Today, Lenovo announced the next-generation ThinkPad X1 Fold that redefines the foldable PC category that Lenovo created in 2020. The new ThinkPad X1 Fold is designed to offer full PC performance with a larger screen area, while maintaining the ultra-portability that the original ground-breaking device offered. As the world's lightest 16-inch commercial laptop device, this next generation delivers a versatile, powerful and portable device - with a sleeker and thinner design that can be comfortably used as a primary PC. Improving on a category-defining PC is not easy, but Lenovo's done just that. Through a combination of customer feedback and end user insights, the innovative design features a 22% larger 16-inch folding OLED display, 25% thinner chassis, and thinner bezels all around to produce a premium, streamlined look and feel that extends to the aluminium frame and a back cover made from 100% recycled woven performance fabric.

When building a next-gen device, there's the advantage of learning from a solid base of customer experience and a groundswell of user input. This insight has served Lenovo well in defining four primary areas where the experience must be flawless: performance, keyboard, display and design.

Intel Graphics in an interview with PC Gamer on the sidelines of the 2022 IFA Berlin, claimed that the real-time ray tracing architecture of the Xe-HPG graphics architecture in the Arc A770 "Alchemist" graphics card is "competitive or better than" the NVIDIA GeForce RTX 3060, and that the company plans to launch the card at an attractive price-point, to grab a slice of the very top of the gaming graphics market bell-curve. The RTX 3060 is a very successful GPU, especially with graphics card prices on the chill, and AMD is already competing with its Radeon RX 6650 XT, which can be spotted at lower prices. The RTX 3060 has been in the crosshairs of Intel Graphics marketing, in recent performance reveals for the A770.

"When you have a title that is optimized for Intel, in the sense that it runs well on DX12, you're gonna get performance that's significantly above an [RTX] 3060," said Tom Petersen with Intel Graphics. "When you have a title that is optimized for Intel, in the sense that it runs well on DX12, you're gonna get performance that's significantly above an [RTX] 3060. And this is A750 compared to a 3060, so 17%, 14%, 10%. It's going to vary of course based on the title," he said. "We're going to be a little bit faster but depending on your game and depending on your settings, it's trading blows, and that's the A750. Obviously, A770 is going to be a little bit faster. So when you add in DX11, you're gonna see our performance is a little less trading blows, and we're kind of behind in some cases, ahead in some cases, but more losses than wins at DX11," he added. While Intel is still non-committal about a launch date, although it stated that the Arc A770 and A750 will launch with an attractive "introductory pricing."

Intel Labs, in collaboration with the Italian Institute of Technology and the Technical University of Munich, has introduced a new approach to neural network-based object learning. It specifically targets future applications like robotic assistants that interact with unconstrained environments, including in logistics, healthcare or elderly care. This research is a crucial step in improving the capabilities of future assistive or manufacturing robots. It uses neuromorphic computing through new interactive online object learning methods to enable robots to learn new objects after deployment.

Using these new models, Intel and its collaborators successfully demonstrated continual interactive learning on Intel's neuromorphic research chip, Loihi, measuring up to 175x lower energy to learn a new object instance with similar or better speed and accuracy compared to conventional methods running on a central processing unit (CPU). To accomplish this, researchers implemented a spiking neural network architecture on Loihi that localized learning to a single layer of plastic synapses and accounted for different object views by recruiting new neurons on demand. This enabled the learning process to unfold autonomously while interacting with the user.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

Intel's upcoming Meteor Lake (MTL) processor is set to deliver a wide range of exciting solutions, with the first being the Intel 4 manufacturing node. However, today we have some interesting Linux kernel patches that indicate that Meteor Lake will have a dedicated "Standalone Media" Graphics Technology (GT) block to process video/audio. Moving encoding and decoding off GPU to a dedicated media engine will allow MTL to play back video without the GPU, and the GPU can be used as a parallel processing powerhouse. Features like Intel QuickSync will be built into this unit. What is interesting is that this unit will be made on a separate tile, which will be fused with the rest using tile-based manufacturing found in Ponte Vecchio (which has 47 tiles).

