Hewlett Packard Enterprise (NYSE: HPE) today announced its ongoing commitment in Europe by building its first factory in the region for next-generation high performance computing (HPC) and artificial intelligence (AI) systems to accelerate delivery to customers and strengthen the region's supplier ecosystem. The new site will manufacture HPE's industry-leading systems as custom-designed solutions to advance scientific research, mature AL/ML initiatives, and bolster innovation.

The dedicated HPC factory, which will become the fourth of HPE's global HPC sites, will be located in Kutná Hora, Czech Republic, next to HPE's existing European site for manufacturing its industry-standard servers and storage solutions. Operations will begin in summer 2022.

Acer today launched new Chromebooks designed for businesses, consumers and families that provide the latest performance updates and durable MIL-STD 810H designs. Extra features help Acer Chrome OS customers get the most from their device for functions like remote working, entertainment, as well as staying productive on-the-go.

"Acer continues to lead the industry in premium Chromebooks that are highly-capable, feature-rich and deliver the exact Chromebook experience our customers want," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "As new generations rely on their Chromebook to do more in their connected world - whether it's for work or personal projects - Acer's innovation will be the foundation of their productive and enjoyable experience."

Acer today announced its refreshed range of TravelMate business laptops for SMB (Small- and Medium- Sized Businesses) and hybrid workers, offering them a wider choice of mobility and performance. Each of the durable Acer TravelMate P4, TravelMate Spin P4 and TravelMate P2 laptops offer workers at the office, home or on the move a highly refined experience with larger touchpads and quieter key presses with a comfortable 1.55 mm travel distance. These durable laptops are designed to deliver powerful performance throughout the work day, enhanced security, advanced connectivity and military-grade durability. They are engineered to handle real life situations such as being bumped through an airport security checkpoint or accidentally dropped, and meet MIL-STD 810H specifications, meaning they can withstand drops, humidity and water spills.

The Acer TravelMate P2, TravelMate P4, and TravelMate Spin P4 laptops provide business-grade security and productivity. These Microsoft Secured-core PCs deliver advanced security down to the firmware level. A SecureBio fingerprint reader and IR camera with a privacy shutter support Windows Hello for secure logins. All models offer advanced connectivity with Wi-Fi 6 to ensure a smoother wireless experience, and optional LTE support so business travelers can enjoy immediate connectivity to local networks.

Acer today announced new models in its professional line of ConceptD creator PCs. The ConceptD 5 laptop, ConceptD 500 mini workstation and ConceptD 100 small form factor desktop now include the latest 12th Gen Intel Core processors and NVIDIA GPUs, while the ConceptD 5 laptop now offers a 16-inch OLED display option. ConceptD PCs are designed and optimized for graphic designers, filmmakers, engineers, architects, developers and other creators. They feature top-of-the-line technology housed in a timeless design aesthetic.

The powerful ConceptD 5 and ConceptD 5 Pro creator laptops for mobile professionals are ideal for those who need the ability to create or edit work on the go. Less than an inch in height, their sophisticated and durable metal design makes them easy to take on the road. Designed to handle large, complex CAD modeling and advanced digital content creation, they smoothly render up to 6K-resolution videos, effortlessly process 3D animations, and deliver the best encoding and image quality for livestreaming.

Acer today introduced a suite of powerful new laptops across its popular Swift and Spin notebook ranges, all featuring 12th Gen Intel Core processors and Windows 11. The Swift 3 OLED combines a beautiful display with powerful performance for professionals on-the-go, while the Spin 5 and Spin 3 are designed for professionals who need a portable laptop with multi-mode functionality.

