Intel's third quarter financials that the company released yesterday, weren't exactly what you'd call stellar. This has put Intel CEO Pat Gelsinger in a bind, as he's been forced to announce cost cuts of US$3 billion annually, starting 2023, but that it'll grow to somewhere between US$8 to 10 billion by 2025. Although Gelsinger didn't reveal the specifics of what these cost cuts will entail, he did mention quite a few potentials, according to The Register. Gelisinger stated that Intel "need to balance increased investment in areas like leadership in [technology development], product, and capacity [at new plants under construction] in Ohio and Germany, with the efficiency measures elsewhere as we drive to have best in class structures."

Intel's CFO David Zinsner, told Barron's that the company will be cutting a "meaningful number" of employees from Intel's payroll. Zisner went on to say that Intel will also perform "portfolio cuts, right-sizing our support organizations, more stringent cost controls in all aspects of our spending, and improved sales and marketing efficiency". It sounds like almost no-one is safe at Intel, especially as portofolio cuts mean that some product lines will either be sold off, or simply just canned in favour of more profitable products. Intel is also betting hard on its IDM 2.0 strategy, where the company is decoupling its hardware and software design teams from its foundry business. Time will tell if this helps restart Intel as a business, but Gelsinger seems to believe that the changes he's implementing at Intel will help turn things around.

Intel Corporation today reported third-quarter 2022 financial results. "Despite the worsening economic conditions, we delivered solid results and made significant progress with our product and process execution during the quarter," said Pat Gelsinger, Intel CEO. "To position ourselves for this business cycle, we are aggressively addressing costs and driving efficiencies across the business to accelerate our IDM 2.0 flywheel for the digital future."

"As we usher in the next phase of IDM 2.0, we are focused on embracing an internal foundry model to allow our manufacturing group and business units to be more agile, make better decisions and establish a leadership cost structure," said David Zinsner, Intel CFO. "We remain committed to the strategy and long-term financial model communicated at our Investor Meeting."

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, announced significant updates to its R11L rugged tablet today. The updated R11L is a competitively-priced 11" fully rugged tablet featuring the latest 12th Gen Intel Pentium Gold processor and architectural innovations to elevate the user experience, making it ideal for those working across industrial sectors, such as warehousing, utilities and logistics, and transportation.

"Durabook devices are designed to meet the demanding needs of workers who rely on rugged technology to streamline workflows and improve productivity in even the harshest environments," said Twinhead CEO Fred Kao. "With its upgrade to Intel's 12th Gen CPU, this latest R11L model is 300% faster than its predecessor, offering more computing power for budget-minded professionals."

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will exhibit at Infocomm SEA 2022, the Professional Audio Visual event in Southeast Asia at Bangkok, Thailand, Booth no. Z12 from Nov. 2 to 4 to showcase the latest LEET gaming series, the comprehensive LIVA Mini PC family and the All-in-One PC to apply for wide range of applications.

ECS will first launch the new LEET Gaming series, LEET Gaming Motherboard Z790H7-A and LEET Gaming Barebone PC B660 during Infocomm SEA 2022. To offer users exceptional PC performance, LEET Z790H7-A designs with the next-generation technology to support the latest Intel 12th & 13th Gen Processors for LGA 1700 socket, dual channel DDR5 RAM up to 128 GB, PCIe 5.0 slot, 2.5 Gb LAN and the latest wireless networking. Besides, LEET Gaming series also provides a gaming PC system, LEET B660, for user to build their own PC more easily. LEET B660 includes a B660H7-M20 Motherboard supported by the Intel 12th Gen Processor for LGA1700 socket, an NVIDIA GeForce RTX 30 series Graphic Card or AMD Radeon RX 6000 series Graphic Card and a power supply up to 650-watt into a 26-liter system case.

