Thursday, January 12th 2023

EK Announces Direct Die Cooling for Intel 12th and 13th Gen Core Processors

EK, the premium liquid cooling hardware manufacturer, is launching the Direct Die product series aimed at delidding and achieving the ultimate cooling of the LGA 1700 socket-based Intel CPUs from the 12th generation Alder Lake and 13th gen Raptor Lake families. Kitguru teamed up with EK to investigate the potential benefits of direct die cooling for Intel's Alder Lake CPUs to achieve the best possible thermal performance on a daily basis. After publishing the first video announcing this collaboration, EK was overwhelmed by the response from Kitguru's audience. In order to bring these products to market, EK reached out to Der8auer, a renowned expert in delidding and direct die applications.

EK has prepared a total of four products to start this Direct Die series: two CPU water blocks (one Limited Edition), a delidding tool, and an upgrade kit for existing EK-Quantum Vector² LGA1700 water blocks. So far, these products are aimed at Intel's LGA1700 socket and 12th and 13th-generation Intel Core CPUs. Delidding is the process of removing the integrated heatspreader (IHS) to reduce the distance between the CPU core die and the coldplate of the CPU cooler. Another benefit involves the removal of an entire layer of thermal transfer from the CPU die to the IHS. The delidding process enables a direct heat transfer from the CPU core to the water block. All this results in a significant reduction in overall thermals and less thermal difference between CPU cores. The procedure is typically performed by experienced enthusiasts because it involves a physical modification of the product that voids the CPU warranty. For a more in-depth explanation, please refer to this EK's blog post on delidding.
EK-Quantum Velocity² Direct Die D-RGB - 1700 Limited Edition
This limited edition of the Direct Die Velocity² CPU water block has a unique brass top that gets nickel- and subsequently gold-plated. The top of each water block features a specific pattern to distinguish it as a genuine limited-edition product. Only a hundred pieces are being made, each featuring a unique ordinal number from 1 to 100.

This package already includes everything you need to perform the delidding process on your CPU and cool it in a direct die manner.

It contains:
  • EK-Quantum Velocity² Direct Die D-RGB - 1700 Limited Edition CPU water block
  • Delidding tool for 12th and 13th generation Intel Core CPUs
  • EK-Exact Mount and ILM replacement die guard for direct die cooling
  • Liquid metal - Thermal Grizzly Conductonaut
  • Two foams for preventing liquid metal spillage
The microfin stack surface is reduced and focused toward the center where the CPU die is located. There is no Integrated heatspreader, so heat density will be significantly higher in this location. The base is thicker to further improve cooling and the ability to absorb heat and transfer it to the coolant.

The microfins also go deeper into the coldplate, reaching even closer to the core. The jetplate has a geometry designed to focus on the center of the fin stack with a very high flow rate and even lower restriction than a regular jetplate. A highly compressible foam frame is also added to ensure your liquid metal application doesn't spread over to surface-mounted components on the CPU and cause a short. A secondary purpose is that it also protects the ILM replacement frame made of anodized aluminium. The ILM frame is insulated toward the motherboard to prevent any shorts. The Thermal Grizzly Conductonaut is included in the package.

The block uses a modified EK-Exact Mount to account for the ILM replacement frame that also acts as a die-guard. The backplate is insulated via both anodization and a polycarbonate sheet from the motherboard components.

The coldplate is manufactured out of the highest-grade 99.99%-pure electrolytic copper, machined with precision for the best possible contact and heat transfer. The coldplate is further nickel-plated, while the top of the water block is made of CNC-machined cast acrylic.

EK-Quantum Velocity² Direct Die D-RGB - 1700 Nickel + Plexi
From the front, the water block looks like a regular Velocity² CPU LGA 1700, but it shares some of its parts with the Limited Edition Direct Die gold water block.

It contains:
  • EK-Quantum Velocity² Direct Die D-RGB - 1700 Nickel + Plexi water block
  • EK-Exact Mount and ILM replacement die guard for direct die cooling
  • Liquid metal - Thermal Grizzly Conductonaut
  • Two foams for preventing liquid metal spillage
It uses the same modified coldplate with the microfin stack reduced in surface that focuses coolant toward the center where the CPU die is located.

The block uses a modified EK-Exact Mount to account for the ILM replacement frame that also acts as a die-guard. The backplate is insulated via both anodization and a polycarbonate sheet from the motherboard components.

