Monday, November 5th 2018

Intel Announces Cascade Lake Advanced Performance and Xeon E-2100

Intel today announced two new members of its Intel Xeon processor portfolio: Cascade Lake advanced performance (expected to be released the first half of 2019) and the Intel Xeon E-2100 processor for entry-level servers (general availability today). These two new product families build upon Intel's foundation of 20 years of Intel Xeon platform leadership and give customers even more flexibility to pick the right solution for their needs.

"We remain highly focused on delivering a wide range of workload-optimized solutions that best meet our customers' system requirements. The addition of Cascade Lake advanced performance CPUs and Xeon E-2100 processors to our Intel Xeon processor lineup once again demonstrates our commitment to delivering performance-optimized solutions to a wide range of customers," said Lisa Spelman, Intel vice president and general manager of Intel Xeon products and data center marketing.
Cascade Lake advanced performance represents a new class of Intel Xeon Scalable processors designed for the most demanding high-performance computing (HPC), artificial intelligence (AI) and infrastructure-as-a-service (IaaS) workloads. The processor incorporates a performance optimized multi-chip package to deliver up to 48 cores per CPU and 12 DDR4 memory channels per socket. Intel shared initial details of the processor in advance of the Supercomputing 2018 conference to provide further insight to the company's extended innovations in workload types.

Cascade Lake advanced performance processors are expected to continue Intel's focus on offering workload-optimized performance leadership by delivering both core CPU performance gains1 and leadership in memory bandwidth constrained workloads. Performance estimations include:
  • Linpack up to 1.21x versus Intel Xeon Scalable 8180 processor and 3.4x versus AMD EPYC 7601
  • Stream Triad up to 1.83x versus Intel Scalable 8180 processor and 1.3x versus AMD EPYC 7601
  • AI/Deep Learning Inference up to 17x images-per-second2 versus Intel Xeon Platinum processor at launch.
Intel SGX on the Intel Xeon E-2100 processor family delivers hardware-based security and manageability features to further secure customer data and applications. This feature is currently unique to the Intel Xeon E processor family and allows new entry-level servers featuring an Intel Xeon E-2100 processor to provide an additional layer of hardware-enhanced security measures when used with properly enabled cloud applications.
The Xeon E-2100 processor is targeted at small- and medium-size businesses and cloud service providers. The processor supports workloads suitable for entry-level servers, but also has applicability across all computing segments requiring enhanced data protections for the most sensitive workloads.
Small businesses deploying Intel Xeon E-2100 processor-based servers will benefit from the processor's enhanced performance and data security. They will allow businesses to operate smoothly by supporting the latest file-sharing, storage and backup, virtualization, and employee productivity solutions.
Intel Xeon E-2100 processors are available today through Intel and leading distributors.
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36 Comments on Intel Announces Cascade Lake Advanced Performance and Xeon E-2100

#26
jmcosta
m4dn355

G̶l̶u̶e̶l̶e̶s̶s̶ ̶D̶e̶s̶i̶g̶n̶
There are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.
Posted on Reply
#27
xorbe
When did the term mcm become mcp.
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#28
R0H1T
jmcostaThere are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.
Unlikely, they made EMIB for that & this one doesn't even use EMIB. It will in all likelihood be a worse glued together solution than AMD EPYCs & then there's Rome, Intel's in a potential downward spiral atm & this looks nothing short of a desperate move.
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#29
m4dn355
jmcostaThere are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.
Technique of gluing together dies, what's next in intel's hypocrisy agenda - intel fabric?!
Posted on Reply
#30
mat9v
m4dn355Technique of gluing together dies, what's next in intel's hypocrisy agenda - intel fabric?!
Well, they have UPI with roughly the same throughput as external IF links, so...
But, yeah, they will have to come up with some high bandwidth bus to connect future MCM products and it will be similar to IF :) and it will be internal to their chips. Unless they will do some serious magic with Mesh topology like it is rumored EPYC2 is using.
Posted on Reply
#31
Mysteoa
Its possible that Cascade Lake doesn't have HT, because I don't think they will be able to power and cool it if it had HT.
Posted on Reply
#32
jigar2speed
If 48 is the best Intel can do right now, they are toast against 64 core EYPC that should be announced today. Oh and don't forget the price, performance and watt usage.
Posted on Reply
#33
Xajel
Oooh, finally they hired a good glue expert.
Posted on Reply
#34
phill
It's like everything for guys, higher numbers always equals better....
Posted on Reply
#35
Aquinus
Resident Wat-man
yakkDamage control PR & Marketing in the professional server space is much less effective than in the less informed customer market.

Although buying corporate customers still works, AMD EPYC is flying past intel.
You mean like how you can spin up VMs using EPYC hardware at AWS now?

Put that into perspective for a moment. Amazon was exclusively Intel and now they're including AMD as an option for VMs in AWS. The more companies like Amazon that do that, the more it's going to hurt Intel. Intel has a stranglehold on the server market, but that also means that they have the most to lose.
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#36
Unregistered
AquinusYou mean like how you can spin up VMs using EPYC hardware at AWS now?

Put that into perspective for a moment. Amazon was exclusively Intel and now they're including AMD as an option for VMs in AWS. The more companies like Amazon that do that, the more it's going to hurt Intel. Intel has a stranglehold on the server market, but that also means that they have the most to lose.
Indeed AWS is a big crack in the intel wall. Also HPE, Oracle, and even Dell went on the record with a VP giving a small video blurb. Admittedly Dell probably just did that video to distance themselves from any more collusion accusations with intel... again. Doubt much will come out of that in the short or medium term. But still, AMD was able to create their own opening here through great engineering, not questionable deals. Now AMD needs to work out and emphasize a TCO (total cost of ownership) offer corporations just can't refuse, even if possibly indirectly bribed to do so.
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