Technology and its impact on interactive entertainment experiences is nothing short of remarkable. AI and machine learning are allowing our creators to explore new ways to test games, build worlds, and create deeper, more immersive experiences at a faster rate without sacrificing quality. Our artists are empowered to create more realistic, dynamic animations and visuals at a greater scale, delivering more cinematic moments that draw us in and leave us stunned. Or completely immersed in the most enthralling environments possible, surrounded by and interacting with authentic, high-fidelity characters.

Above all, these advancements connect and offer millions of EA's players and fans around the globe new ways to play, create, watch, and connect in and beyond our games like never before. At the recently concluded Game Developers Conference (GDC), EA's brilliant minds showcased some of these technological innovations, highlighting how they empower our developers to craft extraordinary interactive entertainment experiences. Their talks provided insight into the cutting-edge tools and techniques driving the future of game development at EA, and the positive impact this will have on our developers, players and fans across the globe.

At Xbox, our goal is to empower as many people as possible to play the games they want, with the people they want, anywhere they want, in a way that works for them. This includes the more than 429 million players with some form of disability, who may rely on a variety of accessibility hardware - such as the recently launched Xbox Adaptive Joystick—and features to get the most from their gaming. For many players, it can be a challenge not having a common and consistent language to describe the accessibility features within different video games. To help solve this, Xbox introduced its Game Accessibility Feature Tags back in November 2021.

But we want to do more; at Game Developers Conference (GDC), Xbox proudly joined forces with Electronic Arts, Google, Nintendo of America, Ubisoft and other gaming companies to announce that it is a member of the new Accessible Games Initiative. This initiative, helmed by the Entertainment Software Association (ESA), strives to provide players with clear information about the accessibility features in video games through a set of "tags" that players can use to identify the features available in a specific game, before they make a purchase.

It's been nearly one month since the release of Monster Hunter Wilds on PC and modern consoles! Thank you to all hunters around the world for your incredible support. Whether you're a series veteran with many hunts under your belt, or started your hunting journey with Wilds, we hope you've been enjoying making your way through the game and putting in many hours of hunts in High Rank, long after the credits have rolled. Today, we're excited to share what's next for Monster Hunter Wilds by taking the wraps off of the game's first Free Title Update.

The graceful Leviathan Mizutsune makes its way to the Wilds
Equal parts dazzling and dangerous, Mizutsune moves almost as if it's dancing, and skillfully attacks foes with debilitating bubbles. Get your gear ready to take on this returning monster for the first time in Monster Hunter Wilds. Mizutsune also comes with stylish new armor sets to forge for your hunter and Palico. An eight-star Tempered Mizutsune will also appear. To start the Mizutsune hunt, talk to Kanya in the Scarlet Forest Base Camp at Hunter Rank (HR)21 or above.

Accessibility is a fundamental right for people with disabilities and makes technology easier for everyone. We see this reflected in how customers are using Microsoft technologies around the world. Copilot for Microsoft 365 is unlocking workplace productivity like never before, more than 10 million people use Edge each month to have the web Read Aloud, over 1 million people use Immersive Reader to make webpages easier to read and partners like Tobii Dynavox and Special Olympics are bringing AI to people with disabilities globally. And these are just some of the highlights of what we shared today! Here's a quick summary of the new accessibility products, features and programs announced at the 2025 Ability Summit.

What's new in 2025?
We announced that the Xbox Adaptive Joystick is now available for purchase exclusively at Microsoft Store. With more than 429 million players with disabilities worldwide, we know each player has unique needs and preferences for how they choose to play. The Xbox Adaptive Joystick is a singular, wired controller primarily designed to meet the needs of players with limited mobility. Its versatility helps players seamlessly incorporate it into their existing gaming setups. Built with the Gaming and Disability community who inform the development of Xbox products from the beginning. The joystick joins our family of adaptive accessories including the mouse, pen, adaptive kit and Xbox Adaptive Controller. For more details visit Xbox Support.

