The recent 80 Gbps USB4 Version 2.0 standard looks set to get company from Thunderbolt at 80 Gbps in the not too distant future, as Intel has demoed its next generation Thunderbolt hardware to the media during its Technology Tour 2022 in Israel. It doesn't appear that Intel showed too much of the upcoming technology, but the company did apparently show it running at 80 Gbps, or if you want to be picky, two times 40 Gbps in dual link mode, much in the same way USB4 Version 2.0 will operate.

According to Tom's Hardware, Intel hasn't set the marketing name in stone quite yet, so it's not clear what Intel will be calling its next generation of Thunderbolt. What is clear is that Intel will continue to deliver on its own Thunderbolt products, despite USB4 having almost feature parity with Thunderbolt, apart from some Intel platform specific features. What is also unknown, is a potential availability date for Intel's next generation of Thunderbolt, but an educated guess will be before USB4 Version 2.0 launches.

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, is announcing its most advanced GPU server, incorporating eight NVIDIA H100 Tensor Core GPUs. Due to its advanced airflow design, the new high-end GPU system will allow increased inlet temperatures, reducing a data center's overall Power Usage Effectiveness (PUE) while maintaining the absolute highest performance profile. In addition, Supermicro is expanding its GPU server lineup with this new Universal GPU server, which is already the largest in the industry. Supermicro now offers three distinct Universal GPU systems: the 4U,5U, and new 8U 8GPU server. The Universal GPU platforms support both current and future Intel and AMD CPUs -- up to 400 W, 350 W, and higher.

"Supermicro is leading the industry with an extremely flexible and high-performance GPU server, which features the powerful NVIDIA A100 and H100 GPU," said Charles Liang, president, and CEO, of Supermicro. "This new server will support the next generation of CPUs and GPUs and is designed with maximum cooling capacity using the same chassis. We constantly look for innovative ways to deliver total IT Solutions to our growing customer base."

Here are the first pictures of a low-profile Intel Arc A380 graphics card by MSI. The half-height card is 2 slots thick, and is probably the first A380 card we've come across that appears to lack a power connector. The card surfaced on Japanese IT news portals, when a DAIV-built commercial desktop was disassembled revealing this low-profile card. The desktop combines a Core i7-12700 with this A380 card. The card appears to feature a complex aluminium fin-stack heatsink instead of a cheap aluminium monoblock one. The typical board power of A380 running at stock frequencies is exactly 75 W, and so MSI could build this card without any power connectors. Other board partners have been known to include at least a 6-pin connector to minimize power draw from the slot.

In an article explaining how to choose the right desktop processor with examples, Intel Canada accidentally leaked the Core i9-13900K, i7-13700K, and i5-13600K processors. The article has since been corrected with their 12th Gen predecessors, but not before screenshots made it to social media. The screenshots confirm the core-count of the i5-13600K to be 14-core/20-thread (6P+8E), the i7-13700K to be 16-core/24-thread (8P+8E), and the flagship i9-13900K to be 20-core/32-thread (8P+16E). It also mentions their clock speeds to be 5.10 GHz P-core boost for the i5-13600K, 5.30 GHz for the i7-13700K, and 5.40 GHz for the i9-13900K; however leaked press-deck slides list these as maximum Turbo Boost 2.0 frequencies. The Boost Max 3.0 and Thermal Velocity Boost frequencies are much higher. In case of the i9-13900K, it can be as high as 5.80 GHz. Intel is expected to launch its 13th Gen Core desktop processor series on September 27.

As with every generation before it, Intel is preparing a line of 13th Gen Core processors with 35 W processor base power under the "T" brand extension. The Core i7-13700T retains the core-configuration of the i7-13700K (8P+8E), but with a much more aggressive power-management for commercial-desktop applications. Geekbench 5.4.5 scores of the processor were leaked to the web, where the processor was shown matching or beating the Core i5-12600K, a previous-generation 6P+4E core processor with much higher boost frequencies, and power limits.