Intel Linux PatchesStarting with [Meteor Lake], media functionality has moved into a new, second GT at the hardware level. This new GT, referred to as "standalone media" in the spec, has its own GuC, power management/forcewake, etc. The general non-engine GT registers for standalone media start at 0x380000, but otherwise use the same MMIO offsets as the primary GT.

Standalone media has a lot of similarity to the remote tiles present on platforms like [Xe HP Software Development Vehicle] and [Ponte Vecchio], and our i915 [kernel graphics driver] implementation can share much of the general "multi GT" infrastructure between the two types of platforms.

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced three new Expert-series laptops, including the ExpertBook B5 (B5602C), ExpertBook B5 Flip (B5602F) and the first Expert Series workstation, the ExpertBook B6 Flip (B6602F). Debuting at IFA 2022 (Hall 11.2, booth 101), the new laptops and mobile workstation offer unrivaled performance and mobility, designed for business users in today's fast-paced world, where work is no longer confined to the office.

ASUS Computer International President Benjamin Yeh said: "The workplace has changed, and it's up to business owners, executives, retailers, and other workers to decide its future. These users are forging the new future of work, and they need tools that work invisibly, reliably and seamlessly day after day. ASUS is known for innovating highly reliable and durable devices for the consumer and gaming markets. Now, with the Expert-series portfolio, we are setting a new standard for the commercial PC market to enable businesses to define their new work style—whatever that might be—with elite performance, premium craftsmanship, durability and enterprise-grade tools."

MIPS, a leading developer of highly scalable RISC processor IP, announced it is working with Intel to accelerate innovation in open computing. As part of this effort, MIPS' eVocore is being incorporated into the new Intel Pathfinder for RISC-V, a platform designed to deliver new capabilities for pre-silicon development. Intel Pathfinder allows new ways for System-on-a-Chip (SoC) architects and system software developers to define new products and pursue pre-silicon software development on RISC-V.

"MIPS is thrilled to be part of the Intel Pathfinder for RISC-V platform, providing high performance cores with support for multi-cluster, multi-core and multi-threading to accelerate innovation," said Desi Banatao, MIPS CEO. "These multiprocessors have unique features and a high level of scalability that make them ideal for compute-intensive tasks across a broad range of markets and applications."

A leaked Intel company document detailing the "go to market" (GTM) plan for its 13th Gen Core "Raptor Lake" desktop processors, reveals key dates associated with it. Intel will likely hold a launch event for the 13th Gen Core "Raptor Lake" processors on September 27, 2022 (when it's September 28 in Taiwan). This happens to be the same day AMD's Ryzen 7000 "Zen 4" processors go on sale. Pre-orders for these processors will open on October 13, 2022 (or October 14 in Taiwan). This is when you'll be able to order one online. October 20 is when the processors will be available to purchase off the shelf (October 21 in Taiwan). This document does not deal with review NDAs, so we'll have to guess that reviews go live somewhere between September 27 and October 13.

Built on the same Intel 7 process as "Alder Lake," "Raptor Lake" introduces an IPC increase with its "Raptor Cove" P-cores, and a doubling in the count of its "Gracemont" E-cores, along with increases in L2 cache sizes for both the P-cores and E-core clusters. The processor is said to be built on the same LGA1700 package as the 12th Gen, and compatible with Intel 600 series chipset motherboards with a UEFI firmware update. The processors launch alongside new Intel 700-series chipset motherboards that have out-of-the-box support for them.

Network security is of paramount importance in the energy, oil and gas industries, which is why AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced the ICS-6280, its latest Industrial-Grade Network Appliance. Powered by the Intel Atom x6000E series processors (formerly Elkhart Lake), the ICS-6280 is specially designed for optimal performance in rugged industrial environments, with features such as redundant power supply capabilities supporting wide voltage inputs from 9Vdc to 48Vdc. This is bolstered by its wide operating temperature of -40°C ~ 75°C, which ensures continuity of operation in industrial settings.

While durable and rugged, the ICS-6280 maintains excellent connectivity via its sophisticated and purpose-built I/O, with LAN Bypass and wireless network support, including expansion options to facilitate Wi-Fi and cellular network connections for excellent networking even in remote deployment scenarios. The most important element to be considered when building an industrial IoT network is security, particularly in the energy, oil and gas sectors. Therefore, the ICS-6280 insures against threats by incorporating physical security features such as an isolated COM port, alongside NGFW, redundant power supply, and UTM support to its mechanism.

