Power Consumption and Temperatures

The Gigabyte X570S AERO G uses a single heatsink that spans across both VRM sections. With fin stacks underneath, any airflow will help dissipate the thermal build up.



For the Gigabyte X570S AERO G motherboard, one probe is placed along each bank of power stages. A probe is left out to log the ambient temperature as well. For temperature measurement, I use a Reed SD-947 4 channel Data Logging Thermometer paired with four Omega Engineering SA1 self adhesive thermocouple probes. All temperatures are presented as Delta-T which is the recorded temperature minus the ambient temperature as a base. The end result accounts for variation in ambient temperature, including changes over the course of a test.

Prime95's Small FFT is used for maximum power consumption over a 30 minute period. For testing, I used a Ryzen 9 3900X set to 4 GHz and locked at 1.35 V, and 1.15 V for the SoC. Temperatures are logged every second. The results are charted below.


The Gigabyte X570S AERO G performs exceptionally well in the VRM torture test considering the size of the VRM heatsink. It is sufficient for the intended purpose. While overclocking is not suggested for a work computer, the VRM at least will not get thermally out of control. The Prime95 test is designed around the worst-case scenario for every situation. Using this motherboard in a case with exceptionally poor airflow will be mostly okay even it isn't ideal.


Moving onto Cinebench R20, which is also a power-hog, we get to see a more real-world use case plays out. After 30 minutes, VRM temperatures are decent and nearly plateaued by the end.