The Core i7-13700T comes with nominal clock speeds of just 1.40 GHz, compared to 3.40 GHz of the i7-13700K, while its P-core maximum boost is probably 4.90 GHz, compared to 5.40 GHz of its enthusiastic sibling. The maximum boost frequency difference between the two SKUs may not seem like much, but the tighter power limits mean that the i7-13700T will hold on to boost frequencies in much smaller bursts. The chip is shown scoring 1939 points in the single-threaded test, and 11564 points in the multi-threaded one. In the ST test, the chip has sufficient power budget to boost one P-core to its maximum frequency, and so it's beating the i5-12600K with its 1856 ST score. In the multi-threaded test, it's slightly worse than the 11608 points of the i5-12600K. While it has more cores, there simply isn't enough power budget to run them at high frequencies. The Core i7-13700T likely won't be part of the first wave of 13th Gen Core SKUs, and will probably launch by late-2022 or early-2023.

With Intel's 13th Gen Core "Raptor Lake" facing stiff competition from AMD's Ryzen 7000 series, and the "Zen 4" series being augmented with 7000X3D series in early-2023, it's becoming a foregone conclusion that Intel will launch a possible "Core i9-13900KS" SKU, which is on its way to being the world's first desktop processor that can boost up to the 6.00 GHz mark. The processor should be able to boost its 8 "Raptor Cove" P-cores to the 6.00 GHz mark, given that the maximum boost frequency of the stock i9-13900K is already rumored to be at 5.70 GHz.

At its Tech Tour event in Israel, Intel confirmed that "Raptor Lake" brings a 15% single-threaded, and 41% multi-threaded performance gain over "Alder Lake." The single-threaded gain is from the higher IPC of the "Raptor Cove" P-core, coupled with its frequency set as high as 5.70 GHz; whereas the multi-threaded performance gain is a combination of increased IPC of the P-cores, and increased frequencies for both the P-cores and E-cores. The E-core clusters get more shared L2 cache, which should improve their performance, too.

Intel's accelerated computing group head Raja Koduri, who heads the team behind the Arc "Alchemist" graphics, on late-Sunday, refuted rumors about the company shutting down the Arc graphics product line. Responding to a question to that effect on Twitter, Koduri tweeted "we are shrugging about these rumors as well. They don't help the team working hard to bring these to market, they don't help the PC graphics community..one must wonder, who do they help?..we are still in first gen and yes we had more obstacles than planned to overcome, but we persisted."

Rumors about Intel dropping the axe on Arc have been around for some time now, after repeated delays in getting the products to market, limited regional launches; and gathered steam as Intel closed down the Optane Memory business last quarter. Last week, after Intel presented a less-than-perfect outlook for its processor business hinted that it could exit "other" unprofitable businesses.

Today, President Joe Biden joins Intel, Ohio Gov. Mike DeWine and other federal, state and local officials to celebrate breaking ground in the Silicon Heartland on two of the world's most advanced chipmaking facilities. As part of Intel's commitment to develop a skilled talent pipeline for its two new leading-edge chip fabs, Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. During this first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programs.

"Today marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain. The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security. We would not be here today without the support of leaders in the administration, Congress and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking," said Pat Gelsinger, Intel CEO.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

Intel on Thursday confirmed that there will be only four Arc "Alchemist" desktop graphics card SKUs in the retail channel, and that it will be led by the A770 Limited Edition, which maxes out the DG2-512 silicon, and features 17.5 Gbps memory across its 256-bit wide memory bus, putting 560 GB/s of memory bandwidth at its disposal. The A750 uses 16 Gbps memory data-rates, and has 512 GB/s of bandwidth. It turns out, that the mid-range A580 features a 256-bit wide memory bus, and not the previously-reported 192-bit, which means it has the same 512 GB/s bandwidth as the A750. The A580 and A750 come with 8 GB of memory, while the A770 tops out with 16 GB.

