It would appear that motherboards based on the upcoming Intel B760 chipset aren't much of a secret, as even online price comparison sites are now starting to post details about the upcoming models. German Geizhals has posted details about Biostars B760A Silver motherboard and although the site doesn't have pictures of the board, it does provide a drawing from what appears to be the manual. As this is an entry level model, there isn't too much to get excited about, but it appears to be a decent enough board overall.

The B760A Silver sports four DDR5 DIMM slots, a PCIe 5.0 x16 slot, a PCIe 4.0 x4 slot and two PCIe 3.0 x1 slots, as well as three PCIe 4.0 M.2 slots for NVMe SSDs and an M.2 for an optional Wi-Fi/Bluetooth card. Other features include an HDMI 2.1 and DP 1.2 port around the back, as well as 2.5 Gbps Ethernet and a 10 Gbps USB-C port. The board has a front header for another 10 Gbps USB-C port, but there's no support for a 20 Gbps USB-C port. Biostar has at least not been stingy with fan headers, as a total of six are spread out around the board and for those that like RGB lights, there are also three ARGB headers. Geizhals isn't listing any retailers stocking the board as yet, so we don't get any indication on the cost of the board.

TECNO, a global innovative technology brand with operations in over 70 markets, recently announced the latest MEGABOOK S1 at TECNO Flagship Product Launch 2022 in Dubai, delivering its first flagship laptop to users.

In 2019, TECNO announced new efforts in building a digital product ecosystem by launching its AIoT business strategy, aiming to deliver digital to every person, home, and organization and help them create a fully- connected smart digital lifestyle. Following this vision, as the upgraded line of MEGABOOK T1, the flagship MEGABOOK S1 highlights the concept of ideas that create wonders, targeting users in professional fields like business and the creative industries, helping them work with ease while still achieving a higher efficiency.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the ultimate overclocking motherboard Z790 AORUS TACHYON with the latest 13th gen Intel Core processors has smashed 10 world O.C. records including PCMark 7, 3D Mark…etc, as well as 16 GFP (Global First Place) of individual category test by different core numbers, and obtained 9 HFP (Hardware First Place) highest record in specific CPU ID vs. core count. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dream motherboard for overclockers, which delivers unparalleled O.C performance with a more friendly and thoughtful interface to set its leading role on Z790 O.C. motherboards.

"It's inspiring that Z790 AORUS TACHYON breaks 10 overclocking world records and more than 20 various overclocking scores, which not only proves GIGABYTE's strong R&D strength but also demonstrates that GIGABYTE's devotion to providing formidable O.C motherboard. We believe this is just the beginning and will continue to create superior overclocking performance and records by Z790 AORUS TACHYON. We look forward to seeing more overclockers around the world using this motherboard to break more world records!" said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

Intel is planning to refresh its desktop processor product stack with new "Raptor Lake Refresh" SKUs in Q3-2023, according to a leaked roadmap. At this point it's unclear if these are just new SKUs within the 13th Gen Core desktop product stack, or if they'll form the 14th Gen Core family, much in the same way as "Coffee Lake Refresh" formed the 9th Gen Core, replacing the 8th Gen Core "Coffee Lake." At this point we don't know what constitutes "Raptor Lake Refresh," but it provides Intel's product managers with the opportunity to increase CPU core-counts across the product stack without needing a new silicon (the Raptor Lake silicon has 8 P-cores and 16 E-cores), slightly higher clock-speeds, and other improvements. We don't know if this will herald a new CPU socket or platform at this point, either.

The most interesting item in this leaked roadmap slide has to be the reference to the "mainstream workstation" segment, with products in the 250 W TDP bracket. The so-called "Sapphire Rapids 64L" could be a cut-down version of the "Sapphire Rapids" enterprise processor on a new socket, backed by the Intel W790 chipset. The "64L" part of the codename could be a reference to its PCIe Gen 5 lane count of 64, which is less than the 112 available to the full "Sapphire Rapids" silicon in its W-3400 product-stack. It's unclear if these processors feature a Core X branding like their predecessors from the "Cascade Lake-X" family, or Xeon W. Besides fewer PCIe lanes, Intel could also segment these chips with fewer DDR5 memory channels, though both the PCIe and DDR5 connectivity will be much wider than those of the "Raptor Lake-S" mainstream desktop processors.