The new Acer Swift 3 OLED laptop (SF314-71) is powered by the latest 12th Gen Intel Core H-series processors with Intel Iris Xe graphics, PCIe Gen 4 SSDs and up to 16 GB of LPDDR5 memory, offering professionals, freelancers and students powerful performance for creation-focused work and gaming. The laptop has also been Intel Evo verified as meeting key experience targets such as instant wake from sleep and offering 10 hours of real-world battery life. In a pinch, a 30-minute charge yields over 4 hours of battery life. Light, modern and thin, the Swift 3 OLED features a 14-inch 16:10 WQXGA+ (2.8k) OLED display with a 92% screen-to-body ratio, which is VESA DisplayHDR True Black 500-certified. The display provides true-to-life images supporting 100% of the DCI-P3 color gamut. The laptop has a 17.9 mm-thin aluminium metal chassis, weighs just 1.4 kg, and features an OceanGlass touchpad made from ocean-bound plastic waste that provides users with a sleek glass-like tactile feeling when scrolling.

The ambitious performance enhancement by Intel Graphics rivaling NVIDIA DLSS and AMD FSR, the Intel XeSS (Xe Super Sampling,) will debut on May 20, 2022, with a patch for "Dolmen," developer Massive Work Studio announced. This matches our report from March 2022 that referenced an "early Summer" debut. This would mean Intel Graphics has a driver release planned very soon, for its Xe LP-based iGPUs and Iris Xe MAX discrete GPU; as well as the first round of Arc 3 "Alchemist" mobile graphics, which will launch with XeSS support.

Much like FSR and DLSS, XeSS works with a supported game to render raster 3D scenes at a lower resolution than the display resolution, and upscales them using a sophisticated algorithm that minimizes image quality loss, with a net gain in frame-rates. XeSS will play a particularly big role in Intel's plans to grab a slice of the gaming graphics market with its Arc "Alchemist" discrete GPUs. XeSS appears to work similar to AMD FSR 2.0, with its upscaler using motion-vectors and temporal data from the game engine to reconstruct details in the outbound frames. Also, much like FSR, XeSS will be open to GPUs from other brands.Update May 17th: The Dolmen Twitter handle just put out an update that XeSS support is coming "this Summer," implying that it will not release on May 20 as earlier reported.

AMD has been on a roll ever since it launched its first generation Zen core, which brought a much-needed performance and efficiency boost that finally brought a level of competitiveness against Intel's offerings. Years of iterations and design improvements have only increased AMD's value proposition towards consumers and businesses. A testament to that fact is that AMD in Q1 2022 hit its largest market share in history.

According to market analysis firm Mercury Research, AMD's offerings have continued to claw back market share from Intel, despite its strong recovery in performance and efficiency metrics following the debut of the 12th Gen Intel CPU family, Alder Lake. The firm places AMD's overall x86 market share for 1Q 2022 (including IoT and SoCs such as the ones found in the latest gaming consoles) at a record-breaking 27.7%, up 2.1% QoQ and a staggering 7% YoY. The server side of the equation has seen less stellar gains, but still increased by 0.9% QoQ, and 2.7% YoY, achieving a high of 11.6% share against Intel's decades-long market stranglehold.

One of the electric vehicle driving forces in the car market, Tesla, has today announced that the company would have to issue a soft recall of a few select car models over an issue with overheating. The affected vehicles are Tesla Model 3 2022, Tesla Model S 2021-2022, Tesla Model X 2021-2022, and Tesla Model Y 2022. Tesla's infotainment system is powered by AMD Ryzen APUs, replacing the Intel Atom CPUs found in the previous models. With Ryzen APUs overheating, the infotainment system can lag or restart and sometimes cause it to get completely turned off. The problem is that the car's liquid cooling will prioritize cooling the batteries instead of the processor, causing it to overheat. Tesla issued a soft recall on these models, meaning that a regular firmware update will fix this issue.

TeslaTesla, Inc. (Tesla) is recalling certain 2021-2022 Model S, Model X, and 2022 Model 3 and Model Y vehicles operating certain firmware releases. The infotainment central processing unit (CPU) may overheat during the preparation or process of fast-charging, causing the CPU to lag or restart. A lagging or restarting CPU may prevent the center screen from displaying the rearview camera image, gear selection, windshield visibility control settings, and warning lights, increasing the risk of a crash. Tesla will perform an over-the-air (OTA) software update that will improve CPU temperature management, free of charge. Owner notification letters are expected to be mailed July 1, 2022. Owners may contact Tesla customer service at 1-877-798-3752. Tesla's number for this recall is SB-22-00-009.

