NVIDIA today unveiled the NVIDIA DGX-1, the world's first deep learning supercomputer to meet the unlimited computing demands of artificial intelligence. The NVIDIA DGX-1 is the first system designed specifically for deep learning -- it comes fully integrated with hardware, deep learning software and development tools for quick, easy deployment. It is a turnkey system that contains a new generation of GPU accelerators, delivering the equivalent throughput of 250 x86 servers.

The DGX-1 deep learning system enables researchers and data scientists to easily harness the power of GPU-accelerated computing to create a new class of intelligent machines that learn, see and perceive the world as humans do. It delivers unprecedented levels of computing power to drive next-generation AI applications, allowing researchers to dramatically reduce the time to train larger, more sophisticated deep neural networks.

AMD today announced early availability of its new mobile 7th Generation AMD A-Series Processors, timed to support an exciting new notebook design by HP Inc. Equipped with advanced video, graphics, performance, and security features designed to boost productivity and enhance the entertainment experience, 7th Generation AMD A-Series Processors (codenamed "Bristol Ridge") also provide outstanding energy efficiency.

New OEM PC designs powered by mobile 7th Generation AMD A-Series Processors -- from ultrathin notebooks and convertibles to sleek All-in-Ones -- will come to market first with HP in the new HP ENVY x360, and with other OEM announcements expected later in the year. AMD will officially introduce 7th Gen A-Series APUs and showcase a wide range of OEM designs at Computex 2016, May 31-June 4, 2016, in Taipei, Taiwan.

AMD today announced that researchers at the Canadian Hydrogen Intensity Mapping Experiment (CHIME) will harness the AMD FirePro S9300 x2 Server GPU, the world's fastest single-precision GPU accelerator, to analyze extraordinary amounts of data to help create a new, very detailed 3D map of the largest volume of the Universe ever observed. Rather than using traditional dish-shaped telescopes, CHIME consists of four 100-metre-long cylindrical reflectors which cover an area larger than five professional hockey rinks and gathers signals for the critical computational analyses supplied by the AMD FirePro S9300 x2 GPU cluster.

The CHIME project was created to investigate the discovery that the expansion of the Universe is speeding up rather than slowing down. Using consumer technologies similar to those found in common radio receivers, the telescope collects radio waves that have travelled through space for up to 11 billion years and feeds them into a massive supercomputer powered by a series of AMD FirePro S9300 x2 GPUs. The intense number crunching required to map the Universe's expansion in this way was previously cost-prohibitive, but is now being enabled by AMD FirePro GPUs. The anticipated results will help create a highly-detailed map showing the intensity of the hydrogen radiation from billions of galaxies, which will help scientists understand the accelerating expansion of the Universe.

At Embedded World today, AMD announced its 3rd Generation AMD Embedded G-Series SoCs and the Embedded G-Series LX SoC, providing customers a broadened portfolio of performance options. The latest offerings expand developers' ability to scale x86 platforms, starting with the entry-level AMD Embedded G-Series LX SoC, which is pin compatible to the previous generation G-Series SoC devices. Also announced today are two new, higher performing 3rd Generation AMD Embedded G-Series SoCs, codenamed "Prairie Falcon" and "Brown Falcon," which introduce for the first time pin compatibility for G-Series processors with the higher performance AMD Embedded R-Series SoC.

The new products expand upon the low power capabilities of the award-winning AMD Embedded G-Series SoC platform, bringing scalable performance, power, and price across the CPU, GPU, multimedia, and I/O controller hardware, helping to lower development costs for AMD customers. Together, the new G-Series processors deliver immersive, graphically rich experiences across a broad range of platforms, from entry-level to mainstream gaming, digital signage, imaging, and industrial control.

AMD today launched new thermal solutions, including the flagship AMD Wraith Cooler, as well as the new AMD A10-7860K and new AMD Athlon X4 845 desktop processors. Designed for the consumer who cares about how their desktop PC runs, sounds, and looks, AMD now offers new thermal solutions that generate less than one-tenth the noise of their predecessors -- running at a near-silent 39 decibels, about as quiet as a library.

The new AMD Wraith Cooler combines near-silent operation with unique styling via a sleek fan shroud and LED illumination. Providing superb cooling, the new design delivers 34 percent more airflow and 24 percent more surface area for heat dissipation than its predecessor.

AMD's next-generation "Zen" x86-64 CPU micro-architecture will support up to 32 cores per socket, according to leaked Linux kernel patch on LKML. We know from older reports, that AMD clumps groups of four cores in subunits it calls "Zen quad-core units." Not to be confused with its current "module" design, a quad-core unit is a group of four completely independent cores, which share nothing other than an L3 cache. TechFrag used this bit to deduce that the "Zen" architecture is scalable up to eight quad-core units per socket, or 32 cores per socket.

