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Latency Increase from Larger L2 Cache on Intel "Raptor Cove" P-core Well Contained: Report

According to an investigative report by "Chips and Cheese," the larger L2 caches in Intel's 13th Gen Core "Raptor Lake-S" doesn't come with a proportionate increase in cache latency, and Intel seems to have contained the latency increase well. "Raptor Lake-S" significantly increases L2 cache sizes over the previous generation. Each of its 8 "Raptor Cove" P-cores has 2 MB of dedicated L2 cache, compared to the 1.25 MB with the "Golden Cove" P-cores powering the current-gen "Alder Lake-S," which amounts to a 60 percent increase in size. The "Gracemont" E-core clusters (group of four E-cores), sees a doubling in the size of the L2 cache that's shared among the four cores in the cluster, from 2 MB in "Alder Lake," to 4 MB. The last-level L3 cache shared among all P-cores and E-core clusters, sees a less remarkable increase in size, from 30 MB to 36 MB.

Larger caches have a direct impact on performance, as more data is available close to the CPU cores, sparing them a lengthy fetch/store operation to the main memory (RAM). However, making caches larger doesn't just cost die-area, transistor-count, and power/heat, but also latency, even though L2 cache is an order of magnitude faster than the L3 cache, which in turn is significantly faster than DRAM. Chips and Cheese tracked and tabulated the L2 cache latencies of past Intel client microarchitectures, and found a generational increase in latencies with increasing L2 cache sizes, leading up to "Alder Lake." This increase has somehow tapered with "Raptor Lake."

Intel Claims "Ponte Vecchio" Will Trade Blows with NVIDIA Hopper in Most Compute Workloads

With AMD and NVIDIA launching its next-generation HPC compute architectures, "Hopper" and CDNA2, it began seeming like Intel's ambitious "Ponte Vecchio" accelerator based on the Xe-HP architecture, has missed the time-to-market bus. Intel doesn't think so, and in its Hot Chips 34 presentation, disclosed some of the first detailed performance claims that—at least on paper—put the "Hopper" H100 accelerator's published compute performance numbers to shame. We already had some idea of how Ponte Vecchio would perform this spring, at Intel's ISC'22 presentation, but the company hadn't finalized the product's power and thermal characteristics, which are determined by its clock-speed and boosting behavior. Team blue claims to have gotten over the final development hurdles, and is ready with some big numbers.

Intel claims that in classic FP32 (single-precision) and FP64 (double-precision) floating-point tests, its silicon is highly competitive with the H100 "Hopper," with the company claiming 52 TFLOP/s FP32 for the "Ponte Vecchio," compared to 60 TFLOP/s for the H100; and a significantly higher 52 TFLOP/s FP64 for the "Ponte Vecchio," compared to 30 TFLOP/s for the H100. This has to do with the SIMD units of the Xe-HP architecture all being natively capable of double-precision floating-point operations; whereas NVIDIA's architecture typically relies on FP64-specialized streaming multiprocessors.

Acer Unveils Eco-conscious Chromebook Vero 514

Acer unveiled today the new Acer Chromebook Vero 514 - the first Chromebook in its line of eco-conscious Vero devices that reflects the company's commitment to sustainability by offering consumers and commercial customers more options that allow them to reduce their ecological footprint. The new Acer Chromebook Vero 514 (CBV514-1H/T) features a thoughtful design that takes the entire product lifespan into consideration, since it is easy to upgrade, repair, disassemble and recycle. It also uses recycled materials in most areas of the product including 30% post-consumer recycled (PCR) plastic in the chassis and 50% PCR plastic in the keycaps, 100% ocean-bound plastics on the touchpad surface and 90% recycled paper packaging.

"The simplicity, security and speed of Chromebooks are the ideal complements to our Vero line's focus on delivering powerful devices that keep an eye on the environment," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "The new Acer Chromebook Vero 514 is the next step in embodying our Earthion mission by developing eco-friendlier products that have a positive ecological impact on our customers' businesses, homes and schools."

