Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its 64 GB, 32 GB, and 16 GB Server Premier DDR5 4800MT/s Registered DIMMs have been validated on the 4th Gen Intel Xeon Scalable Processor (formerly codenamed Sapphire Rapids). For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard memory solution sold by specification for use in white-box servers, and is platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, register, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Intel's 4th Gen Xeon Scalable Processor is their first to support next-generation DDR5 server-class memory and features eight memory channels, arranged in up to two DIMMs per channel, or 16 DIMMs per CPU socket. At 4800MT/s, each DDR5 Registered DIMM provides a peak bandwidth of 38.4 GB/s, which when grouped in multi-channel configurations provides a marked increase in performance over DDR4-based servers. DDR5 introduces advanced features for a more reliable and more efficient memory subsystem, including on-die ECC (ODECC), double the number of banks and double the burst length, improved refreshes, inclusion of a power management circuit (PMIC), additional temperature sensors, decision feedback equalization (DFE), and dual independent 32-bit subchannels (40-bit for ECC).

Back in February 2022 SiFive announced its partnership with Intel Foundry Services (IFS), to bring its "Horse Creek" SoC to market and now SiFive has announced that it's getting ready to launch its first development board on said SoC. This summer, SiFive will launch the HiFive Pro P550 development board, which will kick things up a serious notch when it comes to embedded SoC development boards, regardless of the CPU core the SoC is built around. The HiFive Pro P550 will be one of few microATX based embedded SoC development boards out there and so far, to our knowledge, the only one with a RISC-V based SoC. The Horse Creek SoC sports quad core, 2.2 GHz, 13-stage, triple-issue, out-of-order pipeline RISC-V RV64GBC CPU built on the Intel 4 node. The SoC also has a DDR5 5600 MHz memory interface, support for eight lanes of PCIe 5.0 and comes in a 19 x 19 mm FBGA package.

The HiFive Pro P550 will offer 16 GB of DDR5 memory, but based on the render of the motherboard, this is soldered to the board, rather than relying on standard DDR5 DIMMs. Furthermore, the board has two x16 PCIe 3.0 expansion slots, although it's unclear how many PCIe each slot features, as well as a PCIe 3.0 M.2 2280 M-key slot for NVMe SSDs and a PCIe 3.0 M.2 E-key slot for a WiFi/Bluetooth module. The board also sports multiple USB/USB 3.0 ports and even a pair of USB-C ports. The press release also mentions both Gigabit and 10 Gbps Ethernet support, as well as support for onboard graphics and remote system management, without going into any further details. It'll be interesting to see if the Horse Creek SoC can deliver on its expected performance target, especially as SiFive has a lot to prove, especially as the company calls the RISC-V architecture inevitable.

The Intel Ethernet i226-V onboard 2.5 GbE controller appears to have a design flaw that causes the Ethernet connection to drop at random times for a few seconds. The I226-V is the latest version of Intel's cost-effective 2.5 Gbps Ethernet networking chips meant for PC motherboards with chipsets that have integrated MACs (i.e. Intel chipsets). It succeeds the I225-V, which was Intel's first consumer 2.5 GbE PHY. The I225-V was plagued by various issues that caused it to be unstable at 2.5 Gbps (but could be worked around by forcing 1 GbE mode). Many premium Intel 700-series chipset Socket LGA1700 motherboards integrate the new I226-V, which is the I225's successor, as their default onboard 2.5 GbE controller. Some enthusiast-segment motherboards have a second Ethernet controller that's either of a different brand (such as Realtek or Marvell), or a different kind of wired Ethernet (such as 10 GbE).

