"Panther Lake" is the codename for the microarchitecture behind Intel's 17th Gen Core processors due for 2026-27. It succeeds the 16th Gen "Lunar Lake" (2025-26), 15th Gen "Arrow Lake" (2024-25); and 14th Gen "Meteor Lake" (2023-24) architectures. While very little is known about "Panther Lake," the first piece of information discovered in the LinkedIn profile page of one Intel Graphics engineer, suggests that the graphics tile of the processor will feature an iGPU based on the Xe3 "Celestial" graphics architecture, which is two generations ahead of the current Xe "Alchemist," and one ahead of Xe2 "Battlemage."

Intel's graphics architectures will continue to be highly scalable and modular in their applications, with variants of them scaling between low-power iGPUs to large client discrete GPUs, and very-large HPC-AI processors. The variant for the iGPU powering "Panther Lake" will be Xe3-LPG, a highly skimmed version of the architecture for lower Xe Core counts, with just the right hardware to operate in power-constrained devices such as mobile processors. From the looks of it, Intel will stick with the disaggregated chiplet design for its processor architectures going all the way down to "Panther Lake," as an older company slide detailing the scalability of "Celestial" highlighted a "next platform" processor succeeding "Meteor Lake" and its immediate successor ("Arrow Lake").

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

Today, Intel launched Intel Agilex 7 FPGAs with F-Tile, equipped with the fastest field-programmable gate array (FPGA) transceivers available on the market and designed to help customers address challenges across the most bandwidth-intensive areas of the data-centric world, including data centers and high-speed networks. Created with embedded, networking and cloud customers in mind, Intel's new F-Tile-enabled Agilex 7 FPGAs deliver flexible hardware solutions with industry-leading transceiver performance, delivering up to 116 gigabits per second (Gbps) and hardened 400 gigabit Ethernet (GbE) intellectual property (IP).

"Intel's Agilex 7 with F-Tile is loaded with transceivers that deliver more flexibility, bandwidth and data rate performance than any other FPGA on the market today. Together with Intel manufacturing and our supply chain resilience, we're delivering multiple industry-leading products and capabilities that our customers and the industry require to address a broad range of critical business needs," said Shannon Poulin, Intel corporate vice president and general manager of the Programmable Solutions Group.

A new story is making the rounds, citing Wang Rui, chair Intel China, in the media in both China and Taiwan, claiming that Intel is working on test chips for as many as 43 potential customers for Intel Foundry Services (IFS). At least seven of those potential customers are said to be from the top 10 foundry clients globally. This sounds a bit too good to be true, considering that IFS has as yet to prove that they can deliver on their promises.

Furthermore, Wang Rui is meant to have gone on record, saying that IFS has taped out products on both its 20A and 18A nodes. Exactly what these products are, wasn't divulged, but as the 18A node isn't expected to go into mass production until the second half of 2024, this sounds a little bit too good to be true. What makes this even less believable is that the Intel 4 node is only set to go into mass production in the second half this year and before Intel moves to its Ångström nodes, the company still has to deliver on its Intel 3 node. The Intel China chair is also reportedly confident that Intel will be returning to a leading foundry position by 2025.

Without mentioning it in its driver change-log, Intel Graphics has quietly addressed the issue of unusually high power-draw for its Arc A-series GPUs in multi-monitor setups. The older 101.4091 drivers had a typical single-monitor idle power-draw of around 11 W, which would shoot up to 40 W idle in multi-monitor setups. In our own launch-day review of the Arc A770, we logged a 44 W multi-monitor power-draw. Intel now claims that the multi-monitor idle power-draw has been tamed, with the latest 101.4146 drivers the company released last week lowering this down to "8 to 9 W" for multi-monitor setups, and "7 to 8 W" for single-monitor ones.

