ASUS today announced ASUS Chromebook Vibe CX55 Flip, engineered with a striking aesthetic and powerful components for nonstop cloud gaming—with an immersive 144 Hz FHD display, accurate anti-ghosting keyboard and ultra-fast WiFi 6 technology. According to Gartner, "The rise of cloud gaming, growing at a compound annual growth rate (CAGR) of 30% from 2019 to 2025, will motivate many gamers to offload hardware to the cloud and rely on CSPs to provide the infrastructure to deliver these games." When emergent cloud-gaming services are factored in, it is clear that a vast and significant market is just waiting to be tapped—and that's where ASUS Chromebook Vibe CX55 Flip makes its bold entrance.

The fresh, vibrant design features a dynamic, distinctive and daring look that's both stylish and durable, with exclusive color-blocked WASD keycaps to bring flair to online play. Coupled with access to leading cloud-gaming services, including NVIDIA GeForce NOW, Xbox Cloud Gaming (Beta) and Amazon Luna, ASUS Chromebook Vibe CX55 Flip is set to energize this underserved audience—ready for all-new gaming adventures. Powering all the entertainment is up to an 11th Gen Intel Core i7 processor, 16 GB of memory and immersive Harman Kardon audio.

ASRock is shaping up to be the first major custom-design Intel Arc "Alchemist" board partner with a footprint in the EU and North America. The company is ready with a pair of custom-design Arc A770 products based on its key gamer-focused brands. The first of these is the ASRock A770 Phantom Gaming OC. This card features a meaty triple-slot Phantom Gaming cooling solution, complete with RGB LED illumination. It should also feature the company's highest state of tuning for the A770. The next of the custom-design cards is the Arc A750 Challenger. This card features clean 2-slot, dual-fan design, and a factory-overclock. It's also likely that ASRock is extending the Challenger OC treatment to the A770.

Intel CEO Pat Gelsinger sent the following statement announcing creation of an internal foundry model for external customers and Intel product lines and the creation of the IDM 2.0 Acceleration Office, under the leadership of Stuart Pann, to all company employees on Oct. 11: When I returned to Intel in 2021, I introduced our IDM 2.0 strategy: a multiyear journey to regain unquestioned technology leadership, manufacturing scale and long-term growth. Today, we begin the next phase of our IDM 2.0 journey.

In the first phase of our transformation, we made significant progress on our process roadmaps and capacity. We remain on track to deliver five process nodes in four years, and we've invested in the capacity required to meet the industry's demand for semiconductors, bringing much-needed balance to the global supply chain.
The next phase of our IDM 2.0 journey requires a fundamental shift in mindset. We must embrace an internal foundry model, not only for our external customer commitments but also for our Intel product lines. This is a significant evolution in how we think and operate as a company, but the systems and infrastructure that served us well in the IDM 1.0 world will not enable us to achieve the full potential of IDM 2.0.

We've been aware of Intel's upcoming NUC 13 Extreme—codenamed Raptor Canyon—since July this year, with the compute element module having leaked back in August. Now Intel has previewed the NUC 13 Extreme at TwitchCon and we have a better idea what the biggest NUC to date will look like. The chassis has a volume of no less than 13.9 litres, which is bigger than many Mini-ITX cases. The main reason for this is that the NUC 13 Extreme has enough space for a triple slot GPU, although if you're hoping to put a GeForce RTX 4090 inside, then you're out of luck, as it seems to be limited to the length of an RTX 3080 or thereabout. The compute modul appears to have changed somewhat from the early leak, or it's possible it just wasn't a very good render.

As we've known, Intel will be kitting out the NUC 13 Extreme with a range of CPU options and it was confirmed during the stream that it'll handle a "full" Core i9K without specifying which model. The Intel rep mentioned a highly optimised heatsink, which appears to be something along the lines of a modified GPU cooler with a blower cooler. This is because the compute module is largely the same shape and size as a graphics card. The chassis itself looks like a bit of a nightmare to deal with, as it has a lot of removable parts to allow access to the innards of the NUC 13 Extreme. The compute module has to be installed at an angle, or it won't fit inside the chassis, whereas the graphics card looks relatively easy to install. You can find the full video in the link below and it starts just past the four hour mark.

Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that NEC Corporation has selected over 116 Supermicro GPU servers that contain dual socket 3rd Gen Intel Xeon Scalable processors and each with eight NVIDIA A100 80 GB GPUs. As a result, the Supermicro GPU server line can include the latest and most powerful Intel Xeon scalable processors and the most advanced AI GPUs from NVIDIA.