Since mid-December, users of Intel 700-series chipset motherboards (which debut the I226-V), have been reporting random connections drops to Intel's Support Community, Microsoft, ASUS and Reddit 1, 2, 3, 4, 5. These drops are momentary, last a few seconds, and you'll mostly not notice it; however for applications that need an uninterrupted connection (such as online gaming, video conferencing, VPN, Remote Desktop etc.), such a link drop will be noticeable. You can check if you are affected by opening Windows Event Viewer, navigate to "Windows Logs," "System" and search for "e2fnexpress," in particular Event 27 "Intel Ethernet Controller I226-V, Network link is disconnected." and Event 32 "Intel Ethernet Controller I226-V. Network link has been established at 1 Gbps full duplex." We've experienced the issue in our labs. We tried updating to the latest 27.8 drivers from Intel, and used the latest motherboard BIOS, at 1 Gbps speed, but the issue couldn't be fixed reliably. In the end, we just switched over to the motherboard's second network interface, which is not an Intel NIC, and the issue went away. Another option could be to buy a cheap PCI-Express network card or use the board's integrated Wi-Fi. Still, such issues aren't acceptable, especially not from a world-leading manufacturer like Intel, who once was reputed for the quality of its networking equipment. Intel and its motherboard partners need to get on top of this issue.Update Mar 1st: Intel has issued a Windows workaround and patch for these issues. Let us know if this fixes it for you.

Update Mar 4th: User @lovingbenji reports that on his system this new driver version does not fix the disconnect issue.

GUNNIR, the Chinese Intel Arc board partner, unveiled a 16 GB version of its Arc A770 Photon graphics card with specs that partially match Intel's A770 16 GB Limited Edition. Custom-design versions of the A770, such as the one from ASRock Phantom Gaming, only come with 8 GB of memory. The card comes with GUNNIR's heaviest dual-slot, triple-fan cooling solution. While the card offers an overclocked GPU, with the A770 running at 2.40 GHz (compared to 2.10 GHz reference), the memory runs at the same 16 Gbps GDDR6-effective speed as the A770 8 GB version, and not the 17.5 Gbps that the A770 16 GB Limited Edition comes with. This leaves you with a still-respectable 512 GB/s of memory bandwidth on tap. The card draws power from two 8-pin PCIe power connectors. GUNNIR is pricing the card at RMB ¥3,199 ($470).

Intel CEO Pat Gelsinger, in an interview with CNN at WEF Davos, stated that semiconductor chip supply chains will have a greater influence on geopolitics than oil supply-chains over the next 50 years. Modern civilization is increasingly digitized, and most modern conveniences are "chipped" and connected in some form, which would put the chip-producing nations, or entities producing/supplying the chips at a distinct geopolitical advantage, similar to the oil-producing ones today. The location of "oil reserves [has] defined geopolitics for the last five decades," Gelsinger said; "where the technology supply chains are, and where semiconductors are built, is more important for the next 5 decades," he added.

We caught a taste of exactly what he meant when global semiconductor supply chains buckled around 2020-onward, hitting a multitude of other industries, including automobiles, construction, remote-work, consumer electronics, and much more. Unlike oil, which is a geographically constrained being a natural resource, chips can be manufactured almost anywhere, dictated only by geopolitical, trade, and IP barriers. Gelsinger calls for a much wider geographic spread of chip-production, so the supply-chains get resilient to disruptions due to unforeseen events. "We need this geographically balanced, resilient supply chain," he said. Gelsinger is at the forefront of advocating semiconductor manufacturing on U.S. soil to not only meet local demand, but also contribute to global supply-chain resilience. The CHIPS Act passed by U.S. Congress in 2022 will oversee more than $200 billion in public investments on semiconductor manufacturing and tech-research in the U.S.

ASUS today announced the latest additions to its business-friendly range of ExpertCenter desktop PCs—the all-new ExpertCenter D5 Tower (D500TE) and ExpertCenter D7 Tower (D700TE) models.