The Intel Arc A380 has recently been tested for crypto mining performance after support for the card was added in the latest release of Nanominer. The card achieved a hash rate of 10.2 MH/s while mining Ethereum Classic (ETC) without any optimizations at a TDP of 75 W equating to 0.136 MH/s per Watt which is significantly below other popular mining cards which can reach 0.38 MH/s per Watt. This limited performance can be partially attributed to the availability of only 8 Xe-Cores and the relatively small 96-bit memory bus. The card will struggle to mine Ethereum due to its limited 6 GB of VRAM while Ethereum Classic should work fine as demonstrated.

Intel Graphics today posted a technological deep-dive video presentation into how XeSS (Xe Super Sampling), the company's rival to NVIDIA DLSS and AMD FSR, works. XeSS is a gaming performance enhancement technology where your game is rendered by the GPU at a lower resolution than what your display is capable of; while a high-quality upscaling algorithm scales it up to your native resolution while minimizing quality losses associated with classical upscaling methods.

The video details mostly what we gathered from our older articles on how XeSS works. A game's raster and lighting is rendered at a lower-resolution, frame-data along with motion vectors are fed to the XeSS upscaling algorithm, and is then passed on to the renderer's post-processing and the native-resolution HUD is applied. The XeSS upscaler takes not just motion vector and the all important frame inputs, but also temporal data from processed (upscaled) frames, so a pre-trained AI could better reconstruct details.

When it releases, the Core i5-13400 will join a long like of Intel processors that are extremely successful in the market—chips that are priced around the $200-mark, and bang in the middle of the market bell-curve. Other chips in the lineup include the i5-12400, i5-11400, i5-10400, and the i5-9400. With the 13th Generation "Raptor Lake," Intel is configuring the i5-13400, i5-13500, and the i5-13600 (non-K) as 6P+4E processors (that's 6 "Raptor Cove" P-cores with 4 "Gracemont" E-cores); whereas their 12th Gen predecessors only had 6 "Golden Cove" P-cores, and no E-cores. The top Core i5 part, the i5-13600K, will stand out featuring a 6P+8E configuration.

Maximum boost frequencies of the Core i5-13400 and i5-13500 surfaced on the web thanks to Passmark screenshots scored by TUM_APISAK. Boost frequencies of 13th Gen Core processors weren't part of the recent lineup leak. The i5-13400 has a maximum boost frequency of 4.10 GHz, while the i5-13500 comes with 4.50 GHz. Both SKUs have an identical base frequency of 2.50 GHz. The maximum turbo frequency of 4.10 GHz for the i5-13400 is significantly lower than the 5.80 GHz of the flagship i9-13900K, and the 5.10 GHz of the i5-13600K. It's also quite spaced apart from the i5-13500, with its 4.50 GHz. Perhaps Intel really wants some consumer interest in the Core i5 SKUs positioned between the i5-13400 and the i5-13600K.

An Intel Core i9-13900 "Raptor Lake" (non-K) processor was spotted in the wild by Benchleaks. The non-K parts are expected to have 65 W Processor Base Power and aggressive power-management, compared to the unlocked i9-13900K, although the core configuration is identical: 8 P-cores, and 16 E-cores. Besides tighter power limits out of the box, and a locked multiplier, the i9-13900 also has lower clocks, with its maximum boost frequency for the P-cores set 5.60 GHz, compared to the 5.80 GHz of the i9-13900K. It's still a tad higher than the 5.40 GHz of the i7-13700K.

Tested in Geekbench 5.4.5, the i9-13900 scores 2130 points in the single-threaded test, and 20131 points in the multi-threaded one. Wccftech tabulated these scores in comparison to the current-gen flagship i9-12900K. The i9-13900 ends up 10 percent faster than the i9-12900K in the single-threaded test, and 17 percent faster in the multi-threaded. The single-threaded uplift is thanks to the higher IPC of the "Raptor Cove" P-core, and slightly higher boost clock; while the multi-threaded score is helped not just by the higher IPC, but also the addition of 8 more E-cores.