Intel Core i9-13900K processor has just been launched, and overclockers worldwide got their hand on a few samples to make history. According to the HWBot submission, a Swedish overclocker named "elmor" has pushed Intel's top-end consumer SKU to a fantastic 8.812 GHz. For more than eight years, the record for the single-highest overclocking speed was held by AMD FX-8370, from the now-bygone era of AMD Black Edition processors. The overclocking attempt was performed using liquid nitrogen (LN2) that cools the chip using its −195.8 °C temperature. Pushing core voltage to 1.850 Volts and VCCIN to 2 Volts, multiplier set to x88, and a bus speed of 100.15 MHz. In addition to the Core i9-13900K CPU, elmor used ASUS ROG Maximus Z790 APEX motherboard and 32 GB DDR5 GSKILL memory running at 4808 MT/s.

As a reminder, the FX-8370 CPU was holding the number one sport for eight years with a speed of 8.722 GHz. Beating the FX-8370 by just 90 MHz, it will be interesting to see if any of the upcoming CPU SKUs can match this overclocking record, and we are curious if any contender will come to beat elmor's current record.

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the Instant 6 GHz technology which is exclusively designed for performance enhancement of Intel Core i9-13900K processor. By simply updating the latest BIOS on GIGABYTE's Z790 motherboards and activating related settings, users can boost the performance of Intel Core i9-13900K to 6 GHz in a snap. Other than the Turbo Boost mode, GIGABYTE Instant 6 GHz technology can unleash the potential power of the processor to boost the single-core performance up to 3% higher, which leading up to experiencing the unparalleled performance of future processors.

The lately launched Intel Core i9-13900K processor enables users to enjoy O.C. performance in an easier way. Using GIGABYTE's latest Instant 6 GHz technology, the system can automatically tweak CPU voltage and Vcore Load Line Calibration to detect the most two optimized cores running at 6 GHz frequency. Instead of suffering from complex O.C settings, users can enjoy effortless Overclocking by simply updating the latest BIOS on GIGABYTE's Z790 motherboards and activating the Instant 6 GHz option in the BIOS. This further delivers a 3% performance boost on one single core, and provides an O.C. edition-like experience on i9-13900K processor. The latest GIGABYTE Z790 motherboards ascend to a new level with their exclusive VRM design, thermal design, and convenience. The BIOS support Instant 6 GHz technology of Z790 motherboards has been updated on the GIGABYTE official website, users can upgrade BIOS with Q-Flash or Q-Flash Plus.

ASUS Republic of Gamers (ROG) today announced a new series of ROG Ryuo III AIO coolers, with four models to choose from: the ROG Ryuo III 360 ARGB and the ROG Ryuo III 240 ARGB, both available in black or white editions.

As the first ROG AIO coolers equipped with an 8th generation Asetek pump, the ROG Ryuo III 360 ARGB and ROG Ryuo III 240 ARGB offer exceptional cooling potential, making them ideal partners for the latest high-end chips from Intel and AMD. This pump sports a 3-phase motor capable of higher flow rates than previous generations, all while operating more quietly. The square cold plate is larger than the previous generation, and its size makes it ideal for this year's hot-off-the-press CPUs.

Today Intel launched its 13th gen Core processors alongside the Z790 chipset, which in turn lead to a lot of new motherboards being available. However, it appears that ASRock is working on a special edition of its Z790 PG Riptide board that has something of an unusual twist. The board is known as the Z790 PG Sonic and appears to be some kind of cooperation with Sega, since the board carries clear Sonic the Hedgehog branding.

The board seems to be some kind of limited edition version of the Z790 PG Riptide, as we can't spot any features that have changed, at least not based on the pictures posted by @momomo_us on Twitter. The top of the board has Sonic themed heatsinks, as well as some of the printing on the PCB and the rear is adorned with a rather large Sonic in white on the black PCB. Obviously the packaging is also adorned with a Sonic print, but there doesn't appear to be any other connection to Sonic or Sega, which makes the whole partnership a bit of a mystery at the moment, but it's highly likely that we're looking at a limited edition product for the Asian markets here.