Intel Introduces First-of-its-Kind Semiconductor Co-Investment Program

Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of its program, Intel has signed a definitive agreement with the infrastructure affiliate of Brookfield Asset Management, one of the largest global alternative asset managers, which will provide Intel with a new, expanded pool of capital for manufacturing build-outs.

SCIP is a key element of Intel's Smart Capital approach, which aims to provide innovative ways to fund growth while creating further financial flexibility to accelerate the company's IDM 2.0 strategy. Intel's agreement with Brookfield follows the two companies' memorandum of understanding announced in February 2022. Under the terms of the agreement, the companies will jointly invest up to $30 billion in Intel's previously announced manufacturing expansion at its Ocotillo campus in Chandler, Arizona, with Intel funding 51% and Brookfield funding 49% of the total project cost. Intel will retain majority ownership and operating control of the two new leading-edge chip factories in Chandler, which will support long-term demand for Intel's products and provide capacity for Intel Foundry Services (IFS) customers. The transaction with Brookfield is expected to close by the end of 2022, subject to customary closing conditions.

TSMC (Not Intel) Makes the Vast Majority of Logic Tiles on Intel "Meteor Lake" MCM

Intel's next-generation "Meteor Lake" processor is the first mass-production client processor to embody the company's IDM 2.0 manufacturing strategy—one of building processors with multiple logic tiles interconnected with Foveros and a base-tile (essentially an interposer). Each tile is built on a silicon fabrication process most suitable to it, so that the most advanced node could be reserved for the component that benefits from it the most. For example, while you need the SIMD components of the iGPU to be built on an advanced low-power node, you don't need its display controller and media engine to, and these could be relegated to a tile built on a less advanced node. This way Intel is able to maximize its use of wafers for the most advanced nodes in a graded fashion.

Japanese tech publication PC Watch has annotated the "Meteor Lake" SoC, and points out that the vast majority of the chip's tiles and logic die-area is manufactured on TSMC nodes. The MCM consists of four logic tiles—the CPU tile, the Graphics tile, the SoC tile, and the I/O tile. The four sit on a base tile that facilitates extreme-density microscopic wiring interconnecting the logic tiles. The base tile is built on the 22 nm HKMG silicon fabrication node. This tile lacks any logic, and only serves to interconnect the tiles. Intel has an active 22 nm node, and decided it has the right density for the job.

Intel Graphics Releases Arc 30.0.101.3268 Beta Drivers with Dozens of Fixes

Intel Graphics over the weekend released the Arc Graphics Drivers version 30.0.101.3268 beta. These drivers add performance optimization for Saints Row and Madden NFL 23, but that's hardly the defining feature. In our testing, the drivers were found to to be night-and-day compared to the previous version, in terms of overall system stability. The release comes hot on the heels of a report that Intel fixed as many as 43 bugs just by watching a product review video by Gamers Nexus.

Among the fixed issues are lower-than-expected performance with Marvel's Spider Man (Remastered) in DirectX 12 mode; an application crash with SoTR in DirectX 12 mode with ray traced shadow quality set to "high," a texture-corruption issue with Battlefield 2042 in DirectX 12 mode; artifacts and object loading failures seen in Halo Infinite, an application crash with Horizon Zero Dawn, and the nasty bug where Windows Update attempts to replace the installed driver, causing severe stability issues. As many as 17 bugs related to Arc Control and 11 bugs related to Arc Control Performance Tuning, have been fixed, as listed below.

DOWNLOAD: Intel Arc 30.0.101.3268 beta

Intel Detects 43 GPU Driver Bugs... By Watching a Review Video

Intel has been in the firing lines for the consecutive delays and general lack of clarity surrounding the launch of its Arc Alchemist family of discrete GPUs. Staggered availability has meant that the only currently available Arc GPU - the A380 - is still only available in the Chinese market, where the Internet café game is still strong. Intel drivers in particular have been fraught with bugs and as we know, software can bring even the most competent hardware to its knees. So there's maybe an echo of warning bells to the real state of Arc's software suite when Intel admits to having detected 43 different GPU driver bugs... While watching a review video from Gamers Nexus.

