Intel is planning a January 2023 market debut of its 4th Gen Xeon Scalable "Sapphire Rapids" server processors, which will be followed rather quickly by the launch of Xeon W-3400 and W-2400 processors targeting a segment of the market that spans HEDTs and workstations. According to information scored by leaf_hobby, a reliable source with Intel roadmap leaks; the company is planning a February 2023 announcement of these processors, followed by availability of the W-2400 in March, and W-3400 in April.

Intel could extensively market the various hardware-accelerators on the "Sapphire Rapids" MCM to the workstation crowd, where they might help users overcome the rather low CPU core-count of these processors compared their upcoming AMD Threadripper 7000 series counterparts. "Sapphire Rapids" tops out at 60-core/120-thread per socket, whereas the SP5-based Threadripper 7000 is expected to offer 96-core/192-thread. Both platforms offer the latest I/O, including PCIe Gen 5, CXL, and ECC DDR5 memory.

TrendForce reports that the recent easing of tight supply for components has led to rising shipments for enterprise servers. Furthermore, ODMs for the most part have been able to sustain the momentum of data center build-out with the demand from ByteDance and the tenders issued by Chinese telecom companies. Nevertheless, the performance of the enterprise SSD market on the whole has been impacted by falling NAND Flash prices. For 3Q22, the NAND Flash industry's enterprise SSD revenue dropped by 28.7% QoQ to US$5.22 billion. Furthermore, all enterprise SSD suppliers recorded a negative performance for the period as well.

Regarding individual enterprise SSD suppliers' revenue figures for 3Q22, Samsung posted around US$2.12 billion. Its market share also shrank to 40.6% from 44.5% in 2Q22. Samsung's performance was mainly dragged down by the decline in its NAND Flash ASP. In the aspect of product development, SSDs featuring 128L NAND Flash and PCIe 4.0 will remain Samsung's main offerings for enterprise storage during 2023.

January 3, 2023, on the sidelines of the International CES, Intel could launch dozens upon dozens of 13th Gen Core processor SKUs spanning every conceivable client PC platform. The event is expected to bring "Raptor Lake" to the mobile platform, with announcements spanning the ultra-portable "Raptor Lake-U," the thin-and-light performance "Raptor Lake-P," the mainstream mobile "Raptor Lake-H," and the enthusiast mobile "Raptor Lake-HX." This would cover almost every mobile device segment, including 7-9 W U-segment, to the 15-28 W P-segment, the 35-45 W H-segment, and the >55 W HX-segment, with several SKUs per segment across the four brand extensions (Core i3 thru Core i9).

For the desktop platform, Intel is expected to announce its new Core i9-13900KS "Raptor Lake-S" flagship, the world's first 6 GHz processor, besides a large number of 13th Gen Core "Raptor Lake-S" non-K SKUs in the 65 W TDP class, forming the bulk of the company's desktop processor lineup. Besides these, the company will also announce the more affordable Intel H770 and B760 desktop motherboard chipsets, bringing down platform costs (the 13th Gen Core processors are already supported on inexpensive motherboards based on the B660 and H670 chipsets via a BIOS update). Lastly, the company could announce "Raptor Lake" processors for the workstation segment, possibly compatible with the W780 chipset, and supporting ECC DDR5 memory, among other features relevant to the commercial desktop and workstation segments.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

Today, Intel unveiled research breakthroughs fueling its innovation pipeline for keeping Moore's Law on track to a trillion transistors on a package in the next decade. At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

"Seventy-five years since the invention of the transistor, innovation driving Moore's Law continues to address the world's exponentially increasing demand for computing. At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore's Law alive and well for years to come." -Gary Patton, Intel vice president and general manager of Components Research and Design Enablement

Not entirely unexpected, pictures of the first B760 motherboard, or at least its packaging and the board inside the packaging, has made an appearance online. We're around a month or so from the expected announcement of Intel's more cost effective 700-series chipset, which will likely follow the Z790 chipset by adding more PCIe 4.0 lanes, but otherwise differ very little from the current B660 chipset.

No actual details were provided when it comes to the specs of the Gigabyte B760 Aorus Elite AX DDR4, but it's likely that this will be the last generation of DDR4 motherboards. This is because it's unlikely that Intel will support DDR4 memory on future desktop PC platforms. What we can spot through the antistatic bag, is a board design that is very similar to Gigabyte's current B660 Aorus Elite AX DDR4, but with a new motif on the chipset and NVMe drive heatsinks. In fact, the board layout appears to be near identical from what little we can see, but there are some clearly visible component placement that can be seen and compared to the current model. Hopefully we'll get some better pictures of this board in the near future from the leaker.

