Friday, June 10th 2022
AMD RDNA3 Offers Over 50% Perf/Watt Uplift Akin to RDNA2 vs. RDNA; RDNA4 Announced
AMD in its 2022 Financial Analyst Day presentation claimed that it will repeat the over-50% generational performance/Watt uplift feat with the upcoming RDNA3 graphics architecture. This would be a repeat of the unexpected return to the high-end and enthusiast market-segments of AMD Radeon, thanks to the 50% performance/Watt uplift of the RDNA2 graphics architecture over RDNA. The company also broadly detailed the various new specifications of RDNA3 that make this possible.
To begin with, RDNA3 debuts on the TSMC N5 (5 nm) silicon fabrication node, and will debut a chiplet-based approach that's somewhat analogous to what AMD did with its 2nd Gen EPYC "Rome" and 3rd Gen Ryzen "Matisse" processors. Chiplets packed with the GPU's main number-crunching and 3D rendering machinery will make up chiplets, while the I/O components, such as memory controllers, display controllers, media engines, etc., will sit on a separate die. Scaling up the logic dies will result in a higher segment ASIC.AMD also stated that it has re-architected the compute unit with RDNA3 to increase its IPC. The graphics pipeline is bound to get certain major changes, too. The company is doubling down on its Infinity Cache on-die cache memory technology, with RDNA3 featuring the next-generation Infinity Cache (which probably operates at higher bandwidths).
From the looks of it, RDNA3 will be exclusively based on 5 nm, and the company announced, for the very first time, the new RDNA4 graphics architecture. It shared no details about RDNA4, except that it will be based on a more advanced node than 5 nm.
AMD RDNA3 is expected to debut in the second half of 2022, with ramp across 2023. RDNA4 is slated for some time in 2024.
To begin with, RDNA3 debuts on the TSMC N5 (5 nm) silicon fabrication node, and will debut a chiplet-based approach that's somewhat analogous to what AMD did with its 2nd Gen EPYC "Rome" and 3rd Gen Ryzen "Matisse" processors. Chiplets packed with the GPU's main number-crunching and 3D rendering machinery will make up chiplets, while the I/O components, such as memory controllers, display controllers, media engines, etc., will sit on a separate die. Scaling up the logic dies will result in a higher segment ASIC.AMD also stated that it has re-architected the compute unit with RDNA3 to increase its IPC. The graphics pipeline is bound to get certain major changes, too. The company is doubling down on its Infinity Cache on-die cache memory technology, with RDNA3 featuring the next-generation Infinity Cache (which probably operates at higher bandwidths).
From the looks of it, RDNA3 will be exclusively based on 5 nm, and the company announced, for the very first time, the new RDNA4 graphics architecture. It shared no details about RDNA4, except that it will be based on a more advanced node than 5 nm.
AMD RDNA3 is expected to debut in the second half of 2022, with ramp across 2023. RDNA4 is slated for some time in 2024.
121 Comments on AMD RDNA3 Offers Over 50% Perf/Watt Uplift Akin to RDNA2 vs. RDNA; RDNA4 Announced
And please don't cut the audio. I actually use it! Almost everyone who HDMI-outs to a TV uses GPU audio.
I was thinking more along the lines of 100w chip split into two 50w chips and a 50% efficiency uplift on each. across. If you take 50% efficiency uplift on each chip you end up at 2x performance at the same wattage. There approximately 1/6 die size reduction as well from 6nm to 5nm so if that were linear and it's not exactly that simple, but you'd end up with a 50w part consuming more like 41.66w each instead or 83.34w in total. That leaves like 16.66w to account for or efficiency power per watt.
You also have double the infinity fabric cache and we've seen measurable gains in efficiency thru that. Plus AMD indicated architectural optimization improvements over RDNA2 whatever that implies. For gaming it's hard to say and probably some stuff to do with variable rate shading/upscale/compression and overall configuration balance between TMU's/ROPs and so on scaling. You've also got memory performance and efficiency uplift isn't standing still either. Simply put there are plenty of possible ways AMD can extract further performance and efficiency to reach that target figure.