At the end of January, we reported on issues with Intel's i226-V 2.5 Gbps Ethernet controllers, which are used on a wide range of motherboards with both Intel and AMD CPUs, where users were having issues with stuttering and connections dropping. Intel has now released a workaround and a patch for the issue, not only for the i226, but also the i225 and the Killer E3100 2.5 Gbps network controller. What the workaround does, is disable the Energy-Efficient Ethernet mode, or EEE as it's also known as. EEE is only supposed to kick in when an Ethernet connection is idle and it's said to reduce power consumption by up to 50 percent.

However, in this case, it seems like EEE kicks in even when the Ethernet connection is active, which is causing the stuttering and connection dropouts. The patch disables EEE for all speeds above 100 Mbps, but it's also possible to disable EEE manually in the device settings in Windows. MSI is the first motherboard manufacturer to have released an updated driver on its site, but as this isn't a final solution to the problem, it's unlikely that this is the last we'll hear about the issue. Intel is apparently working on finding the root cause of the problem, but it's unclear if it's going to be possible to patch it in software or if a hardware revision is going to be required in the end.Update Mar 4th: User @lovingbenji reports that on his system this new driver version does not fix the disconnect issue.

Although DRAM is using much less refined production processes compared to the latest processors and GPUs, all the major manufacturers are continuing to shrink their manufacturing nodes step by step. Part of the reason for this, is that a node shrink doesn't have the same improvements for DRAM as it does for most types of field-effect transistors or FETs, which are mostly used for making processor logic of some kind. SK Hynix is now said to have entered the partner verification process of its 5th gen 1β DRAM, to make sure its latest 1x nm DRAM is compatible with major applications. In SK Hynix's case this should roughly translate to a 12 nm process node.

According to Chosun Media in Korea, Intel will take part in this verification, with Intel having finished verification of SK Hynix's 4th gen 1α DRAM for its 4th gen Xeon Scalable processor. Initially, SK Hynix's 5th gen 1β DRAM will be targeting server applications, so it's likely it will be tested for compatibility with the same platforms from Intel, among others. The new 1β DRAM is said to increase efficiency by more than 40 percent, although the publication didn't mention if this is power efficiency or something else. The 1β DRAM from SK Hynix, as well as Samsung—who announced its 1β DRAM in December 2022—are made using an EUV lithography process and the two Korean DRAM makers are the only two makers of DRAM that are using EUV so far.

Once upon a time, the data center market represented a duopoly of x86-64 makers AMD and Intel. However, in recent years companies started developing custom Arm-based processors to handle workloads as complex within smaller power envelopes and doing it more efficiently. According to Counterpoint Research firm, we have the latest data highlighting a significant new player called Ampere Computing in the data center world. With the latest data center revenue share report, we get to see Intel/AMD x86-64 and AWS/Ampere Arm CPU revenue. For the first time, we see that a 3rd party company, Ampere Computing, managed to capture as much as 1.54% market revenue share of the entire data center market in 2022. Thanks to having CPUs in off-the-shelf servers from OEMs, enterprises and cloud providers are able to easily integrate Ampere Altra processors.

Intel, still the most significant player, saw a 70.77% share of the overall revenue; however, that comes as a drop from 2021 data which stated an 80.71% revenue share in the data center market. This represents a 16% year-over-year decline. This reduction is not due to the low demand for server processors, as the global data center CPU market's revenue registered only a 4.4% YoY decline in 2022, but due to the high demand for AMD EPYC solutions, where team red managed to grab 19.84% of the revenue from 2022. This is a 62% YoY growth from last year's 11.74% revenue share. Slowly but surely, AMD is eating Intel's lunch. Another revenue source comes from Amazon Web Services (AWS), which the company filled with its Graviton CPU offerings based on Arm ISA. AWS Graviton CPUs accounted for 3.16% of the market revenue, up 74% from 1.82% in 2021.

AAEON, a leading manufacturer of AI development solutions, has released the UP Squared Pro 7000, bringing the acclaimed UP Squared Pro series into its third generation. The UP Squared Pro 7000 sees dramatic improvements when compared to the boards preceding it. The first of these is that it is the world's first industrial motherboard equipped with the Intel Core /Atom /N-Series processor platform (formerly Alder Lake-N), which offers 1.4x the CPU performance of the previous generation, alongside the benefit of supporting the Intel Distribution of OpenVINO Toolkit. In addition, the board hosts 16 GB of onboard LPDDR5 4800 MHz system memory, doubling the bandwidth and data transfer speed of the previous model, while also increasing overall energy-efficiency.