Assassin's Creed Shadows, launching on March 20, will continue the series' tradition of bringing players closer to history with a section of its database titled "Cultural Discovery." As part of the in-game Codex, this feature offers players carefully selected encyclopedic entries on the history, art, and culture of the Azuchi-Momoyama period. This cultural encyclopedia was written by historians and includes images from museums and institutions. Similar to the History of Baghdad feature in Assassin's Creed Mirage, Cultural Discovery will be integrated into the main game of Assassin's Creed Shadows, and is tied to player progression. Cultural Discovery contains almost two times as many entries as the History of Baghdad, with more than 125 entries at launch, and more to come.

As players visit sites that provide a historical and cultural exploration of 16th-century Japan, they will unlock articles on the economy, castles, military affairs, daily life, historical figures, and events. One notable cultural codex entry, shown above, features an exclusive replica of a Kabuto, or Japanese war helmet, that symbolizes the first contact between Japan and Spain. The original Kabuto is part of one of the oldest collections of Japanese armor in Europe, and is kept at the Royal Armory in Madrid. This Kabuto had been almost entirely damaged during the fire suffered by the Royal Armory on July 10, 1884. Ubisoft, Patrimonio Nacional, and Spanish company Factum Arte joined forces to recover what was left of this Feudal Japan relic, create a faithful physical reconstruction of it, and make it accessible to people around the world through its inclusion in Assassin's Creed Shadows. The physical replica from Factum Arte will become part of the Royal Armory of Madrid's collection.

Samsung aims to create 1,000-layer NAND by 2030 relying on its new "multi-BV" NAND design. The Bell reports that this plan involves stacking four wafers to overcome structural limits. Wafer bonding technology plays a crucial role in this progress and Samsung intends to use it to break the 1,000-layer barrier. Samsung Electronics DS division CTO, Song Jae-hyuk, pointed out that wafer bonding allows separate production of peripheral and cell wafers before joining them into one semiconductor. The Bell says this technology will likely appear first in Samsung's 10th-gen NAND (V10), while industry experts think a single wafer can hold about 500 NAND layers when implementing only cell structures. In the past, Samsung has used the COP (Cell on Peripheral) technique, a method that places the peripheral circuit on one wafer, with NAND cells stacked on top. However, as NAND layers grow, the lower peripheral parts face more pressure potentially affecting reliability.

Samsung's plan involves working with China's YMTC, which should offer a hybrid bonding patent for V10 NAND. ZDNet reports that the South Korean tech company will start making its V10 NAND in large quantities in the second half of 2025, with about 420-430 layers. Besides wafer bonding, Samsung adds other technologies to its NAND plan. The Bell points out that cold etching using molybdenum, and other new ideas will start with 400-layer NAND and play a key part in growing to 1,000 layers. Samsung isn't alone in trying to create ultra-high-layer NAND products. Japan's Kioxia also wants to reach this goal through its "multi-stack CBA" (CMOS Bonded to Array) technology. The company's plan is even bolder hoping to sell 1,000-layer 3D NAND by 2027.

Atelier games have been around since the late '90s, with more than two dozen titles shipped in that time - but you're forgiven some unfamiliarity the series, as Atelier Yumia: The Alchemist of Memories and the Envisioned Land will be the very first to arrive on Xbox. After playing through the first few hours of the game and speaking with producer Junzo Hosoi, it's becoming clear that the first Atelier title on Xbox isn't simply the latest in the series, it's the most ambitious entry yet.

"As a huge Xbox fan, I'm thrilled to finally bring the series to the system," Hosoi told me via email, "But when I look at the game as a whole, I don't describe Atelier Yumia as the next Atelier game. I describe it as a completely new JRPG series that has Atelier features." My preview session bore that out; players will find familiar RPG elements aplenty - strategic, real-time battles, crafting, exploration - but they come together in way that feels altogether different from others in the genre. The secret ingredient, if you will, lies in the super deep crafting system.

Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8 Gb/s NAND interface speed, superior power efficiency, and heightened density

Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies' revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.

Scientists have made a big step forward in data storage technology, they've managed to improve the manufacturing process for 3D NAND flash memory. This type of storage technology stacks memory cells on top of each other to obtain higher data density. A team of experts from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Lab came up with a better way to etch (the process of carving holes into alternating layers of silicon oxide and silicon nitride) by using hydrogen fluoride plasma. This new method cuts vertical channels through silicon-based materials twice as fast as before achieving 640 nanometers in just one minute.