We've conducted our own review of Intel's Arc A380 (after importing it from China), and we did call to attention how we "encountered numerous bugs including bluescreens, corrupted desktop after startup, random systems hangs, system getting stuck during shutdown sequences, and more." Only AMD and NVIDIA seem to have an idea on just how complex the matter of breaking into and maintaining a position in this particular product segment takes. Intel itself is still in the process of learning just what that takes, as its own VP and general manager of the Visual Computing Group, Lisa Pearce, penned in a blog post.

Intel's 13th Gen Core CPU Lineup Seemingly Leaks a Month Ahead of the Launch

Although this information hasn't been verified yet, it looks very plausible, but there are also some crucial bits missing. However, we now appear to have the full list of Intel Core 13000-series CPUs, that ranges from the Core i9-13900KF to the Core i3-13100. The information comes via Bilibili and should as such be taken with a grain of salt, but there are no big surprises here, except possibly the fairly low base clocks for some of the Core i9-13900K and KF SKUs, which sits at 3 GHz, compared to 3.2 GHz for the 12th gen equivalents.

What the leaker doesn't appear to have gotten hold of, is the boost frequency for the CPUs, possibly because Intel has kept it away from its partners so far. Earlier rumours have suggested boost speeds of 5.5 GHz or potentially even higher for a future KS SKU. Thanks to Intel adding additional E-cores into the mix, even the lower-end Core i5 CPUs will get four to eight E-cores this time around, whereas the 12th gen CPUs only offered E-cores on the Core i5-12600K and KF. Sadly the Core i3-13100 still gets to make do with only four P-cores. Intel is expected to reveal its 13th gen Core CPUs on the 27th or 28th of September.

TSMC has Seven Major Customers Lined Up for its 3 nm Node

Based on media reports out of Taiwan, TSMC seems to have plenty of customers lined up for its 3 nm node, with Apple being the first customer out the gates when production starts sometime next month. However, TSMC is only expected to start the production with a mere 1,000 wafer starts a month, which seems like a very low figure, especially as this is said to remain unchanged through all of Q4. On the plus side, yields are expected to be better than the initial 5 nm node yields. Full-on mass production for the 3 nm node isn't expected to happen until the second half of 2023 and TSMC will also kick off its N3E node sometime in 2023.

Apart from Apple, major customers for the 3 nm node include AMD, Broadcom, Intel, MediaTek, NVIDIA and Qualcomm. Contrary to earlier reports by TrendForce, it appears that TSMC will continue its rollout of the 3 nm node as previously planned. Apple is expected to produce the A17 smartphone and tablet SoC, as well as advanced versions of the M2, as well as the M3 laptop and desktop processors on the 3 nm node. Intel is still said to be producing its graphics chiplets with TSMC, with the potential for GPU and FPGA products in the future. There's no word on what the other customers are planning to produce on the 3 nm node, but MediaTek and Qualcomm are obviously looking at using the node for future smartphone and tablet SoCs, with AMD and NVIDIA most likely aiming for upcoming GPUs and Broadcom for some kind of HPC related hardware.

Intel Arc A580 Hits AotS Benchmark Database, Roughly Matches RTX 3050

Intel Arc A580 is an upcoming entry-mainstream desktop graphics card based on the Xe-HPG "Alchemist" graphics architecture, and positioned between the A380 and A750. Based on the larger 6 nm DG2-512 silicon than the one powering the A380, the A580 is endowed with 16 Xe Cores, or double the SIMD muscle of the A380, with 2,048 unified shaders. The card enjoys 8 GB of GDDR6 memory across a 128-bit bus, which at 16 Gbps data-rate produces 256 GB/s bandwidth.

