Samsung Electronics today unveiled the Galaxy Book3 series, its latest flagship PC lineup featuring the Galaxy Book3 Ultra, Book3 Pro 360 and Book3 Pro. The Galaxy Book3 Ultra—Samsung's new premium PC—features ultra-high-performance computing, the Galaxy Book3 Pro 360 features a 2-in-1 convertible form factor with S Pen functionality, and the Galaxy Book3 Pro features thin and light, mobility-first clamshell design. The Galaxy Book3 series is designed for those who need seamless multi-device connectivity and premium hardware to supercharge their productivity and creativity.

"Today, we're seeing an increasing number of people using multiple devices to perform efficiently. These new workflows are made possible thanks to our open and extensive Galaxy ecosystem," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The latest Galaxy Book3 series further enriches our connected offerings. It is tailor-made for Galaxy enthusiasts looking for ultra-high computing performance and seamless connected Galaxy experiences to maximize their productivity and creativity."

Back in January, Intel officially increased the price of its 12th Gen Core processors by 10 percent, a move that was thought to help push the 13th Gen Core processors in retail. Here we are, barely a month later and Intel is now said to be cutting the price on said 12th Gen Core processors by as much as 20 percent. The report comes from DigiTimes in Taiwan and should as such be taken with a pinch of salt, but apparently the higher-end SKUs are expected to see the biggest price cuts.

Twitter user @harukaze5719 has put together a cheat sheet that gives us an easy overview on what we might be able to expect, if the 20 percent price cut is done across the board. This should make Intel's 12th Gen Core processors quite attractive price wise, as all models would end up selling for much less than they did before the 10 percent price increase. This would give Intel some extra leverage over AMD, which might be forced to lower its prices in turn, to be able to stay competitive.

Intel didn't exactly report stellar results for the past year and now news out of the US are reporting that the management team is in for big pay cuts, due to missing the earnings targets. Unfortunately the pay cuts aren't limited to management level employees only, as everyone "level 7" and above are affected. Level 7 appears to be some groups of mid-level employees, such as staff engineers. Intel is said to have 14 different employee levels, where fresh graduates start at level 3 and the CEO is level 14. Pat Gelsinger is expected to see a 25 percent cut to his base salary, with the leadership team seeing a 15 percent cut in their base salary.

However, VP's are only seeing a 10 percent pay cut and those below VP—to level 6—will see a five percent pay cut. This is said to go into effect on the first of March and it might seem like those employees at lower hiring tiers are getting away without a pay cut, but it's not quite that simple. Everyone else will see a pay freeze and incentives will be cut for all employees at Intel. This includes suspended quarterly profit sharing bonuses, no employee recognition program and the retirement plan contribution matching cut in half to 2.5 percent. The only perk left will be the annual bonus. Considering the current state of the world, the upside of all of this, is that Intel is at least not laying off any employees as of right now, at least not officially. That said, we might see some employees jumping ship to Intel's competitors, if they can offer a more attractive package. We should point out that the average salary at Intel is around US$134,000, so it's unlikely that most of its employees will suffer due to the reduction in pay.

Intel cut the baseline prices of its Arc A750 performance-segment graphics card. The card now starts at USD $249, down from its launch price of $289 for the first-party reference-design card. Among the handful custom-design board partners for the A750 are Acer, Gunnir, and ASRock. The A750 targets maxed-out AAA gaming at 1080p, although the card is capable of higher resolutions with the Intel XeSS performance enhancement.

Based on the 6 nm ACM-G10 silicon, the A750 is endowed with 3,584 unified shaders across 28 Xe Cores or 448 EUs, 224 TMUs, 112 ROPs, and 8 GB of 16 Gbps GDDR6 memory across the chip's full 256-bit wide memory interface (512 GB/s memory bandwidth). The card has a typical board power of 225 W, draws it from a combination of 8-pin and 6-pin PCIe power connectors; and has modern display outputs that include HDMI 2.0 and DisplayPort 2.1. The Arc "Alchemist" family of GPUs meets the full DirectX 12 Ultimate feature-set, including real-time ray tracing. They also have regular driver updates with day-zero optimization for big game releases.Many Thanks to TumbleGeorge for the tip.

Intel's upcoming LGA-7529 socket designed for next-generation Xeon processors has been pictured, thanks to Yuuki_Ans and Hassan Mujtaba. According to the latest photos, we see the massive LGA-7529 socket with an astonishing 7,529 pins placed inside of a single socket. Made for Intel's upcoming "Birch Stream" platform, this socket is going to power Intel's next-generation "Sierra Forest" Xeon processors. With Sierra Forest representing a new way of thinking about Xeon processors, it also requires a special socket. Built on Intel 3 manufacturing process, these Xeon processors use only E-cores in their design to respond to AMD EPYC Bergamo with Zen4c.