With Christmas fast approaching, a guide to holiday gift-giving is here. Shop the latest gift to get the greatest reaction. The Mini IT11 Mini PC is the newest member of the GEEKOM Mini series. Premium product. Premium gift. Prepare to buy the premium GEEKOM Mini IT11, which will be available on December 12, 2022. The GEEKOM Mini IT11 is ready to run Windows 11 Pro OS, delivering improved productivity and a personalized, intuitive user experience.

With a revolutionary microarchitecture with 4 Cores, 8 Threads, up to 12M Cache, and 5.00 GHz, the 11th Gen Intel Core i7 processor delivers incredible power and responsiveness. Applications such as document creation, web surfing, rendering, video and image editing can take advantage of its high efficiency and superfast response speed. In combination with fast memory and massive storage, the GEEKOM Mini IT11 is powerful enough to handle even users' most demanding tasks and entertainment needs.

Intel is expanding its 13th Gen Core "Raptor Lake" desktop processor family with a number of new SKUs, led by the new flagship Core i9-13900KS. A leaked company slide confirmed the upper-end SKUs' specs. Led from the top, the new i9-13900KS packs the same 8P+16E (8 performance cores + 16 efficiency cores) configuration as the i9-13900K. It has a slightly higher 3.20 GHz base frequency compared to the 3.00 GHz of the i9-13900K, but boosts all the way up to 6.00 GHz, compared to 5.80 GHz of the i9-13900K. To ensure improved boost frequency residency, Intel bumped up the processor base power value from 125 W to 150 W, while leaving the maximum turbo power value untouched at 253 W.

We also see the specs of the non-K Core i9-13900 and Core i7-13700, which offer the same 8P+16E and 8P+8E core-configs as the i9-13900K and i9-13700K, respectively, but without unlocked multipliers. The i9-13900 ticks at 2.00 GHz with 5.60 GHz maximum turbo frequency, whereas the i7-13700 does 2.10 GHz base, with up to 5.20 GHz boost, compared to 3.40 GHz base and 5.40 GHz boost of the i7-13700K. As "locked" chips both have lower processor base power values of just 65 W, and maximum turbo power values of 219 W. Both these chips could include a cooling solution in the box, which is very likely the Laminar RH1 stock cooler that company includes with the i9-12900 and i9-12700. Intel is expected to announce these chips alongside a large number of 13th Gen Core i5 SKUs on January 3.

Intel Arc "Alchemist" graphics architecture was originally developed as a forward-facing PC GPU architecture with many of the contemporary graphics technologies, including full DirectX 12 Ultimate support, however, the GPU curiously lacks hardware support for DirectX 9. Released 20 years ago, DirectX 9 continued to power AAA PC titles well into the 2010s as game console development lagged (the era of Xbox 360 and PlayStation 3), and most e-sports titles of the time included either native or fallback DirectX 9 support for those on older GPUs. This is a problem for Intel, as many of the currently-popular e-Sports titles may still use DirectX 9, and so the Intel Graphics team set out to individually optimize DirectX 9 titles with each new Arc GPU driver release.

While Arc GPUs lack DirectX 9 support, foolproof API translation technologies exist, which convert DirectX 9 API instructions into DirectX 12. This is not fundamentally unlike how 32-bit applications work on 64-bit Windows (using WOW64 machine-architecture translation). This, however, requires per-game optimization to ensure any engine-level special features are correctly translated. With the latest 101.3959 Beta drivers, Intel optimized popular DirectX 9 titles "League of Legends," "Counter Strike: Global Offensive," "Starcraft 2," "Payday 2," "Guild Wars 2," "Stellaris," "NiZhan," and "Moonlight Blade." The company seems to be going about this the smart way, by relying on market analysis for selecting the games in need of optimization (understanding what DirectX 9 games are still being played).