QNAP Systems, Inc. today announced the release of the quad-core 2-bay TS-251+ and 4-bay TS-451+ NAS that provide an uncompromising high-performance and scalable storage solution for small offices and workgroup users with appealing affordability. The new models feature virtualization readiness, containerized applications, advanced backup solutions, real-time & offline video transcoding, QvPC Technology, HDMI video playback with an included remote control, and many more functions that are beneficial for businesses and SOHO users to build a cost-efficient and modern storage solution.

The TS-251+ and TS-451+ are powered by a 22nm 64-bit quad-core Intel Celeron 2.0GHz processor (burst up to 2.42GHz) with 2GB/8GB energy-efficient DDR3L RAM. They also include dual Gigabit LAN ports, and can deliver up to 225 MB/s throughput and up to 205 MB/s transfer speeds with AES 256-bit volume & folder encryption."The TS-251+ & TS-451+ are ideal choices for those who demand the superior performance of a quad-core x86-based NAS without breaking the budget," said Jason Hsu, Product Manager of QNAP. "Both NAS are speedy, versatile and provide future-proof scalability."

AMD today announced new AMD Embedded R-Series SOC processors that establish performance leadership across a targeted range of embedded application market requirements for digital signage, retail signage, medical imaging, electronic gaming, media storage and communications and networking. Designed for demanding embedded needs, the processors incorporate the newest AMD 64-bit x86 CPU core ("Excavator"), plus third-generation Graphics Core Next GPU architecture, and state-of-the-art power management for reduced energy consumption. Combined, these AMD innovations and technologies provide industry-leading graphics performance and key embedded features for next-generation designs.

The single-chip system-on-chip (SOC) architecture enables simplified, small form factor board and system designs from AMD customers and a number of third party development platform providers, while providing astounding graphics and multimedia performance, including capability for hardware-accelerated decode of 4K video playback. With a robust suite of peripheral support and interface options, high-end AMD Radeon graphics, designed for the industry's first Heterogeneous Systems Architecture (HSA) 1.0 certification, and support for the latest DDR4 memory, the new AMD R-Series SOC addresses the needs of a wide range of markets and customers.

Jim Keller, one of the lead architects of AMD's x86 CPU architectures, has left the company. He held the post of Chief Architect of Microprocessor Cores at AMD. With his association, AMD's launched some of its most successful CPU architectures, such as the original K7 (Athlon, Athlon XP, Duron); the very first 64-bit x86 architecture, and K8 (Athlon64). Keller then left AMD to join Apple, in its development of the A4 and A5 SoCs, before rejoining AMD in 2012 to begin work on the "Zen" architecture.

Keller's departure doesn't throw "Zen" in jeopardy. "Jim helped establish a strong leadership team that is well positioned for success as we enter the completion phase of the "Zen" core and associated system IP and SoCs," said AMD in a statement. "Zen" remains on-track for sampling in 2016, and its "first full year of revenue" in 2017, which would indicate a market launch some time in 2016. AMD CTO Mark Papermaster will take over as additional charge of Keller's position.

AMD announced availability of its newest budget socket FM2+ APU, the A8-7670K. This part, like the recently-launched A10-7870K, is based on the company's new 28 nm "Godavari" silicon. It combines a quad-core x86-64 CPU based on the "Excavator" micro-architecture, with an integrated Radeon R7 series graphics core, featuring six Graphics CoreNext 1.2 compute units amounting to 384 stream processors; a dual-channel DDR3 integrated memory controller, with native support for DDR3-2133 MHz memory; and a PCI-Express gen 3.0 root complex.

The CPU cores on the AMD A8-7670K are clocked at 3.60 GHz, with maximum TurboCore frequency of 3.90 GHz. The CPU features unlocked base-clock multipliers, enabling CPU overclocking. The four CPU cores are spread across two "Excavator" modules, with a total of 4 MB of cache between them. The GPU is clocked at 757 MHz, and offers native support for DirectX 12 (feature level 12_0). It offers Dual-Graphics support, letting you pair it with select discrete GPUs from AMD's lineup. With the advent of DirectX 12, it should also support asynchronous multi-GPU. The A8-7670K is available now, and is priced at US $117.99 in its retail package.