The Intel Xeon roadmap will split in 2024, where Sierra Forest will populate dense and efficient cloud computing with E-cores, while its Granite Rapids sibling will power high-performance computing using P-cores. This interesting split will be followed by the new LGA-7529 socket pictured below, which is a step up from Intel's current LGA-4677 socket with 4677 pins used for Sapphire Rapids. With higher core densities and performance targets, the additional pins are likely to be mostly power/ground pins, while the smaller portion is picking up the additional I/O of the processor.20:20 UTC: Updated with motherboard picture of dual-socket LGA-7529 system, thanks to findings of @9550pro lurking in the Chinese forums.

MSI, a world-leading laptop brand, has hold their brand new laptop virtual event MSIology: The Leap to Singularity today. Featuring the latest NVIDIA GeForce RTX 40 series GPUs and up to 13th Gen Intel Core HX series processors which is now available for pre-order and early bird rewards.

MSI strives for perfection and a premium experience in the laptop lineup which comes with innovative technology breakthroughs, extremely powerful performance and aesthetic brand new design. "We have been leading the trends for high-end laptops, and it continues!" Said MSI Notebook Worldwide Sales & Marketing Director, Derek Chen.

Lenovo announced today at Information Systems Europe (ISE 2023) in Barcelona the all new ThinkSmart View Plus running Microsoft Teams display, a standalone collaboration display with premium audio, video, and whiteboarding features. The smart collaboration solution is purpose built for hot desking, phone booths, executive desks and home office use cases. Also joining the portfolio of smart collaboration solutions are the newly announced Lenovo IP Controller for collaboration spaces and the newly available ThinkSmart One.

ThinkSmart View Plus
As the way people work continues to evolve, it is vital to stay connected and engaged, regardless of how and where they work. The innovative ThinkSmart View Plus running Microsoft Teams display is a solution that enables hybrid work by increasing productivity, flexibility, and collaboration through its personal and hotdesking experiences.

Facing global economic headwinds, the four major North American cloud service providers (CSPs) have scaled back their server procurement quantities for 2023 and could make further downward corrections in the future. Meta is the leader among the four in terms of server demand reduction, followed by Microsoft, Google, and AWS. TrendForce has lowered the YoY growth rate of their total server procurement quantity for this year from the original projection of 6.9% to the latest projection of 4.4%. With CSPs cutting demand, global server shipments are now estimated to grow by just 1.87% YoY for 2023. Regarding the server DRAM market, prices there are estimated to drop by around 20~25% QoQ for 1Q23 as CSPs' downward corrections exacerbate the oversupply situation.

Looking at the four CSPs individually, the YoY decline of Meta's server procurement quantity has been widened to 3.0% and could get larger. The instability of the global economy remains the largest variable for all CSPs. Besides this, Meta has also encountered a notable obstacle in expanding its operation in Europe. Specifically, its data center in Denmark has not met the regional standard for emissions. This issue is expected to hinder its progress in setting up additional data centers across the EU. Moreover, businesses related to e-commerce account for about 98% of Meta's revenue. Therefore, the decline in e-commerce activities amidst the recent easing of the COVID-19 pandemic has impacted Meta's growth momentum. Additionally, Meta's server demand has been affected by the high level of component inventory held by server ODMs.

Acer today announced its latest additions to the TravelMate series of Windows 11 Education laptops, designed to improve students' overall learning experiences and boost productivity whether in school or at home. The Acer TravelMate B5 14 features up to an FHD display and is powered by up to Intel Core i3 N-series processors to support the essential needs of mobile college students, as well as secondary school students. The newest 11-inch TravelMate laptops let students get more out of their blended classroom experience as the TravelMate B3 Spin 11 comes with an optional dockable Wacom AES stylus for added flexibility, while the TravelMate B3 11 has up to 9.5 hours of battery life to provide students with a reliable laptop that could be maximized throughout the school day.

Additionally, these laptops are shipped with Acer's new User Sensing Software,[1] which combines Break Reminder, Screen Distance Reminder, and User Sensing technology to help reduce digital eye strain and ensure data security. The dependable TravelMate B series laptops alsoconform to military-grade durability standards that could withstand drops as high as 122 cm, possess reinforced I/O ports and spill-resistant keyboards to protect inner components from damage, and HD webcams that come with a camera shutter for added privacy protection. With Acer's dedication to achieving its Earthion mission in mind, all the education laptops possess recycled materials in their components and packaging, an EPEAT ecolabel, and are TCO Certified, the leading sustainability certification for IT products worldwide.