Powered by up to the latest 13th Generation Intel Core i9 processor and professional-grade NVIDIA graphics, these new ExpertCenter desktops benefit from a voluminous 27-liter case for maximum expandability. Embracing the ExpertCenter ethos, the new models are meticulously engineered to deliver professional performance, easy maintenance, enterprise-grade security and manageability. They're also built to and tested to military-grade standards of strength and resilience. Sustainability and efficiency are also cornerstones of the ExpertCenter design, from manufacturing and packaging to daily use—achieving multiple certifications for their environmental consideration.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."

Intel's Xeon processors feature a wide range of embedded functionalities that the company has developed over the years. One such is the Virtual RAID on CPU (VROC) that enabled the functionality of an NVMe RAID card on the CPU, simplifying the installation, cost, and maintenance of high-performance storage arrays. Debuting in 2017, it is present in some consumer-facing Core models and Xeon Scalable platforms where it sees the highest usage. However, on January 6, Intel posted a product change notice that notified the users that the VROC function would be discontinued, with the last orders being placed on January 23 and the last shipping with VROC being made on March 31. This caused confusion, especially in the enterprise sector, which utilizes Intel Xeon processors for their workloads and storage arrays.

Tom's Hardware has reached out to Intel for clarification and got the following statement:

Intel SpokespersonThe PCN [Product Change Notice] was prematurely posted while the decision was under evaluation. After discussing with the ecosystem and customers we realize there is significant demand for this product and intend to continue to support it.

Dell Technologies expands the industry's top selling server portfolio, with an additional 13 next-generation Dell PowerEdge servers, designed to accelerate performance and reliability for powerful computing across core data centers, large-scale public clouds and edge locations. Next-generation rack, tower and multi-node PowerEdge servers, with 4th Gen Intel Xeon Scalable processors, include Dell software and engineering advancements, such as a new Smart Flow design, to improve energy and cost efficiency. Expanded Dell APEX capabilities will help organizations take an as-a-Service approach, allowing for more effective IT operations that make the most of compute resources while minimizing risk.

"Customers come to Dell for easily managed yet sophisticated and efficient servers with advanced capabilities to power their business-critical workloads," said Jeff Boudreau, president and general manager, Infrastructure Solutions Group, Dell Technologies. "Our next-generation Dell PowerEdge servers offer unmatched innovation that raises the bar in power efficiency, performance and reliability while simplifying how customers can implement a Zero Trust approach for greater security throughout their IT environments."

ASUS today announced Vivobook S 16 Flip OLED (TP3604), a convertible 16-inch laptop that's just 19.6 mm slim and 1.9 kg light. It's designed to give users the 360° of freedom they need to explore all the possibilities. Available in stylish Midnight Black or Cool Silver, this exciting laptop is built to be tough, undergoing the world's strictest US military-grade durability testing regime, and features the formidable power of the latest 13th Gen Intel Core H-series processors and a long-lasting 70 Wh battery.

Users can treat their eyes to the gorgeous visuals on the 3.2K 120 Hz OLED NanoEdge touchscreen with its Corning Gorilla Glass NBT scratch-resistant covering, and capture all their greatest ideas using the optional ASUS Pen 2.0, an MPP 2.0 stylus with 4096 pressure levels. Built with hygiene in mind, ASUS Vivobook S 16 Flip OLED uses ASUS Antimicrobial Guard Plus to inhibit the growth of viruses and bacteria by up to 99% on frequently-touched surfaces. Its environmental credentials are solid, too: it uses 30% post-consumer recycled (PCR) plastics in its construction, and is shipped in 100% recyclable packaging.

Intel faces its stiffest long-term challenge not from AMD in the client desktop and server segments, but from the likes of Apple and Qualcomm in the ultraportable notebook SoC market. The company is looking to meet the challenge head-on with not just its current Hybrid architecture-based "Rocket Lake-U" processors, but the upcoming "Meteor Lake" and "Arrow Lake" architectures, which disaggregate the processor into chiplets build on various foundry nodes, including ones that are external to Intel. The move here is to keep Intel ahead of the curve with Moore's Law buckling. The real ace up Intel's sleeves is "Lunar Lake."