A first for the UP Squared Pro product line, the UP Squared Pro 7000 supports MIPI CSI cameras via an FPC port, freeing up its two 2.5 GbE (Intel i226-IT) and three USB 3.2 Gen 2 ports for other peripheral devices. Developers also gain access to exceptional expansion from the dense, 4" x 4" (101.6 mm x 101.6 mm) board, with the same 40-pin GPIO header alongside M.2 E, M, and B Keys for CNVI, PCIe, and USB add-ons.

MSI, a world leader in high-performance and innovative computing solutions, announced the PRO DP10 13M Business & Productivity Mini PC. This pint-sized enclosure is packed with more technology than what meets the eye. Featuring a compact chassis, powerful processor options, exclusive software, and Thunderbolt 4, the PRO DP10 13M is designed with efficiency and productivity in mind.

Powerful Ideas with Limitless Potential
PRO DP10 provides limitless potential while being less than 1.1 liters in volume. The small design helps tidy up a desk and save space, while the available robust hardware and software configurations support users in multitasking. Up to a 13th Gen Intel Core i7 processor with 12 cores and Iris Xe Graphics enables users to edit graphics and work with multiple programs faster and more seamlessly than previous generations. Furthermore, it supports up to 64 GB memory with a dual-channel design to address specific task requirements, delivering a robust and stable computing performance. In addition, the rich selection of IO ports includes one DP-out, one HDMI-out, one D-Sub (VGA), and one Thunderbolt 4, which supports up to 40Gb transfer speed and display output up to 8K resolution. The PRO DP10 can support up to four displays simultaneously, so users can view different programs in great detail.

The four major North American cloud service providers (CSPs) have made cuts to their server procurement quantities for this year because of economic headwinds and high inflation. Turning to server OEMs such as Dell and HPE, they are observed to have scaled back the production of server motherboards at their ODM partners. Given these developments, TrendForce now projects that global server shipments will grow by just 1.31% YoY to 14.43 million units for 2023. This latest figure is a downward correction from the earlier estimation. The revisions that server OEMs have made to their outlooks on shipments shows that the demand for end products has become much weaker than expected. They also highlight factors such as buyers of enterprise servers imposing a stricter control of their budgets and server OEMs' inventory corrections.

Intel Graphics today released the Arc Graphics GPU drivers 31.0.101.4146 WHQL. These work with Arc A-series discrete GPUs, Iris Xe MAX discrete GPU, and the Iris iGPUs found in Intel Core processors from the 11th Gen onward. For Arc A-series GPUs, the drivers add optimization for "Destiny 2: Lightfall" and "Wo Long: Fallen Dynasty," along with several performance improvements for "Halo Infinite" (DX12). Besides performance improvements, several color-corruption bugs with the game have been fixed for Arc A-series GPUs; and an application crash noticed with "Red Dead Redemption 2" in Vulkan API mode with fullscreen. Texture corruption issues with DiRT 5, and "Total War: Warhammer 40,000: Darktide," have been fixed.

DOWNLOAD: Intel Arc Graphics Drivers 31.0.101.4146 WHQL

After launching its beta version in September 2022, Intel today released version 1.0 of the Intel Quantum Software Development Kit (SDK). The SDK is a full quantum computer in simulation that can also interface with Intel's quantum hardware, including Intel's Horse Ridge II control chip and Intel's quantum spin qubit chip when it becomes available this year. The kit allows developers to program quantum algorithms in simulation, and it features an intuitive programming interface written in C++ using an industry-standard low-level virtual machine (LLVM) compiler toolchain. As a result, Intel's SDK offers seamless interfacing with C/C++ and Python applications, making it more versatile and customizable.