Le Comptoir du Hardware scored a die-shot of a 2P+8E core variant of the "Meteor Lake" compute tile, and Locuza annotated it. "Meteor Lake" will be Intel's first processor to implement the company's IDM 2.0 strategy to the fullest. The processor is a multi-chip module of various tiles (chiplets), each with a certain function, sitting on die made on a silicon fabrication node most suitable to that function. Under this strategy, for example, if Intel's chip-designers calculate that the iGPU will be the most power-hungry component on the processor, followed by the CPU cores, the graphics tile will be built on a more advanced process than the compute tile. Intel's "Meteor Lake" and "Arrow Lake" processors will implement chiplets built on the Intel 4, TSMC N3, and Intel 20A fabrication nodes, each with unique power and transistor-density characteristics. Learn more about the "Meteor Lake" MCM in our older article.

The 2P+8E (2 performance cores + 8 efficiency cores) compute tile is one among many variants of compute tiles Intel will develop for the various SKUs making up the next-generation Core mobile processor series. The die is annotated with the two large "Redwood Cove" P-cores and their cache slices taking up about 35% of the die area; and the two "Crestmount" E-core clusters (each with 4 E-cores), and their cache slices, taking up the rest. The two P-cores and two E-core clusters are interconnected by a Ring Bus, and share an L3 cache. The size of each L3 cache slice is either 2.5 MB or 3 MB. At 2.5 MB, the total L3 cache will be 10 MB, and at 3 MB, it will be 12 MB. As with all past generations, the L3 cache is fully accessible by all CPU cores in the compute tile.

Intel has allowed the media to get a closer look at the next generation of silicon that will power millions of systems in years to come during its private Vision event. PC Watch, a Japanese tech media, managed to get some shots of the upcoming Meteor Lake, Sapphire Rapids, and Ponte Vecchio processors. Starting with Meteor Lake, Intel has displayed two packages for this processor family. The first one is the ultra-compact, high-density UP9 package used for highly compact mobile systems, and it is made out of silicon with minimal packaging to save space. The second one is a traditional design with more oversized packaging, designed for typical laptop/notebook configurations.

Today at the Intel Vision conference, Habana Labs, an Intel company, announced its second-generation deep learning processors, the Habana Gaudi 2 Training and Habana Greco Inference processors. The processors are purpose-built for AI deep learning applications, implemented in 7nm technology and build upon Habana's high-efficiency architecture to provide customers with higher-performance model training and inferencing for computer vision and natural language applications in the data center. At Intel Vision, Habana Labs revealed Gaudi2's training throughput performance for the ResNet-50 computer vision model and the BERT natural language processing model delivers twice the training throughput over the Nvidia A100-80GB GPU.

"The launch of Habana's new deep learning processors is a prime example of Intel executing on its AI strategy to give customers a wide array of solution choices - from cloud to edge - addressing the growing number and complex nature of AI workloads. Gaudi2 can help Intel customers train increasingly large and complex deep learning workloads with speed and efficiency, and we're anticipating the inference efficiencies that Greco will bring."—Sandra Rivera, Intel executive vice president and general manager of the Datacenter and AI Group

Lenovo announced today its latest generation of stylish and savage gaming laptops: the Lenovo Legion 7i and 7 (16", 7) portable powerhouses, and the thin and light Lenovo Legion Slim 7 and 7i (16", 7) laptops. Sitting at the apex of gaming performance, the new Lenovo Legion 7i and 7 are now the world's most powerful 16-inch gaming laptops. And joining the 16-inch QHD gaming category are Lenovo Legion's thinnest and lightest gaming laptops yet - the new Lenovo Legion Slim 7i and 7 - now available in a taller 16:10 display for when productivity meets play. The new Lenovo Legion 7 series laptops exceed expectations with a number of innovation firsts that adapt to and balance the multi-dimensional needs of modern gamers and professional players. These new devices not only have the world's largest battery capacity on a 16-inch gaming laptop, they also reign as the world's first 16-inch gaming laptops with FHD webcams for better streaming, and as the first 16-inch WQXGA (2560×1600) gaming laptops. The Windows 11 laptops' minimalist design, long battery life, and whisper-quiet artificial intelligence (A.I.) tuned thermals are purpose-built for those who want performance and mobility.

