During the Aspen Security Forums 2023, Intel CEO Pat Gelsinger spoke on the topic of semiconductors and national security. During his speech, Gelsinger mentioned that Intel should get the lion's share of the US$52 billion US CHIPS Act money, simply because Intel is a US company. In Gelsinger's opinion, it appears that TSMC and Samsung don't deserve as much, despite both companies manufacturing semiconductors for US companies, with Samsung already having a foundry in Texas, while TSMC is still struggling with the construction of its Arizona foundry.

Admittedly, Intel has far more foundries in the US, but it also seems like Gelsinger forgot about other foundries, such as GlobalFoundries, but also companies such as Micron, Texas Instruments, Qorvo, NXP, On Semi, Analog Devices and so forth that all own foundries that produce their own chips on US soil. We'd expect all these companies to be eyeing the CHIPS Act cash and without many of those companies, Intel wouldn't be able to sell any of its chips, as many of them produce much needed components that are used to build motherboards, laptops and what not. Gelsinger was obviously pointing fingers at the current US China trade war and how the export controls are causing concerns with regards to the global semiconductor business. As such, Gelsinger wants Intel to have fewer restrictions from the currently imposed trade regulations, largely due to China being some 25 to 30 percent of Intel's market, with Intel being busy expanding in the country. Make what you want of this, but it's clear that Gelsinger is expecting to eat the cake and have it at the same time. Video after the break.

US authorities have imposed a $300 million penalty on Seagate Technology Holdings plc, a market leader in data storage solutions, for an alleged violation of export controls. The US Commerce Department has investigated the California-based company's business dealings with Chinese hardware firm Huawei Technologies Co. Limited, specifically for the sale of hard disk drives to operations within mainland China. It has found that Seagate has broken the "foreign direct product (FDP) rule" that was established by the US Government back in 2020. Seagate is said to have sold approximately 7.4 million hard drive units to Huawei after the period in which the new rulings took effect - the total value of these shipments was estimated in the region of $1.1 billion.

The US government's serving of a civil penalty to Seagate appears to be part of a larger drive to prevent North American tech companies from selling advanced computer equipment to Chinese firms. Two other suppliers (not named) of storage solutions had agreed to the government imposed terms and ceased trade with Huawei in 2020. In contrast, Seagate has seemingly become a record breaking heretic according to a statement released yesterday by the Bureau of Industry (BIS) and Security: "This historic foreign direct product enforcement case and settlement represents the largest standalone administrative penalty in BIS history. Today's resolution also includes a multi-year audit requirement and a five-year suspended Denial Order. In August 2020, the Bureau of Industry and Security imposed controls over certain foreign-produced items related to Huawei. Despite this, in September 2020, Seagate announced it would continue to do business with Huawei. Seagate did so despite the fact that its only two competitors had stopped selling HDDs to Huawei, resulting in Seagate becoming Huawei's sole source provider of HDDs."

The Japanese government, on Friday March 31, announced that it plans to place restrictions on its export of 23 types of semiconductor manufacturing equipment. This follows similar efforts announced by other nations, including the USA and the Netherlands. In a news conference, the Minister for Economy, Trade and Industry (METI), Yasutoshi Nishimura stated: "We are fulfilling our responsibility as a technological nation to contribute to international peace and stability." The press release makes no mention of a trade battle between the USA or China, but the implication is that METI is limiting the latter's access to Japan's most advanced chip making equipment.

Nishimura-san continues: "If our exports are not being re-appropriated for military use, we will continue exporting. We believe the impact on companies will be limited." The U.S. government has called on its allies to prevent China's access to semiconductor manufacturing technology in order to slowdown domestic technological and military advancement. Japan and the Netherlands have previously agreed, back in January of this year, to restrict exports to China of equipment that could be used to churn out sub-14 nm chips.

Today the Dutch government has published more information on upcoming restrictions on export of semiconductor equipment. These new export controls focus on advanced chip manufacturing technology, including the most advanced deposition and immersion lithography tools. Due to these upcoming regulations, ASML will need to apply for export licenses for shipment of the most advanced immersion DUV systems.

It will take time for these controls to be translated into legislation and take effect. Based on today's announcement, our expectation of the Dutch government's licensing policy, and the current market situation, we do not expect these measures to have a material effect on our financial outlook that we have published for 2023 or for our longer-term scenarios as announced during our Investor Day in November last year.

The US Government reinstated over 350 products to a list of exclusions to American import tariffs that were in place in January 2021. This would exclude "printed circuit boards," which is an oversimplified classification of motherboards and graphics cards, along with a range of other PC components that appear like PCBs. The US-China trade-war had caused a curious situation of pre-built computers (such as notebooks, desktops, and workstations) enjoying lower prices than import of their various components. This has had a direct impact on prices of motherboards and graphics cards. Whatever the geopolitical motive behind the move, it should certainly take the pressure off pricing, which have been affected not just by the tariffs, but also component shortages, and spikes in material prices, as well as logistics costs due to the COVID-19 pandemic, as well as the situation in Eastern Europe.

The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components. Fabless IC design companies that supply such components therefore benefitted greatly from manufacturers' procurement demand, and the IC design industry underwent tremendous growth in 2020. In particular, the top three IC design companies (Qualcomm, Broadcom, and Nvidia) all posted YoY increases in their revenues, with Nvidia registering the most impressive growth, at a staggering 52.2% increase YoY, the highest among the top 10 companies.