ASUS introduced the N3150-C and N3050-C, two mini-ITX motherboards based on the Intel Celeron quad-core N3150 and N3050 SoCs, respectively. The two SoCs are based on the "Braswell" silicon, embedding quad-core or dual-core CPUs based on the 64-bit x86 "Airmont" CPU micro-architecture. The dual-core N3050 features HyperThreading, enabling four logical CPUs, while the quad-core N3150 lacks it. Both chips also embed dual-channel DDR3L IMCs, supporting up to 8 GB of memory; 8th generation Intel graphics with 12 execution units, and TDPs under 6W.

The N3150-C and N3050-C from ASUS feature a common PCB design, with 24+4 pin power inputs, two full-size DDR3 DIMM slots, a single open-ended PCI-Express 2.0 x4 expansion slot, an mPCIe slot, two each of SATA 6 Gb/s, USB 3.0, and USB 2.0 ports, 6-channel HD audio, gigabit Ethernet, HDMI and D-Sub display outputs; and legacy connectivity that includes two PS/2 ports, and a serial (RS-232) port.

AMD today announced that Samsung Electronics Co., Ltd. selected the AMD Embedded G-Series SoC (system on chip) for a new line of all-in-one cloud monitors featuring integrated thin client technology. The Samsung 21.5-inch TC222W and 23.6-inch TC242W are powered by AMD Embedded G-Series SoCs that couple high-performance compute and graphics capability in a highly integrated, low power design. The AMD SoC improves data transfer rates and saves space on the motherboard, which makes it a perfect fit for the compact form factors required by thin clients.

"Thin client is a key market for AMD Embedded Solutions and we're thrilled that Samsung has chosen to partner with us for their newest line of products," said Scott Aylor, vice president and general manager, Embedded Solutions, AMD. "The collaboration with Samsung builds on the number one position AMD holds in a market that continues to grow, becoming more and more prevalent in commercial installations that serve a broad range of markets."

Planned availability starting in Q3 2015, the Windows-supported Samsung cloud monitors will provide customers with expanded choice, capability and configuration flexibility. Complete with Samsung's professional-grade display panel, the cloud monitors will create a superior user experience through easy connectivity and high-quality reliability. As a superior option for effective desktop virtualization, Samsung's thin-client monitors will also enable improved productivity and optimized end-to-end performance.

AMD announced no less than five new products based on its swanky new 28 nm "Fiji" silicon, the company's most powerful GPU, packing over 8 TFLOP/s of raw compute power, and the first GPU to feature stacked HBM (high-bandwidth memory), moved to the GPU package, and communicating with the GPU die over a special silicon substrate called the interposer. The "Fiji" silicon will enable AMD to target NVIDIA's entire high-end GPU lineup.

The first product is Project Quantum. This is a console-sized SFF gaming desktop designed by AMD, which will be sold by the company's add-in board partners. Despite its diminutive size, the desktop packs two "Fiji" GPUs in AMD CrossFireX, and an AMD 64-bit x86 machine driving the rest. All main components (the CPU, the chipset, and the two GPUs), are liquid-cooled. This desktop will enable smooth 4K/5K gaming in the living room.

AMD gave us a technical preview of its next-generation "Carrizo" APU, which is perhaps the company's biggest design leap since "Trinity." Built on the 28 nm silicon fab process, this chip offers big energy-efficiency gains over the current-generation "Kaveri" silicon, thanks to some major under-the-hood changes.

The biggest of these is the "Excavator" CPU module. 23 percent smaller in area than "Steamroller," (same 28 nm process), Excavator features a new high-density library design, which reduces die-area of the module. Most components are compacted. The floating-point scheduler is 38% smaller, fused multiply-accumulate (FMAC) units compacted by 35%, and instruction-cache controller compacted by another 35%. The "Carrizo" silicon itself uses GPU-optimized high-density metal stack, which helps with the compaction. Each "Excavator" module features two x86-64 CPU cores, which are structured much in the same way as AMD's previous three CPU core generations.

AMD (NYSE: AMD) today at its Future of Compute event announced the addition of its first high performance system-on-a-chip (SoC), codenamed "Carrizo", and a mainstream SoC codenamed "Carrizo-L" as part of the company's 2015 AMD Mobile APU family roadmap. In collaboration with hardware and software partners, these new 2015 AMD Mobile APUs are designed as complete solutions for gaming, productivity applications, and ultra high-definition 4K experiences. With support for Microsoft DirectX 12, OpenCL 2.0, AMD's Mantle API, AMD FreeSync and support for Microsoft's upcoming Windows 10 operating system, the 2015 AMD Mobile APU family enables the experiences consumers expect.