Intel has demonstrated an early prototype of next-generation Thunderbolt in action, aligned to the USB Implementers Forum's (USB-IF) release of the USB4 v2 specification this week. Next-generation Thunderbolt will deliver 80 gigabits per second (Gbps) of bi-directional bandwidth and enable up to 120 Gbps for the best display experience, providing up to three times the capability of today's technologies to meet the growing needs of content creators and gamers, all while maintaining compatibility with previous versions of Thunderbolt and USB.

"Intel has always been the industry pioneer and leader for wired connectivity solutions, and Thunderbolt is now the mainstream port on mobile PCs and integrated into three generations of Intel mobile CPUs. We're very excited to lead the industry forward with the next generation of Thunderbolt built on the USB4 v2 specification, advanced to this next generation by Intel and other USB Promoter Group members," said Jason Ziller, general manager of the Client Connectivity Division at Intel.

According to the latest TrendForce research, pandemic-induced materials shortages abated in the second half of this year and the supply and delivery of short-term materials has recovered significantly. However, assuming materials supply is secure and demand can be met, the annual growth rate of server shipments in 2023 is estimated to be only 3.7%, which is lower than 5.1% in 2022.

TrendForce indicates that this growth slowdown is due to three factors. First, once material mismatch issues had eased, buyers began adjusting previously placed purchase order overruns. Thus, ODM orders also decreased but this will not affect the 2022 shipment volume of whole servers for the time being. Second, due to the impact of rising inflation and weakness in the overall economy, corporate capital investment may trend more conservative and IT-related investment will emphasize flexibility, such as the replacement of certain server terminals with cloud services. Third, geopolitical changes will drive the continuing emergence of demand for small-scale data centers and previous construction of hyperscale data centers will slow. The recent ban on military/HPC servers issued by the U.S. Department of Commerce on October 7 has a very low market share in terms of its application category, so the impact on the overall server market is limited at present. However, if the scope of the ban is expanded further in the future, it will herald a more significant slowdown risk for China's server shipment momentum in 2023.

Intel has been busy briefing its customers about its 13th gen Core processors and courtesy of a reader over at Videocardz, we now know a little bit more about Intel's positioning of its Core i9-13900K processor. In the slides, Intel is pitching its upcoming flagship CPU against AMD's current flagship, the Ryzen 9 7950X, which is hardly surprising, since it'll be its main competitor. Intel put the two CPUs through 12 game benchmarks using an unknown graphics card and on average, the Core i9-13900K leads by around 11 percent. As always, take the numbers with a sprinkle of salt, especially as we don't know the system configuration, or even what resolution was used, but we'd hazard a guess that it's 1080p or lower. Intel only allowed for one game win for AMD, with Intel being as much as 22 percent ahead in The Riftbreaker.

Intel also claims to lead in content creation, but this doesn't appear to be quite true, as AMD either comes out on top or ties with Intel in all of the Pugetbench tests. Intel is somewhat ahead in AutoCAD Catalyst and a healthy 16 percent ahead in Autodesk Revit, but as we know, the type of scene being rendered can have a huge impact in these types of tests, as we've seen from both camps. On the plus side, here it appears that content creators shouldn't have to worry too much about which CPU is in their system, as both should be performing exceptionally well. Intel is set to launch its 13th gen Core processors tomorrow, so it won't be long until we'll have some third party benchmarks comparing the two CPUs.

Intel Arc A770 "Alchemist" graphics card has an idle power-draw problem. It pulls 44 W (card-only) power when idling. This used to be acceptable some 15 years ago, but GPU idle power-draw has come a long way since. The reigning Goliath GeForce RTX 4090 pulls just 21 W when idling, and the RTX 3070, the card the A770 was extensively compared against, only pulls 9 W—that's 7 LED downlights worth power-difference between the A770 and RTX 3070. Intel has a workaround to this problem: enable the PCI-Express active state power management (ASPM) setting to L1 mode in your motherboard's UEFI BIOS setup program.