The team found out that mixing in certain chemicals like phosphorus trifluoride helps the etching process. They also learned that some byproducts can slow down etching, but adding water can help fix this problem. "The salt can decompose at a lower temperature when water is present, which can accelerate etching", said Yuri Barsukov, a former PPPL researcher now working at Lam Research. This breakthrough is important as the need for data storage received a huge boost with the rise of AI programs, that need tons of storage.

TrendForce's latest research report highlights that the NAND Flash industry will continue to face dual pressure from weak demand and oversupply in 2025. In response, manufacturers including Micron, Kioxia/SanDisk, Samsung, and SK hynix/Solidigm have similar plans to cut production—a move that could accelerate industry consolidation in the long term.

TrendForce reports that NAND Flash manufacturers are primarily implementing production cuts by lowering utilization rates and delaying process upgrades. These actions are driven by three major factors:

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding. Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation.

Hybrid bonding offers several advantages when compared to the more widely used micro-bumping. Since it does not require bumps, it allows for more stacked layers and can accommodate thicker chips that help address warpage. Hybrid-bonded chips also benefit from faster data transmission and improved heat dissipation.

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. Random logic structures down to 9,5 nm (19 nm pitch), random vias with 30 nm center-to-center distance, 2D features at 22 nm pitch, and a DRAM specific lay out at P32nm were printed after single exposure, using materials and baseline processes that were optimized for High NA EUV by imec and its partners in the framework of imec's Advanced Patterning Program. With these results, imec confirms the readiness of the ecosystem to enable single exposure high-resolution High NA EUV Lithography.

Following the recent opening of the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands, customers now have access to the (TWINSCAN EXE:5000) High NA EUV scanner to develop private High NA EUV use cases leveraging the customer's own design rules and lay outs.

SK hynix is reportedly developing 400-layer NAND flash memory, with plans to begin mass production by late 2025. The company is collaborating with supply chain partners to develop the necessary process technologies and equipment for 400-layer and higher NAND chips. This information comes from a recent article by Korean media outlet etnews citing industry sources.

SK hynix intends to use hybrid bonding technology to achieve this, which is expected to bring new packaging materials and components suppliers into the supply chain. The development process involves exploring new bonding materials and various technologies for connecting different wafers, including polishing, etching, deposition, and wiring. SK hynix aims to have the technology and infrastructure ready by the end of next year.

Researchers from the Helmholtz-Zentrum Dresden-Rossendorf (HZDR), TU Chemnitz, TU Dresden and Forschungszentrum Jülich have been the first to demonstrate that not just individual bits, but entire bit sequences can be stored in cylindrical domains: tiny, cylindrical areas measuring just around 100 nanometers. As the team reports in the journal Advanced Electronic Materials, these findings could pave the way for novel types of data storage and sensors, including even magnetic variants of neural networks.

"A cylindrical domain, which we physicists also call a bubble domain, is a tiny, cylindrical area in a thin magnetic layer. Its spins, the electrons' intrinsic angular momentum that generates the magnetic moment in the material, point in a specific direction. This creates a magnetization that differs from the rest of the environment. Imagine a small, cylinder-shaped magnetic bubble floating in a sea of opposite magnetization," says Prof. Olav Hellwig from HZDR's Institute of Ion Beam Physics and Materials Research, describing the subject of his research. He and his team are confident that such magnetic structures possess a great potential for spintronic applications.

AMD is developing a new technology that promises to significantly reduce the size on disk of games, as well as reduce the size of game patches and updates. Today's AAA games tend to be over a 100 GB in size, with game updates running into tens of gigabytes, with some of the major updates practically downloading the game all over again. Upcoming games like Call of Duty: Black Ops 6 is reportedly over 300 GB in size, which pushes the game away from those with anything but Internet connections with hundreds of Mbps in speeds. Much of the bulk of the game is made up of visual assets—textures, sprites, and cutscene videos. A modern AAA title could have hundreds of thousands of individual game assets, and sometimes even redundant sets of textures for different image quality settings.