"Supermicro is thrilled to deliver an additional 580 PFLOPS of AI training power to its worldwide AI installations," said Charles Liang, president, and CEO, Supermicro. "Supermicro GPU servers have been installed at NEC Corporation and are used to conduct state-of-the-art AI research. Our servers are designed for the most demanding AI workloads using the highest-performing CPUs and GPUs. We continue to work with leading customers worldwide to achieve their business objectives faster and more efficiently with our advanced rack-scale server solutions."

Intel Alder Lake source code for BIOS/UEFI building and optimization has been leaked in a massive 6 GB leak that appeared on 4chan and GitHub. While this number may seem small, it is a colossal codebase, given that the regular code files take up small space. We assume that the documentation is bundled there as well, however, we can not check ourselves as the repository has been taken down. Tom's Hardware has contacted an Intel representative to talk about the code leak and the rep issued a statement for the website.

Intel SpokespersonOur proprietary UEFI code appears to have been leaked by a third party. We do not believe this exposes any new security vulnerabilities as we do not rely on obfuscation of information as a security measure. This code is covered under our bug bounty program within the Project Circuit Breaker campaign, and we encourage any researchers who may identify potential vulnerabilities to bring them our attention through this program. We are reaching out to both customers and the security research community to keep them informed of this situation.

Amazon US has kindly revealed the pricing for a pair of upcoming Intel Z790 chipset based motherboards from ASUS. For those hoping for better motherboard pricing versus AMD's X670 based boards, we have to be the bringer of bad news, as the two fall in the same ballpark, although Intel seems to have a slight edge here. The cheaper of the two models is the ASUS Prime Z790-P WiFi, which is the Intel equivalent to the Prime X670-P board for AMD's AM5 socket. The Prime Z790-P offers slightly weaker connectivity around the back, but has more PCIe slots compared to its AMD sibling. Unfortunately, it seems like Amazon doesn't stock the Prime X670-P, so we had to look elsewhere for pricing and Newegg charges US$289.99 for it, whereas Amazon charges US$249.99 for the Prime Z790-P, making it a more attractive option. However, that's still US$30 more than its predecessor, the Prime Z690-P, making this a pretty steep jump in price considering the two are very similar in terms of what you get for your money.

The second board is the ASUS ROG Maximus Z790 Hero, which is a premium product, something that's reflected in the pricing as well. Features like Thunderbolt 4 and an ROG Hyper M.2 card for PCIe 5.0 SSDs are included here, as well as an extended bundle. There's no direct AMD equivalent here, as ASUS only has a model in the US$400 range and one in the US$1000 range on the AMD side. However, it appears that ASUS has decided to keep the same price point as the ROG Maximus Z690 Hero. This isn't entirely surprising, as the boards appear to be almost identical, bar some change to the layout to the rear I/O. At US$629.99, this isn't a cheap board, but it wasn't expected either, as ASUS does charge a premium price for its ROG products. Both boards are said to be shipping from the 20th of October.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the breakthrough DDR5 performance of XMP DDR5-7600 and O.C. performance to DDR5-7950 under fan cooling on Z790 AORUS XTREME and MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 7200 memory. Featuring Shielded Memory Routing of SMD memory DIMM, exclusive DDR5 overclocking BIOS setting, top-quality components, and enhanced design from hardware to firmware on motherboards, this performance proves GIGABYTE's strong leading role in product quality and performance.

To unleash the ultimate DDR5 performance, GIGABYTE Z790 AORUS XTREME and MASTER implement new generation Shielded Memory Routing design. By optimizing memory trace width, length, and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules. Further with low signal-loss PCB, signal loss inside PCB and external interference are greatly reduced which can maintain high-speed DDR5 signal transmission to achieve higher DDR5 speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7600 and DDR5-7950 O.C. under fan cooling with T-FORCE DELTA RGB DDR5 7200 memory. The detailed memory information is listed in the memory support list of the motherboard.

At the forefront of precision robotics engineering, AAEON has announced the UP Element i12 EDGE, in what the company believes will be a key step in innovating the autonomous mobile robot (AMR) and industrial automation markets.

Combining the agile architecture of 12th Generation Intel Core i3, i5, and i7 processor platforms with industrial-grade engineering, the UP Element i12 EDGE harnesses up to 10 cores and 12 threads, Intel Iris Xe graphics, and a selection of peripheral technologies in a rugged, flexible, and easily deployed edge system.
AAEON believes the UP Element i12 EDGE will have a significant role to play in the AMR market. With three USB 3.2 and two USB 2.0 ports for multiple 3D cameras and sensors, along with a dual COM port pin header for RS-232/422/485 connectivity, the device is equipped with enhanced object detection capabilities and more accurate positional data via LiDAR and IMU connections.