Arm today announced the appointment of new Board members Dr. Paul E. Jacobs, chairman and CEO of XCOM Labs and former CEO and executive chairman of Qualcomm Inc., and Rosemary Schooler, former corporate vice president and general manager of Data Center and AI Sales for Intel. Both bring significant public company experience spanning technology development, business strategy and corporate governance to Arm as it continues to prepare for a public listing.

"The unique insights and depth of experience that Paul and Rosemary bring will help us expand and diversify our Board while providing enormous value to Arm at such a pivotal moment in our journey," said Rene Haas, CEO, Arm.

Amazon Web Services (AWS) cloud division is extensively developing custom Arm-based CPU solutions to suit its enterprise clients and is releasing new iterations of the Graviton series. Today, during the company re:Invent week, we are getting a new CPU custom-tailored to high-performance computing (HPC) workloads called Graviton3E. Given that HPC workloads require higher bandwidth, wider datapaths, and data types span in multiple dimensions, AWS redesigned the Graviton3 processor and enhanced it with new vector processing capabilities with a new name—Graviton3E. This CPU is promised to offer up to 35% higher performance in workloads that depend on heavy vector processing.

With the rising popularity of HPC in the cloud, AWS sees a significant market opportunity and is trying to capture it. Available in the AWS EC2 instance types, this chip will be available with up to 64 vCPU cores and 128 GiB of memory. The supported EC2 tiers that will offer this enhanced chip are C7gn and Hpc7g instances that provide 200 Gbps of dedicated network bandwidth that is optimized for traffic between instances in the same VPC. In addition, Intel-based R7iz instances are available for HPC users in the cloud, now powered by 4th generation Xeon Scalable processors codenamed Sapphire Rapids.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to extend the instant 6 GHz technology designed for Intel Core i9-13900K and Core i7-13700K processors to the Z690 platform. By simply upgrading the latest BIOS of Z690 motherboards and activating the relevant settings, users can optimize their Intel Core i9-13900K and Core i7-13700K processors to 6 GHz for the performance boost on single-core up to 3%. This enables users who stay with the existing Z690 platform can enjoy the performance enhancement of the new CPU as well.

The latest Intel 13th gen processor has impressed users with its class-leading performance. GIGABYTE's Instant 6 GHz on the Z790 platform was renowned for unleashing the performance of Intel Core i9-13900K and Core i7-13700K processors for users in an easier way and is now employed on the Z690 platform. By simply upgrading the latest BIOS with Instant 6 GHz activated, the system can automatically tweak CPU voltage and Vcore Load Line Calibration of Intel Core i9-13900K and Core i7-13700K processors to detect the most two optimized cores running at 6 GHz frequency. This further delivers a 3% performance boost on one single core like the Z790 platform.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance products, providing the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.

It can be widely used in harsh industrial environments, and provide stable computing performance, which can be deployed in industries ranging from the most edge computing to various Embedded platforms such as machine control and multimedia retail and the high-performance edge computing application products are the core of digital transformation, and how to continuously strengthen their capabilities has become more and more important. Power consumption is intended to realize energy-saving and carbon-reducing applications of various edge high-performance computing, and actively deploy in multiple application fields such as autonomous mobile robots (AMR).

Intel's upcoming Core i9-13900KS flagship processor is expected to be an estimated 22% pricier than the i9-13900K, suggests a Canadian retailer with early placeholder listings for chips that won't be in stock for months from now. The i9-13900KS is expected to be the world's first 6 GHz retail desktop processor, with its maximum boost frequency either at or beyond 6.00 GHz, compared to the 5.80 GHz of the i9-13900K. The chip will be built from the topmost tier bins of the "Raptor Lake-S" silicon. As this point we don't know if it comes with a higher Maximum Turbo Power (MTP) value than the 253 W of the i9-13900K.

Intel is designing the Core i9-13900KS to ward off the threat from AMD's Ryzen 7 7800X3D "Zen 4" processor that incorporates 3D Vertical Cache technology for a significant gaming performance uplift. 3DV cache raised gaming performance of "Zen 3" up to the levels of 12th Gen Core "Alder Lake" processors, and the expectation now is that it will similarly raise gaming performance of "Zen 4" to be competitive with that of "Raptor Lake."

EK, the premium liquid cooling gear manufacturer, is introducing the ultimate water cooling solution for Intel Arc A750 and A770 graphics cards. These new Intel GPUs get a premium Vector² water block solution with a passive backplate. The EK-Quantum Vector² ARC A750/A770 are single-package liquid cooling solutions consisting of a Vector² series water block and a black-anodized aluminium backplate. Its aesthetics are dominated by minimalist straight lines and the backplate coming around the side of the GPU to cover the PCB completely.