Acer today launched four new Chromebooks to meet the needs of students, teachers and administrators, including its first Acer Chromebook Vero model designed specifically for the education market. These new models provide the latest in durability, performance, and features, making them a powerful tool for helping educators deliver better learning outcomes.

"As a leading provider of Chromebooks for the K12 education market, Acer knows what students and teachers need to keep the focus on learning - and these new Acer Chromebooks deliver what's needed and more," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "Our new Chromebooks provide advances in all the areas that have helped establish them as an essential tool for learning: student-focused durability features, reliable performance and advanced connectivity options to support school technology initiatives."

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

Yesterday, Intel reported that the company experienced one of the most challenging quarters and year overall revenue results, which led the company's share price to plummet and erase almost 10 billion dollars from its market cap. Amid the economic downtrend, the company is preparing to axe unnecessary developments and research costs that it would get in low-margin markets. Today, this has been reflected in the company's network switch business and the RISC-V pathfinder program. In 2019, the company acquired Barefoot Networks, which ended up in a line of Tofino series of standalone network switches. Apparently, this has been a low-margin or unprofitable business for Intel. "NEX continues to do well and is a core part of our strategic transformation, but we will end future investments in our network switching product line, while still fully supporting existing products and customers," noted Intel CEO Pat Gelsinger, adding, "Since my return, we have exited seven businesses, providing in excess of $1.5 billion in savings". Intel NICs are not affected, and the company's investments in other networking businesses continue.

Additionally, the company is also doing a shutdown of its RISC-V Pathfinder program. Thanks to Yusuke Ohara, who questioned Intel's Pathfinder for RISC-V program support, we have information that the company is discontinuing the program "effective immediately." The support also advises that Intel will not provide additional advancements or bug fixes, so everyone should consult 3rd parties for any software and development.

Intel Foundry Services, the semiconductor foundry business of Intel, has onboarded an undisclosed fabless customer, the company disclosed in its Q4-2022 Financial Results presentation. This signals that the company wants to serve the semiconductor manufacturing industry beyond its own products, and scale up to demands, just like TSMC, UMC, Samsung Foundry, or other such semiconductor foundries do. The customer is looking to build chips on the Intel 3 foundry-node, which is rumored to offer performance/Watt and transistor-density figures comparable to TSMC 4N (4 nm EUV). Intel will extensively use Tower Semiconductor's silicon fabrication IP in the deal. Throughout its manufacturing lifecycle (from risk production to mass-production and completion), the deal is expected by Intel to generate over $4 billion in revenue for the company.Image Courtesy: VideoCardz

Intel in its Q4-2022 Financial Results presentation confirmed that it has split Accelerated Computing Group (AXG), the business that designs both client GPUs and scalar compute processors, and distributed its IP among the CCG (client computing group), and DCAI (data-center and artificial-intelligence group). CCG is Intel's largest breadwinner, and the group behind its Intel Core client processors. This business was receiving iGPU IP from AXG, and will now oversee all its client graphics portfolio. The DCAI group will handle the company's Data Center GPU lineup, with products such as "Ponte Vecchio."

Over 2023, Intel is expected to update its Arc Graphics series with the refreshed "Alchemist+" graphics architecture. Very little is known about "Alchemist+," except that it is rumored to introduced a more advanced third-party foundry node than its current TSMC 6 nm node; and while retaining the same IP as the current "Alchemist" GPUs, scale upward—either in terms of Xe core counts; or performance, by increasing clock-speeds. 2024 will see Intel introduce "Battlemage," its second client graphics architecture for discrete GPUs. "Battlemage" is expected to introduce new architectural changes, utilize an even newer foundry node, and significantly increase performance. Raja Koduri hinted in late 2022 that he still wants to build GPUs in the 200-300 W power-range, without implying that this constitutes "mid-range," so we'll have to wait and see how "Battlemage" improves performance/Watt over "Alchemist+."Image Courtesy: VideoCardz

Intel's server processor lineup led by the 4th Gen Xeon Scalable "Sapphire Rapids" processors face stiff competition from AMD 4th Gen EPYC "Genoa" processors that offer significantly higher multi-threaded performance per Watt on account of a higher CPU core-count. The gap is only set to widen, as AMD prepares to launch the "Bergamo" processor for cloud data-centers, with core-counts of up to 128-core/256-thread per socket. A technologically-embattled Intel is preparing quick counters as many as three new server microarchitecture launches over the next 23 months, according to Intel, in its Q4-2022 Financial Results presentation.