Slated for "beyond 2024" (which could mean 2025 or later), "Lunar Lake" is reportedly a fresh ground-up design for not just the SoC, but also the CPU microarchitecture, with a design focus on performance/Watt, and a focus on mobile devices. This, according to a statement to Dr Ian Cutress. Intel has already brought Hybrid CPU cores to the PC, and with Arm partners loading their SoCs with three or more kinds of CPU cores; Intel could possibly give "Lunar Lake" even more [kinds of] Hybrid processing capabilities. Another hint on the direction in which Intel is heading comes from unlikely quarters—"Sapphire Rapids." Intel's latest enterprise processors attempt to overcome the CPU core-count deficit to AMD, by incorporating various on-die accelerators—these are fixed-function hardware that accelerate specific kinds of enterprise workloads. Intel could give us another lick about "Lunar Lake" in its January 26 Q4-2022 Financial Disclosures Day.

EK, the premium liquid cooling gear manufacturer, is releasing the EK-Quantum Velocity² ILM Replacement - 1700, a product that replaces the motherboard's Integrated Loading Mechanism (ILM) with a frame that bolsters the structural rigidity of the socket, motherboard, and even the CPU. It is used for cooling 12th and 13th generation Intel Core CPUs with regular EK-Quantum Vector² CPU water blocks, not Direct Die models.

Due to the rectangular and elongated design of these CPUs and the way the stock ILM holds the CPU down, the Intel 12th and 13th-gen CPUs are prone to warping caused by uneven pressure. The new contact frame from EK mitigates this issue as it prevents any warping or bending of the CPU and its surrounding area. This improves the cooling efficiency due to more even pressure applied on the CPU. As a result, the bending is removed and the CPU's center that contains the heat source is no longer concave, enabling improved contact with the cooler.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

According to multiple reports and sources close to Tom's Hardware, Intel and Microsoft have quietly resumed operations and a basic level of support in Russia. As to comply with sanctions imposed by Europe, the UK, and US, Intel and Microsoft are forbidden to sell any new technology within the state of Russia. This has made Intel and Microsoft block official software downloads. However, Intel has stated that the company is obliged to provide warranty services that are a part of purchasing an Intel product. "Intel continues to comply with all applicable export regulations and sanctions in the countries in which it operates. This includes compliance with the sanctions and export controls against Russia and Belarus issued by the US and allied nations. Access to resources that meet driver update needs, such as the Intel Download Center and Intel Download Support Assistant (IDSA), are part of Intel's warranty obligations," said Intel, adding that "There have been no recent changes to our operations."

These changes are not exactly "recent," as reports close to Tom's Hardware have noted that downloads were resumed towards the end of 2022. Izvestia and CNews reported that users could access the Intel download portal without VPN and IP masking. This required finding a download section through Google/Yandex, as the official Intel Russia website is still not officially reachable by Russian IPs.

ASUS today announced six of the latest models in its popular Vivobook Classic series of everyday laptops, led by the updated Vivobook 14 OLED (X1405), Vivobook 15 OLED (X1505) and Vivobook 16 (X1605). These are accompanied by new versions of the affordable Vivobook 14 (X1404), Vivobook 15 (X1504) and Vivobook 17 (X1704).

Smooth performance is delivered by up to 13th Gen Intel Core H-series processors with 16 GB RAM and up to a 1 TB SSD. Quiet and efficient cooling is provided by the dual-vented cooling system with an IceBlade fan and up to two heat pipes. The long-lasting up to 50 Wh battery gives users more freedom, and there's up to WiFi 6E for ultrafast connectivity. Other helpful design features include the latest ASUS AI noise-canceling audio technology for crystal-clear communications, and there are bundled productivity-enhancing ASUS apps including GlideX, MyASUS and ScreenXpert.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new high-performance TVS-h874 QuTS hero NAS models that incorporate 12th Gen Intel Core i9 sixteen-core, i7 twelve-core multi-thread processors with Intel Core Hybrid Technology for optimal computing performance and smooth multiple virtual machine (VM) operation. Integrating the reliable ZFS-based operating system, PCIe Gen 4 expandability, M.2 NVMe SSD caching, and 2.5GbE/10GbE connectivity, the TVS-h874 assists businesses in building high-performance storage environments for hosting multiple VM, application servers, and running business data backup/restore applications.