The Intel Xe-HPG "Alchemist" graphics architecture reportedly uses PCIe Gen 2-era L0 and L1 ASPM, which needs to be forced via software settings. To do this, find the PCIe ASPM settings in your BIOS setup, and enable them with the "L1" setting. You then make your way to Power Options in the Windows Control Panel, edit your active power scheme, and manually set the PCI-Express "Link state power-management" to "Maximum." This affects the power-management behavior and performance of all PCIe devices in your system, including NVMe SSDs, not just the graphics card. Intel did not put out its power-draw numbers for this workaround, but we intend to test it as soon as we can.

he U.S. Defense Advanced Research Projects Agency (DARPA) has selected Intel for Phase 1 of the Space-Based Adaptive Communications Node (Space-BACN) program, which aims to create a low-cost, reconfigurable optical communications terminal that will translate information between diverse satellite constellations. A Space-BACN satellite terminal will enable communications between satellite constellations, enabling data to be sent anywhere around the planet at the speed of light.

DARPA is planning for a future where tens of thousands of satellites from multiple private sector organizations deliver broadband services from low earth orbit (LEO). The goal of Space-BACN is to create an "internet" of satellites, enabling seamless communication between military/government and commercial/civil satellite constellations. The program will facilitate collaboration among partners to ensure that the terminal being designed is reconfigurable to provide interoperability among the participating constellation providers.

AMD reportedly scaled down production of its Ryzen 7000 series desktop processors in response to bleak demand across the PC hardware industry. Wccftech claims to have read an internal company document calling for reduced supply to the channel as market response to the Ryzen 7000-series is weak. This comes hot on the heels of AMD revising its Q3-2022 forecast, trimming its guidance by a $1 billion drop in revenue, citing weak demand in the PC market. However, we are seeing no deviation from the launch pricing for Ryzen 7000-series SKUs or compatible Socket AM5 motherboards. The platform went on sale from late September, on the same day that Intel announced its competing 13th Gen Core "Raptor Lake" processors. The new Intel chips are expected to start selling from a little later this month.

Unlike 13th Gen Core processors, Ryzen 7000 series processors appear to be a victim of the platform—notwithstanding the high pricing of the processors, which start at $299 for the 6-core 7600X, buyers lack access to affordable motherboards, and have to contend with expensive DDR5 memory. Pricing of cheaper LGA1700 motherboards based on entry-level H610 and B660 chipsets with cost-effective DDR4 memory support have added depth to consumer choice, besides Intel's 12th Gen range starting from under $150.

Acer has launched its Predator BiFrost Arc A770 graphics card in Taiwan and the official pricing appears to be NT$12,900 or US$404, local shops are already selling the card for far less. The BiFrost comes with 16 GB of GDDR6 memory and an overclocking option that boosts the GPU speed from 2,200 MHz to 2,400 MHz. The latter also increases the TDP from 250 to 280 Watts. As seen in the launch announcement pictures, the card has a rather unusual fan design and Acer has even come up with some marketing names for the setup. The blower fan is referred to as Aeroblade 3D and the regular 92 mm fan as Frostblade 2.0. We're not sure how there's a version 2.0 when this is Acer's first retail graphics card.

The card measures 267 x 117.75 mm and has as we've also seen, a pair of 8-pin power connectors. The port configuration consists of three DP 2.0 ports and one HDMI 2.1 port. Local shops are offering the card on sale for US$372 to as little as US$313 (NT$9990), which is only US$13 more than Intel's own Arc A750 cards retail for in Taiwan. This price point makes it a fair bit more attractive, even taking potential driver related issues and hardware limitations into account.

In December of 2021, we covered the appearance of Russia's home-grown Baikal-S processor, which has 48 cores based on Arm Cortex-A75 cores. Today, thanks to the famous chip photographer Fritzchens Fritz, we have the first die shows that show us exactly how Baikal-S SoC is structured internally and what it is made up of. Manufactured on TSMC's 16 nm process, the Baikal-S BE-S1000 design features 48 Arm Cortex-A75 cores running at a 2.0 GHz base and a 2.5 GHz boost frequency. With a TDP of 120 Watts, the design seems efficient, and the Russian company promises performance comparable to Intel Skylake Xeons or Zen1-based AMD EPYC processors. It also uses a home-grown RISC-V core for management and controlling secure boot sequences.