The Intel Labs and Components Research organizations have demonstrated the industry's highest reported yield and uniformity to date of silicon spin qubit devices developed at Intel's transistor research and development facility, Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. This achievement represents a major milestone for scaling and working towards fabricating quantum chips on Intel's transistor manufacturing processes.

The research was conducted using Intel's second-generation silicon spin test chip. Through testing the devices using the Intel cryoprober, a quantum dot testing device that operates at cryogenic temperatures (1.7 Kelvin or -271.45 degrees Celsius), the team isolated 12 quantum dots and four sensors. This result represents the industry's largest silicon electron spin device with a single electron in each location across an entire 300 millimeter silicon wafer.

We're excited to release a new 3DMark feature test for Intel's new XeSS AI-enhanced upscaling technology. This new feature test is available in 3DMark Advanced and Professional Editions. 3DMark feature tests are special tests designed to highlight specific techniques, functions, or capabilities. The Intel XeSS feature test shows you how XeSS affects performance.

The 3DMark Intel XeSS frame inspector tool helps you compare image quality with an interactive side-by-side comparison of XeSS and native-resolution rendering. Check out the images below to see an example comparison of native resolution rendering and XeSS in the new 3DMark feature test.

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced a new Expert series desktop model, the ExpertCenter D7 SFF (D700SD).

The ExpertCenter D7 SFF is designed for long-term use, giving business users in financial, retail, manufacturing, creative fields, and other industries a durable solution. It's designed to suit growing business needs with tool-free expansion, making this model an investment that can evolve with a business. The case is rotatable and can be fully opened for convenient maintenance and upgrades, with side panels on the chassis that are easily removed without a screwdriver, and a 3.5-inch HDD tool-free tray that enables users to quickly replace or upgrade hard drives.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, introduced today the high-performance TVS-hx74 QuTS hero NAS series, including the 4-bay TVS-h474, 6-bay, TVS-h674 and 8-bay TVS-h874 models that incorporate 12th Gen Intel Core multi-core/multi-thread processors. The TVS-hx74 running ZFS-based QuTS hero operating system ensures data integrity and supports block-level inline data deduplication and compression, near-limitless snapshots, and real-time SnapSync. Featuring PCIe Gen 4 (up to twice the transmission speed of Gen 3) expandability, M.2 NVMe SSD caching, and 2.5 GbE connectivity, the TVS-hx74 tackles demanding business challenges in storage, backup, virtualization, and application servers.

"QNAP's TVS-hx74 is the ideal entry-level ZFS NAS for SMBs," said Meiji Chang, General Manager of QNAP, adding "The multi-core processors and versatile expandability also fulfill multi-tasking demands in enterprise IT environments and provide abundant computing resources for virtualization applications." "We are excited to see QNAP employ Intel's cutting-edge solution within their latest NAS series. The 12th Gen Intel Core multi-core/multi-thread processors will deliver excellent computing performance for accelerating SMB virtualization applications and graphical demands," said Jason Ziller, General Manager, Client Connectivity Division at Intel Corporation.

ASUS today announced ExpertBook B5 (B5602C) and ExpertBook B5 Flip (B5602F), all-new laptop models engineered with an expansive 16-inch, 16:10 display and strong, lightweight build for extreme flexibility and business productivity on the go—plus the option of an OLED panel for stunning visuals.

The new models laptops are set for serious travel with amazing all-day battery life, and are engineered with many cutting-edge technologies to improve mobile work efficiency. These include an up to 12th Gen Intel Core processor with up to Intel Arc A350M discrete graphics, dual-fan cooling, AI-powered conferencing technology, and dual-SSD RAID support. B5 Flip additionally benefits from a 360°-flippable screen, plus the added versatility enabled by support for a fast-charging, garaged stylus. ExpertBook B5 and ExpertBook B5 Flip are also packed with features to protect personal privacy and business data, including vPro support, a built-in fingerprint sensor and TPM 2.0 chip.

Unfortunately there's no pricing attached to this leak, unlike the earlier pricing details for MSI's B650 motherboards from B&H, but Videocardz has managed to get the specs for ASRocks upcoming B650 and B650E motherboards. Once again we're looking at a collection of seven models, four B650E and three B650 models in total. Something interesting to note that Videocardz is pointing out, is that only the cheapest board in the lineup has a six layer PCB, with most models using an eight layer PCB and the Mini-ITX board is going up to 10 layers. In other words it seems like most entry level boards are now using high-end PCBs, due to the transition to PCIe 5.0.