"We continue to innovate and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Computing and Graphics business group, AMD. "AMD's commitment to graphics and compute performance, as expressed by our goal to improve APU energy efficiency 25x by 2020, combines with the latest industry standards and fresh innovation to drive the design of the 2015 AMD Mobile APU family. We are excited about the experiences these new APUs will bring and look forward to sharing more details in the first half of next year."

AMD today demonstrated the first network function virtualization (NFV) solution on AMD's 64-bit ARM-based SoC and announced that it is now sampling to AMD's embedded customers. The NFV demonstration is powered by a 64-bit ARM-based AMD Embedded R-Series SoC, codenamed "Hierofalcon," supported with technology from two key ecosystem partners -- Aricent for the networking software stack and Mentor Graphics for embedded Linux and tools. NFV is an innovative solution that simplifies deployment and management for network and telecommunications service providers with a fully virtualized communications infrastructure that helps maximize performance, while working to reduce costs.

At ARM TechCon, AMD specifically showcased the capabilities of an ARM-based NFV solution, virtualizing the functionality of a packet data network gateway, serving gateway, and a mobility management entity. In addition to virtualizing hardware components, AMD showcased a live traffic migration between the ARM-based AMD Embedded R-Series SoC and the x86-based second generation AMD R-Series APU. AMD's ARM-based NFV solution will be especially valuable for telecommunications network infrastructure providers interested in a flexible software-defined networking (SDN) implementation to manage networking services with configurable hardware to help reduce complexity and cost. NFV is the abstraction of numerous network devices such as routers and gateways, to enable relocation of network functions from dedicated hardware appliances to generic servers. With NFV, much of the intelligence currently built into proprietary, specialized hardware is accomplished with software running on general purpose hardware. The resulting solution is a fully virtualized communications infrastructure -- including virtual servers, storage and networks -- that simplifies deployment and management for network and telecommunications service providers. AMD is paving the way for both new and established service providers to design and deploy either x86 or ARM-based NFV infrastructure which meets their performance, cost and complexity requirements.

Lenovo and IBM today announced that they have completed the initial closing for Lenovo's acquisition of IBM's x86 server business under the terms described in their announcement on Monday, September 29, 2014. Lenovo is acquiring System x, BladeCenter and Flex System blade servers and switches, x86-based Flex integrated systems, NeXtScale and iDataPlex servers and associated software, blade networking and maintenance operations. IBM retains its System z mainframes, Power Systems, Storage Systems, Power-based Flex servers, and PureApplication and PureData appliances.

As part of the agreement, Lenovo and IBM have also established a strategic alliance where Lenovo will serve as an Original Equipment Manufacturer (OEM) to IBM and will resell select products from IBM's industry-leading storage and software portfolio. These include IBM's entry and midrange Storwize storage product family, Linear Tape Open (LTO) products, and elements of IBM's system software portfolio, including Smart Cloud software, General Parallel File System and Platform Computing solutions.

AMD (NYSE: AMD) today will make the first public demonstration of Apache Hadoop running on an ARM Cortex-A57-based AMD Opteron A-Series processor. In a technical session at the JavaOne conference to be delivered this afternoon by AMD corporate fellow Leendert van Doorn, the company will show how the expanding AMD Opteron A-Series server software ecosystem now includes Hadoop, the Java-based framework for storage and large-scale data processing. In addition, Henrik Stahl, vice president, Java product management and Internet of Things at Oracle, will join van Doorn on stage to discuss Oracle's support for AMD's 64-bit ARM server architecture.

Hadoop, a distributed processing technology used primarily for big data analysis, is a rapidly expanding market expected to reach upward of $50 billion by 2020. The combination of 64-bit ARM-based servers and Hadoop is designed to accelerate the changing economics of large-scale computing by enabling distributed processing across clusters of ARM-based servers. Running on the recently announced AMD Opteron A1100 development platform, the demonstration will feature Apache Hadoop running on the Oracle JDK. Leendert will also show multiple nodes running the same demonstration using Linux environments based on Fedora technology from the Red Hat-sponsored Fedora community and the community supported OpenSUSE Project.

Lenovo announced today that conditions for Lenovo's acquisition of IBM's x86 server business have been satisfied and the parties anticipate they will begin closing the transaction effective on October 1, 2014. The acquisition will make Lenovo the third-largest player in the $42.1 billion global x86 server market. Lenovo is acquiring System x, BladeCenter and Flex System blade servers and switches, x86-based Flex integrated systems, NeXtScale and iDataPlex servers and associated software, blade networking and maintenance operations. IBM will retain its System z mainframes, Power Systems, Storage Systems, Power-based Flex servers, PureApplication and PureData appliances.