The 4th Gen Xeon Scalable "Sapphire Rapids," with a core-count of up to 60-core/120-thread, and various application-specific accelerators, witnessed a quiet launch earlier this month, and is shipping to Intel customers. The company says that it will be joined by the Xeon Scalable "Emerald Rapids" architecture in the second half of 2023; followed by "Granite Rapids" and "Sierra Forest" in 2024. Built on the same LGA4677 package as "Sapphire Rapids," the new "Emerald Rapids" MCM packs up to 64 "Raptor Cove" CPU cores, which support higher clock-speeds, higher memory speeds, and introduce the new Intel Trust Domain Extensions (TDX) instruction-set. The processor retains the 8-channel DDR5 memory interface, but with higher native memory speeds. The chip's main serial interface is a PCI-Express Gen 5 root-complex with 80 lanes. The processor will be built on the last foundry-level refinement of the Intel 7 node (10 nm Enhanced SuperFin); many of these refinements were introduced with the company's 13th Gen Core "Raptor Lake" client processors.

Intel in its Q4-2022 Financial release call reiterated that its Core "Meteor Lake" processor remains on course for a 2H-2023 launch. The company slide does not mention the client form-factor the architecture targets, and there are still rumors of a "Raptor Lake Refresh" desktop processor lineup for 2H, which would mean that "Meteor Lake" will debut as a high-performance mobile processor architecture attempting to dominate the 7 W, 15 W, 28 W, and 35 W device market-segments, with its 6P+16E CPU that introduce IPC increases on both the P-cores and E-cores; and a powerful new iGPU. The slide also mentions that its succeeding "Lunar Lake" architecture is on course for 2024.

"Meteor Lake" is Intel's first chiplet-based MCM processor, in which the key components of the processor are built on various silicon fabrication nodes, based on their need for such a cutting-edge node; such that the cost-optimization upholds the economic aspect of Moore's Law. The compute tile, the die that has the CPU cores, features a 6P+16E setup, with six "Redwood Cove" P-cores, and sixteen "Crestmont" E-cores. At this point it's not known if "Crestmont" cores are arranged in clusters of 4 cores, each. The graphics tile features a powerful iGPU based on the newer Xe-LPG graphics architecture that meets full DirectX 12 Ultimate feature-set. The processor's I/O is expected to support even faster DDR5/LPDDR5 memory speeds, and feature PCIe Gen 5.

Intel Corporation today reported fourth-quarter and full-year 2022 financial results. The company also announced that its board of directors has declared a quarterly dividend of $0.365 per share on the company's common stock, which will be payable on March 1, 2023, to shareholders of record as of February 7, 2023.

"Despite the economic and market headwinds, we continued to make good progress on our strategic transformation in Q4, including advancing our product roadmap and improving our operational structure and processes to drive efficiencies while delivering at the low-end of our guided range," said Pat Gelsinger, Intel CEO. "In 2023, we will continue to navigate the short-term challenges while striving to meet our long-term commitments, including delivering leadership products anchored on open and secure platforms, powered by at-scale manufacturing and supercharged by our incredible team."

Intel is preparing to launch HEDT/workstation processors based on its "Sapphire Rapids-WS" MCM, and one of the first of these parts, the Xeon W9-3495X, surfaced on the Geekbench online database. The W9-3495X is a 56-core/112-thread processor with 56 "Golden Cove" P-cores, each with 2 MB of L2 cache, and sharing 105 MB of L3 cache in a mesh-topology layout. The processor likely features an 4-channel (8 sub-channel) DDR5 memory interface, with ECC; and supports up to 4 TB of memory. The PCI-Express Gen 5 lane counts remain unknown. Intel is expected to launch these processors along with companion W790 chipset motherboards, on February 15, 2023. This processor, running on a Supermicro-designed motherboard, and 128 GB of DDR5 memory, scored 1284 points in Geekbench 5, along with 36990 points multi-threaded.

Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce a new collaboration to establish a framework for the transfer of technology captured in an OCP-approved specification to JEDEC for inclusion in one of its standards. This alliance brings together members from both the OCP and JEDEC communities to share efforts in developing and maintaining global standards needed to advance the electronics industry.

Under this new alliance, the current effort will be to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification to become part of JEDEC JEP30: Part Model Guidelines for use with today's EDA tools. With this updated JEDEC standard, expected to be published in 2023, Chiplet builders will be able to provide electronically a standardized Chiplet part description to their customers paving the way for automating System in Package (SiP) design and build using Chiplets. The description will include information needed by SiP builders such as Chiplet thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing the Chiplet in package, and security parameters.