The US Government has instituted a ban on supply of GAA-FET EDA software to China (the Chinese government and companies in China). Humans can no longer design every single circuit on chips with tens of billions of transistors, and so EDA (electronics design automation) software is used to micromanage design based broadly on what chip architects want. Synopsys, Cadence, and Siemens are major EDA software suppliers. Intel is rumored to use an in-house EDA software that it doesn't sell, although this could change with the company roping in third-party foundries, such as TSMC, for cutting-edge logic chips (which will need the software to make sense of Intel's designs).

GAA or "gates-all-around" technology is vital to building transistors in the 3 nm and 2 nm silicon fabrication nodes. Samsung is already using GAA for its 3 nm node, while TSMC intends to use it with its 2N (2 nm) node. Intel is expected to use it with its Intel 20A (20 angstrom, or 2 nanometers) node. Both Intel and TSMC will debut nodes powered by GAAFETs for mass-production in 2024. The US Government has already banned the sales of EUV lithography machines to China, as well as machines fabricating 3D NAND flash chips with greater than 128 layers or 14 nm. In the past, technology embargoes have totally stopped China from copying or reverse-engineering western tech, or luring Taiwanese engineers armed with industry secrets away on the promise of wealth and a comfortable life in the Mainland.

The flagship Core i9-13900K/KF "Raptor Lake" processor could come with a maximum boost frequency as high as 5.80 GHz, according to early store listings by a Canadian retailer that mentions the processor's retail SKU. This would be the highest possible clock speed sustained by the "Raptor Cove" P-cores of the processor, with its best available boosting algorithm (Intel processors tend to have many). The listing also reveals the maximum boost frequency of the Core i7-13700K/KF to be 5.40 GHz. Intel typically gives its unlocked Core i7 SKUs one less boosting algorithm than the Core i9, besides lower frequencies. The fastest mid-range part from the series, the Core i5-13600K, ticks at speeds of up to 5.10 GHz.

The listings see the Core i9-13900K go for CAD $941 (USD $727), the i9-13900KF at CAD $901 (USD $696), the Core i7-13700K at CAD $663 (USD $512), the i7-13700KF at CAD $626 (USD $484); the mid-range Core i5-13600K at CAD $461 ($356), and the i5-13600KF at CAD $424 (USD $327). These prices may seem high as they're pre-launch listings, and hardware in Canada tends to be slightly pricier than in the States. Going by launch prices of the 12th Gen Alder Lake, Intel seems to be raising the launch prices of "Raptor Lake" by a single-digit percentage.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

According to an investigative report by "Chips and Cheese," the larger L2 caches in Intel's 13th Gen Core "Raptor Lake-S" doesn't come with a proportionate increase in cache latency, and Intel seems to have contained the latency increase well. "Raptor Lake-S" significantly increases L2 cache sizes over the previous generation. Each of its 8 "Raptor Cove" P-cores has 2 MB of dedicated L2 cache, compared to the 1.25 MB with the "Golden Cove" P-cores powering the current-gen "Alder Lake-S," which amounts to a 60 percent increase in size. The "Gracemont" E-core clusters (group of four E-cores), sees a doubling in the size of the L2 cache that's shared among the four cores in the cluster, from 2 MB in "Alder Lake," to 4 MB. The last-level L3 cache shared among all P-cores and E-core clusters, sees a less remarkable increase in size, from 30 MB to 36 MB.

Larger caches have a direct impact on performance, as more data is available close to the CPU cores, sparing them a lengthy fetch/store operation to the main memory (RAM). However, making caches larger doesn't just cost die-area, transistor-count, and power/heat, but also latency, even though L2 cache is an order of magnitude faster than the L3 cache, which in turn is significantly faster than DRAM. Chips and Cheese tracked and tabulated the L2 cache latencies of past Intel client microarchitectures, and found a generational increase in latencies with increasing L2 cache sizes, leading up to "Alder Lake." This increase has somehow tapered with "Raptor Lake."

With AMD and NVIDIA launching its next-generation HPC compute architectures, "Hopper" and CDNA2, it began seeming like Intel's ambitious "Ponte Vecchio" accelerator based on the Xe-HP architecture, has missed the time-to-market bus. Intel doesn't think so, and in its Hot Chips 34 presentation, disclosed some of the first detailed performance claims that—at least on paper—put the "Hopper" H100 accelerator's published compute performance numbers to shame. We already had some idea of how Ponte Vecchio would perform this spring, at Intel's ISC'22 presentation, but the company hadn't finalized the product's power and thermal characteristics, which are determined by its clock-speed and boosting behavior. Team blue claims to have gotten over the final development hurdles, and is ready with some big numbers.