The Vector² cooling engine combines the jet plate with a 3D-machined Plexi insert to improve flow distribution and thermal performance. This cooling engine is based on an Open Split-Flow cooling engine design, which proved to be a superior solution for GPU water blocks. It is characterized by low hydraulic flow restriction, meaning it can be used with weaker water pumps or pumps running on low-speed settings and still achieve top performance. EK took great care to achieve a symmetrical flow domain by utilizing an internal bridge to secondary components. This was done to ensure the cooling of secondary components without sacrificing flow distribution over the GPU core.

Back in September 2021, reports about Intel working on something called SDSi or software defined silicon, started to appear. Now, over a year later, the company has finally launched its SDSi products under the Intel On Demand branding. Back then, we speculated about what features Intel would put behind a paywall and although we were somewhat off track, Intel has put some specific "instructions" behind the paywall on the supported Xeon processors. Specifically, some CPUs will have Quick Assist, Dynamic Load Balancer and Data Streaming Accelerator available as an On Demand feature. Additionally, Intel is also putting its Software Guard Extensions and In-Memory Analytics Accelerator behind the same pay wall.

It appears that these features will be offered as-a-service offering from some of Intel's service partners, but there's also a "one-time activation of select CPU accelerators and security features" according to the Intel On Demand website. It's unclear which Xeon SKUs will get Intel On Demand, but according to The Register, it'll be the upcoming Sapphire Rapids based Xeon processors which should be the first parts affected. Intel has listed partners like HP, Lenovo and SuperMicro, among others, that are involved with the Intel On Demand program. It will still be possible to buy next gen Xeon CPUs that are fully feature enabled like today, but it's unclear if the Intel On Demand Xeon SKUs will offer some kind of cost benefits to companies that don't need the additional features that are behind the paywall.

Intel Corporation today announced that Barbara G. Novick, co-founder and senior advisor at BlackRock Inc., was elected to its board of directors, effective Dec. 1, 2022. Novick will serve as an independent director and join the board's Audit & Finance and Compensation committees. "As co-founder and leader of one of the world's most successful investment firms, Barbara brings a unique perspective to Intel's board," said Omar Ishrak, chairman of the Intel board. "With her deep experience in investment and finance as well as broad business acumen, Barbara will be a strong advocate for the interests of our stockholders as Intel continues its transformation."

Novick, 62, co-founded BlackRock in 1988 and continued as its vice chairman until February 2021, when she transitioned to senior advisor. In 2009, she established BlackRock's Global Government Relations and Public Policy Group to provide a voice for investors, which she headed until 2021; and from 2018 to 2020, she additionally oversaw BlackRock's Global Investment Stewardship team.

Based on the latest data and research, TrendForce has further corrected down the projected YoY growth rate of whole server shipments for 2023 to 2.8%. Three factors are behind this revision. First, lead time has started to return to its usual length for most orders related to server components from 3Q23 onward. Seeing this, server OEMs and cloud service providers (CSPs) have also begun to correct the component mismatch issue by lowering demand for items that are in excess while maintaining a constant inventory level for items that are still in tight supply. This development, in turn, has reduced the flow of server orders going to ODMs. Second, the wave of demand that was generated earlier from the effects of the COVID-19 pandemic is dissipating. Hence, expansion activities have cooled off noticeably for services such as video streaming, e-commerce, etc. Among CSPs, Meta, Google, and ByteDance (TikTok) have lowered their server procurement quantities for next year. Lastly, the global economic outlook has remained fairly negative, so companies across most industry sectors have formulated a more conservative expenditure plan and scaled back IT-related spending for next year.

Jon Peddie Research reports the growth of the global PC-based graphics processor unit (GPU) market reached 75.5 million units in Q3'22 and PC CPU shipments decreased by -19% year over year. Overall, GPUs will have a compound annual growth rate of 2.8% during 2022-2026 and reach an installed base of 3,138 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in the PC will grow to reach a level of 26%.

Year-to-year total GPU shipments, which include all platforms and all types of GPUs, decreased by -25.1%, desktop graphics decreased by -15.43%, and notebooks decreased by -30%—the biggest drop since the 2009 recession. AMD's overall market share percentage from last quarter decreased by -8.5%, Intel's market share increased by 10.3%, and NVIDIA's market share decreased by -1.87%, as indicated in the following chart.

AMD will build "Zen 4" based Ryzen Threadripper processors in an attempt to meet competition from Intel, which is rumored to launch HEDT processors of its own based on "Sapphire Rapids." While Intel's chip tops out at 60-core/120-thread and has a constellation of task-specific hardware-accelerators, AMD will arm its processors with raw CPU core-count, going as high up as 96-core/192-thread. The company has assigned the codename "Storm Peak" for these chips.

The Ryzen Threadripper 7000-series "Storm Peak" processor engineering samples surfaced on the Einstein@Home user database. As many as three OPNs have surfaced, "AMD Eng Sample: 100-000000884-21_N" and "AMD Eng Sample: 100-000000884-20_Y," which are 96-core/192-thread; and the "AMD Eng Sample: 100-000000454-20_Y," which is 64-core/128-thread. "Storm Peak" is likely just a variation of EPYC "Genoa," geared for higher frequencies.