Adding to its incredibly popular UP Xtreme product line, industry leader AAEON has announced the release of the UP Xtreme i12, the next generation developer board with 12th Generation Intel Core Processors (formerly Alder Lake-P). Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON's next-generation UP Xtreme i12 utilizes the 12 core, 16 thread hybrid architecture of 12th Generation Intel Core Processors, making it more energy-efficient despite possessing double the previous generation's thread count. With these improvements, the UP Xtreme i12 offers up to 20% greater CPU performance, while also hosting 32 GB onboard LPDDR5 system memory, which provides double the bandwidth and memory capacity of the previous generation.

The UP Xtreme i12's configuration of HDMI 2.0b, eDP 1.4, and two DP 1.4 slots give it the necessary tools to host four simultaneous 4K displays, alongside USB 4.0 and 2.5 GbE ports ensuring high-speed connectivity to peripheral cameras. Compounding this powerful, efficient function is the 2.47 x increase in graphics speed provided by Intel Iris Xe graphics, which makes the board an excellent candidate for smart retail deployments.

Intel Graphics today released the Intel Arc GPU Graphics Drivers, version 31.0.101.3959 beta. These bring game optimization for "World of Warcraft: Dragonflight," "Warhammer 40,000: Darktide," "The Callisto Protocol," "Marvel's Midnight Suns," and "Fortnite Chapter 4." The drivers also improve DirectX 9 game experience for a number of games (Arc GPUs lack native support for D3D9 and rely on API translation). These games include the likes of "Starcraft 2," "Payday 2," and CS:GO. Among the issues fixed with this release include ghosting and corruption noticed in "Victoria 3" in DirectX 11 mode; texture corruption with "Hearts of Iron IV," flickering noticed with "Stellaris" and "Sonic Frontiers." Grab the drivers from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 31.0.101.3959 beta

Intel is planning a January 2023 market debut of its 4th Gen Xeon Scalable "Sapphire Rapids" server processors, which will be followed rather quickly by the launch of Xeon W-3400 and W-2400 processors targeting a segment of the market that spans HEDTs and workstations. According to information scored by leaf_hobby, a reliable source with Intel roadmap leaks; the company is planning a February 2023 announcement of these processors, followed by availability of the W-2400 in March, and W-3400 in April.

Intel could extensively market the various hardware-accelerators on the "Sapphire Rapids" MCM to the workstation crowd, where they might help users overcome the rather low CPU core-count of these processors compared their upcoming AMD Threadripper 7000 series counterparts. "Sapphire Rapids" tops out at 60-core/120-thread per socket, whereas the SP5-based Threadripper 7000 is expected to offer 96-core/192-thread. Both platforms offer the latest I/O, including PCIe Gen 5, CXL, and ECC DDR5 memory.

TrendForce reports that the recent easing of tight supply for components has led to rising shipments for enterprise servers. Furthermore, ODMs for the most part have been able to sustain the momentum of data center build-out with the demand from ByteDance and the tenders issued by Chinese telecom companies. Nevertheless, the performance of the enterprise SSD market on the whole has been impacted by falling NAND Flash prices. For 3Q22, the NAND Flash industry's enterprise SSD revenue dropped by 28.7% QoQ to US$5.22 billion. Furthermore, all enterprise SSD suppliers recorded a negative performance for the period as well.

Regarding individual enterprise SSD suppliers' revenue figures for 3Q22, Samsung posted around US$2.12 billion. Its market share also shrank to 40.6% from 44.5% in 2Q22. Samsung's performance was mainly dragged down by the decline in its NAND Flash ASP. In the aspect of product development, SSDs featuring 128L NAND Flash and PCIe 4.0 will remain Samsung's main offerings for enterprise storage during 2023.