A leaked Ashes of the Singularity benchmark database entry reveals that the A580 scores roughly 95 FPS at 1080p on average, with 110 FPS in the normal batch, around 102 FPS in the medium batch, and around 78 FPS in the heavy batch. The benchmark used the Vulkan API, and an unknown 16-thread Intel processor with 32 GB of memory. These scores put the A580 roughly at par with the GeForce RTX 3050 "Ampere" in this test, which would make it a reasonable solution for playing popular online games at 1080p with medium-high settings, or AAA games at medium settings.

Intel Core i9-13900K Reportedly 60% Faster Than i9-12900K in 7-Zip Decompression Test

The upcoming flagship Intel Core i9-13900K processor has recently appeared in a 7-Zip benchmark screenshot where the chip beat its predecessor by 20% and 60% in compression and decompression tests respectively. The i9-13900K looks set to feature an additional 8 High-Efficiency cores for a total of 24 cores along with a higher boost clock of 5.8 GHz. This increased core count and clock speed account for the majority of the performance improvements with the i9-13900K reaching a max single thread clock of 5716 MHz and 4611 MHz on 16 threads compared to 5021 MHz and 4060 MHz with the i9-12900K. The processors were both paired with a 32 GB set of DDR5-6400CL32 memory on an unspecified motherboard. These results have not been confirmed with Intel expected to officially unveil the new lineup on September 27th.

Intel Intros NUC 12 Pro "Wall Street Canyon" Compact Commercial Desktops

Intel late-Tuesday (16/08) announced the NUC 12 Pro "Wall Street Canyon" line of compact desktops as enclosed prebuilt mini PCs, and bare motherboards. These are based on the 12th Gen Core "Alder Lake-P" (2P+8E) mobile processors paired typically with up to 16 GB of dual-channel DDR4 memory, up to 512 GB of M.2 NVMe Gen 4 SSD storage, an additional Gen 4 M.2 slot, and come with preinstalled Windows 11. Certain variants feature a slightly larger chassis with room for a 2.5-inch SATA 6 Gbps drive. Select SKUs come with Thunderbolt 4 ports, 20 Gbps USB 3.2x2 ports, 2.5 GbE, and Wi-Fi 6E networking. and certain SKUs even offer vPro management features for commercial environments.
A video-presentation by SimplyNUC follows.

MSI Introduces Prestige 16 Mini-LED Laptops with Alder Lake-P

MSI has updated its Prestige series lineup with new members, Prestige 16 and Prestige 16 EVO. Both in Urban Silver color and equipped with Intel 12th Gen Core i7 Processor, they are powerful productivity tools that business users can really appreciate.

The MSI Prestige 16 has a decent discrete GPU performance from NVIDIA GeForce RTX 3050 Ti, and is the first Prestige laptop that has a 16:10 ratio mini-LED panel. With the MSI True Color Technology, it reaches the high dynamic range (HDR) with DisplayHDR 1000 standard, which significantly expands the range of two important factors—contrast ratio and color accuracy. Thanks to Dynamic Cooler Boost, MSI's patented dual-fan thermal technology, Prestige 16/Prestige 16 EVO are powerful laptops that maintain less than 35 dB background noise. For business users who hold online conferences frequently, they can expect to have smooth video conferencing experience with the quadruple microphone and Ambient Light Sensor that come along with AI noise canceling solution.

AMD Pushes Ryzen 7000 "Zen 4" Availability Date to Clash with Intel "Raptor Lake" Announcement Date

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.

Flagship Intel Arc A770 GPU Showcased in Blender with Ray Tracing and Live Denoising

Intel Arc Alchemist graphics cards span both gamer and creator/professional user market sector, where we witnessed Intel announce gamer and pro-vis GPU SKUs. Today, we are seeing the usage of the flagship Arc Alchemist SKU called A770 in Blender rendering with ray tracing enabled. The GPU is designed to have a DG2-512 GPU with 512 EUs, 4096 Shading Units, 16 GB of GDDR6 memory, and 32 Xe cores for ray tracing, be a powerhouse for games, and handle some professional software as well. At SIGGRAPH 2022, Bob Duffy, Intel's Director of Graphics Community Engagement, showcased a system with Arc A770 GPU running Blender Cycles with ray tracing and denoising.

