Wednesday, August 20th 2008
Intel Demonstrates Centrino 3 Mobile Platform
We are barely months into having Centrino 2 laptops at the store, following delays of six weeks with its launch owing to last minute glitches with its integrated graphics (IGP), and Intel has already demonstrated a Nehalem-based mobile computing platform at the ongoing Intel Developer Forum (IDF). This mobile computing platform for now can be loosely called a prelude to the successor of Centrino 2, it is codenamed Calpella.
The platform will be using dual-core and quad-core CPUs codenamed Auburndale and Clarksfield respectively. Intel set-up a Clarksfield validation platform with the mobile Nehalem in situ. The size of the active cooler explains a lot, and that's a quad-core chip we're talking about. It wouldn't be too far sighted telling that by this time, next year high-end laptops will be equipped with an 8-thread-capable Nehalem mobile CPU.
Source:
Hexus.net
The platform will be using dual-core and quad-core CPUs codenamed Auburndale and Clarksfield respectively. Intel set-up a Clarksfield validation platform with the mobile Nehalem in situ. The size of the active cooler explains a lot, and that's a quad-core chip we're talking about. It wouldn't be too far sighted telling that by this time, next year high-end laptops will be equipped with an 8-thread-capable Nehalem mobile CPU.
5 Comments on Intel Demonstrates Centrino 3 Mobile Platform
And is it just me, or when you're demoing a notebook chipset, is it wise to be using both discrete graphics and storage controllers? Doesn't speak well of its onboard capabilities thusfar... I mean, the fact that they're even calling this a validation of a "mobile" chipset is a little unjustified.