The coldplate is manufactured out of the highest-grade 99.99%-pure electrolytic copper, machined with precision for the best possible contact and heat transfer. The coldplate is then further nickel-plated, while the top of the water block is made of CNC-machined cast acrylic.

EK-Quantum Velocity² IHS Removal Tool - 1700
This is a delidding or IHS removal tool. It allows users to remove the Integrated heatspreader (IHS) from their CPUs and directly cool the CPU die. It is a safe, easy, quick, and ultimately practical way of removing the IHS. While the IHS and CPU Die look flat to the human eye, the surface is actually very uneven.

Thermal compounds are used to fill the gaps between the CPU and IHS surfaces. But even with high-quality thermal compounds and even solder, it still accounts for an additional layer before reaching the cooler, resulting in reduced cooling efficiency. Additionally, the silicone adhesive that "glues" the IHS to the CPU can make a larger gap between them and further decrease the thermal transfer efficiency.

EK focused on the tool's safety to prevent users from damaging their valuable 12th and 13th-gen Intel CPUs. Using the tool is basically slotting the CPU into the device, making sure to align the triangle on the CPU with the triangle marker of the tool, and turning the attached screw.

The delidding tool is made of black-anodized aluminium and produced under license from Der8auer.

EK-Quantum Velocity² Direct Die - 1700 Upgrade Kit
This upgrade or conversion kit converts your existing EK-Quantum Velocity² 1700 CPU water block into an LGA1700 direct die cooling product.

It consists of a replacement coldplate, jetplate, a new set of screws, and a black-anodized backplate with an attached ILM Direct Die replacement frame.

EK also has a special product that is not meant for direct die cooling but for regular water blocks. It is a contact frame, or more precisely, the EK-Quantum Velocity² ILM Replacement - 1700. This product bolsters the structural rigidity of the socket, motherboard, and even the CPU. Its primary use is to improve cooling efficiency as the contact area is more suitable and even more pressure is applied to the center where the heat source from the CPU die comes from.

This product has been developed with the famous German overclocker, Der8auer.

EK-Matrix7
The EK-Quantum Velocity² is an EK-Matrix7-certified product. The EK-Matrix7 is a convenient product raster that adds a new dimension to PC liquid cooling, where increments of 7 mm manage the height of products and the distance between ports. This improves product alignment and reduces the time spent planning the loop and bending tubes. Through the meticulous planning of our products, building a liquid-cooled PC becomes easy and fun, just like toy bricks.

Compatibility
The new EK-Quantum Velocity² direct die product series is socket-specific, compatible only with Intel LGA 1700 sockets and Alder and Raptor Lake CPUs.

Availability and Pricing
The products from the Direct Die series are made in Slovenia, Europe and are available for pre-order through the EK Webshop and Partner Reseller Network. These products are expected to start shipping in mid-February 2023. The table below shows the manufacturer's suggested retail price (MSRP) with VAT included.
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45 Comments on EK Announces Direct Die Cooling for Intel 12th and 13th Gen Core Processors

#26
Eliad Buchnik
Vya DomusUhm...

What ?
What he meant to say there are low-power variants, and it is not just an Intel issue but also AMD.
As a matter of fact, we are long away from the days when top power consumption was in the 90s of watts.
The improvement in manufacturing is not as it used to be, and it affects power consumption as well.
Just to clarify something - you can cut the power consumption by a lot if you limit it, it would just cost you a few 100s of Mhz from the CPU frequency.
In other words, modern CPUs are pushed beyond the point of diminishing returns so they could be more competitive.
Posted on Reply
#27
VSG
Editor, Reviews & News
maxflySweet idea but damn the price is stupid. $75 for the ihs removal tool? Wtaf? 2 bills for the plastic block? Nope. Won't do plexi topped EK CPU blocks again. Never want to hear that awful CRACK again.

If our man @VSG was able to keep the Velocity2 he reviewed we might be able to see some reviews nonetheless. I'd still like to see what kind of temp drops you might get with say a 13700k...aw hell. Does VSG have AM4 or 1700?
I have the block but no spare CPU to de-lid to be honest. The I9-12900K I used for recent CPU block reviews is a loaner from Intel so I can't just remove the IHS. I did do something similar on an older CPU with my personal CPU though: www.techpowerup.com/review/delidding-the-intel-core-i7-7700k/
Posted on Reply
#28
skizzo
so $75 for the delidder seems like a kick in the nuts. I used to stick CPUs in one of my vices so one side is against I guess PCB and the other side against just the IHS and then tighten the shit outta them until POP goes the IHS lol
Posted on Reply
#29
JustBenching
Vya DomusUhm...