While we don't have any comparable data to showcase, the system managed to produce a decent rendering in Blender 3.3 LTS release, using Intel's oneAPI. The demo scene had 4,369,466 vertices, 8,702,031 edges, 4,349,606 faces, and 8,682,950 triangles, backed by ray tracing and live denoising. We are yet to see more detailed benchmarks and how the GPU fares against the competition.

AAEON Announces the EPIC-TGH7 4-inch SBC

AAEON, a global leader in industrial computing, has introduced the world to the next generation of single board computer with the release of the EPIC-TGH7, which holds the distinction of being the first board of its kind to host Intel 11th Generation Xeon /Core processors. With such an advanced processor package, the EPIC-TGH7 offers 8 cores and 16 threads to increase processing speed and power for intensive, high-end computing. However, this advancement has not sacrificed power-efficiency, with the EPIC-TGH7 providing up to 45 W with Xeon -level performance.

Hosting up to 8 USB ports, dual LAN ports, and a PCIe[x8] slot; the EPIC-TGH7 enables PCIe 4.0 speeds of up to 16GT/s, despite retaining the same EPIC board form factor measuring just 4.53" x 6.50" (115 mm x 165 mm). AAEON believes this combination of I/O density and high-speed expansion will be particularly applicable to healthcare imaging and military defense applications, with the board being able to accommodate the advanced graphics required for such uses.

Intel Xe iGPUs and Arc Graphics Lack DirectX 9 Support, Rely on API Translation to Play Older Games

So you thought your Arc A380 graphics card, or the Gen12 Xe iGPU in your 12th Gen Core processors were good enough to munch through your older games from the 2000s and early 2010s? Not so fast. Intel Graphics states that the Xe-LP and Xe-HPG graphics architectures, which power the Gen12 Iris Xe iGPUs and the new Arc "Alchemist" graphics cards, lack native support for the DirectX 9 graphics API. The two rely on API translation such as Microsoft D3D9On12, which attempts to translate D3D9 API commands to D3D12, which the drivers can recognize.

Older graphics architectures such as the Gen11 powering "Ice Lake," and Gen9.5 found in all "Skylake" derivatives, feature native support for DirectX 9, however when paired with Arc "Alchemist" graphics cards, the drivers are designed to engage D3D9On12 to accommodate the discrete GPU, unless the dGPU is disabled. API translation can be unreliable and buggy, and Intel points you to Microsoft and the game developers for support, Intel Graphics won't be providing any.

Intel Asks Xe-HPG Scavenger Hunt Winners to Accept a CPU In Lieu of Graphics Card

Remember that Xe-HPG Scavenger Hunt that Intel hosted last year? If you somehow missed it, Intel was maybe giving away some Arc graphics cards to 300 lucky winners. There were two different tiers of prizes, grand prize and first prize, which later ended up translating to an Arc A770 and an Arc A750 graphics card respectively. Now news via VideoCardz are suggesting that Intel is trying to get out of giving these 300 people their prize, well, at least the promised graphics card, in exchange for an Alder Lake CPU.

Intel has apparently sent out an email to the winners, asking them to accept an Intel Core i7-12700K if they were a grand prize winner or a Core i5-12600K if they were a first prize winner, instead of the promised graphics card. The winners have until Friday the 19th of August to decide if they want a CPU instead of a GPU, although Intel is apparently still allowing them to wait for a GPU, the company just doesn't say how long the wait will be. As the prize has to have a similar retail price, it's also possible to get a ballpark figure of the MSRP of Intel's supposedly upcoming Arc 700-series graphics cards. The Arc A770 should end up at around the $410 mark and the A750 around the $290 mark, as this is the ballpark MSRP for the CPU's that are being offered. It would be interesting to know how many people would be willing to do the trade, but sadly we're unlikely to ever find out.