Below, you can see the die shots taken by Fritzchens Fritz and annotated details by Twitter user Locuza that marked the entire SoC. Besides the core clusters, we see that a slum of cache connects everything, with six 72-bit DDR4-3200 PHYs and memory controllers surrounding everything. This model features a pretty good selection of I/O for a server CPU, as there are five PCIe 4.0 x16 (4x4) interfaces, with three supporting CCIX 1.0. You can check out more pictures below and see the annotations for yourself.

Intel's upcoming 13th generation of Core processors, codenamed "Raptor Lake," is supposed to arrive in the coming days. Apparently, one user pre-ordered the CPU and got it delivered to their home. Pictured below is the box of Intel Core i9-13900KF CPU. This SKU comes without integrated graphics and boasts eight P-cores with 16 E-cores on board. This is supposed to boost performance, along with the higher frequencies Raptor Lake is advertised to bring. The user even showed screenshots of proof that the software recognizes this upcoming model, so the information seems legit. In the screenshots below, we see that the P-cores of this SKU is reaching 5.5 GHz clock speeds. We are yet to see how much this silicon is capable of; however, the frequency alone looks promising.

Intel announced the general availability of the Arc A770 and A750 performance-segment desktop graphics cards. This includes Intel's reference-design Limited Edition cards, and custom-design ones by the likes of ASRock, Gunnir, and Acer, among other OEMs. The A750 has a baseline price of USD $289, the A770 8 GB at $329, and the A770 16 GB at $349.

Based on the Xe-HPG "Alchemist" graphics architecture, the A750 and A770 are carved out of the same 6 nm ACM-G10 silicon. The A750 is configured with 28 Xe Cores, 448 EU, or 3,584 unified shaders; whereas the A770 maxes it out with 32 Xe Cores, 512 EU, or 4,096 unified shaders. Both cards get 256-bit wide GDDR6 memory interfaces, and while the A750 uses 16 Gbps memory (512 GB/s bandwidth); the A770 has 17.5 Gbps (560 GB/s).

Today, we shared our vision for the next era of the Windows PC, where the PC and the cloud intersect and tap into innovative AI technology that unlocks new experiences. So that each of us can participate, be seen, heard and express our creativity.

For nearly 40 years, the Windows PC has held a place at the center of our lives. It's contributed to new levels of productivity, kept us all connected, and unlocked our creativity and potential through innovations we couldn't have imagined when we first began this journey. Just think about how far we've come in how people interact with it. From the very first text-based keyboard input to the precision of point and click with the mouse, up to today, where touch, voice, pen and gestures all help people use the Windows PC more naturally and intuitively. From its inception, Surface has been a catalyst for that change.

The world is without a doubt entering a recession and now the first rumours of mass layoffs in the tech industry are starting. According to Bloomberg, Intel is considering laying off thousands of employees as a measure to cut costs, as its businesses are slowing down. Bloomberg is mainly citing the PC market, which the publication calls Intel's main business, although Intel's Client Computing Group (CCG) does a lot more than just selling PC chips, but the group was Intel's largest source of revenue in Q2 this year by quite some margin. That said, despite a revenue of US$7.7 billion in Q2, this was down 25 percent compared to 2021, which in all fairness was a record year for most companies in the PC industry.

According to Bloomberg, Intel had 113,700 employees as of July this year and the publication said Intel is considering cutting as much as 20 percent of its sales and marketing staff. Bloomberg is expecting Intel to be looking at reducing fixed costs by 10 to 15 percent, although this is unlikely to affect key parts of Intel's business units. Last quarter, most of Intel's business units made a healthy profit, but only the Network and Edge Group had a significant revenue increase over the same quarter in 2021, with most other groups being down significantly. The third quarter results aren't expected to improve upon things, something that appears to be reflected in Intel's share price, which is down over 50 percent in 2022. That said, all of Intel's competitors are in the same boat and it's likely that we'll see more news about companies that are considering trimming back on their expenses and staff numbers in the near future. Intel is scheduled to report its third quarter earnings on the 27th of October.

