Intel Graphics employees inadvertently revealed that the company's Xe2 "Battlemage" graphics architecture is being designed for the 4 nm silicon fabrication node, which would give Intel's GPU designers a leap in transistor density and power headroom, given that TSMC 4 nm is an EUV node compared to the current 6 nm DUV node the company builds its Arc "Alchemist" GPUs on. The leak also seems to confirm that its succeeding "Celestial" graphics architecture is being designed for 3 nm. An enthusiast named gamma0burst sifted through public profiles of several Intel employees, and scored these details in their professional profile pages.

We are almost certain that Xe2 "Battlemage" is going to be built on the TSMC 4 nm node, and to a slightly lesser degree, about Xe3 "Celestial" being designed for TSMC's 3 nm N3X node. Intel roadmaps pin the debut of "Battlemage" to a 2023-2024 timeline, although this could also be a reference to the iGPU of the upcoming Core "Meteor Lake" processors that debut in the second half of 2023. Intel is highly likely to deliver "Meteor Lake" within its 2H-2023 timeline, which would mean that the mention of "2024" in the graphics technology roadmap could mean that discrete GPUs based on "Battlemage" only arrive next year.The same logic applies to Xe3 "Celestial," with the company mentioning "2024+" on the roadmap slide, which could mean that an "Celestial" will debut with an iGPU for a future Intel Core processor (such as "Panther Lake"), and as a discrete GPU only later. Intel is expected to take advantage of the 4 nm node to quantitatively double the SIMD machinery on the largest "Battlemage" discrete GPU. It is rumored that this chip will feature as many as 1,024 execution units (EU), which doubles the unified shader count to 8,192 over the current Arc A770. Besides double the shaders with higher IPC and clock speeds; "Battlemage" could also introduce larger on-die caches on the GPU to speed up the memory sub-system.