Intel released the XeSS Unreal Engine plugin, letting game developers integrate the performance enhancement technology with their Unreal Engine 4 and Unreal Engine 5 powered games, simulators, and 3D visualization applications. The plugin lets Unreal Engine take advantage of XeSS not just on Intel Arc "Alchemist" GPUs, where they benefit from the accelerated XMX code-path; but also AMD and NVIDIA GPUs, where the technology takes advantage of the slower yet functional DP4a code-path. XeSS is technically a second-generation super-resolution technology that Intel claims is on-par with AMD FSR 2.x and NVIDIA DLSS 2. Integrating it is as straightforward as adding AMD FSR support. Those interested can grab the plugin from the GitHub source link, below.

Rugged embedded computer brand, Cincoze, knows that HMI is the most common application of industrial panel PCs. In addition to visualizing equipment-related data, HMI can also monitor and control machinery equipment, which is helpful for the on-site manager to get an accurate picture of the process status.

The newly launched open frame panel PC is the latest addition to the Cincoze Display Computing - CRYSTAL product line. Whether an industrial panel PC for factory use, a sunlight-readable panel PC for outdoor use, or an open frame panel PC for integration into advanced equipment, customers now have more options for selecting a suitable panel PC for their HMI application. The core technology behind Cincoze panel PCs is CDS (Convertible Display System, Pat. M482908), a modular panel PC system consisting of a computer module and display module that enables convenient on-site maintenance and flexibility for future upgrades.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

As part of Intel's Responsible AI work, the company has developed FakeCatcher, a technology that can detect fake videos with a 96% accuracy rate. Intel's deepfake detection platform is the world's first real-time deepfake detector that returns results in milliseconds. "Deepfake videos are everywhere now. You have probably already seen them; videos of celebrities doing or saying things they never actually did," said Ilke Demir, senior staff research scientist in Intel Labs.

Intel's real-time deepfake detection uses Intel hardware and software and runs on a server and interfaces through a web-based platform. On the software side, an orchestra of specialist tools form the optimized FakeCatcher architecture. Teams used OpenVino to run AI models for face and landmark detection algorithms. Computer vision blocks were optimized with Intel Integrated Performance Primitives (a multi-threaded software library) and OpenCV (a toolkit for processing real-time images and videos), while inference blocks were optimized with Intel Deep Learning Boost and with Intel Advanced Vector Extensions 512, and media blocks were optimized with Intel Advanced Vector Extensions 2. Teams also leaned on the Open Visual Cloud project to provide an integrated software stack for the Intel Xeon Scalable processor family. On the hardware side, the real-time detection platform can run up to 72 different detection streams simultaneously on 3rd Gen Intel Xeon Scalable processors.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings its upcoming server platforms powered by 4th Gen Intel Xeon Scalable processors optimized for HPC and storage markets at SC22 on November 14-17, Booth#2000 in the Kay Bailey Hutchison Convention Center Dallas.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue driving the changes in the HPC landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in chip technology coupled with the rise in cloud computing has brought high levels of compute power within reach for smaller organizations. HPC now is affordable and accessible to a new generation of users."

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

Today, MLCommons published results of its industry AI performance benchmark in which both the 4th Generation Intel Xeon Scalable processor (code-named Sapphire Rapids) and Habana Gaudi 2 dedicated deep learning accelerator logged impressive training results.


"I'm proud of our team's continued progress since we last submitted leadership results on MLPerf in June. Intel's 4th gen Xeon Scalable processor and Gaudi 2 AI accelerator support a wide array of AI functions and deliver leadership performance for customers who require deep learning training and large-scale workloads." Sandra Rivera, Intel executive vice president and general manager of the Datacenter and AI Group

Rescale, the leader in high performance computing built for the cloud to accelerate engineering innovation, today announced it is teaming with NVIDIA to integrate the NVIDIA AI platform into Rescale's HPC-as-a-Service offering. The integration is designed to advance computational engineering simulation with AI and machine learning, helping enterprises commercialize new product innovations faster, more efficiently and at less cost.

Additionally, Rescale announced the world's first Compute Recommendation Engine (CRE) to power Intelligent Computing for HPC and AI workloads. Optimizing workload performance can be prohibitively complex as organizations seek to balance decisions among architectures, geographic regions, price points, scalability, service levels, compliance, and sustainability objectives. Developed using machine learning on NVIDIA architectures with infrastructure telemetry, industry benchmarks, and full-stack metadata spanning over 100 million production HPC workloads, Rescale CRE provides customers unprecedented insight to optimize overall performance.