January 3, 2023, on the sidelines of the International CES, Intel could launch dozens upon dozens of 13th Gen Core processor SKUs spanning every conceivable client PC platform. The event is expected to bring "Raptor Lake" to the mobile platform, with announcements spanning the ultra-portable "Raptor Lake-U," the thin-and-light performance "Raptor Lake-P," the mainstream mobile "Raptor Lake-H," and the enthusiast mobile "Raptor Lake-HX." This would cover almost every mobile device segment, including 7-9 W U-segment, to the 15-28 W P-segment, the 35-45 W H-segment, and the >55 W HX-segment, with several SKUs per segment across the four brand extensions (Core i3 thru Core i9).

For the desktop platform, Intel is expected to announce its new Core i9-13900KS "Raptor Lake-S" flagship, the world's first 6 GHz processor, besides a large number of 13th Gen Core "Raptor Lake-S" non-K SKUs in the 65 W TDP class, forming the bulk of the company's desktop processor lineup. Besides these, the company will also announce the more affordable Intel H770 and B760 desktop motherboard chipsets, bringing down platform costs (the 13th Gen Core processors are already supported on inexpensive motherboards based on the B660 and H670 chipsets via a BIOS update). Lastly, the company could announce "Raptor Lake" processors for the workstation segment, possibly compatible with the W780 chipset, and supporting ECC DDR5 memory, among other features relevant to the commercial desktop and workstation segments.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

Today, Intel unveiled research breakthroughs fueling its innovation pipeline for keeping Moore's Law on track to a trillion transistors on a package in the next decade. At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

"Seventy-five years since the invention of the transistor, innovation driving Moore's Law continues to address the world's exponentially increasing demand for computing. At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore's Law alive and well for years to come." -Gary Patton, Intel vice president and general manager of Components Research and Design Enablement

Not entirely unexpected, pictures of the first B760 motherboard, or at least its packaging and the board inside the packaging, has made an appearance online. We're around a month or so from the expected announcement of Intel's more cost effective 700-series chipset, which will likely follow the Z790 chipset by adding more PCIe 4.0 lanes, but otherwise differ very little from the current B660 chipset.

No actual details were provided when it comes to the specs of the Gigabyte B760 Aorus Elite AX DDR4, but it's likely that this will be the last generation of DDR4 motherboards. This is because it's unlikely that Intel will support DDR4 memory on future desktop PC platforms. What we can spot through the antistatic bag, is a board design that is very similar to Gigabyte's current B660 Aorus Elite AX DDR4, but with a new motif on the chipset and NVMe drive heatsinks. In fact, the board layout appears to be near identical from what little we can see, but there are some clearly visible component placement that can be seen and compared to the current model. Hopefully we'll get some better pictures of this board in the near future from the leaker.

Arm today announced the appointment of new Board members Dr. Paul E. Jacobs, chairman and CEO of XCOM Labs and former CEO and executive chairman of Qualcomm Inc., and Rosemary Schooler, former corporate vice president and general manager of Data Center and AI Sales for Intel. Both bring significant public company experience spanning technology development, business strategy and corporate governance to Arm as it continues to prepare for a public listing.

"The unique insights and depth of experience that Paul and Rosemary bring will help us expand and diversify our Board while providing enormous value to Arm at such a pivotal moment in our journey," said Rene Haas, CEO, Arm.

Amazon Web Services (AWS) cloud division is extensively developing custom Arm-based CPU solutions to suit its enterprise clients and is releasing new iterations of the Graviton series. Today, during the company re:Invent week, we are getting a new CPU custom-tailored to high-performance computing (HPC) workloads called Graviton3E. Given that HPC workloads require higher bandwidth, wider datapaths, and data types span in multiple dimensions, AWS redesigned the Graviton3 processor and enhanced it with new vector processing capabilities with a new name—Graviton3E. This CPU is promised to offer up to 35% higher performance in workloads that depend on heavy vector processing.