"The Intel Quantum SDK helps programmers get ready for future large-scale commercial quantum computers. It will not only help developers learn how to create quantum algorithms and applications in simulation, but it will also advance the industry by creating a community of developers that will accelerate the development of applications, so they are ready when Intel's quantum hardware becomes available," said Anne Matsuura, director of Quantum Applications & Architecture, Intel Labs.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, will be showcasing its latest generation of systems that accelerate workloads for the entire Telco industry, specifically at the edge of the network. These systems are part of the newly introduced Supermicro Intel-based product line; the better, faster, and greener systems based on the brand new 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids) that deliver up to 60% better workload-optimized performance. From a performance standpoint these new systems that demonstrate up to 30X faster AI inference speedups on large models for AI and edge workloads with the NVIDIA H100 GPUs. In addition, Supermicro systems support the new Intel Data Center GPU Max Series (formerly codenamed Ponte Vecchio) across a wide range of servers. The Intel Data Center GPU Max Series contains up to 128 Xe-HPC cores and will accelerate a range of AI, HPC, and visualization workloads. Supermicro X13 AI systems will support next-generation built-in accelerators and GPUs up to 700 W from Intel, NVIDIA, and others.

Supermicro's wide range of product families is deployed in a broad range of industries to speed up workloads and allow faster and more accurate decisions. With the addition of purpose-built servers tuned for networking workloads, such as Open RAN deployments and private 5G, the 4th Gen Intel Xeon Scalable processor vRAN Boost technology reduces power consumption while improving performance. Supermicro continues to offer a wide range of environmentally friendly servers for workloads from the edge to the data center.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

Late last year, it was reported that Intel is skipping its upcoming "Meteor Lake" microarchitecture for the desktop platform, giving it a mobile-platform debut in late-2023, with "Arrow Lake" following on in 2024, which would address both platforms. In the interim, Intel was expected to release a "Raptor Lake Refresh" architecture for desktop in 2023. It turns out now, that both the "Raptor Lake Refresh" and "Meteor Lake" architectures are coming to desktop—we just don't know when.

Apparently, Intel will brazen it out against AMD with a maximum CPU core-count of just 6 performance cores and 16 efficiency cores possible for "Meteor Lake." It's just that both the P-cores and a E-cores get an IPC uplift with "Meteor Lake." The processor features up to six "Redwood Cove" P-cores with an IPC uplift over the current "Raptor Cove" cores; and introduce the new "Crestmont" E-cores. A lot will depend on the IPC uplift of the latter. Leaf_hobby, a reliable source with Intel leaks on social media, has some interesting details on the I/O capabilities of "Meteor Lake" on the desktop platform.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

AAEON, a leading manufacturer of industrial-grade server solutions, has announced the release of the ZEUS-WHI0 4U Rackmount Whitely Platform Server System. The ZEUS-WHI0 is AAEON's first system-level solution to utilize a 3rd Generation Intel Xeon Scalable Processor (formerly Ice Lake-SP). With up to 40 cores and 80 threads, this platform provides server-grade power while also benefitting from peripheral technologies such as Intel Crypto Acceleration, Intel VT-x, and Intel AES-NI.

Equipped with seven PCIe slots with up to Gen 4 speed capability, the ZEUS-WHI0 is exceptionally expandable, making it capable of supporting up to four GPU cards for AI acceleration and enhanced graphics realization. Further to this, the ZEUS-WHI0 also supports eight 2.5" or 3.5" HDD via two 4-bay inputs for storage, alongside an additional M.2 2280 M-Key for PCIe [x4].

AMD and Arm have been gaining up on Intel in the server CPU market in the past few years, and the margins of the share that AMD had won over were especially large in 2022 as datacenter operators and server brands began finding that solutions from the number-2 maker growing superior to those of the long-time leader, according to Frank Kung, DIGITIMES Research analyst focusing primarily on the server industry, who anticipates that AMD's share will well stand above 20% in 2023, while Arm will get 8%.