Yesterday, we have reported that ASUS is officially increasing the prices of their graphics cards and motherboards, due to increased component and logistics costs. What the company meant by that was not exactly clear to everyone, as it looked like the company has adjusted to the current market prices exceeding the MSRP of components like graphics cards. The GPUs are today selling at much higher prices compared to the original MSRP and it is representing a real problem for consumers. Today, we get to see what is the underlying problem behind the announcement we saw yesterday and if we are going to see more of that in the close future.

According to the New York Times, the Chinese import tariff exemptions have expired with the arrival of a new year (2021) and we can expect the tariffs to start from 7.5%-25%, which will massively increase component costs. A Reddit user has noted that MSRP will increase about $80 for every major GPU manufacturer like ASUS, GIGABYTE, PNY, Zotac, etc. so we are expecting MSRP adjustment from other companies to follow just like ASUS did. The import tariff exemptions are also supposed to increase MSRPs of other PC components like motherboards, SSDs, PSUs, cases... everything without exemption. As a product of a trade war between China and the Trump administration, it remains a question will these tariffs get easier shortly, so consumers can afford their desired components.

Semiconductor manufacturing has been the latest victim of the recent trade war between China and the United States. With the US imposing sanctions on Chinese manufacturers, they have not been able to use any US technology without the approval of the US government. That has caused many companies to lose customers and switch their preferred foundry. The US government has also decided to sanction a Chinese company Huawei from accessing any US-technology-based manufacturing facilities, thus has prevented the Chinese company from manufacturing its chips in the facilities of TSMC. Left without almost any way to keep up with the latest semiconductor technology, Huawei is reportedly working on its own manufacturing facilities.

According to the Financial Times, Huawei is about to enter domestic silicon production with its partner company Shanghai IC R&D. And a big note here is that the manufacturing facility will not use any US technology. The production is allegedly going to start as soon as the end of this year, and the first process that will come out the door will be a rather outdated 45 nm node. The company is expecting to move on to a more advanced 28 nm node by the end of next year. While the capacities are unknown, we can assume that it will be enough for the company's purposes. With this move, Huawei will be 100% independent from any US influence and will own the complete vector of software and hardware, that is a custom made design by the company.Huawei R&D Center

Recently, the technology trade war between the US and China has been very challenging for Chinese semiconductor manufacturers. With a new regulation to prevent the use of US technology on foreign lands, the US administration has managed to prevent many companies from manufacturing the latest processes, and they have lost a part of their customer base. In awe of this craze, it seems like many silicon designers are storming to the competing foundries to get their designs taped out. According to the DigiTimes report, TSMC has seen a massive spike in demand for its 28 nm semiconductor node. The surge is going to reach a peak of almost 100% in the fourth quarter this year. The growth is mainly being driven by Chinese customers who are switching their manufacturing facilities. The report indicated that Qualcomm, as well, is a big part of the growth besides the remaining companies.

IC Insights recently released its September Update to the 2020 McClean Report that presented the second of a two-part analysis on the global IC foundry industry and included a look at the pure-play foundry market by region.

China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China's economic growth but its foundry marketshare still increased by two percentage points to 21%. Moreover, despite the Covid-19 shutdown of China's economy earlier this year, China's share of the pure-play foundry market is forecast to be 22% in 2020, 17 percentage points greater than it registered in 2010 (Figure 1).

China's upcoming 14th five-year plan (2021-2025) will continue to highlight technology and capacity upgrades as the core of its semiconductor self-sufficiency strategy, with foundry capacity projected to expand 40% from the preceding plan and fabrication process expected to advance to 7 nm, according to Digitimes Research.

Bolstered by national policies in the 13th five-year plan, China's IC manufacturing industry is expected to see combined revenues double to CNY240 billion (US$34.28 million) in 2020 from 2016, and may also move 12 nm to production by the end of the year after having volume produced 14 nm process.

As the US stranglehold on Huawei keeps on tightening its grip, China's government is keen on both investing more heavily into in-country semiconductor manufacturing that can become a viable alternative to Huawei as a source a silicon, as well as decrease the country's dependence on Western or Western-tied companies. The country has already developed promising alternatives to foreign DRAM solutions via Xi'an UniIC Semiconductors and Yangtze Memory Technologies (YMTC). Now, following a previously-successful funding round held in Hong Kong (worth some $2.2 billion injected last month), China's largest contract chipmaker Semiconductor Manufacturing International Corporation (SMIC) is looking for an additional $2.8 billion funding round via Shanghai.

SMIC is currently years behind TSMC, the current benchmark when it comes to semiconductor manufacturing. For now, SMIC is only able to provide 14 nm product designs - and even in that node, silicon is being quoted as having as much as a 70% defect-rate on any given wafer produced by the company (they've already started 14 nm production of Huawei's low-cost Kirin 710 chipset). At any rate, sources point towards a 6,000 monthly wafer production capacity within SMIC, a very, very low number that fails to meet any current demand (TSMC, for scale, are quoted as producing as many as 110,000 7 nm wafers per month). It's definitely an uphill battle, but SMIC counts with the might of the Chinese government through its sails - so while the waters might not be smooth, investment rounds such as these two (which amount to some $5 billion capital injection in two months) will be sure to help grease the engines for china's semiconductor expansion as much as possible.