What ?
What part of "Intel has a 24core 35w CPU called 13900t" did you not understand? You are repeating the same nonsense in every intel and nvdia thread. CPUs and GPUs draw as much power as you allow them to. You dont want your 13900k to draw 500 watts and require a direct die? GREAT, power limit it to 125 watts. Problem solved
Posted on Reply
#30
ThrashZone
Eliad BuchnikI have, the big issue with monoblock is the VRM section and the fact it forces you to completely disassemble the motherboard to install/uninstall the monoblock.
This might not be the case.
Hi,
Yep if one doesn't cut part of the back of the case so they can get to the vrm screws "been there and done this just to change thermal paste lol" yes you have to remove the board to install and uninstall
This is definitely not an issue with the ek block this thread is about.

Not directed to you EB,
It's just surprising so many have focused more to the words "mono block" rather than "style mount" the later is what I was referring to because they both share this similarity
Owe well you can lead a horse to water but can't fores them to drink :cool:
Posted on Reply
#31
ZoneDymo
fevgatosWhat part of "Intel has a 24core 35w CPU called 13900t" did you not understand? You are repeating the same nonsense in every intel and nvdia thread. CPUs and GPUs draw as much power as you allow them to. You dont want your 13900k to draw 500 watts and require a direct die? GREAT, power limit it to 125 watts. Problem solved
The problem is that you make it a versus argument.... Read their original statement again and you will hopefully notice they were talking about CPUs in general and Intel was never mentioned....sooo yeah...
Posted on Reply
#32
Totally
ThrashZoneHi,
Never installed a mono block have you :laugh:
I have 2 installed and in use and a third that's just collecting dust. A Monoblock just combined two separate blocks (vrm and cpu) into one MONOlithic waterBLOCK. "Mount style" are you referring to stand-offs? The things just a very large number tower heatsinks, non-cpu waterblocks use to mount to the mobo?
Posted on Reply
#33
MKRonin
Can someone define the term "product raster" for me?
Posted on Reply
#34
The Von Matrices
How does such a delidding tool even work? I thought that the IHS was soldered so you would have to heat it up, and that would melt the plastic.
Posted on Reply
#35
Solaris17
Super Dainty Moderator
The Von MatricesHow does such a delidding tool even work? I thought that the IHS was soldered so you would have to heat it up, and that would melt the plastic.
You pre-heat then remove though I dont know about the KS (should in a few days) in any case with the rokitcool it doesnt hurt them. Its not like 2ltr soda plastic. It can take the contact heat.
Posted on Reply
#36
ThrashZone
The Von MatricesHow does such a delidding tool even work? I thought that the IHS was soldered so you would have to heat it up, and that would melt the plastic.
Hi,
Well it's a slow process
The delid tool only pushes the top a little bit
Then you remove the chip and flip the chip and repeat and it can take more than a few flips before the solder breaks loose enough to be removed.

Then you remove the solder.
Posted on Reply
#37
Chaitanya
Dyatlov ALooks very well and if Drausser is involved it can only be very good. Hope we can see some reviews soon too.
Here you go, Der8auers review:
Posted on Reply
#38
Ahhzz
Stick to the OT, everyone. Quit carrying on petty little bickerings all over the forums, and start acting like you've not actually just stepped off the playground.
Posted on Reply
#39
Durvelle27
Has delidding gotten easier

I remember a time when it was make it or break it
Posted on Reply
#40
Solaris17
Super Dainty Moderator
Durvelle27Has delidding gotten easier

I remember a time when it was make it or break it
You can still break it. For these chips you have to pre-heat them.
Posted on Reply
#41
Durvelle27
Solaris17You can still break it. For these chips you have to pre-heat them.
Didn't all of them require pre-heating to soften bonding material. I think the biggest problem was damaging transistors or cracking the die.
Posted on Reply
#42
Solaris17
Super Dainty Moderator
Durvelle27Didn't all of them require pre-heating to soften bonding material. I think the biggest problem was damaging transistors or cracking the die.
It was and there are still really close.
Posted on Reply
#43
Durvelle27
Solaris17It was and there are still really close.
Times have truly changed
Posted on Reply
#44
ThrashZone
Hi,
Yep no more pigeon poop "thermal paste" inside anymore :laugh:
Posted on Reply
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