ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

Thanks to the attribution of Puget Systems, we have a preview of Intel's latest Xeon W-3400 and Xeon W-2400 workstation processors based on Sapphire Rapids core technology. Delivering up to 56 cores and 112 threads, these CPUs are paired with up to eight TeraBytes of eight-channel DDR5-4800 memory. For expansion, they offer up to 112 PCIe 5.0 lanes come with up to 350 Watt TDP; some models are unlocked for overclocking. This interesting HEDT family for workstation usage comes at a premium with an MSRP of $5,889 for the top-end SKU, and motherboard prices are also on the pricey side. However, all of this should come as no surprise given the expected performance professionals expect from these chips. Puget Systems has published test results that include: Photoshop, After Effects, Premiere Pro, DaVinci Resolve, Unreal Engine, Cinebench R23.2, Blender, and V-Ray. Note that Puget Systems said that: "While this post has been an interesting preview of the new Xeon processors, there is still a TON of testing we want to do. The optimizations Intel is working on is of course at the top, but there are several other topics we are highly interested in." So we expect better numbers in the future.Below, you can see the comparison with AMD's competing Threadripper Pro HEDT SKUs, along with power usage using different Windows OS power profiles:

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

With the new PRO and the FOCUS (E23), XMG introduces two laptop series on a similar hardware basis: Both feature Intel's Core i9-13900HX and NVIDIA graphics cards up to the GeForce RTX 4070. While the PRO 15 and PRO 17 are slightly thinner as gaming workstations and boast more extensive connectivity, the FOCUS scores at a more affordable price and is not only available in 15.6 and 17.3-inch versions, but also in a 16-inch format. For the laptops originally designed as an entry-level series, the hardware upgrades mean a significant upgrade: the FOCUS series moves closer to the PRO laptops.

The key components found in the new XMG PRO 15 and PRO 17 as well as the XMG FOCUS 15, FOCUS 16 and FOCUS 17 are almost identical. All laptops employ Intel's Core i9-13900HX with 24 cores (8 P-cores, 16 E-cores) and 32 threads. The freely configurable graphics card options each include NVIDIA's new, DLSS-3-capable GeForce RTX 4050 (FOCUS only) as well as 4060 and 4070 (FOCUS and PRO) with a maximum graphics power rating of up to 140 watts (115 watts TGP plus 25 watts Dynamic Boost 2.0). However, since the clock behaviour and the actual power consumption of the GPUs in the new generation are subject to much more restrictive, application-specific specifications from NVIDIA, the maximum values are only achieved in synthetic stress tests such as Furmark - according to the official requirements of the graphics chip manufacturer.

ENERMAX, an industry-leading force dedicated to design extreme performance computer power supplies and cooling solutions, announces that its overclocking-graded AIO CPU cooler, LIQTECH TR4 II series, is now ready for Intel LGA4677 Xeon platform! The CPU mounting kits inside of the new version of LIQTECH TR4 II are designed for Intel Sapphire Rapid-based W-3400 and W-2400 series Xeon processors with socket LGA4677, and AMD Ryzen Threadripper PRO processors with socket sWRX8 / sTRX4/ TR4, as well as AMD socket SP3 for AMD EPYC processors.

Awarded as the BEST AIO CPU Cooler in European Hardware Awards, the LIQTECH TR4 II series is the world's first AIO CPU cooler tailored to provide 100% full coverage of the integrated heatspreader (IHS) of both AMD Ryzen Threadripper PRO and upcoming Intel Xeon Sapphire Rapids processors with unparalleled cooling results. The unbeatable cooling capacity (500 W TDP) makes it the best cooling solution for both Intel Xeon W-3400 and W-2400 series processor (LGA4677) and AMD Ryzen Threadripper PRO processors designed for workstations and high-end desktops (HEDTs).