Prices are one of the three major drivers that resulted in datacenter operators and server brands switching to AMD. Comparing server CPUs from AMD and Intel with similar numbers of cores, clockspeed, and hardware specifications, the price tags of most of the former's products are at least 30% cheaper than the latter's, and the differences could go as high as over 40%, Kung said.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

Thanks to the attribution of Puget Systems, we have a preview of Intel's latest Xeon W-3400 and Xeon W-2400 workstation processors based on Sapphire Rapids core technology. Delivering up to 56 cores and 112 threads, these CPUs are paired with up to eight TeraBytes of eight-channel DDR5-4800 memory. For expansion, they offer up to 112 PCIe 5.0 lanes come with up to 350 Watt TDP; some models are unlocked for overclocking. This interesting HEDT family for workstation usage comes at a premium with an MSRP of $5,889 for the top-end SKU, and motherboard prices are also on the pricey side. However, all of this should come as no surprise given the expected performance professionals expect from these chips. Puget Systems has published test results that include: Photoshop, After Effects, Premiere Pro, DaVinci Resolve, Unreal Engine, Cinebench R23.2, Blender, and V-Ray. Note that Puget Systems said that: "While this post has been an interesting preview of the new Xeon processors, there is still a TON of testing we want to do. The optimizations Intel is working on is of course at the top, but there are several other topics we are highly interested in." So we expect better numbers in the future.Below, you can see the comparison with AMD's competing Threadripper Pro HEDT SKUs, along with power usage using different Windows OS power profiles:

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

With the new PRO and the FOCUS (E23), XMG introduces two laptop series on a similar hardware basis: Both feature Intel's Core i9-13900HX and NVIDIA graphics cards up to the GeForce RTX 4070. While the PRO 15 and PRO 17 are slightly thinner as gaming workstations and boast more extensive connectivity, the FOCUS scores at a more affordable price and is not only available in 15.6 and 17.3-inch versions, but also in a 16-inch format. For the laptops originally designed as an entry-level series, the hardware upgrades mean a significant upgrade: the FOCUS series moves closer to the PRO laptops.

The key components found in the new XMG PRO 15 and PRO 17 as well as the XMG FOCUS 15, FOCUS 16 and FOCUS 17 are almost identical. All laptops employ Intel's Core i9-13900HX with 24 cores (8 P-cores, 16 E-cores) and 32 threads. The freely configurable graphics card options each include NVIDIA's new, DLSS-3-capable GeForce RTX 4050 (FOCUS only) as well as 4060 and 4070 (FOCUS and PRO) with a maximum graphics power rating of up to 140 watts (115 watts TGP plus 25 watts Dynamic Boost 2.0). However, since the clock behaviour and the actual power consumption of the GPUs in the new generation are subject to much more restrictive, application-specific specifications from NVIDIA, the maximum values are only achieved in synthetic stress tests such as Furmark - according to the official requirements of the graphics chip manufacturer.

ENERMAX, an industry-leading force dedicated to design extreme performance computer power supplies and cooling solutions, announces that its overclocking-graded AIO CPU cooler, LIQTECH TR4 II series, is now ready for Intel LGA4677 Xeon platform! The CPU mounting kits inside of the new version of LIQTECH TR4 II are designed for Intel Sapphire Rapid-based W-3400 and W-2400 series Xeon processors with socket LGA4677, and AMD Ryzen Threadripper PRO processors with socket sWRX8 / sTRX4/ TR4, as well as AMD socket SP3 for AMD EPYC processors.

Awarded as the BEST AIO CPU Cooler in European Hardware Awards, the LIQTECH TR4 II series is the world's first AIO CPU cooler tailored to provide 100% full coverage of the integrated heatspreader (IHS) of both AMD Ryzen Threadripper PRO and upcoming Intel Xeon Sapphire Rapids processors with unparalleled cooling results. The unbeatable cooling capacity (500 W TDP) makes it the best cooling solution for both Intel Xeon W-3400 and W-2400 series processor (LGA4677) and AMD Ryzen Threadripper PRO processors designed for workstations and high-end desktops (HEDTs).