Today, Intel Corporation and Broadcom Inc. showcased the industry's first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second. The trial used an Intel Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.

"We are proud to highlight how next-generation Wi-Fi 7 can make new mobile PC experiences possible. Industry collaboration is essential to ensure we deliver on the promises of this new wireless technology. We would like to thank our colleagues at Broadcom for their great technical cooperation, which helped enable this unprecedented, first-of-its-kind demonstration of ultra-high speed and ultra-low latency Wi-Fi 7," said Carlos Cordeiro, Intel Fellow and Wireless CTO, Client Computing Group, Intel.

Vijay Nagarajan, vice president, Wireless Connectivity Division, Broadcom, said, "Today's milestone sends a clear message: the ecosystem is ready and Wi-Fi 7 is here to deliver extraordinary capacity and blazing fast speeds to extend gigabit broadband. The reliable, low latency communication provided by Wi-Fi 7 is a key element of Broadcom's vision for connecting everything as the Internet evolves to its next iteration replete with immersive experiences. Industry collaboration is key to making this unprecedented connectivity a reality and we were delighted to work with Intel to achieve another industry first."

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x 16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz enhances high end performance for advanced inspection equipment and improves efficiency.

The upcoming Intel 13th Gen Core "Raptor Lake" promises to be an overclocker's delight, with an extreme overclocking feat surfacing of an astounding 8 GHz overclock of the chip. There are several riders to this feat. The most obvious being that an engineering sample (and not a retail chip), was used. Extreme cooling, such as liquid-nitrogen was used to keep the feisty chip cool. All 16 of its E-cores were disabled, and the 8 P-cores had HyperThreading disabled.

A stunning 1.792 V core voltage was used, to get the clock speed up to 8000 MHz, with an 80.0 multiplier and 100 MHz base clock. This would be the first Intel processor in around a decade to hit the 8 GHz-mark, with the last one being the i7-5775C "Broadwell." The clock-speed leaderboard is dominated by the AMD FX-8350 and FX-8150, with the unbeaten record being The Stilt's 8772 MHz.

The most juicy bits of the Intel 13th Gen Core "Raptor Lake" launch press-deck just leaked, courtesy of Igor's Lab. They reveal the six SKUs Intel will debut the 13th Gen Core desktop processor series with, highlight key differences with the previous-gen "Alder Lake," and also detail what the new Intel Z790 chipset brings to the table. To begin with, the first-wave of 13th Gen Core processors will include six SKUs—the Core i9-13900K, i9-13900KF, i7-13700K, i7-13700KF, i5-13600K, and the i5-13600KF. The -K and -KF parts are identical to each other, spare for the lack of integrated graphics with the -KF ones.

Many of the key specs of these six SKUs were already leaked to the web along with those of several SKUs from future waves of 13th Gen SKUs, but this slide confirms a handful interesting specs related to power. The slide confirms 125 W as the Processor Base Power value for all six SKUs, 253 W as the Maximum Turbo Power value for the Core i9 and Core i7 K/KF SKUs; and 181 W as the Maximum Turbo Power for the Core i5 K/KF SKUs. This is a definite step up from the 241 W MTP for the previous-gen Core i9, 190 W MTP for the Core i7, and 150 W MTP for the Core i5. Of course, these limits are like a hedge blocking your path, you can relax them in the motherboard BIOS.

Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, today announced its next-generation Exos X systems, the advanced storage arrays powered by Seagate's sixth generation controller architecture. The new Exos X systems feature up to twice the performance of the previous generation and enhanced enterprise-class durability. To help protect the stored data, Exos X systems incorporate ADAPT (Advanced Distributed Autonomic Protection Technology) erasure coding solution with Seagate's innovative self-healing storage technology ADR (Autonomous Drive Regeneration).

The Exos X series is a family of petabyte-scale, rack-mounted block storage enclosures that aggregate and virtualize dozens to hundreds of hard drives and SSDs for maximum data resiliency, availability and performance. Exos X systems are ideal as highly available enterprise storage infrastructure for conventional enterprise data centers as well as private clouds.