"Lenovo Legion has always occupied a place at the pinnacle of gaming performance, complementing gamers' personal and professional lives to adapt to wherever they go, whether it's a tournament stadium, classroom, or boardroom," said Ouyang Jun, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "More stylish and savage than ever before, Lenovo's new Legion 7 series laptops are leveling up to push the limits of smarter, high-performance gaming."

GIGABYTE today launched AORUS 17X gaming laptop, the brand-new flagship model that combines breakthrough performance with enhanced portability. The AORUS 17X is powered by the latest Intel 12th generation Core i9 HX processor that offers up to 16 cores. Pairing with the NVIDIA GeForce RTX 30 series graphics card, the powerful combo in the AORUS 17X can deliver a significant performance gain up to 32% over its predecessor, allowing enthusiasts to enjoy desktop-class gaming performance on the go. High-performance cores demand superior cooling. The latest generation of AORUS 17X adopts the exclusive WINDFORCE Infinity cooling system. It features a pair of highly efficient fans, 6 heat pipes, and multiple cooling fins that can efficiently remove heat produced by the CPU and the GPU, keeping the laptop cool while maintaining maximum performance throughout the workload.

Different from the conventional thin-bezel displays that are generally limited to the sides, the new AORUS 17X, as well as the AORUS 17, are the world's first four-sided super-thin bezel gaming laptops with the bent-type technology. Thanks to the innovation, the AORUS 17X screen's bottom border is trimmed by 30%, making the overall screen-to-body ratio reach 90%. The bent-type panel also makes it possible for the AORUS 17X to pack a big 17" screen in a nearly 15" tall chassis, greatly increasing its portability. The AORUS 17X is also engineered for fast-paced gaming, delivers ultra-high refresh rate of up to 360 Hz, which is six times faster than conventional laptops. The beastly AORUS 17X gaming laptop reshapes the game by bringing unmatched power and gaming visuals to a more compact form factor, making it a powerhouse laptop for heavy-duty gaming on the go. For more information on AORUS 17X and other AORUS series gaming laptops, check out the AORUS official website.

Intel today debuted the 12th Gen Core HX "Alder Lake" processors for high-end gaming notebooks and mobile workstations. These processors are designed to bring desktop-class performance to the mobile segment, and debut the "Alder Lake" C0 silicon in a mobile package. Until now, the fastest Core "Alder Lake" mobile processor was based on a silicon that physically had 6 performance cores (P-cores), and 8 efficiency cores (E-cores). The HX-series sees the desktop C0 silicon, with its 8 P-cores and 8 E-cores, and 30 MB of L3 cache, in the mobile form factor.

This also brings PCI-Express 5.0 x16 PEG connectivity for discrete graphics cards, 8-lane DMI 4.0 chipset bus, and a mobile variant of the Z690 chipset, which can put out two M.2 NVMe Gen 4 slots in addition to the one from the processor die. The additional PCIe budget should allow up to two discrete Thunderbolt 4 controllers. Memory support includes dual-channel (4 sub-channel) DDR5-4800, dual-channel DDR4-3200, and LPDDR4-4267. Certain models even have ECC memory support, targeted at mobile workstations. Intel is using the highest bins of the C0 die, coupled with some aggressive power-management, to achieve processor base power (PBP) of 55 W (10 W lower than the 65 W PBP of the desktop Core i9-12900). The maximum turbo power value for all SKUs is set at 154 W. All processor models in the Core HX series will come with memory overclocking support, some even with CPU overclocking support.