Intel GPU Business in a $3.5 Billion Hole, Jon Peddie Recommends Sell or Kill

Jon Peddie Research (JPR) provides some of the most authoritative and informative market-research into the PC graphics hardware industry. The firm just published a scathing editorial on the future of Intel AXG (Accelerated Computing Systems and Graphics), the business tasked with development of competitive discrete GPU and HPC compute accelerators for Intel. Founded to much fanfare in 2016 and led by Raja Koduri since 2016; AXG has been in the news for the development of the Xe graphics and compute architecture, particularly with the Xe-HP "Ponte Vecchio" HPC accelerator; and the Arc brand of consumer discrete graphics solutions. JPR reports that Intel has invested several billions of Dollars into AXG, to little avail, with none of its product lines bringing in notable revenues for the company. Xe-LP based iGPUs do not count as they're integrated with client processors, and their revenues are clubbed with CCG (Client Computing Group).

Intel started reporting revenues from the AXG business since Q1-2021, around which time it started selling its first discrete GPUs as the Intel DG1 Xe MAX, based on the same Xe-LP architecture powering its iGPUs. The company's Xe-HPG architecture, designed for high-performance gaming, was marketed as its first definitive answer to NVIDIA GeForce and AMD Radeon. Since Q1-2021, Intel has lost $2.1 billion to AXG, with not much to show for. The JPR article suggests that Intel missed the bus both with its time-to-market and scale.

Intel Introduces First Protections Against Certain Physical Threats

Intel improves software reliability by building silicon enhancements realized through logic inside the processor. Today, the company described a new technique to complement existing software mitigations for fault injection attacks. Tunable Replica Circuit (TRC) - Fault Injection Protection uses hardware-based sensors to explicitly detect circuit-based timing failures that occur as the result of an attack. TRC is first delivered in the 12th Gen Intel Core processor family. It adds fault injection detection technology to the Intel Converged Security and Management Engine (Intel CSME), where it is designed to detect non-invasive physical glitch attacks on the pins supplying clock and voltage. TRC is also designed to detect electromagnetic fault injections.

"Software protections have hardened with virtualization, stack canaries and code authentication before execution," said Daniel Nemiroff, senior principal engineer at Intel. "This has driven malicious actors to turn their attention to physically attacking computing platforms. A favorite tool of these attackers is fault injection attacks via glitching voltage, clock pins and electromagnetic radiation that cause circuit timing faults and may allow execution of malicious instructions and potential exfiltration of secrets."

LattePanda Team and Global Partners Jointly Launch LattePanda 3 Delta - the Fast and Pocket-sized Single-board Computer

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

ÆPIC Leak is an Architectural CPU Bug Affecting 10th, 11th, and 12th Gen Intel Core Processors

The x86 CPU family has been vulnerable to many attacks in recent years. With the arrival of Spectre and Meltdown, we have seen side-channel attacks overtake both AMD and Intel designs. However, today we find out that researchers are capable of exploiting Intel's latest 10th, 11th, and 12th generation Core processors with a new CPU bug called ÆPIC Leak. Named after Advanced Programmable Interrupt Controller (APIC) that handles interrupt requests to regulate multiprocessing, the leak is claimeing to be the first "CPU bug able to architecturally disclose sensitive data." Researchers Pietro Borrello (Sapienza University of Rome), Andreas Kogler (Graz Institute of Technology), Martin Schwarzl (Graz), Moritz Lipp (Amazon Web Services), Daniel Gruss (Graz University of Technology), and Michael Schwarz (CISPA Helmholtz Center for Information Security) discovered this flaw in Intel processors.
ÆPIC Leak is the first CPU bug able to architecturally disclose sensitive data. It leverages a vulnerability in recent Intel CPUs to leak secrets from the processor itself: on most 10th, 11th and 12th generation Intel CPUs the APIC MMIO undefined range incorrectly returns stale data from the cache hierarchy. In contrast to transient execution attacks like Meltdown and Spectre, ÆPIC Leak is an architectural bug: the sensitive data gets directly disclosed without relying on any (noisy) side channel. ÆPIC Leak is like an uninitialized memory read in the CPU itself.

