less XPC Mini PC barebones driven by the latest Intel Atom D2700 processor. The XS35V3 and XS36V launched today, succeed the XS35/V2 launched last September, which were based on previous-generation Atom D525 chips. Measuring 252 x 162 x 38.5 mm (WxDxH), the XS35V3 features a slimline optical drive bay apart from a 2.5" SATA drive bay to hold an HDD or SSD. It has two DDR3 SO-DIMM slots, supporting up to 4 GB of single-channel DDR3-1066 MHz memory. Front-panel includes a card-reader (supports SDHC/SD/MS/MS Pro), and a USB 2.0 port. Its rear-panel includes stereo line-out and mic-in audio jacks, four USB 2.0 ports, an Ethernet port, and display outputs that include HDMI 1.3 and D-sub (VGA). It also features wireless b/g/n LAN.

The XS36V has a slightly smaller chassis, measuring 200 x 160 x 36 mm. It lacks a slimline optical drive bay, its only drive bay is a 2.5" SATA. Most of its logic board is identical to that of its sibling. Apart from the a card-reader (SDHC/SD/MS/MS Pro) and a USB 2.0 port, the front-panel features two RS232 serial (COM) ports. Its rear-panel is identical to that of the XS35V3. Both models include a 40W external power brick. The XS35V3 is priced around US $149, while the XS36V is priced slightly higher.

Barebones mini PCs expert Shuttle Computer launched its first barebones featuring Intel Z77 Express chipset, ready for 3rd generation "Ivy Bridge" Core processors in the LGA1155 package, while retaining support for every LGA1155 "Sandy Bridge" processor launched till date. Shuttle also launched an Intel X79-based mini PC barebone, which supports Core i7 "Sandy Bridge-E" processors.

Called the SZ77R5, the Z77 barebone features four DDR3 DIMM slots supporting 32 GB of dual-channel DDR3-1600 MHz memory, expansion slots that include one PCI-Express 3.0 x16, one PCI-Express 2.0 x4 and one mPCIe; two SATA 6 Gb/s, two SATA 3 Gb/s ports, one eSATA 3 Gb/s, and one mSATA; four USB 3.0 ports, gigabit Ethernet, and 8-channel HD audio. Its chassis features two 5.25" and one 3.5" drive bays, front-panel that includes two of the four USB 3.0 ports, a USB 2.0 port with "fast charging" (high current), and front-panel HD audio. To power the machine, a 500W 80 Plus-compliant PSU is included. The SZ77R5 measures 332 x 216 x 198 mm (WxDxH). It will be priced around 32,800 JPY (US $404).

Although slated for June, Intel's budged 22 nm "Ivy Bridge" processors, under the Core i3 brand extension, matter a lot to system builders, small businesses, and enterprises. Three of its first models to be launched are priced. These include the Core i3-3220, priced at 113€ (US $149); Core i3-3225 at 130€ (US $172); and Core i3-3240 at 132€ (US $172).

The i3-3220 succeeds the current-generation Core i3-2100, it is clocked at 3.30 GHz. The i3-3225 has the same clock speed, but a faster integrated graphics (HD 4000 vs. HD 2500 on the i3-3220). The i3-3240 is clocked at 3.40 GHz, but retains the slower HD 2500 graphics from the i3-3220. All three chips are dual-core, lack Turbo Boost, but feature Hyper Threading. The PCI-Express root complex is thrown back to PCI-Express Gen 2.0, they lack Gen 3.0.

Team Group Inc., one of the leading memory storage manufacturers in the world, pronounces that all memory module series, including Xtreem and Elite, now provide complete supports for the latest Series 7 chipsets of Intel! Meticulous verification tests have proven that Team Group's modules are perfectly compatible with major motherboards available in the market. This is a major performance improvement, and brings out the best of the new generation Core processor.

iBUYPOWER, a leading innovator in gaming PCs, is excited to announce the availability of Intel's Performance Tuning Protection Plan on all new iBUYPOWER gaming systems. The plan offers iBUYPOWER customers a one-time replacement for a CPU that is internally damaged by operating the processor outside of Intel's published specifications.

The protection plan will be available at no additional charge with the order of any Intel Z68-based iBUYPOWER system featuring an Intel Core K Series processor. This includes iBUYPOWER's popular Chimera, LAN Warrior II and Erebus systems. The company also offers free liquid CPU cooling on all new desktop systems.

Intel is preparing to phase out six entry-level mobile processor models across its Core i3, Pentium, and Celeron brands. The phase-out is part of Intel's natural product development cycle, as scores of new processor models will be introduced this year. Intel announced the phase-out of the following six models in its latest product change notification: Celeron P4600 (PGA988, 2.00 GHz); Pentium P6100, P6200, P6300 (2.00, 2.13, 2.20 GHz, respectively); Core i3-370M, i3-390M (2.13, 2.20 GHz, respectively).

The PCN mentions that customers can continue to place orders for these chips with the option to cancel orders, till 10/16/2012, beyond which orders can't be cancelled, the last shipments of these chips will be out in 2013.

Intel is expected to start shipping Xeon E3 processors based on 22 nm "Ivy Bridge" silicon within June, according to a DigiTimes report. A key feature of the new Xeon chips driving its advent is support for PCI-Express 3.0, which could greatly increase bandwidth for compatible add-on cards and controllers. Ivy Bridge allows PCI-Express lanes from the processor root complex to be split into x16, x8, and even x4 links, which greatly increase bandwidth from previous-generation PCI-Express 2.0 bus. Built in the LGA1155 package, the new Xeon chips will be compatible with existing platforms that run Xeon Sandy Bridge processors, as well as new lines of server/workstation motherboards that feature PCI-Express 3.0 expansion. We know from a slightly older report that Intel will launch low-voltage Xeon processors around this time.

ASUS has plans to give several of its Z77 and H77 chipsets-based motherboards support for Thunderbolt I/O by means of an optional add-on card. Several of currently-launched ASUS 7-series chipset motherboards feature a header marked "TB_HEADER", which lets the motherboard interface with the Thunderbolt I/O add-on card. This header most likely transmits the motherboard's DisplayPort link (from the Flexible Display Interface) to the Thunderbolt I/O card. The card itself is likely based on Intel's 2-channel "Cactus Ridge" Thunderbolt controller, and connects to the system bus over PCI-Express 2.0 x4. ASUS motherboards supporting the optional Thunderbolt add-on card with the TB_HEADER include Maximus V Gene, P8Z77-V Deluxe, P8Z77-V Pro, P8Z77-V, Sabertooth Z77, P8H77-V, and P8H77-M Pro. The Thunderbolt I/O card should be available starting April 27.