"With the close of the x86 acquisition, Lenovo will add a world-class business that extends our capabilities in enterprise hardware and services, immediately making us a strong number three in the global server market," said Yang Yuanqing, chairman and CEO of Lenovo. "Now, our priorities are to ensure a smooth integration and deliver a seamless transition for customers. By combining Lenovo's global reach, efficiency and operational excellence with IBM's legendary quality, innovation and service, I am confident that we will have competitive advantages to help us drive profitable growth and build Lenovo into a global enterprise leader."

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2014 2Q.

Graphics chips are without doubt one of the most powerful, exciting, and essential components in tech today: not only does every computer require one (or more), but the technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. New technologies and compute programs are taking advantage of the ability of GPU power to scale. On top of that, PC gaming momentum continues to build. It would be no exaggeration to say that GPUs are becoming the 800-pound gorilla in the room.

Only the third active licencee of Intel's x86 machine architecture, VIA Technology, is readying its first x86 processor in years, codenamed Isaiah II. This chip is based on a brand new 64-bit x86 core design by VIA and the engineering team it acquired from Centaur Technology, another erstwhile x86 licencee, and features modern instruction sets such as AVX 2.0. VIA began sampling a quad-core processor based on Isaiah II, which was put to live test by the company, at its InfoComm 2014 booth. It was compared to Intel's "Bay Trail" Atom and AMD's "Kabini" Athlon chips. It turns out that the Isaiah II is pretty good, if it comes out soon enough.

The Isaiah II based quad-core chip, featuring 2.00 GHz clock speeds, and 2 MB of L2 cache, was put through SANDRA. The BGA chip was running on a VIA-made motherboard, with its own VIA VX11H chipset. It was compared to AMD Athlon 5350 (quad-core "Jaguar" with 2.05 GHz clocks), and Intel Atom Z3770 (quad-core "Silvermont" with 2.40 GHz clocks). The results are tabulated below. At 2.00 GHz, armed with the latest multimedia and cryptography instruction-sets, VIA's chip is faster than Intel's in most tests, despite lower clocks. It trades blows - and wins - against AMD's chip, in most tests. VIA is expected to launch the first chips based on Isaiah II in late-August, 2014. VIA is hedging its bets with efficient compact PCs, kiosks, and digital signage, with its new chip.

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

AMD Senior Vice President and General Manager, Global Business Units, Lisa Su has been named a winner in the EE Times and EDN 2014 UBM Tech ACE Awards in the Executive of the Year category. The awards program honors the people and companies behind the technologies and products that are changing the world of electronics.

The winners were announced at an awards ceremony Tuesday, April 1, at The Fairmont San Jose, during EE Live! "I am flattered and honored to be selected for the UBM 'Executive of the Year' award. When I look at the list of this year's nominees and past winners, it is a who's who of the industry's leaders," said Su. "AMD is in the middle of an important and comprehensive transformation, but it is very much a team effort. On behalf of the entire AMD team, we very much appreciate the recognition for the work."

Intel is ready with an NUC form-factor system based on its Atom "Bay Trail" SoC. Called the NUC DN2820FYKH, the system runs a Celeron N2820 SoC, which integrates a dual-core 64-bit x86 CPU clocked at 2.40 GHz, and a TDP of under 7.5W. Its board features a single DDR3L SO-DIMM slot, a single SATA 3 Gb/s port, a single USB 3.0 SuperSpeed port, two USB 2.0 ports, HDMI display output, and stereo audio. Network connectivity includes gigabit Ethernet, 802.11 b/g/n WLAN, IrDA, and Bluetooth 4.0. The unit measures 116.6 x 112 x 55 mm, and features a VESA wall-mount, letting you latch it onto your monitor. Intel plans to sell it for US $139.

Here are the first pictures of an AMD A10-7700K "Kaveri" APU with its integrated heat-spreader (IHS, or 'lid') removed. Put next to its predecessors, "Richland," "Trinity," and "Llano," AMD's new APU silicon is its biggest for the DIY PC market, more so because it's built on the 28 nm silicon fab process, compared to its predecessors being built on 32 nm. The die measures roughly 245 mm², and packs a staggering 2.41 billion transistors.

Under the IHS, AMD is using a thermal paste to transport heat from the die, and not a solder. The chip should be easy to de-lid, if you know what you're doing. Kaveri integrates two "Steamroller" x86-64 CPU modules with two cores each, a total of 4 MB of L2 cache, a massive on-die GPU with 512 stream processors based on the Graphics CoreNext micro-architecture, a dual-channel DDR3 IMC with hUMA and DDR3-2400 native support; and a PCI-Express 3.0 root complex.