"The new TVS-h874 models adopt Intel Core Hybrid Technology, combining Performance-cores and Efficient-cores," said Andy Chuang, Product Manager of QNAP, adding "The Performance Hybrid Architecture intelligently allocates CPU cores to different tasks, thus increasing the performance of the new TVS-h874 models by 3.55 times compared with previous models."

Intel today formally launched the Core i9-13900KS "Raptor Lake" flagship desktop processor. At an MSRP of USD $700, the i9-13900KS is positioned a notch above the $590 i9-13900K, which it replaces as the top 13th Gen Core desktop part you can buy. The i9-13900KS features the same 8P+16E core-configuration as the i9-13900K, but at increased clock speeds and power limits. It is the world's first 6 GHz processor, with its maximum boost frequency set at exactly 6.00 GHz, up from 5.80 GHz of the i9-13900K. This is not just a minor +200 MHz speed bump, but backed by increased power-limits, which enable improved multi-threaded boost-frequency spread thanks to the Adaptive Boost Technology carried over from the previous-generation i9-12900KS.

The 8 "Raptor Cove" P-cores of the i9-13900KS are clocked at 3.00 GHz base with up to 6.00 GHz boost, compared to 3.00/5.80 GHz of the i9-13900K, while the E-core frequencies are left untouched at 2.20 GHz base and up to 4.30 GHz boost. The big change here is the processor base power value, which is now set at 150 W, compared to 125 W of the i9-13900K, and while the maximum turbo power value is the same 253 W, Intel has changed the way its power headroom is utilized to support improved boost frequency spread across the P-cores. It seems like Intel hasn't sampled tech publications this processor, and the handful publications that have posted their reviews today using processors sourced from friendly retailers, report increased power-draw, and the need for large aftermarket cooling solutions even at stock frequencies. The i9-13900KS is being offered as an overclocking-friendly chip to those who know what they're doing and can handle extreme cooling solutions.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its DDR5 product for servers using 1anm, the fourth generation of the 10 nm process technology, has been validated on the 4th Gen Intel Xeon Scalable processor (formerly codenamed Sapphire Rapids) for the first time in the industry. "The validation of the 1anm DDR5 compatibility by Intel for its newest processor that supports DDR5 for the first time is monumental," SK hynix said. "We will seek a fast turnaround in the semiconductor memory industry by actively responding to the growing server market through DDR5, which is already in mass production."

The validation of the company's 1anm DDR5 product, which adopts 1anm technology using the EUV lithography process, is for 4th Gen Intel Xeon Scalable processors, Intel's latest server CPU launched on January 10th. The 4th Gen Intel Xeon Scalable processor has been cited as a key to a turnaround in the industry, given that the launch of a next-generation server CPU requires server replacement and thus, results in a rapid increase in demand for high-performance memory chips. Experts predict that DDR5, expected to meet customers' such needs, will soon become the flagship product in the server DRAM market.

AI is at the heart of humanity's most transformative innovations—from developing COVID vaccines at unprecedented speeds and diagnosing cancer to powering autonomous vehicles and understanding climate change. Virtually every industry will benefit from adopting AI, but the technology has become more resource intensive as neural networks have increased in complexity. To avoid placing unsustainable demands on electricity generation to run this computing infrastructure, the underlying technology must be as efficient as possible.