Intel Corporation today announced that Shlomit Weiss, senior vice president and co-general manager (GM) of the Design Engineering Group (DEG), will replace senior vice president Sunil Shenoy, who will retire at the end of the year. Weiss will lead the company's design, development, validation and manufacturing support of intellectual properties (IPs) and system-on-chips (SoCs), reporting directly to Intel CEO Pat Gelsinger and joining the company's executive leadership team.

"The design engineering organization plays a central role in our ability to deliver leadership products in every category in which we compete. It requires a leader with deep technical expertise and passion for engineering excellence, and Shlomit has that in spades," Gelsinger said. "With more than three decades of experience in semiconductor and SoC design engineering and management, Shlomit is known for her focus on quality and predictable execution, which are critical focus areas as we advance our IDM 2.0 strategy."

AAEON's new GENE-ADP6 unlocks the door to elite edge computing, digital signage, and machine vision applications with enhanced features across the board. The GENE-ADP6 provides a 15% improvement in CPU performance through the Intel 12th Generation Core /Celeron CPU (formerly Alder Lake-P), featuring hybrid platform processor architectures with up to 12 cores and 16 threads. Along with an improvement in CPU power, the GENE-ADP6 shows greater AI-readiness, with Intel's Deep Learning Boost AI accelerator providing enhanced inferencing capabilities to make the GENE-ADP6 perfect for 5G and AI edge computing.

For faster, more advanced storage speeds, the GENE-ADP6 introduces 64GB system memory via two dual-channel DDR5 SODIMMs, being AAEON's first 3.5" SubCompact Board to do so. This improvement from DDR4 to DDR5 offers up to 50% faster data transfer speeds and a new, more efficient power management structure. The GENE-ADP6 supports M.2 3052/3042 and M.2 2230 modules, enabling 5G and Wi-Fi for enhanced application connectivity. Additionally, the board's FPC expansion slot provides sophisticated, high-performance PCIe x4 (Gen 4) speed. This also gives users the flexibility to expand the board's additional PCIe x4 slot for machine vision, smart retail and industrial automation applications.

The PCI resizable-BAR feature is an absolute must for Intel Arc "Alchemist" graphics cards to perform as advertised, to the extent that Intel recommends sticking to "other vendors" (NVIDIA, AMD), for those on machines that lack resizable-BAR or prefer it disabled. In our testing of the Arc A380, we found a big performance gap between resizable-BAR being enabled and disabled. The company said that while it is working on driver optimizations that improve performance for machines lacking resizable-BAR, its general advice for those on older platforms is to stick with other vendors.

Resizable-BAR enables the software to see the entire video memory of a graphics card as a single large addressable block, rather than through 256 MB apertures. AMD and NVIDIA's driver architectures have optimized their memory-management to cope with these apertures through the advent of PCI-Express, but Intel Arc hasn't. Its memory-management model relies on large bursts of memory transfers, for which it needs resizable-BAR. The performance penalty for lacking it could be as high as 40 percent. In related news, Intel Graphics confirmed that the Arc A770 will be available both in 16 GB and 8 GB memory variants at launch—which is still slated for Soonuary, 2022.

Intel's upcoming Core i9-13900K "Raptor Lake" flagship desktop processor continues to amaze with its performance lead over the current i9-12900K "Alder Lake," in leaked benchmarks of the processor tested in a number of synthetic benchmarks. The 8P+16E hybrid processor posts a massive 30% lead in multi-threaded performance with Cinebench R23, thanks to higher IPC on the P-cores, the addition of 8 more E-cores, higher clock speeds, and larger caches all around. These gains are also noted with CPU-Z Bench, where the i9-13900K is shown posting a similar 30% lead over the i9-12900K.