Intel claims that in classic FP32 (single-precision) and FP64 (double-precision) floating-point tests, its silicon is highly competitive with the H100 "Hopper," with the company claiming 52 TFLOP/s FP32 for the "Ponte Vecchio," compared to 60 TFLOP/s for the H100; and a significantly higher 52 TFLOP/s FP64 for the "Ponte Vecchio," compared to 30 TFLOP/s for the H100. This has to do with the SIMD units of the Xe-HP architecture all being natively capable of double-precision floating-point operations; whereas NVIDIA's architecture typically relies on FP64-specialized streaming multiprocessors.

Acer unveiled today the new Acer Chromebook Vero 514 - the first Chromebook in its line of eco-conscious Vero devices that reflects the company's commitment to sustainability by offering consumers and commercial customers more options that allow them to reduce their ecological footprint. The new Acer Chromebook Vero 514 (CBV514-1H/T) features a thoughtful design that takes the entire product lifespan into consideration, since it is easy to upgrade, repair, disassemble and recycle. It also uses recycled materials in most areas of the product including 30% post-consumer recycled (PCR) plastic in the chassis and 50% PCR plastic in the keycaps, 100% ocean-bound plastics on the touchpad surface and 90% recycled paper packaging.

"The simplicity, security and speed of Chromebooks are the ideal complements to our Vero line's focus on delivering powerful devices that keep an eye on the environment," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "The new Acer Chromebook Vero 514 is the next step in embodying our Earthion mission by developing eco-friendlier products that have a positive ecological impact on our customers' businesses, homes and schools."

Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of its program, Intel has signed a definitive agreement with the infrastructure affiliate of Brookfield Asset Management, one of the largest global alternative asset managers, which will provide Intel with a new, expanded pool of capital for manufacturing build-outs.

SCIP is a key element of Intel's Smart Capital approach, which aims to provide innovative ways to fund growth while creating further financial flexibility to accelerate the company's IDM 2.0 strategy. Intel's agreement with Brookfield follows the two companies' memorandum of understanding announced in February 2022. Under the terms of the agreement, the companies will jointly invest up to $30 billion in Intel's previously announced manufacturing expansion at its Ocotillo campus in Chandler, Arizona, with Intel funding 51% and Brookfield funding 49% of the total project cost. Intel will retain majority ownership and operating control of the two new leading-edge chip factories in Chandler, which will support long-term demand for Intel's products and provide capacity for Intel Foundry Services (IFS) customers. The transaction with Brookfield is expected to close by the end of 2022, subject to customary closing conditions.

Intel's next-generation "Meteor Lake" processor is the first mass-production client processor to embody the company's IDM 2.0 manufacturing strategy—one of building processors with multiple logic tiles interconnected with Foveros and a base-tile (essentially an interposer). Each tile is built on a silicon fabrication process most suitable to it, so that the most advanced node could be reserved for the component that benefits from it the most. For example, while you need the SIMD components of the iGPU to be built on an advanced low-power node, you don't need its display controller and media engine to, and these could be relegated to a tile built on a less advanced node. This way Intel is able to maximize its use of wafers for the most advanced nodes in a graded fashion.

Japanese tech publication PC Watch has annotated the "Meteor Lake" SoC, and points out that the vast majority of the chip's tiles and logic die-area is manufactured on TSMC nodes. The MCM consists of four logic tiles—the CPU tile, the Graphics tile, the SoC tile, and the I/O tile. The four sit on a base tile that facilitates extreme-density microscopic wiring interconnecting the logic tiles. The base tile is built on the 22 nm HKMG silicon fabrication node. This tile lacks any logic, and only serves to interconnect the tiles. Intel has an active 22 nm node, and decided it has the right density for the job.

Intel Graphics over the weekend released the Arc Graphics Drivers version 30.0.101.3268 beta. These drivers add performance optimization for Saints Row and Madden NFL 23, but that's hardly the defining feature. In our testing, the drivers were found to to be night-and-day compared to the previous version, in terms of overall system stability. The release comes hot on the heels of a report that Intel fixed as many as 43 bugs just by watching a product review video by Gamers Nexus.