Super Micro Computer, Inc. (Nasdaq: SMCI), a global leader in enterprise computing, storage, networking, and green computing technology, supports two new Intel-based accelerators for demanding cloud gaming, media delivery, AI and ML workloads, enabling customers to deploy the latest acceleration technology from Intel and Intel Habana. "Supermicro continues to work closely with Intel and Habana Labs to deliver a range of server solutions supporting Arctic Sound-M and Gaudi 2 that address the demanding needs of organizations that require highly efficient media delivery and AI training," said Charles Liang, president and CEO. "We continue to collaborate with leading technology suppliers to deliver application-optimized total system solutions for complex workloads while also increasing system performance."

Supermicro can quickly bring to market new technologies by using a Building Block Solutions approach to designing new systems. This methodology allows new GPUs and acceleration technology to be easily placed into existing designs or, when necessary, quickly adapt an existing design when needed for higher-performing components. "Supermicro helps deliver advanced AI and media processing with systems that leverage our latest Gaudi 2 and Arctic Sound-M accelerators," stated Sandra Rivera, executive vice president and general manager of the Datacenter and AI Group at Intel. "Supermicro's Gaudi AI Training Server will accelerate deep learning training in some of the fastest growing workloads in the datacenter."

On Tuesday and Wednesday next week, Intel will host its Intel Vision event which will take a look at what the company will bring in the near future. Although not specified in the program, VideoCardz have managed to secure a slide listing no less than seven new Alder Lake-HX mobile CPUs that Intel are expected to reveal during the event. The new chips will be fully loaded out with eight performance and eight efficient cores and with a total of 24 threads at the top-end, i.e. the same as Intel's current desktop parts. In fact, according to VideoCardz, these CPUs are the same physical size as the desktop CPUs, just in a different packaging that reduces the Z-height.

Alder Lake-HX comes with a base power TDP of 55 W and is said to be a new enthusiast CPU range from Intel in the mobile space. As such, overclocking is said to be allowed, which can push the turbo TDP to at least 157 W and this applies to all the CPUs in the Alder Lake-HX family. The platform is also said to feature a full set of PCIe lanes, which means 16 PCIe 5.0 lanes, 20 PCIe 4.0 lanes and 12 PCIe 3.0 lanes. DDR5 memory with XMP 3.0 profiles is also supported, alongside something called Dynamic Memory Boost. Oddly enough, Intel has even made several vPro SKU's that support overclocking, albeit with some kind of limit compared to the non vPro SKUs. It'll be interesting to see what kind of notebooks these CPUs will be going into and what kind of cooling systems will be required, but it's pretty obvious we're talking desktop replacement machines.

Intel has announced that it has bought 11 year old, veteran Finnish graphics IP developer Siru Innovations. You'd be forgiven if you've never heard about the company, but it has pedigree harking back to the late 1980's and early 1990's, as at least one of its founders was part of the legendary demogroup Future Crew that made some of the most impressive graphics and audio demo software during the BBS era. All three founders were at Bitboys when it was founded in the 1990's and if you haven't heard about Bitboys, you might simply not be old enough. The company was hyped for its Glaze3D graphics architecture that never actually launched, due to the fact that Infineon stopped manufacturing a very specific type of embedded memory that the GPUs were based on.

Bitboys was later acquired by ATI, who in turn of course was taken over by AMD. However, the story doesn't end here, as AMD sold the Imageon business unit to Qualcomm in 2009 and the three founders of Siru moved to Qualcomm for a couple of years, before starting Siru. Since the Intel announcement, the Siru website has been taken down, but the company was working on developing mobile graphics IP, as well as helping other companies develop their own graphics related IP, drivers and so on. As to what Intel is planning on doing with the Siru team isn't entirely clear, but Balaji Kanigicherla, Intel's VP and General Manager, AXG Custom Compute Group Innovating Custom Silicon & Platform Solutions in Blockchain, High Performance Edge Compute and Cloud Computing, Supercomputer, posted on LinkedIn saying that Siru will be joining the AXG Group. You can read the full post below.

