Monday, January 6th 2025
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Intel "Panther Lake" Confirmed for 2025 Launch, Based on Intel 18A Node
Intel at its 2025 International CES keynote unveiled its next-generation mobile processor, codenamed "Panther Lake." Intel confirmed that the chip will be built on its homebrew Intel 18A foundry node. The current "Lunar Lake" and "Arrow Lake" processors see the company leverage TSMC N3 node for the Compute tiles. "Panther Lake" would see the x86-64 core IP return to an Intel node. "Panther Lake" is rumored to combine next-generation "Cougar Cove" P-cores with existing "Skymont" E-cores both in the Compute complex, and in the SoC tile as low-power island E-cores. "Panther Lake" is expected to debut in the second half of 2025.
9 Comments on Intel "Panther Lake" Confirmed for 2025 Launch, Based on Intel 18A Node
ARL has the "old" inneficient long latency design probably because of the last minute move from Intel 2 to TSMC N3, as a stop gap solution.
No reason it is retained in Panther Lake. But we ll see.
I surely hope the comparison to Lunar Lake isn't an indicator of this being just another boring mobile platform with tiny bursts of performance. Porting a design to a new node is most certainly not a "last minute move", especially a totally different type of node which will require a lot of different implementations. This move was planned out years in advance.
Look at 15th gen and their own wrong assumptions of their own product.
It did not deliver what all other intel personell believed to be true.
My respect to their interim CEOs but what can they do if they are beeing lied to by their own treams concerning progress.
So let´s wait and see.
Good luck!
Pat knows intel 20A may not be ready.
Hence he said:
have a plan B ready.
Plan B uses the already designed meteor lake , except 1 tiles redesigned, the CPU tile with TSMC N3.
So they may have been ready with 2 designs, and "last minute" (probably begining of 2024?) commit to the suboptimal N3 route.
That's why ARL design is suboptimal, with the old and ineficient meteor lake design.
(If it were up to me, they should even tape out multiple more ambitous designs too)
There is still a challenge though, wafers are usually reserved years in advance, at least if they want a decent price. So they might have to pay a hefty premium to TSMC if they want a "last minute" scaling of a backup plan, or there might not even be more free capacity available. This is also one of the many advantages of Intel owning their own foundries. And even though they may take a few iterations to get their node right sometimes, they usually make much larger and ambitious improvements and iterate their nodes more than TSMC, and as we saw with the "disastrous" 10 nm, they managed to achieve some impressive performance (especially for large dies) eventually.