Intel has reportedly deferred its orders for 3 nm wafers with TSMC, sources in PC makers tell Taiwan-based industry observer DigiTimes. Built on the TSMC N3 node, the wafers were supposed to power the Graphics tiles (containing the iGPU), of the upcoming "Arrow Lake" processors, which were originally on course for a 2024 release. The DigiTimes report detailing this development says that Intel's 3 nm wafer orders have been deferred to Q4-2024, which would realistically mean a 2025 launch for whatever product was designed to use 3 nm tiles. Advance orders for next-gen wafers by high-volume clients such as Intel, are usually placed several quarters in advance, so the foundry could suitably scale up its capacity.

Intel has recently updated its open-source C++ header file library for high-performance SIMD-based sorting to support the AVX-512 SIMD instruction set. Extending the capability of regular AVX2 support, the sorting functions now implement 512-bit extensions to offer greater performance. According to Phoronix, the NumPy Python library for mathematics that underpins a lot of software has updated its software base to use the AVX-512 boosted sorting functionality that yields a fantastic uplift in performance. The library uses AVX-512 to vectorize the quicksort for 16-bit and 64-bit data types using the extended instruction set. Benchmarked on an Intel Tiger Lake system, the NumPy sorting saw a 10-17x increase in performance.

Intel's engineer Raghuveer Devulapalli changed the NumPy code, which was merged into the NumPy codebase on Wednesday. Regarding individual data types, the new implementation increases 16-bit int sorting by 17x and 32-bit data type sorting by 12-13x, while float 64-bit sorting for random arrays has experienced a 10x speed up. Using the x86-simd-sort code, this speed-up shows the power of AVX-512 and its capability to enhance the performance of various libraries. We hope to see more implementations of AVX-512, as AMD has joined the party by placing AVX-512 processing elements on Zen 4.

The new NH-U14S DX-4677, NH-U12S DX-4677, NH-U9 DX-4677 and NH-D9 DX-4677 4U are dedicated, customised solutions for Intel's professional LGA4677 platform (Sapphire Rapids), which makes them an ideal fit for both 4th generation Xeon Scalable CPUs (Platinum, Gold, Silver or Bronze) and W-3400 or W-2400 series Xeon processors for workstations such as the w9-3495X, w7-3465X or w7-2495X. Whereas the large 14 cm NH-U14S DX-4677 and 12 cm NH-U12S DX-4677 are an excellent choice for tower-style cases and thus lend themselves to use in high-performance quiet workstations, the smaller NH-D9 DX-4677 4U and NH-U9 DX-4677 fit 4U cases, which makes them perfect for more compact workstations as well as 4U class rack-mount servers that need to run as quietly as possible.

While the NH-U9's direction of airflow is perpendicular to the long axis of the LGA4677 socket, the NH-D9's direction of airflow is parallel to the long axis of the LGA4677 socket. Depending on the orientation of the socket(s) on the motherboard, choosing either the NH-U9 or de NH-D9 enables system builders to align the airflow of the cooler(s) with the exhaust fans of the chassis and thereby ensure optimal system performance. Thanks to their compact footprint, both models are ideal for building dual socket setups with motherboards where larger coolers may interfere with each other.

iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today announced the new RDY Ouro Kronii system featuring the special edition Y60 Ouro Kronii PC case.

"It's been an incredible journey collaborating with Kronii and hololive Engish," said King Perez de Tagle, Marketing Executive Producer of HYTE and iBUYPOWER. "It's about time The Warden of Time gets a high-performance gaming PC and the RDY Ouro Kronii limited edition systems are ready to ship. stay tuned for even more!" The RDY Ouro Kronii will boast the latest Intel Core i9 13900K or KF CPU, NVIDIA RTX 4070 Ti GPU, Z790 motherboard, and the custom Y60 Ouro Kronii PC case. The RDY Ouro Kronii will provide users with maximum performance in virtually any application with reliable components and iBUYPOWER's expert assembly.

HP Inc. announced its new Z by HP high-performance workstation desktop lineup, engineered to change what is possible within complex, data rich workflows. HP is advancing hybrid workforce management with the HP Anyware Remote System Controller, a device that gives IT departments the management capabilities to support high performance devices from anywhere.