Today, Lenovo unveiled the newest addition to its gaming portfolio that comes with a novel twist. Designed for a wide audience of gaming enthusiasts across varying skill levels, the 16-inch Lenovo IdeaPad Gaming Chromebook is the company's first ever cloud gaming laptop. Delivering more power, faster speeds, and stunning visuals, this device also comes with new ChromeOS software features, including the ability to easily find and access the latest games while enjoying an elevated gaming experience.

Much like the rest of the tech industry, gaming has surged in popularity over the last few years with the number of online gamers increasing by more than 32%, currently making up over one-third of the more than 3 billion total gamers worldwide. The droves of people who flocked to gaming as an outlet during the pandemic have diversified the space, as well, with people of all ages taking up the hobby. The IdeaPad Gaming Chromebook is built for a broad spectrum of players across generations and skillsets, offering an enhanced yet simple gameplay experience, as well as the device features that support productivity - all at an accessible price point.

ASUS today announced ASUS Chromebook Vibe CX55 Flip, engineered with a striking aesthetic and powerful components for nonstop cloud gaming—with an immersive 144 Hz FHD display, accurate anti-ghosting keyboard and ultra-fast WiFi 6 technology. According to Gartner, "The rise of cloud gaming, growing at a compound annual growth rate (CAGR) of 30% from 2019 to 2025, will motivate many gamers to offload hardware to the cloud and rely on CSPs to provide the infrastructure to deliver these games." When emergent cloud-gaming services are factored in, it is clear that a vast and significant market is just waiting to be tapped—and that's where ASUS Chromebook Vibe CX55 Flip makes its bold entrance.

The fresh, vibrant design features a dynamic, distinctive and daring look that's both stylish and durable, with exclusive color-blocked WASD keycaps to bring flair to online play. Coupled with access to leading cloud-gaming services, including NVIDIA GeForce NOW, Xbox Cloud Gaming (Beta) and Amazon Luna, ASUS Chromebook Vibe CX55 Flip is set to energize this underserved audience—ready for all-new gaming adventures. Powering all the entertainment is up to an 11th Gen Intel Core i7 processor, 16 GB of memory and immersive Harman Kardon audio.

ASRock is shaping up to be the first major custom-design Intel Arc "Alchemist" board partner with a footprint in the EU and North America. The company is ready with a pair of custom-design Arc A770 products based on its key gamer-focused brands. The first of these is the ASRock A770 Phantom Gaming OC. This card features a meaty triple-slot Phantom Gaming cooling solution, complete with RGB LED illumination. It should also feature the company's highest state of tuning for the A770. The next of the custom-design cards is the Arc A750 Challenger. This card features clean 2-slot, dual-fan design, and a factory-overclock. It's also likely that ASRock is extending the Challenger OC treatment to the A770.

Intel CEO Pat Gelsinger sent the following statement announcing creation of an internal foundry model for external customers and Intel product lines and the creation of the IDM 2.0 Acceleration Office, under the leadership of Stuart Pann, to all company employees on Oct. 11: When I returned to Intel in 2021, I introduced our IDM 2.0 strategy: a multiyear journey to regain unquestioned technology leadership, manufacturing scale and long-term growth. Today, we begin the next phase of our IDM 2.0 journey.

In the first phase of our transformation, we made significant progress on our process roadmaps and capacity. We remain on track to deliver five process nodes in four years, and we've invested in the capacity required to meet the industry's demand for semiconductors, bringing much-needed balance to the global supply chain.
The next phase of our IDM 2.0 journey requires a fundamental shift in mindset. We must embrace an internal foundry model, not only for our external customer commitments but also for our Intel product lines. This is a significant evolution in how we think and operate as a company, but the systems and infrastructure that served us well in the IDM 1.0 world will not enable us to achieve the full potential of IDM 2.0.