Intel Graphics today released the latest version of its Arc GPU Graphics Drivers. Version 101.4090 beta comes with launch-day optimization for "Forspoken." The company also fixed a couple of issues with this release. For Arc "Alchemist" discrete GPUs, an application freeze issue with "A Plague Tale: Requiem" has been fixed. Box corruptions noticed in "Need for Speed: Unbound," have also been fixed. For Intel Core processors with Xe LP-based iGPUs, a screenspace corruption issue with NFS: Unbound has been fixed; besides an intermittent application crash with Total War: Warhammer III in DirectX 11 mode, and color corruption in Battlefield: 2042. Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.4090 beta

Intel Corporation today announced that Frank D. Yeary has been appointed as the new independent chair of its board of directors. This follows Dr. Omar Ishrak's decision to step down as chair. Ishrak will remain on Intel's board as an independent director and continue to serve on the audit and finance committee and corporate governance and nominating committee.

"I'm pleased to welcome Frank as chair of Intel's board. His expertise in unlocking stockholder value, focus on corporate governance and familiarity with Intel are powerful assets to both the board and the company as we execute our strategy," said Pat Gelsinger, CEO of Intel. "I also want to thank Omar for his tremendous contributions as chair. He was instrumental in bringing me back to the company as CEO and has fostered a high-impact working dynamic across the board and management team. I look forward to his continued service as a valued member of the board."

A Chinese OEM put a desktop Intel Arc "Alchemist" A380 GPU on an MXM board for notebooks and mobile workstations with upgradable graphics. This isn't the mobile A380M, but rather the desktop A380 that has been designed into an MXM 3.1 type-A board that's capable of PCIe Gen 4 x8. The 6 nm ACM-G11 ASIC is flanked by three GDDR6 memory chips that make the board's 6 GB of memory across its 96-bit memory bus. What's interesting about this board is its tight power limits, which are set at 50 W, that can draw up to 75 W. The card puts out three HDMI and one DP outputs. Its cooling solution mount-hole spacing appears to match that of the popular GeForce GTX 1050 Ti.

Alongside its facilities in Hillsboro, Oregon, Intel was meant to build a state of the art, $700 million R&D centre, but it appears that the company has decided to slam the brakes on that project, as part of its cost saving measures. The "mega lab" as it has also been referred to, will most likely not get built at all, despite the comparably small cost in relation to building a semiconductor fab, but $700 million saved is still going to make Intel look good in front of its shareholders. In total, Intel is said to be looking at cutting US$3 billion in spending for 2023 and cancelling the construction of the R&D facility contributes almost a quarter of that sum.

The "mega lab" was supposed to cover 18,580 square metres of floor space, largely dedicated towards data centre R&D projects. According to Intel, those projects will still go ahead, just at other facilities, according to a statement sent to Oregon Live. Intel is apparently also scrapping plans for a much smaller, US$200 million R&D facility in Israel, while potentially also pushing back its plans for new fabs in Europe. The latter might come down to what kind of subsidies Intel can get from the German government and the EU.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Back in February 2022 SiFive announced its partnership with Intel Foundry Services (IFS), to bring its "Horse Creek" SoC to market and now SiFive has announced that it's getting ready to launch its first development board on said SoC. This summer, SiFive will launch the HiFive Pro P550 development board, which will kick things up a serious notch when it comes to embedded SoC development boards, regardless of the CPU core the SoC is built around. The HiFive Pro P550 will be one of few microATX based embedded SoC development boards out there and so far, to our knowledge, the only one with a RISC-V based SoC. The Horse Creek SoC sports quad core, 2.2 GHz, 13-stage, triple-issue, out-of-order pipeline RISC-V RV64GBC CPU built on the Intel 4 node. The SoC also has a DDR5 5600 MHz memory interface, support for eight lanes of PCIe 5.0 and comes in a 19 x 19 mm FBGA package.

The HiFive Pro P550 will offer 16 GB of DDR5 memory, but based on the render of the motherboard, this is soldered to the board, rather than relying on standard DDR5 DIMMs. Furthermore, the board has two x16 PCIe 3.0 expansion slots, although it's unclear how many PCIe each slot features, as well as a PCIe 3.0 M.2 2280 M-key slot for NVMe SSDs and a PCIe 3.0 M.2 E-key slot for a WiFi/Bluetooth module. The board also sports multiple USB/USB 3.0 ports and even a pair of USB-C ports. The press release also mentions both Gigabit and 10 Gbps Ethernet support, as well as support for onboard graphics and remote system management, without going into any further details. It'll be interesting to see if the Horse Creek SoC can deliver on its expected performance target, especially as SiFive has a lot to prove, especially as the company calls the RISC-V architecture inevitable.