Tuesday, December 12th 2023
DNP Develops Photomask Process for 3nm EUV Lithography
Dai Nippon Printing Co., Ltd. (DNP) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography process that supports Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
Background
DNP has continually responded to the demands of semiconductor manufacturers in terms of performance and quality. In 2016, we became the world's first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW). In 2020, we developed a photomask manufacturing process for 5 nm EUV lithography processes, and have been supplying masks that meet the needs of the semiconductor market. In this latest development, in order to meet the needs of further miniaturization, we have developed a photomask for EUV lithography capable of supporting 3 nm processes.
Summary
DNP will provide the newly developed photomask capable of supporting 3 nm EUV lithography to semiconductor related manufacturers throughout the world. In addition, we will also support the development of peripheral technologies for EUV lithography, aiming for annual sales of 10 billion yen in 2030.
Through joint development with partners, such as imec, DNP will continue to develop more advanced photomasks capable of supporting processes finer than 3 nm and even beyond 2 nm.
Source:
DNP
Background
DNP has continually responded to the demands of semiconductor manufacturers in terms of performance and quality. In 2016, we became the world's first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW). In 2020, we developed a photomask manufacturing process for 5 nm EUV lithography processes, and have been supplying masks that meet the needs of the semiconductor market. In this latest development, in order to meet the needs of further miniaturization, we have developed a photomask for EUV lithography capable of supporting 3 nm processes.
- MBMW introduced by DNP in 2016 is capable of irradiating with approximately 260,000 electron beams, and can significantly shorten the lithography time even with complex pattern shapes. On this occasion, we have improved the manufacturing process by leveraging the characteristics of the equipment, while optimizing the data correction technology and processing conditions to match the complex curved pattern structure of photomask for EUV lithography.
- DNP has installed a new MBMW, and plans to commence operations in the second half of 2024. We will also strengthen our support for semiconductor manufacturing in advanced areas such as photomasks for EUV lithography.
- DNP will promote joint development of EUV photomasks for next-generation EUV exposure equipment with Interuniversity Microelectronics Center (imec), a cutting-edge international research organization headquartered in Belgium.
DNP will provide the newly developed photomask capable of supporting 3 nm EUV lithography to semiconductor related manufacturers throughout the world. In addition, we will also support the development of peripheral technologies for EUV lithography, aiming for annual sales of 10 billion yen in 2030.
Through joint development with partners, such as imec, DNP will continue to develop more advanced photomasks capable of supporting processes finer than 3 nm and even beyond 2 nm.
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