With the rising popularity of HPC in the cloud, AWS sees a significant market opportunity and is trying to capture it. Available in the AWS EC2 instance types, this chip will be available with up to 64 vCPU cores and 128 GiB of memory. The supported EC2 tiers that will offer this enhanced chip are C7gn and Hpc7g instances that provide 200 Gbps of dedicated network bandwidth that is optimized for traffic between instances in the same VPC. In addition, Intel-based R7iz instances are available for HPC users in the cloud, now powered by 4th generation Xeon Scalable processors codenamed Sapphire Rapids.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to extend the instant 6 GHz technology designed for Intel Core i9-13900K and Core i7-13700K processors to the Z690 platform. By simply upgrading the latest BIOS of Z690 motherboards and activating the relevant settings, users can optimize their Intel Core i9-13900K and Core i7-13700K processors to 6 GHz for the performance boost on single-core up to 3%. This enables users who stay with the existing Z690 platform can enjoy the performance enhancement of the new CPU as well.

The latest Intel 13th gen processor has impressed users with its class-leading performance. GIGABYTE's Instant 6 GHz on the Z790 platform was renowned for unleashing the performance of Intel Core i9-13900K and Core i7-13700K processors for users in an easier way and is now employed on the Z690 platform. By simply upgrading the latest BIOS with Instant 6 GHz activated, the system can automatically tweak CPU voltage and Vcore Load Line Calibration of Intel Core i9-13900K and Core i7-13700K processors to detect the most two optimized cores running at 6 GHz frequency. This further delivers a 3% performance boost on one single core like the Z790 platform.

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance products, providing the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.

It can be widely used in harsh industrial environments, and provide stable computing performance, which can be deployed in industries ranging from the most edge computing to various Embedded platforms such as machine control and multimedia retail and the high-performance edge computing application products are the core of digital transformation, and how to continuously strengthen their capabilities has become more and more important. Power consumption is intended to realize energy-saving and carbon-reducing applications of various edge high-performance computing, and actively deploy in multiple application fields such as autonomous mobile robots (AMR).

Intel's upcoming Core i9-13900KS flagship processor is expected to be an estimated 22% pricier than the i9-13900K, suggests a Canadian retailer with early placeholder listings for chips that won't be in stock for months from now. The i9-13900KS is expected to be the world's first 6 GHz retail desktop processor, with its maximum boost frequency either at or beyond 6.00 GHz, compared to the 5.80 GHz of the i9-13900K. The chip will be built from the topmost tier bins of the "Raptor Lake-S" silicon. As this point we don't know if it comes with a higher Maximum Turbo Power (MTP) value than the 253 W of the i9-13900K.

Intel is designing the Core i9-13900KS to ward off the threat from AMD's Ryzen 7 7800X3D "Zen 4" processor that incorporates 3D Vertical Cache technology for a significant gaming performance uplift. 3DV cache raised gaming performance of "Zen 3" up to the levels of 12th Gen Core "Alder Lake" processors, and the expectation now is that it will similarly raise gaming performance of "Zen 4" to be competitive with that of "Raptor Lake."

EK, the premium liquid cooling gear manufacturer, is introducing the ultimate water cooling solution for Intel Arc A750 and A770 graphics cards. These new Intel GPUs get a premium Vector² water block solution with a passive backplate. The EK-Quantum Vector² ARC A750/A770 are single-package liquid cooling solutions consisting of a Vector² series water block and a black-anodized aluminium backplate. Its aesthetics are dominated by minimalist straight lines and the backplate coming around the side of the GPU to cover the PCB completely.

The Vector² cooling engine combines the jet plate with a 3D-machined Plexi insert to improve flow distribution and thermal performance. This cooling engine is based on an Open Split-Flow cooling engine design, which proved to be a superior solution for GPU water blocks. It is characterized by low hydraulic flow restriction, meaning it can be used with weaker water pumps or pumps running on low-speed settings and still achieve top performance. EK took great care to achieve a symmetrical flow domain by utilizing an internal bridge to secondary components. This was done to ensure the cooling of secondary components without sacrificing flow distribution over the GPU core.