International semiconductor consortium or ISMC is a new joint venture between Abu Dhabi-based Next Orbit Ventures and Israeli Tower Semiconductor that is getting ready to invest big. The consortium is said to be looking at investing no less than US$3 billion in a chip foundry based in Karnataka, India. Maybe the most interesting part here is that Tower Semiconductor is set to be acquired by Intel, assuming the deal passes all regulatory reviews. This means that Intel could be replacing Tower Semiconductor in the consortium before the new fab has been finished.

Not much information is available about ISMC, but the planned chip plant would be one of the first foundries in India, as well as the largest foundry in the nation. So far ISMC has only signed a memorandum of Understanding with the government of Karnataka, so things could still change. However, the US$10 billion incentive by the central Indian government might be part of the reason behind the decision. Tower Semiconductor specialises in various speciality process technologies, such as SiGe, BiCMOS and SOI and manufacturer mixed-signal and RFCMOS chips, as well as CMOS based image sensors, power management chips and various types of non-volatile memory and some MEMS products for its customers. The new fab is expected to bring 1,500 direct and some 10,000 indirect jobs to the region.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new enterprise-grade rackmount NAS model, the TS-h1886XU-RP R2 NAS which runs on QuTS hero, a ZFS-based file system. Powered by Intel Xeon D-1622 processor and 32 GB DDR4 Error Correcting Code (ECC) memory, the TS-h1886XU-RP R2 delivers reliable server-grade performance to help enterprises tackle modern business IT challenges, including high-speed centralized file storage, virtualization, backup, disaster recovery, and cloud storage gateways.

"The TS-h1886XU-RP R2 provides enterprises with a high-performance cost-effective 10GbE NAS. Compared to its predecessor, it has four 2.5GbE ports, making file transfer and information sharing more efficient. The TS-h1886XU-RP R2 is fully equipped to support virtualization applications, remote backup and disaster recovery, cloud storage gateways, and security management to maximize the efficiency and value of enterprise IT," said Jerry Deng, product manager of QNAP.

Razer, the world's leading lifestyle brand for gamers, announces a brand-new model of the Razer Blade 15 featuring an OLED QHD 240 Hz display will soon be available for purchase. This never-before-seen panel brings brighter, more vivid colors to life at e-sports-level speeds like no other laptop today. Paired with a 12th gen Intel ️ Core i9-12900H processor and an NVIDIA ️ RTX 3070 Ti laptop graphics card, the new Blade 15 stakes ground as an easy choice for both gamers and creators alike.

Both games and video content move swiftly thanks to the panel's ultrafast 1 ms response time, freeing users from the decision of color-accuracy or speed. The unique new OLED display will reach a typical 400 nits brightness and include up to 100% DCI-P3 colors for a crisp, clean picture perfect for a variety of functions, including photo and video editing, watching movies or playing AAA gaming titles.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today introduces their brand new B660M-SILVER motherboard. Top shelf performance packed in a compact uATX form-factor, BIOSTAR's new B660M-SILVER motherboard is ready to take the market by storm. Designed based on Intel's B660 chipset, the B660M- SILVER carries unparalleled compatibility with all the latest Intel 12th gen processors.

Highly suitable for content creators, casual gamers, or as a solid base for a daily driver pc, the new B660M-SILVER motherboard is a jack of all trades, built to cater to a broad use spectrum. Carrying BIOSTAR's signature SILVER range styling and added RGB customizability, the B660M-SILVER motherboard makes any build look special.

In an interview with CNBC's TechCheck, Intel CEO Pat Gelsinger said he expected the chip shortage to continue to drag on, at least until 2024. Unfortunately he didn't go into too much detail as to why, beyond there being an equipment shortage, which in turn will slow down the speed at which new fabs can be put online. In other words, Intel is pointing fingers at ASML and other companies that manufacture the various types of equipment that is needed to manufacture semiconductors.