In gaming benchmarks, these leads translate into a roughly-10-15 percent gain in frame-rates. Games still aren't too parallelized, Intel Thread Director localizes gaming workloads to the P-cores, which remain 8 in number. And so, the gaming performance gains boil down mainly to the IPC increase of the "Raptor Cove" P-cores, and their higher clock-speeds, compared to the 8 "Golden Cove" P-cores of the i9-12900K. From the looks of it, the i9-13900K will maintain a competitive edge over the upcoming AMD Ryzen 9 7950X mainly because the high IPC of 8 (sufficient) P-cores sees it through in gaming benchmarks, while the zerg-rush of 24 cores clinches the deal in multi-threaded benchmarks that scale across all cores.

Courtesy of Wccftech, we now have a complete picture of what Intel is planning to announce on the 27th of this month. The information is extremely detailed and covers no less than 14 different processor SKUs, ranging from the Core i9-13900K/KF to the Core i5-13400/F. All of the CPUs except the Core i5-13400/F and the upcoming Core i3 models will support memory speeds of up to DDR5 5600, whereas the lower end parts will be limited to DDR5 4800. All 13th Gen Intel CPUs should also support DDR4 3200 memory. Just as with the 12th Gen CPUs, the 13th Gen KF and F will not support ECC memory and of course, no IGP.

There's nothing that really stands out when looking at the specs and most things are expected based on earlier rumours. The Core i9-13900K/KF will indeed boost up to 5.8 GHz on up to two cores and all P-cores will boost up to 5.4 GHz, with the E-cores boosting up to 4.3 GHz. The Core i7-13700K/KF will have a much bigger gap here, compared to the the Core i7-12700K/KF versus the Core i9-12900K/KF where there was a 200 MHz boost frequency gap, which has now been extended to 400 MHz, as the Core i7-13700K/KF only boosts up to 5.4 GHz on two cores. Interestingly, the base clock frequency for the P-cores seems to have dropped 200 MHz on theK/KF parts, compared to 12th Gen equivalents in the product stack. For the remaining details, have a look at the data provided below.

It was only yesterday that the USB Promoters Group announced the USB4 Version 2.0 spec with support for speeds of up to 80 Gbps, something TechPowerUp mentioned at the end of our USB4 article back in June. Now details of a 120 Gbps asymmetric mode has popped up, courtesy of Angstronomics and we've managed to confirm that it is indeed something that is coming from one of our own sources. We were in fact told back in June that the 80 Gbps mode was meant to be asymmetric, but this was not mentioned in the recent press release.

The 120 Gbps mode will use three of the four data pairs for upstream data and the fourth 40 Gbps data pair will be for downstream data from and to the host controller.Asymmetric data transfers are nothing new over USB Type-C cables, as the DP Alt Mode is already taking advantage of this. This is possible because USB4 Version 2.0 will move to PAM3 (Pulse-Amplitude Modulation) data encoding from today's 64/66- or 128/132-bit encoding. The next generation of Thunderbolt is also expected to use PAM3 encoding to reach the rumoured 80 Gbps speeds that were posted somewhat by mistake by an Intel executive last year.

TECNO, the global premium smartphone and smart device brand, debuts its first laptop product MEGABOOK T1 at the IFA in Berlin today. TECNO MEGABOOK T1 is designed for the young generation Z with a lighter but better MEGA performance laptop in a cost-effective price of this range. Designed for their carry-by usage, MEGABOOK T1 features the ultra-thinner up to 14.8 mm, featherweight 1.48 kg of 15.6 inches with a shining design. It also provides a 17.5 hours long-lasting battery satisfying up to 3 days of work, plus the 65 W smallest size with gallium nitride (GaN) charger to carry-free. The MEGABOOK T1 will be available at retail in Q3, 2022.