Back in September 2021, reports about Intel working on something called SDSi or software defined silicon, started to appear. Now, over a year later, the company has finally launched its SDSi products under the Intel On Demand branding. Back then, we speculated about what features Intel would put behind a paywall and although we were somewhat off track, Intel has put some specific "instructions" behind the paywall on the supported Xeon processors. Specifically, some CPUs will have Quick Assist, Dynamic Load Balancer and Data Streaming Accelerator available as an On Demand feature. Additionally, Intel is also putting its Software Guard Extensions and In-Memory Analytics Accelerator behind the same pay wall.

It appears that these features will be offered as-a-service offering from some of Intel's service partners, but there's also a "one-time activation of select CPU accelerators and security features" according to the Intel On Demand website. It's unclear which Xeon SKUs will get Intel On Demand, but according to The Register, it'll be the upcoming Sapphire Rapids based Xeon processors which should be the first parts affected. Intel has listed partners like HP, Lenovo and SuperMicro, among others, that are involved with the Intel On Demand program. It will still be possible to buy next gen Xeon CPUs that are fully feature enabled like today, but it's unclear if the Intel On Demand Xeon SKUs will offer some kind of cost benefits to companies that don't need the additional features that are behind the paywall.

Intel Corporation today announced that Barbara G. Novick, co-founder and senior advisor at BlackRock Inc., was elected to its board of directors, effective Dec. 1, 2022. Novick will serve as an independent director and join the board's Audit & Finance and Compensation committees. "As co-founder and leader of one of the world's most successful investment firms, Barbara brings a unique perspective to Intel's board," said Omar Ishrak, chairman of the Intel board. "With her deep experience in investment and finance as well as broad business acumen, Barbara will be a strong advocate for the interests of our stockholders as Intel continues its transformation."

Novick, 62, co-founded BlackRock in 1988 and continued as its vice chairman until February 2021, when she transitioned to senior advisor. In 2009, she established BlackRock's Global Government Relations and Public Policy Group to provide a voice for investors, which she headed until 2021; and from 2018 to 2020, she additionally oversaw BlackRock's Global Investment Stewardship team.

Based on the latest data and research, TrendForce has further corrected down the projected YoY growth rate of whole server shipments for 2023 to 2.8%. Three factors are behind this revision. First, lead time has started to return to its usual length for most orders related to server components from 3Q23 onward. Seeing this, server OEMs and cloud service providers (CSPs) have also begun to correct the component mismatch issue by lowering demand for items that are in excess while maintaining a constant inventory level for items that are still in tight supply. This development, in turn, has reduced the flow of server orders going to ODMs. Second, the wave of demand that was generated earlier from the effects of the COVID-19 pandemic is dissipating. Hence, expansion activities have cooled off noticeably for services such as video streaming, e-commerce, etc. Among CSPs, Meta, Google, and ByteDance (TikTok) have lowered their server procurement quantities for next year. Lastly, the global economic outlook has remained fairly negative, so companies across most industry sectors have formulated a more conservative expenditure plan and scaled back IT-related spending for next year.

Jon Peddie Research reports the growth of the global PC-based graphics processor unit (GPU) market reached 75.5 million units in Q3'22 and PC CPU shipments decreased by -19% year over year. Overall, GPUs will have a compound annual growth rate of 2.8% during 2022-2026 and reach an installed base of 3,138 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in the PC will grow to reach a level of 26%.

Year-to-year total GPU shipments, which include all platforms and all types of GPUs, decreased by -25.1%, desktop graphics decreased by -15.43%, and notebooks decreased by -30%—the biggest drop since the 2009 recession. AMD's overall market share percentage from last quarter decreased by -8.5%, Intel's market share increased by 10.3%, and NVIDIA's market share decreased by -1.87%, as indicated in the following chart.