The base model is the B650 PG Lightning, which is a pretty feature stripped motherboard, yet all PCIe slots are said to be PCIe 4.0 and it has a pre-installed I/O shield. It comes with 2.5 Gbps Ethernet, but WiFi is optional. At least there's a rear mounted 20 Gbps USB-C port here and the board has a total of three M.2 slots, of which one is PCIe 5.0. On the same kind of level sits B650 Pro RS, which is a step down in the sense that one of the M.2 slots PCIe 3.0 x2 and it has fewer PCIe slot, but it appears to have slightly fancier cooling for the VRMs and it gains a DisplayPort output around the back.

PC hardware specialist Acer today on Twitter announced its official entry into the discrete GPU market with its own-brand Intel Arc GPUs. The company will be pulling its gaming-oriented Predator branding for the launch of its very own Intel Arc A770, the Predator BiFrost. Despite going in with the newest discrete GPU manufacturer, Acer's attempt at taking on the thin-margin discrete GPU field marks an interesting entry - at least from a design standpoint. The new Arc A770 BiFrost features an asymmetrical dual-fan setup peppered with RGB lighting and industrial detailing throughout in what seems to be a semi-blower-type design. The card's design is somewhat reminiscent of NVIDIA's take on its Founder Editions, with a number of visible screws that help break up the visual continuity. It also sports a dual 8-pin power delivery circuit - beefier than Intel's own take on the Arc A770, which we've just unboxed.

Best-known for its pre-constructed desktops, laptops, and monitors, Acer is now seemingly looking to dip its toes into the discrete GPU market. Unfortunately, Acer's announcement is bereft of details; there's only a render of the card and no actual specifications on whether the company will be offering the 8 GB version Arc A770, its 16 GB cousin, or both. It's also unknown whether the company is planning on extending its reach towards other Arc models or even other manufacturers such as AMD and NVIDIA, but it does make sense that it's forging ahead with a single manufacturer first.

The Intel Arc 7-series performance-segment graphics cards announced earlier this week, are all priced within $60 of each other. The series begins with the Arc A750 at USD $289. $40 more gets you the Arc A770 Limited Edition 8 GB, at $329. The top-of-the-line Arc A770 Limited Edition 16 GB is priced just $20 higher, at $349. This puts the Intel flagship at least $30 less than the cheapest NVIDIA GeForce RTX 3060 available in the market right now, which can be had for $380. The dark horse here is the AMD Radeon RX 6650 XT, which is going for as low as $320.

Intel extensively compared the A770 to the RTX 3060 in its marketing materials, focusing on how its ray tracing performance is superior to even that of NVIDIA RTX in this segment, and that the Intel XeSS performance enhancement is technologically on-par with 2nd generation super-scaling techs such as FSR 2.0 and DLSS 2. If Intel's performance claims hold, the A770 has the potential to beat both the RTX 3060 and RX 6650 XT in its segment. The Arc A750, A770 8 GB, and A770 16 GB, go on sale from October 12. Stay tuned for our reviews.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

It's the moment you've been waiting for! (And the moment our teams have been working towards!) The Intel Arc A750 and A770 GPUs will be for sale on October 12th starting at $289 and $329 respectively, with the Arc A770 Limited Edition available for $349. After years of price increases in the massive $200-400 GPU segment, Intel is bringing balance back to the GPU market. Pricing seems to have gone off the deep end and we're working to reel it back in with the Intel Arc A-series GPUs. As we've shown in earlier performance blogs, the Arc A750 and A770 trade blows with the NVIDIA GeForce RTX 3060—a popular mainstream GPU. Intel CEO Pat Gelsinger called out the extreme GPU prices in his Intel Innovation Day 1 keynote, showing that the last four years have seen a nonstop upward trend in prices of mainstream GPUs. By entering the GPU space as a third player, Intel is ready to turn these tides in gamers' favor and disrupt the market.

On average, a new GeForce RTX 3060 will set you back $418. (This number was calculated on Newegg.com, targeting in stock, sold by Newegg, new RTX 3060 cards as of Sept 22, 2022.) Picking up an Intel Arc A750 on October 12th for $289 gets you 53% more performance per dollar on average, or an 8 GB Arc A770 for $329 provides 42% more perf/dollar. Why is that? The Arc A700-series performance beats the 3060 in most modern titles using DirectX 12 or Vulkan APIs and our GPUs aren't far behind in most DX11 games—all for much less cash.