Intel is the first company to have publicly said that the semiconductor shortage will continue longer than initially expected, where most companies expected things to ease off towards the end of this year, or at least sometime in 2023. The shortage isn't likely to affect Intel when it comes to products the company manufactures in-house, but if the shortage continues into the foreseeable future, it might have a bigger knock-on effect when it comes to the wide ecosystem that Intel is reliant on, such as motherboards. The other concern is obviously Intel's products that are being manufactured by TSMC, where the company is likely to see increased competition when it comes to getting access to enough capacity at certain production nodes.

Ayar Labs, the leader in chip-to-chip optical connectivity, today announced that the company has secured $130 million in additional financing led by Boardman Bay Capital Management to drive the commercialization of its breakthrough optical I/O solution. Hewlett Packard Enterprise (HPE) and NVIDIA entered this investment round, joining existing strategic investors Applied Ventures LLC, GlobalFoundries, Intel Capital, and Lockheed Martin Ventures. Other new strategic and financial investors participating in the round include Agave SPV, Atreides Capital, Berkeley Frontier Fund, IAG Capital Partners, Infinitum Capital, Nautilus Venture Partners, and Tyche Partners. They join existing investors such as BlueSky Capital, Founders Fund, Playground Global, and TechU Venture Partners.

"As a successful technology-focused crossover fund operating for over a decade, Ayar Labs represents our largest private investment to date," said Will Graves, Chief Investment Officer at Boardman Bay Capital Management. "We believe that silicon photonics-based optical interconnects in the data center and telecommunications markets represent a massive new opportunity and that Ayar Labs is the leader in this emerging space with proven technology, a fantastic team, and the right ecosystem partners and strategy."

At the end of 2021, there was quite a lot of noise when it came to India's homegrown semiconductor fab initiative, where the nation was trying to win over Intel, as well as some other semiconductor manufacturers. It would appear that the Indian government has stepped up its efforts and is now actively pitching to Intel, GlobalFoundries and TSMC. The main person behind this is said to be Rajeev Chandrasekhar, the minister of state for technology and entrepreneurship and a former Intel engineer. So far it seems like Chandrasekhar hasn't gotten very far according to the article The Economic Times, where he states that "We're meeting the CEOs, talking to them, making presentations."

On the other hand, recent news has suggested that Foxconn is interested in setting up some kind of foundry in India, in a partnership with local Vedanta Group. It's unclear what kind of semiconductors this would be for though, especially as Vedanta is mostly in the mining industry. The various Indian states are said to be very keen on the other hand, both in terms of getting new industry, but also in getting new investments. Earlier this month, during his tour of several Asian countries, Intel's CEO, Pat Gelsinger had a meeting with the Indian Prime Minister, Narendra Modi, but what came of that meeting is unclear. India is hoping to be able to reproduce the success it has had when it comes to manufacturing smartphones locally, with Samsung, Nokia and Xiaomi producing locally, as well as Taiwanese Foxconn, Wistron and Pegatron, who contract manufacture Apple devices. However, semiconductors are far more complex to make than smartphones, so if India isn't willing to play the long game, it's unlikely much will come of its attempts to attract semiconductor foundries.

V-Color, a leading memory provider, announces the launch of Manta XPrism RGB DDR5 gaming series, with speeds of DDR5-5600 CL36-36-36-76 1.2 V to 6400 MHz CL32-39-39-102 1.4v. Available in dual channel kits of 32 GB (2x 16 GB) using carefully sorted Hynix ICs for superior overclocking performance, the Manta XPrism RGB DDR5 is designed for the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboard and is XMP 3.0 ready for easy overclocking. To fully complete PC builds, v-color also offers patented SCC 2+2 KIT, available in black and white, for filling unused DIMM slots.

The Manta XPrism RGB comes in 32 GB (2x16GB) modules and offers high-speed performance ranging from 5600 MHz to 6400 MHz. The XPrism RGB is XMP 3.0 ready for optimal frequencies by simply applying profiles in the BIOS. Additionally, each Manta XPrism RGB goes through v-color's patented auto-screening process (Advanced O.C Smart Sorting System).