AMD's solution to this problem is the Neural Block Compression technology. The company will get into the nuts and bolts of the tech in its presentation at the 2024 Eurographics Symposium on Rendering (July 3-5), but we have a vague idea of what it could be. Modern games don't drape surfaces of a wireframe with a texture, but also additional layers, such as specular maps, normal maps, roughness maps, etc). AMD's idea is to "flatten" all these layers, including the base texture, into a single asset format, which the game engine could disaggregate into the individual layers using an AI neural network. This is not to be confused with mega-textures—something entirely different, which relies on a single large texture covering all objects in a scene. The idea here is to flatten the various data layers of individual textures and their maps, into a single asset type. In theory, this should yield significant file-size savings, even if it results in some additional compute cost on the client's end.

TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilization rates to nearly 90%—a move not widely adopted by their competitors.

TrendForce points out that to meet the demand surge in the second half of the year, especially given Kioxia and Western Digital's currently low inventory, the production increase is mainly targeting 112-layer and select 2D products. This strategy is expected not only to secure profitability within the year but also to contribute to a projected 10.9% rise in the annual NAND Flash industry supply bit growth rate for 2024.

"Balatro," the latest indie game sensation published by Playstack has reached a significant milestone by selling one million copies in its first month. This achievement highlights the game's widespread appeal and the enthusiastic response from the gaming community. "We're incredibly grateful for the support and enthusiasm from players worldwide," says Harvey Elliott, CEO of Playstack. "The game's success is a testament to the quality and creativity that the indie sector can deliver, proving that even in uncertain times, innovative games can thrive. We extend our deepest thanks to every player who has joined us on this adventure."

LocalThunk, the solo developer behind "Balatro," shared their gratitude for the game's reception as well. "I'm so grateful to all the players and people that have made this happen. I still can't grasp the response to this game, and I am overjoyed that so many people have been able to have fun with my silly creation. I'm so fortunate that I can continue working on my passion as a career. Thank you!"

Update on March 13, 2024: the PS5 system software update is rolling out globally today. Additionally, later this month a PlayStation App update will enable users to enjoy Share Screen interactions on the app as well. As the new year kicks into high gear with an amazing slate of PS5 game releases like The Last of Us Part II Remastered, Tekken 8 and Helldivers 2, along with FINAL FANTASY VII Rebirth, we're pleased to roll out another PS5 system software beta today with a number of quality-of-life enhancements and new features.

While beta access is limited to invited participants in select countries, we plan to release the update globally in the coming months. If you're selected to participate in the beta, you'll receive an email invitation today when it's available to download. Some features available during the beta phase may not make it into the final version or may see significant changes. Let's jump in to the newly added features below.

Every choice we made when developing Outcast - A New Beginning had, at its core, one motivation: freedom. It was important to us not to limit where players could go at any point; instead, we gave them the tools to navigate the detailed open world we've spent the last few years crafting. We're incredibly proud of Outcast's world and want players to share its richness with us. As players set out across Adelpha, we want to reward them for their curiosity and sense of adventure. Whether it's blitzing through an invader base and unlocking a new weapon module, zipping through gliding challenges to earn jetpack upgrades, or simply taking in the sights, we've strived to make every second spent on the planet of Adelpha feel meaningful to players.

Traveling in style
Knowing that players would be spending a lot of time in Cutter Slade's boots, it was important to us that it felt fun to maneuver him through the world. Open-world games often ask players to cross great distances, and it's our job as developers to ensure that you always feel invigorated by navigating the wilds of Adelpha. When designing how Cutter moved through the world, we didn't want to gatekeep fun traversal abilities for later in the game. From early in Outcast - A New Beginning, you can take advantage of Adelpha's teetering precipices and deep valleys with your gliding suit, swooping across the alien landscape.

NVIDIA's Compute Unified Device Architecture (CUDA) has long been the de facto standard programming interface for developing GPU-accelerated software. Over the years, NVIDIA has built an entire ecosystem around CUDA, cementing its position as the leading GPU computing and AI manufacturer. However, rivals AMD and Intel have been trying to make inroads with their own open API offerings—ROCm from AMD and oneAPI from Intel. The idea was that developers could more easily run existing CUDA code on non-NVIDIA GPUs by providing open access through translation layers. Developers had created projects like ZLUDA to translate CUDA to ROCm, and Intel's CUDA to SYCL aimed to do the same for oneAPI. However, with the release of CUDA 11.5, NVIDIA appears to have cracked down on these translation efforts by modifying its terms of use, according to developer Longhorn on X.