Accelerated computing powered by NVIDIA GPUs and the NVIDIA AI platform offer the efficiency that enables data centers to sustainably drive the next generation of breakthroughs. And now, timed with the launch of 4th Gen Intel Xeon Scalable processors, NVIDIA and its partners have kicked off a new generation of accelerated computing systems that are built for energy-efficient AI. When combined with NVIDIA H100 Tensor Core GPUs, these systems can deliver dramatically higher performance, greater scale and higher efficiency than the prior generation, providing more computation and problem-solving per watt.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

AIC Inc., (from now on referred to as"AIC"), a leading provider in enterprise storage and server solutions, today unveiled its new server systems powered by 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids). The new server platforms are designed to accelerate performance across the most in-demand workloads that businesses rely on including enterprise, storage, AI and HPC.

The newly launched AIC servers, SB102-HK, SB201-HK and HP202-KT, are designed to offer superior processing performance and energy efficiency by leveraging the innovative features of 4th Gen Intel Xeon Scalable processors. With built-in accelerators, the 4th Gen Intel Xeon Scalable processors optimize the utilization of CPU core resources and feature enhanced memory bandwidth with DDR5, advanced I/O with PCIe Gen 5 and Compute Express Link (CXL) 2.0/1.1, and the ability to accelerate PyTorch real-time inference performance by up to 10x using Intel Advanced Matrix Extensions (Intel AMX) compared to the previous generation. The new AIC servers are empowered by advanced security technologies from 4th Gen Intel Xeon Scalable processors, allowing them to protect data and unlock new opportunities for business collaborations.

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel Xeon Scalable processor - the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM's well-established cyber security product line. NSA 7160 is equipped with the latest Intel technologies, featuring eight PCIe Gen5 extension slots for LAN modules, built-in accelerators, CXL1.1 and supports installation of RunBMC module & full-height full-length (FHFL) card.

NEXCOM's NSA 7160 is intended for network security and 5G network applications, with cutting-edge features like multi-core computing performance, high memory capacity, high-speed I/O interface, and improved Intel QuickAssist Technology (Intel QAT) hardware acceleration for both enterprise and telecommunication applications. By leveraging 4th Gen Intel Xeon Scalable processors, NSA 7160 accelerates performance across the fastest-growing workloads and delivers value across multiple applications.

Today, Lenovo unveiled 25 new ThinkSystem and ThinkAgile server and hyperconverged solutions powered by Intel's 4th Generation Xeon Scalable Processors as part of its recently announced Infrastructure Solutions V3 portfolio. Designed to help accelerate global IT modernization for organizations of all sizes, the integrated solutions deliver advanced performance, efficiency and management capabilities specifically optimized for complex workloads, including mission-critical, AI, HPC and containerized applications.

"In today's competitive business climate, modern infrastructure solutions that generate faster insights and more efficiently enable complex workloads from the edge to the cloud are critical across every major industry," said Kamran Amini, Vice President and General Manager of Server & Storage, Lenovo Infrastructure Solutions Group. "With the performance and management improvements of the Intel-based ThinkSystem V3 portfolio, customers can reduce their IT footprint by up to three times to achieve greater ROI and more easily transform their infrastructure with one seamless platform designed for today's AI, virtualization, multi-cloud and sustainable computing demands."

EK, the leading liquid cooling gear manufacturer, is announcing the availability of two high-performance liquid cooling solutions for the Intel "Sapphire Rapids" processor family. These single-socket LGA4677 water blocks are specifically designed to cool the 4th Gen Intel Xeon Scalable CPUs that are optimized for advanced workstation professionals and go up to 60 cores.

EK is quite experienced with demanding needs of heavily threaded, I/O intensive workloads across the industries like Architecture, Engineering and Construction, Media and Entertainment, and Artificial Intelligence and Machine Learning. This enabled them to create the EK-Pro CPU WB 4677, a water block designed to provide sufficient thermal headroom to maximize the performance benefits of Intel Turbo Boost Technology while maintaining healthy processor operating temperatures. EK aimed to create a liquid cooling solution that enables customers to operate at peak performance unrestricted by any thermals.