The complex workflows in industries spanning media and entertainment, data science, and engineering mean increased time pressure and the need for more compute power to deliver faster results. They also highlight a need to iterate with remote teams and push creative boundaries to deliver more accurate results. The new Z by HP Z4, Z6, Z8, and Z8 Fury desktops, powered by Intel, deliver the scalable balance of CPU and GPU compute needed to fuel new levels of speed, accuracy, and creativity.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock W790 WS motherboard for workstations for Intel Xeon W-3400/W-2400 series processors (LGA4677). The ASRock W790 WS features up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Supports New 4th Generation Xeon Processor
The W790 WS chipset is optimized for new Intel Xeon W-2400 series (LGA4677) processors and is compatible with W-3400 series processors with up to 56 cores also. The ASRock W790 WS provides a quad-channel DDR5 design with 2DPC over 8 DIMM slots, maximizing memory performance, potential memory pool capacity and supports ECC RDIMMs to ensure data reliability.

Ahead of its launch, the SKU table of Intel's Xeon W "Sapphire Rapids" HEDT/Workstation-class processor lineup was leaked to the web. The lineup is horizontally split between the Xeon W-3400 series, and the Xeon W-2400 series. The W-2400 series come in rather modest CPU core-counts ranging between 6-core/12-thread and 24-core/48-thread. These chips are characterized by a 4-channel DDR5 memory interface (8 sub-channels); and a 64-lane PCIe Gen 5 I/O. The W-3400 series, on the other hand, ranges between 12-core/24-thread and 56-core/112-thread, nearly maxing out the core-count of the "Sapphire Rapids" MCM. These chips feature a massive 8-channel (16 sub-channel) DDR5 memory interface, and a 112-lane PCIe Gen 5 I/O. Prices for the lineup start at a surprisingly low $360 for the base W-2400 series SKU; while the top W-2400 series SKU is priced at $2,189. The W-3400 series ranges between $1,189 for the base 12-core/24-thread part, and goes all the way up to $5,889 for the top 56-core part. All models feature ECC memory support.

Powerful coolers for large processors on Intel Socket LGA 4677! With the new Enterprise Solution Jet and Stream CPU coolers, Alphacool presents progressive solutions for CPU cooling in server and workstation systems.

The Alphacool ES Jet CPU Cooler is equipped with a new complex 4-nozzle technology. For the first time, it distributes water evenly over the cooler base via four nozzles incorporated into the cooler. Thereby, all cores of the high-performance processor are optimally supplied and thus effectively and precisely cooled. The organic water flow ensures a disturbance-free water flow and thus increases the cooling performance. This method makes it possible to optimally dissipate waste heat of up to 800 watts. The chrome-plated cooler base is made of copper and is ideally suited for server and workstation systems with its extremely high thermal conductivity.

Samsung Electronics announced the Galaxy Book3 Ultra is available for pre-order beginning today, February 14, with global availability starting February 22. Samsung's new premium PC offers an unmatched Samsung Galaxy ecosystem experience and high-performance computing, all in a thin, light and sleek design. The Galaxy Book3 Pro and Book3 Pro 360, has been available for global pre-orders on February 1. The latest Galaxy Book Pro series has experienced record-breaking interest from consumers, generating more than doubling pre-orders of last year's Galaxy Book2 Pro series.

"At Samsung, Ultra means big, bold and the best, regardless of category. That's why we're excited to bring the Ultra heritage to our PC lineup, delivering the seamless multi-device connectivity and ultra-high performance that users demand," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The Galaxy Book3 Ultra delivers on the market expectation for an ultra-high performance laptop, particularly for consumers interested in gaming and content creation who require the powerful performance."

Getac has today announced the expansion of its flagship X600 rugged mobile workstation range with the launch of the X600 Server and X600 Pro-PCI. The new models will sit alongside the recently launched X600 and X600 Pro, creating a comprehensive lineup of rugged mobile workstations that are purpose-built to meet the demands of professionals working in challenging industries, such as defence, manufacturing and oil & gas.

