Thursday, May 23rd 2024
Next Crop of MSI Project Zero Motherboards to Implement CAMM2 DDR5 Memory
The CAMM2 and LPCAMM2 form-factors were originally designed for thin-and-light notebooks, to provide them with memory replacements/upgrades without compromising on the Z-Height tolerances of the device's design. It looks like MSI sees a future for the CAMM2 form-factor on desktops, specifically the ones without cables sticking out. The company's next round of motherboards under its Project Zero banner will replace the conventional DDR5 DIMM slots with DDR5 CAMM2 slots. The company is joining forces with Kingston Technology for the effort.
Kingston is readying a new line of performance-segment CAMM2 modules under its FURY Impact brand that it originally uses for performance SO-DIMMs meant for gaming notebooks. MSI's next-gen Project Zero motherboard features contact points for a DDR5 CAMM2 module. A single CAMM2 module utilizes the entire 160-bit memory bus width of the Socket LGA1700 processor (that's both channels and their sub-channels). Kingston may release CAMM2 modules for most common memory sizes (such as 32 GB, 48 GB, 64 GB, and 96 GB), and most common DDR5 OC speeds for the platform (ranging between DDR5-6000 and DDR5-8000).
Kingston is readying a new line of performance-segment CAMM2 modules under its FURY Impact brand that it originally uses for performance SO-DIMMs meant for gaming notebooks. MSI's next-gen Project Zero motherboard features contact points for a DDR5 CAMM2 module. A single CAMM2 module utilizes the entire 160-bit memory bus width of the Socket LGA1700 processor (that's both channels and their sub-channels). Kingston may release CAMM2 modules for most common memory sizes (such as 32 GB, 48 GB, 64 GB, and 96 GB), and most common DDR5 OC speeds for the platform (ranging between DDR5-6000 and DDR5-8000).
44 Comments on Next Crop of MSI Project Zero Motherboards to Implement CAMM2 DDR5 Memory
In general, PC performance is limited by the amount of heat you can comfortably dissipate, assuming you're not limited by power.
If you ever overclocked sams b-die, you would have known that that kind of stuff is exactly what you want. If I could easy attach a cpu cooler to my memory, I would have actually done it.
Slow access to memory is number one case of frame stutter in games. That's the reason X3D cpu's are so good for gaming, they alleviate the slow speed of main mem.
I'm a big proponent of 'don't mess with standards that work.' but... I have to agree. At this point though, it'd be a hellova shakeup to the industry to try and change that.
Years ago, Intel tried w/ BTX, (AFAIK) pretty much only Dell was fully on-boarded.
And I can tell you that they don't even discuss this stuff between themselves, as that would be to give in to the competition according to the Taiwanese mentality on this kind of stuff.
Trust me, I have tried to talk to these companies. Shuttle as well, plus some others. The issue wasn't the BTX form factor, but rather the size of the coolers that killed it, oh and the fact that it was for OEM/ODMs only, not DIY.
Threw this up as well, for those that wants some more CAMM2/LPCAMM2 action.
www.techpowerup.com/322754/lpddr6-lpcamm2-pictured-and-detailed-courtesy-of-jedec
The location of ICs and designation of which/what area of the module is which “channel” seems like trace length to each individual ic on each channel will have a higher variation; that can’t be good for signal integrity.
Then partner with Noctua or Cooler Master to get out a larger down-blowing cooler that can cool the VRMs, VRM heatsinks, and upper CAMMs in addition to cooling the CPU, while also having a larger heatsink. Depending on the size of the theoretical mobo and the CAMM types chosen, it might even be possible to make a 240mm long down-blowing cooler that accommodates 2 120mm fans.
Gotta applaud the realism
Despite how ironic and strange this sounds, the CAMM2 modules have more luck to being cooled in laptops, both due and despite the space constrains.