A privileged attacker (Administrator or root) is required to access APIC MMIO. Thus, most systems are safe from ÆPIC Leak. However, systems relying on SGX to protect data from privileged attackers would be at risk, thus, have to be patched.

Intel Teams Up with Aible to Fast-Track Enterprise Analytics and AI

Intel's collaboration with Aible enables teams across key industries to leverage artificial intelligence and deliver rapid and measurable business impact. This deep collaboration, which includes engineering optimizations and an innovative benchmarking program, enhances Aible's ability to deliver rapid results to its enterprise customers. When paired with Intel processors, Aible's technology provides a serverless-first approach, allowing developers to build and run applications without having to manage servers, and build modern applications with increased agility and lower total cost of ownership (TCO).

"Today's enterprise IT infrastructure leaders face significant challenges building a foundation that is designed to help business teams drive value from AI initiatives in the data center. We've moved past talking about the potential of AI, as business teams across key industries are experiencing measurable business impact within days, using Intel Xeon Scalable processors with built-in Intel software optimizations with Aible," said Kavitha Prasad, Intel vice president and general manager of Datacenter, AI and Cloud Execution and Strategy.

Intel Unveils Arc Pro Graphics Cards for Workstations and Professional Software

Intel has today unveiled another addition to its discrete Arc Alchemist graphics card lineup, with a slight preference to the professional consumer market. Intel has prepared three models for creators and entry pro-vis solutions, called Intel Arc Pro graphics cards. All GPUs are AV1 accelerated, have ray tracing support, and are designed to handle AI acceleration inside applications like Adobe Premiere Pro. At the start, we have a small A30M mobile GPU aimed at laptop designs. It has a 3.5 TeraFLOP FP32 capability inside a configurable 35-50 Watt TDP envelope, has eight ray tracing cores, and 4 GB of GDDR6 memory. Its display output connectors depend on OEM's laptop design.

Next, we have the Arc A40 Pro discrete single-slot GPU. Having 3.5 TeraFLOPs of FP32 single-precision performance, it has eight ray tracing cores and 6 GB of GDDR6 memory. The listed maximum TDP for this model is 50 Watts. It has four mini-DP ports for video output, and it can drive two monitors at 8K 60 Hz, one at 5K 240 Hz, two at 5K 120 Hz, or four at 4K 60 Hz refresh rate. Its bigger brother, the Arc A50 Pro, is a dual-slot design with 4.8 TeraFLOPs of single-precision FP32 computing, has eight ray tracing cores, and 6 GB of GDDR6 memory as well. It has the same video output capability as the Arc A40 Pro, with a beefier cooling setup to handle the 75 Watt TDP. All software developed using the OneAPI toolkit can be accelerated using these GPUs. Intel is working with the industry to adapt professional software for Arc Pro graphics.

Intel "Raptor Lake" i9-13900K Sees 14% Performance Boost with Power-Limit Unlocks

The upcoming 13th Gen Core i9-13900K "Raptor Lake" 8P+16E core processor offers a significant multi-threaded performance increase with its power-limits relaxed, according to Cinebench R23 testing unearthed by OneRaichu. In its default settings, with stock power limits, the i9-13900K draws up to 254 W of package power, where it scores 35693 points. With the power limits unlocked in the motherboard's UEFI setup program (i.e. PL1/PL2 set at an impossible 4096 W), the processor's package power peaks at 345 W (a 36% increase in peak power-draw), but results in a multi-threaded score of 40616 points, or a 13.8% performance gain.
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