Tuesday, May 30th 2017
Intel's Skylake-X, Kaby Lake-X HEDT CPUs to use TIM; Won't be Soldered
If you had your eyes on those new Intel HEDT processors, which were posted just today with some... Interesting... price-points, you'll be a little miffed to know that Intel has gone on and done it again. The few cents per unit that soldering the CPU would add to the manufacturing costs of Intel's HEDT processors (starting at $999, tray-friendly prices) could definitely bring the blue giant to the red. As such, the company has decided to do away with solder even on its HEDT line of high-performance, eye-wateringly-expensive CPUs in favor of their dreaded TIM.
The news have been confirmed by der8auer, a renowned overclocker. And as you have probably seen in our own VSG's review (and if you haven't shame on you and click that link right away), delidding Intel's CPU's and ridding them of their TIM can improve temperatures by up to a staggering 21 ºC (case in point, an i7-7700K). And that's a quad-core CPU; imagine an Intel Core i9-7980XE 18-core processor sitting under that TIM, and overclocking it to boot. Those are more than four times the cores under an equally bad thermal interface; add to that the likely presence of a thermally-insulating air-gap, and you can imagine where this is going. If you are planning on going for Intel's HEDT platform, you better take those delidding tools off your shelf.
Update: Check this video here for some more information. Turns out both Skylake-X and Kaby Lake-X will make use of the referred TIM, but Skylake-X dies, which make use of a stacked PCB, won't be deliddable with current tools. A new tool is going to be developed by der8auer alongside ASUS for these chips.
Source:
Overclock 3D
The news have been confirmed by der8auer, a renowned overclocker. And as you have probably seen in our own VSG's review (and if you haven't shame on you and click that link right away), delidding Intel's CPU's and ridding them of their TIM can improve temperatures by up to a staggering 21 ºC (case in point, an i7-7700K). And that's a quad-core CPU; imagine an Intel Core i9-7980XE 18-core processor sitting under that TIM, and overclocking it to boot. Those are more than four times the cores under an equally bad thermal interface; add to that the likely presence of a thermally-insulating air-gap, and you can imagine where this is going. If you are planning on going for Intel's HEDT platform, you better take those delidding tools off your shelf.
Update: Check this video here for some more information. Turns out both Skylake-X and Kaby Lake-X will make use of the referred TIM, but Skylake-X dies, which make use of a stacked PCB, won't be deliddable with current tools. A new tool is going to be developed by der8auer alongside ASUS for these chips.
72 Comments on Intel's Skylake-X, Kaby Lake-X HEDT CPUs to use TIM; Won't be Soldered
Selling expensive HEDT cpus with Donald Duck glue and Scrooge McDuck TIM.
Like making the world's most amazing cake and then taking a sh*t on it before you close the box.
How can you not be amazed by Intel's lack of respect towards their HEDT customers.
Hope AMD is doing a bang up job with their 16 core HEDT and give it to Intel sideways.
What will you do next?
dual socet rack just arrives at IT's office and their first to do, is to pick up deliding tools :rolleyes:go infront of the intel office and scream "shut up and take my money" :laugh:
I belong to you Intel.:love:Because you think i wasn't thinking about Delidding :D that's a priority.
www.overclock3d.net/news/gpu_displays/intel_i7_7700k_temps_lower_by_26_degrees_after_tim_replacement/1
So personally, I won't judge until I see the thermal benchmarks.
What will you do?
Will you buy a delid tool such as der8auer used?
Crazy, that's me;)
Thanks.
But like Rej said, in this category? It's so.. outrageous, it's actually ridiculously funny, lol
Only Intel ^^
I won't say it, as we have preciously sensitive people here finding racism in everything, but i'm thinking of a certain stereotype already. Really fitting; both with Intel and this.. practice, if i can even call it that. Well done folks :)
I was under the assumption there are no cutting corners when it comes to HEDT, ofcourse this is coming from my experienced with previous builds 5930K and 6900K which all worked great with passive cooler (Noctua D14 w/o Fans). Even when overclocked to around +/- 4.4Ghz I never had to use FAN on D14 and now I can do the same with 1800X, all thanks to direct contact between die and HS.
I am being direct but INTEL has a good history of utilizing cheap TIM on their past mainstream CPU's haswell,skylake,kabylake etc.
I had my suspicions when they named it SKY-X instead of SKY-E.