"You may not reverse engineer, decompile or disassemble any portion of the output generated using Software elements for the purpose of translating such output artifacts to target a non-NVIDIA platform," says the CUDA 11.5 terms of service document. The changes don't seem to be technical in nature but rather licensing restrictions. The impact remains to be seen, depending on how much code still requires translation versus running natively on each vendor's API. While CUDA gave NVIDIA a unique selling point, its supremacy has diminished as more libraries work across hardware. Still, the move could slow the adoption of AMD and Intel offerings by making it harder for developers to port existing CUDA applications. As GPU-accelerated computing grows in fields like AI, the battle for developer mindshare between NVIDIA, AMD, and Intel is heating up.

The University of Shanghai for Science and Technology (USST), Peking University and the Shanghai Institute of Optics and Fine Mechanics (SIOM) are collaborating on new Optical Data Storage (ODS) technologies—a recently published paper reveals that scientists are attempting to create 3D nanoscale optical disk memory that breaks into petabit capacities. Society (as a whole) has an ever-growing data demand—this requires the development of improved high-capacity storage technologies—the R&D teams believe that ODS presents a viable alternative route to traditional present day solutions: "data centers based on major storage technologies such as semiconductor flash devices and hard disk drives have high energy burdens, high operation costs and short lifespans."

The proposed ODS format could be a "promising solution for cost-effective long-term archival data storage." The researchers note that current (e.g Blu-ray) and previous generation ODS technologies have been: "limited by low capacities and the challenge of increasing areal density." In order to get ODS up to petabit capacity levels, several innovations are required—the Nature.com abstract stated: "extending the planar recording architecture to three dimensions with hundreds of layers, meanwhile breaking the optical diffraction limit barrier of the recorded spots. We develop an optical recording medium based on a photoresist film doped with aggregation-induced emission dye, which can be optically stimulated by femtosecond laser beams. This film is highly transparent and uniform, and the aggregation-induced emission phenomenon provides the storage mechanism. It can also be inhibited by another deactivating beam, resulting in a recording spot with a super-resolution scale." The novel optical storage medium relies on dye-doped photoresist (DDPR) with aggregation-induced emission luminogens (AIE-DDPR)—a 515 nm femtosecond Gaussian laser beam takes care of optical writing tasks, while a doughnut-shaped 639 nm continuous wave laser beam is tasked with retrieval. A 480 nm pulsed laser and a 592 nm continuous wave laser work in tandem to read data.

AI workloads are split into two different categories: training and inference. While training requires large computing and memory capacity, access speeds are not a significant contributor; inference is another story. With inference, the AI model must run extremely fast to serve the end-user with as many tokens (words) as possible, hence giving the user answers to their prompts faster. An AI chip startup, Groq, which was in stealth mode for a long time, has been making major moves in providing ultra-fast inference speeds using its Language Processing Unit (LPU) designed for large language models (LLMs) like GPT, Llama, and Mistral LLMs. The Groq LPU is a single-core unit based on the Tensor-Streaming Processor (TSP) architecture which achieves 750 TOPS at INT8 and 188 TeraFLOPS at FP16, with 320x320 fused dot product matrix multiplication, in addition to 5,120 Vector ALUs.

Having massive concurrency with 80 TB/s of bandwidth, the Groq LPU has 230 MB capacity of local SRAM. All of this is working together to provide Groq with a fantastic performance, making waves over the past few days on the internet. Serving the Mixtral 8x7B model at 480 tokens per second, the Groq LPU is providing one of the leading inference numbers in the industry. In models like Llama 2 70B with 4096 token context length, Groq can serve 300 tokens/s, while in smaller Llama 2 7B with 2048 tokens of context, Groq LPU can output 750 tokens/s. According to the LLMPerf Leaderboard, the Groq LPU is beating the GPU-based cloud providers at inferencing LLMs Llama in configurations of anywhere from 7 to 70 billion parameters. In token throughput (output) and time to first token (latency), Groq is leading the pack, achieving the highest throughput and second lowest latency.

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications—including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company's vision for "Memory Reimagined," covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.