X600 Server: The fully rugged mobile server
The all-new Getac X600 Server delivers a powerful commercial off-the-shelf (COTS) rugged mobile server that can be folded to a slim profile for easy transportation.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

To date, Intel has been promised almost €6.8 billion in subsidies from the federal German government, but apparently this isn't enough for Intel, as the company is now asking for an additional €3.2 billion, for a total of €10 billion is subsidies for its Magdeburg fab. The total investment in the fab in Magdeburg—which was announced back in March 2022—is said to be around €33 billion. In other words, Intel is asking Germany to pitch in almost a third of the cost for its shiny new fab. According to an Intel spokesperson quoted by the Register, Intel is worried about the current geopolitical situation and that the demand for semiconductors has declined, plus the fact that inflation has made everything much more expensive. Intel's Arizona fabs ended up costing an extra US$5 billion, which is about a third extra compared to the original cost estimate, so it's not hard to see why Intel is asking for more money here.

At the same time, the Vietnamese government jumped the gun and announced that Intel is looking at investing US$3.3 billion in the country, as part of an announcement of investments of a total of US$7.4 billion in Ho Chi Minh, by foreign companies. The additional US$4.1 billion investments apparently hinges on Intel's investment in the country, more specifically in the Saigon Hi-Tech Park. The official stance from Intel is that "Vietnam is an important part of our global manufacturing network, but we have not announced any new investments." It's unclear what the exact plans are, but Intel is said to have met up with government officials in Vietnam, according to Bloomberg. It's likely that it would be some kind of chip packaging facility, much like what Intel and AMD already has in Malaysia and China, among other places.

The global PC market has been experiencing a demand downtrend after the cooling down of COVID-19 in 2022. The market saw its shipments decline 15% YoY in 2022 and is expected to see another high single-digit decline in 2023, according to Counterpoint Research's data. However, among all the PC sub-sectors, Arm-based laptops are expected to show a comparatively resilient demand throughout the coming quarters thanks to Apple's success with the MacBook series, increasing ecosystem support and vanishing performance gap with x86 offerings.

ASUS Republic of Gamers (ROG) launches the ROG Strix SCAR and Strix G lineup of gaming laptops. Brand-new designs come to the Strix SCAR 16, Strix SCAR 18, Strix G16, and Strix G18, with updated internals for the Strix SCAR 17 and Strix G17. When combined with ROG's Nebula and Nebula HDR displays and an updated Intelligent Cooling thermal solution, these powerhouse laptops are prepared to power victories among esports pros and gaming enthusiasts alike.

As ROG's highest-performing laptops, the Strix series is powered by the latest and greatest chips from Intel, AMD, and NVIDIA. The Strix SCAR 16 and 18 feature up to an Intel Core i9-13980HX processor with 24 cores and 32 threads, alongside up to NVIDIA GeForce RTX 4090 GPU. A MUX Switch with NVIDIA Advanced Optimus intelligently ensures optimal framerates when plugged in, and better battery life when untethered, with no manual intervention needed. The Strix G16 and G18 are powered by up to an Intel Core i9-13980HX CPU and an NVIDIA GeForce RTX 4080 GPU and the same MUX Switch with Advanced Optimus.

Intel 11th Gen Core "Rocket Lake" desktop processors in the Socket LGA1200 package, the first Intel desktop processor generation in five years to offer an IPC increase, has been marked EOL (end of life) and is formally discontinued from the company's product stack. This comes in the latest product-change notification (PCN), dated February 6, 2023, and is consistent with a normal product lifecycle for Intel. A product marked EOL and discontinued can no longer be ordered from Intel, although there are still plenty of 11th Gen Core processors in the market, which Intel will fully honor product warranties for; so those on entry-level 11th Gen processors such as the i5-11400 still have a certain amount of upgrade headroom to the 8-core i7-11700/K or the faster i9-11900/K. The PCN covers pretty much the entire 11th Gen Core desktop product stack.

GIGABYTE today introduces the AORUS 17, AORUS 15, and AERO 14 OLED, a suite of new laptops optimized to provide power and mobility. The three new additions now join the flagship AORUS 17X, AORUS 15X, and AERO 16 OLED in GIGABYTE's 2023 laptop lineup, which was unveiled earlier at CES 2023. Boasting the latest cores from both Intel and NVIDIA in a sleek and portable design, the AORUS 17 and AORUS 15 provide strong performance with max total graphics power (TGP) for enthusiasts who want to take their games on the go; while the AERO 14 OLED is tailored for creative minds, combining portability with a perfectly color-accurate display.