Among the fixed issues are lower-than-expected performance with Marvel's Spider Man (Remastered) in DirectX 12 mode; an application crash with SoTR in DirectX 12 mode with ray traced shadow quality set to "high," a texture-corruption issue with Battlefield 2042 in DirectX 12 mode; artifacts and object loading failures seen in Halo Infinite, an application crash with Horizon Zero Dawn, and the nasty bug where Windows Update attempts to replace the installed driver, causing severe stability issues. As many as 17 bugs related to Arc Control and 11 bugs related to Arc Control Performance Tuning, have been fixed, as listed below.

DOWNLOAD: Intel Arc 30.0.101.3268 beta

Intel has been in the firing lines for the consecutive delays and general lack of clarity surrounding the launch of its Arc Alchemist family of discrete GPUs. Staggered availability has meant that the only currently available Arc GPU - the A380 - is still only available in the Chinese market, where the Internet café game is still strong. Intel drivers in particular have been fraught with bugs and as we know, software can bring even the most competent hardware to its knees. So there's maybe an echo of warning bells to the real state of Arc's software suite when Intel admits to having detected 43 different GPU driver bugs... While watching a review video from Gamers Nexus.

We've conducted our own review of Intel's Arc A380 (after importing it from China), and we did call to attention how we "encountered numerous bugs including bluescreens, corrupted desktop after startup, random systems hangs, system getting stuck during shutdown sequences, and more." Only AMD and NVIDIA seem to have an idea on just how complex the matter of breaking into and maintaining a position in this particular product segment takes. Intel itself is still in the process of learning just what that takes, as its own VP and general manager of the Visual Computing Group, Lisa Pearce, penned in a blog post.

Although this information hasn't been verified yet, it looks very plausible, but there are also some crucial bits missing. However, we now appear to have the full list of Intel Core 13000-series CPUs, that ranges from the Core i9-13900KF to the Core i3-13100. The information comes via Bilibili and should as such be taken with a grain of salt, but there are no big surprises here, except possibly the fairly low base clocks for some of the Core i9-13900K and KF SKUs, which sits at 3 GHz, compared to 3.2 GHz for the 12th gen equivalents.

What the leaker doesn't appear to have gotten hold of, is the boost frequency for the CPUs, possibly because Intel has kept it away from its partners so far. Earlier rumours have suggested boost speeds of 5.5 GHz or potentially even higher for a future KS SKU. Thanks to Intel adding additional E-cores into the mix, even the lower-end Core i5 CPUs will get four to eight E-cores this time around, whereas the 12th gen CPUs only offered E-cores on the Core i5-12600K and KF. Sadly the Core i3-13100 still gets to make do with only four P-cores. Intel is expected to reveal its 13th gen Core CPUs on the 27th or 28th of September.

Based on media reports out of Taiwan, TSMC seems to have plenty of customers lined up for its 3 nm node, with Apple being the first customer out the gates when production starts sometime next month. However, TSMC is only expected to start the production with a mere 1,000 wafer starts a month, which seems like a very low figure, especially as this is said to remain unchanged through all of Q4. On the plus side, yields are expected to be better than the initial 5 nm node yields. Full-on mass production for the 3 nm node isn't expected to happen until the second half of 2023 and TSMC will also kick off its N3E node sometime in 2023.

Apart from Apple, major customers for the 3 nm node include AMD, Broadcom, Intel, MediaTek, NVIDIA and Qualcomm. Contrary to earlier reports by TrendForce, it appears that TSMC will continue its rollout of the 3 nm node as previously planned. Apple is expected to produce the A17 smartphone and tablet SoC, as well as advanced versions of the M2, as well as the M3 laptop and desktop processors on the 3 nm node. Intel is still said to be producing its graphics chiplets with TSMC, with the potential for GPU and FPGA products in the future. There's no word on what the other customers are planning to produce on the 3 nm node, but MediaTek and Qualcomm are obviously looking at using the node for future smartphone and tablet SoCs, with AMD and NVIDIA most likely aiming for upcoming GPUs and Broadcom for some kind of HPC related hardware.