Heat concentration will be worse in a square die versus that same die chopped in two and elongated to form more of a rectangle in series with each other that can spread heat better w/o contending with hot spots. The whole GPU/CPU heat concentration thing is entirely irrelevant to any of that. The issue is hot spots are easier to tackle and deal with by cutting them in half and elongating heat dispersion. It's like taking a bed of coals in a wood stove or camp fire if you spread them out it'll burn out/cool down more quickly. In this instance you're spreading heat to the IHS and coolers mounting surface in turn.
Power savings a p-state could control one of the two dies to turn it off or place it into a deeper sleep power savings mode below a given work threshold. Additionally it could do something like Ethernet flow control and auto negotiate round-robin deep sleep between each of the GPU die's when it goes below thresholds. Basically they can modulate between the two chip dies for power savings and better heat dispersion between them to negate throttling under heavier workloads leading to more even sustained boost performance.
You reach a saturation point naturally full load like you would with water cooling and ambient temperature rise or any cooling really in regard to cooling TDP effectiveness, but you get there more slowly and have more evenly distributed performance along the way.
In terms of fans idk, but GPU Power Level goes up about 1% and Total Power Level goes up about 3% if if I change my GPU's fan speed from 45% to 100% according to NVIDIA Inspector's readings. I could've sworn it can even play a role in boost clocks in some instances. The power has to come from either PCIE bus or PCIE power connector in either case and will attribute some to warming the PCB in turn due to higher current.
I could've sworn there were instances with Maxwell where if you lower fan RPM's sometimes you can end up with a better boost clock performance than cranking the fan RPM's to 100% contrary to what you'd expect. That's in regard to fairly strict power limits though with a undervolt and overclock scenario to extract better performance per watt. The overall jist of it was fan speed power eats into the boost speeds expected power drawn within the power limits imposed.
In terms of worse RNDA2 SKU's from a balance standpoint with where they are positioned performance and cost consideration wise 6500XT and 6650XT are two of the worst. That unofficial 6700 non XT was done for a reason the 6650XT is a pitiful uplift over the 6600XT and between the 6700XT so it basically better fills that gap not that it's a heck of a lot better. From a performance standpoint it does a better job fill the gap from a price one I didn't check. The 6400XT isn't so bad the PCIE x4 matter is less problematic with it given the further cut down design it doesn't suffocate it quite the same way.
I guess it will be like this:
*not really
They did it twice over the last 3 years, I don't get what is hard to belive.
AMD don't seem to excessively puff up their numbers so I see no reason why this >50% perf / watt claim should not be believed.
It seems like there are a lot of tangible ways they might extract a bit more performance or efficiency potentially depending on how the I/O can sync and leverage it. It's basically a dedicated sequencer for how the GPU operates with low latency chips closely connected to it.
AMD: TSMC 7nm
nVidia: Samsung 8nm
Next
AMD and nVidia: TSMC 5nm
I expect nVidia to keep the advantage in RT and consolidate its advantage with DLSS.
Remember that an nVidia card also supports FSR. The two technologies practically keep the old Turing alive.
As for most of the rest of what you're saying here, it would be incredibly expensive (taping out two different dice, possibly using different libraries) for very little benefit. Double precision FP doesn't matter for consumers. Sure, they have a node advantage, but what you're doing here is essentially hand-waving away the massive efficiency improvements AMD has delivered over the past few generations. Remember, back when both were on 14/16nm, Nvidia was miles ahead, with a significant architectural efficiency lead. Now, AMD has a minor node advantage but also crucially has caught up in terms of architectural efficiency - TSMC 7nm is better than Samsung 8nm, but not by that much. And they're then promising another >50% perf/W increase on top of that, while Nvidia is uncharacteristically quiet.
www.notebookcheck.net/AMD-is-expecting-the-next-gen-RDNA-3-GPUs-scheduled-for-2021-to-deliver-50-improved-performance-per-watt-over-the-new-RX-6000-series.503412.0.html
Although we still don't know many details (chiplets, gpu & memory frequencies etc.) so i will be updating the below sometime in the future when more info becomes known, my current hypothesis is the below :
I meant Navi32-8192 instead of Navi31-8192
It is when I try to connect the notebook to the UHD 4K TV using the HDMI cable. There is never sound via that cable. Yes, for cut down Navi 31 that would be terrible performance causing lack of sense to launch such a version, completely..
Fixed it for you:
Below the table without the MS Paint job (thanks btw!)