ASUS Republic of Gamers (ROG) today announced the Strix G35CA, a next-generation desktop gaming PC for Windows 11 powered by the latest 13th Gen Intel Core processors and up to an NVIDIA GeForce RTX 3090 GPU. The motherboard is built on the all-new Intel Z790 chipset, a robust platform with DDR5, PCI Express (PCIe) 4.0 and WiFi 6E support, ensuring that the G35CA will be a high-performance gaming machine for years to come.

ROG Strix machines are built to power high-performance gaming experiences, and the ROG Strix G35CA is no exception—being powered by up to the 24 core 32 thread Intel Core i9-13900KF processor. Built using Intel's Raptor Lake architecture, the CPU uses a mix of high-powered performance cores and energy-friendly but powerful efficiency cores. This CPU is optimized for Windows 11 and can intelligently allocate tasks between the cores to maintain high performance without sacrificing power efficiency, giving users a seamless gaming experience. With maximum boost clocks of up to 5.8 GHz, this processor is the clear choice for gamers who demand the very best hardware.

Intel tends to send out elaborate media kits with their pre-launch processor review samples. One such kit landed with Caseking, which posted a reveal of what it could look like. A large cardboard box roughly the size of an ATX motherboard box shimmers with holographic film on all its sides. You open its lid to reveal a giant picture of a "Raptor Lake-S" (8P+16E) die. In real life, this die is roughly 260 mm² in area (about that of a postage stamp). The bottom end of this "die" opens out in two segments, one reveals an acrylic memento with another enlarged "Raptor Lake" die, which you can hang on a wall or as a backdrop in your streams; while the other half reveals two paperboard jewel-cases, one contains the Core i9-13900K (8P+16E), and the other a Core i5-13600K (6P+8E). Fancy media kits aren't new, and most hardware companies send them with their major product releases, so sites can optionally do an unboxing preview at a date before that of the review. You can watch Caseking's unboxing video from the source link below.

The upcoming Intel Core i3-N300 is an upcoming entry-level mobile processor that only has "Gracemont" E-cores, no P-cores, and yet somehow isn't branded under Atom or Pentium Silver. This isn't just because Intel retired the entry-level brands in favor of a generic "Intel Inside" brand to be used on entry-level notebooks; but very likely because of the way these chips are architected.

The i3-N300 and i3-N305 were spotted in separate Geekbench submissions discovered by Benchleaks. The chip is identified as having 8 cores and 8 logical processors (threads), but its cache is identified as being 4x 64 KB L1I, with 4x 32 KB L1D, 1x 2 MB L2, and 1x 6 MB L3. It's possible that the chip's design is very similar to a conventional "Alder Lake" processor—with a centralized L3 cache and client interconnect fabric, an uncore, and an iGPU; but with no P-cores, just the two "Gracemont" E-core clusters, each with 2 MB of L2 cache shared among 4 cores.

Intel in the second day of its InnovatiON event, turned attention to its next-generation Xeon Scalable "Sapphire Rapids" server processors, and demonstrated on-package accelerators. These are fixed-function hardware components that accelerate specific kinds of popular server workloads (i.e. run them faster than a CPU core can). With these, Intel hopes to close the CPU core-count gap it has with AMD EPYC, with the upcoming "Zen 4" EPYC chips expected to launch with up to 96 cores per socket in its conventional variant, and up to 128 cores per socket in its cloud-optimized variant.

Intel's on-package accelerators include AMX (advanced matrix extensions), which accelerate recommendation-engines, natural language processing (NLP), image-recognition, etc; DLB (dynamic load-balancing), which accelerates security-gateway and load-balancing; DSA (data-streaming accelerator), which speeds up the network stack, guest OS, and migration; IAA (in-memory analysis accelerator), which speeds up big-data (Apache Hadoop), IMDB, and warehousing applications; a feature-rich implementation of the AVX-512 instruction-set for a plethora of content-creation and scientific applications; and lastly, the QAT (QuickAssist Technology), with speed-ups for data compression, OpenSSL, nginx, IPsec, etc. Unlike "Ice Lake-SP," QAT is now implemented on the processor package instead of the PCH.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel Z790 motherboards supporting the latest 13th Generation Intel Core Processors. ASRock's Z790 series includes premium Z790 Taichi, including a new Special Edition Z790 Taichi Carrara, in addition to Z790 Steel Legend WiFi targeting high-end users, Z790 PRO RS, Z790 PG Lightning and Z790 PG Riptide designed for mainstream users, and also the Z790 PG-ITX/TB4, a powerful mini ITX motherboard with Thunderbolt 4 for small form factor lovers.