Both AORUS 17 and AORUS 15 offer powerful gaming performance fueled by the Intel 13th-gen i7 H series processors and NVIDIA GeForce RTX 4070 laptop GPUs with full access to max 140 W TGP with Dynamic Boost technology, all in a slender profile. These portable powerhouses feature the improved WINDFORCE Infinity cooling system that can handle up to 160 W of thermal design power (TDP) to ensure optimal performance even when running at maximum capacity. As for the significantly upgraded display performance, blazing-fast 240 Hz refresh rates at 1440p resolution enable a smooth and vibrant gaming experience. The gaming essence is reflected both in the device's internal power and the external design. The sleek enclosure is further accented with the mysterious spatial design and RGB Light Bar for a sophisticated gaming aesthetic.

Intel became the first of the three discrete GPU makers to release a day-0 graphics driver for "Hogwarts Legacy." The new Intel Arc GPU Graphics Drivers version 101.4123 beta comes with optimization for the hotly anticipated Harry Potter universe-based RPG, as well as the survival horror "Returnal," so gamers on Intel Arc "Alchemist" discrete GPUs can get gaming the moment the game goes live. The company didn't release any fixes for outstanding issues with this particular release, but identified a bunch of new issues with its driver and the Arc Control app.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.4123 betaUpdate 14:02 UTC: Today's release of NVIDIA GeForce software (version 528.49, lacks "Hogwarts Legacy" optimization.

Update 14:55 UTC: We asked NVIDIA whether a driver update with game-ready support is planned and if there's any estimate when it will come out. The company answered that it had no comment on these questions.

Neo Forza today unveiled the Trinity DDR5-7200 32 GB (2x 16 GB) dual-channel memory kit. Based on SK hynix A-dies, the modules pack an Intel XMP 3.0 profile that runs the kit at its advertised speed of DDR5-7200. It also includes an AMD EXPO profile, although this enables a slightly lower speed of DDR5-6400. The DDR5-7200 XMP 3.0 profile ticks at timings of 36-46-46-82; while the DDR5-6400 EXPO profile offers 40-40-40-77. Both these profiles run the modules at 1.4 V. Neo Forza claims that the module comes with good overclocking headroom, and they've achieved DDR5-8000 on an Intel Core i9-13900K machine with minimal effort. The company didn't reveal pricing or availability information.

Earlier this week, we learned about the existence of the Intel Core i5-13490F, a China-exclusive processor SKU that's designed to strike "just the right" price-performance against AMD's Ryzen 5 7600 series, and possibly even the Ryzen 7 7700. It turns out that the i5-13490F isn't the only such SKU, there's also the Core i7-13790F. Positioned between the i7-13700 and i9-13900, the i7-13790F is a unique piece of silicon. It has the same 8P+8E core-configuration as the i7-13700 and i7-13700K, and even the same 5.20 GHz maximum P-core turbo frequency as the i7-13700, but comes with a little extra shared L3 cache of 33 MB.

Each of the 8 "Raptor Cove" P-cores on the i7-13790F has 2 MB of dedicated L2 cache, and each of the two available E-core clusters has 4 MB of L2 cache that's shared among the four "Gracemont" E-cores in the cluster. The L3 cache that's shared among the 8 P-cores and 2 E-core clusters, has been bumped up to 33 MB from 30 MB on the other 13th Gen Core i7 desktop SKUs. This is still short of the 36 MB physically present on the "Raptor Lake-S" silicon. There are a couple of gotchas, though. Firstly, this is still a "locked" (non-K) SKU having minimal overclocking capabilities, with a 65 W base power and possibly the same 219 W maximum turbo power as the i7-13700; and secondly, as an "F" SKU, it lacks integrated graphics. The i5-13490F and i7-13790F appear to be targeting the SI and retail channels, and come in an exclusive black paperboard box. The i7-13790F is priced at RMB ¥2,999 including taxes, or about $440.