TECNO MEGABOOK T1 has a unique look with Startrail Phantom that breaks the normal design by adding the expose linear at the surface. The Startrail Phantom features a dual tone with multiple shiny strips running across, which acts like the trajectory of the universe plants. The indistinct "MEGABOOK" bounce on the linear, like the young generation Z who are young and wild. Meanwhile, the whole body of MEGABOOK T1 is made with premium aluminium metal to improve the texture with more silky and glassy. The laptop provides 7 colors catering to the young generation's desire of self-expression. As the Windows 11 slogan "make the everyday easier", As the Windows 11 slogan "make the everyday easier", which can help GEN Z use smoothly in daily work, creative, and watch YouTube movies. MEGABOOK T1 provides a 15.6 Inch IPS FHD screen of 100% sRGB and brightness in 350nits, plus the TÜV Eye Comfort Certification for their all-day for work and watching movies without worry. The self-developed TECNO VOC sound system cooperates with DTS sound and AI-powered technology to give an immersed experience in audio and meeting for daily scenarios. The keyboard comes with a starry backlit is fully matched the stylish of the young generation's needs.

OFF Global, the French startup that holds the international license to create Nokia branded laptops, today announces two new models, Nokia PureBook Fold and Nokia PureBook Lite ahead of IFA.

Bringing more choice and flexibility in a new sleek and stylish design, the Nokia PureBook Fold packs productivity and portability into a 2-in-1 experience. Whether in tablet or laptop mode, it offers a range of uses specifically designed for students or teens on the go, in the classroom or at home. The Nokia PureBook Lite is a sleek all-rounder with key features for the whole family to breeze through daily tasks or play; from streaming, surfing to homework, it's also available in a bold range of colors.

Today, Lenovo announced the next-generation ThinkPad X1 Fold that redefines the foldable PC category that Lenovo created in 2020. The new ThinkPad X1 Fold is designed to offer full PC performance with a larger screen area, while maintaining the ultra-portability that the original ground-breaking device offered. As the world's lightest 16-inch commercial laptop device, this next generation delivers a versatile, powerful and portable device - with a sleeker and thinner design that can be comfortably used as a primary PC. Improving on a category-defining PC is not easy, but Lenovo's done just that. Through a combination of customer feedback and end user insights, the innovative design features a 22% larger 16-inch folding OLED display, 25% thinner chassis, and thinner bezels all around to produce a premium, streamlined look and feel that extends to the aluminium frame and a back cover made from 100% recycled woven performance fabric.

When building a next-gen device, there's the advantage of learning from a solid base of customer experience and a groundswell of user input. This insight has served Lenovo well in defining four primary areas where the experience must be flawless: performance, keyboard, display and design.

Intel Graphics in an interview with PC Gamer on the sidelines of the 2022 IFA Berlin, claimed that the real-time ray tracing architecture of the Xe-HPG graphics architecture in the Arc A770 "Alchemist" graphics card is "competitive or better than" the NVIDIA GeForce RTX 3060, and that the company plans to launch the card at an attractive price-point, to grab a slice of the very top of the gaming graphics market bell-curve. The RTX 3060 is a very successful GPU, especially with graphics card prices on the chill, and AMD is already competing with its Radeon RX 6650 XT, which can be spotted at lower prices. The RTX 3060 has been in the crosshairs of Intel Graphics marketing, in recent performance reveals for the A770.

"When you have a title that is optimized for Intel, in the sense that it runs well on DX12, you're gonna get performance that's significantly above an [RTX] 3060," said Tom Petersen with Intel Graphics. "When you have a title that is optimized for Intel, in the sense that it runs well on DX12, you're gonna get performance that's significantly above an [RTX] 3060. And this is A750 compared to a 3060, so 17%, 14%, 10%. It's going to vary of course based on the title," he said. "We're going to be a little bit faster but depending on your game and depending on your settings, it's trading blows, and that's the A750. Obviously, A770 is going to be a little bit faster. So when you add in DX11, you're gonna see our performance is a little less trading blows, and we're kind of behind in some cases, ahead in some cases, but more losses than wins at DX11," he added. While Intel is still non-committal about a launch date, although it stated that the Arc A770 and A750 will launch with an attractive "introductory pricing."