Bethesda today released the final system requirements for its upcoming massacre-fest Doom Eternal. The game, which is geared for release just 10 days from now (March 20th), promises to be one of the most impressive (and fluid) games in recent times, if the original, modern Doom is anything to go by.

Bethesda has even gone so far so as to list preferred specs for gamers that want to play in 4K at 60 FPS or in 1440p at 120 FPS: and these are pretty abusive, with an NVIDIA GeForce RTX 2080 Ti being required - likely because of its gargantuan 11 GB VRAM. AMD's Ryzen 7 3700X or Intel's Core i9-9900K are the requirements here, alongside 16 GB of system RAM. Check after the break for a breakdown on recommended specs for other resolutions and quality settings, and for Bethesda's trailer showing off customization options for your DOOM slayer. Do you have what it takes to run the game?

The B550 chipset has been absent for a while, meaning that mid-tier motherboard models were lacking and that space is about to be filled. So far, the only thing we got was a B550A chipset, which lacked proper support for PCIe 4.0 connection, based on the refreshed B450 chipset. The B550A supports only one PCIe 4.0 slot, the one connected directly to CPU, while the regular, non-A version is said to deliver proper PCIe 4.0 configuration. The first picture of AMD's upcoming B550 motherboard has appeared.

Thanks to the findings of VideoCardz, we have a picture of a B550 motherboard manufactured by SOYO, a Chinese motherboard manufacturer, and the brand behind Maxsun. Pictured below is a Micro-ATX format motherboard featuring two x16 PCIe 4.0 slots and one smaller, x1 slot. There are two DDR4 slots, along with M.2 PCIe 4.0 connector. Additionally, it has some interesting dragon-inspired masking as well.

Cybersecurity researcher Moritz Lipp and his colleagues from the Graz University of Technology and the University of Rennes uncovered two new security vulnerabilities affecting all AMD CPU microarchitectures going back to 2011, detailed in a research paper titled "Take A Way." These include "Bulldozer" and its derivatives ("Piledriver," "Excavator," etc.,) and the newer "Zen," "Zen+," and "Zen 2" microarchitectures. The vulnerabilities are specific to AMD's proprietary L1D cache way predictor component. It is described in the security paper's abstract as a means for the processor to "predict in which cache way a certain address is located, so that consequently only that way is accessed, reducing the processor's power consumption."

By reverse engineering the L1D cache way predictor in AMD microarchitectures dating from 2011 to 2019, Lipp, et al, discovered two new attack vectors with which an attacker can monitor the victim's memory accesses. These vectors are named "Collide+Probe," and "Load+Reload." The paper describes the first vector as follows: "With Collide+Probe, an attacker can monitor a victim's memory accesses without knowledge of physical addresses or shared memory when time-sharing a logical core." The second vector is described as "With Load+Reload, we exploit the way predictor to obtain highly-accurate memory-access traces of victims on the same physical core." The two vulnerabilities have not been assigned CVE entries at the time of this writing. The research paper, however, describes the L1D cache way predictor in AMD processors as being vulnerable to attacks that can reveal contents of memory or even keys to a vulnerable AES implementation. For now there is no mitigation to these attacks, but the company is reportedly working on firmware and driver updates. Access the research paper here.

When AMD pushed out the Radeon RX 590 in late-2018, its key spec was that the "Polaris 20" die had been ported to GlobalFoundries 12LPP (12 nm) silicon fabrication node, yielding headroom to dial up clock speeds over the 14 nm RX 580. The underlying silicon was labeled "Polaris 30" as it was the second major version of the "Polaris 10" die. NVIDIA's GeForce GTX 16-series beat the RX 590 both in performance and price, with even the GTX 1650 Super performing on-par, and the GTX 1660 beating it. It turns out that AMD has a lot of unsold 14 nm "Polaris 20" inventory to go around, and it wants to release them out as the new RX 590 GME.

An Expreview review of an XFX-branded RX 590 GME confirms that the the chip is indeed based on the "Polaris 20 XTR" silicon which is built on the 14 nm process. The card has GPU clock speeds that appear similar to reference clock speeds of the RX 590, with 1460 MHz base compared to 1469 MHz of the original RX 590. But this is where the similarities end. In its testing, Expreview found that the RX 590 GME is on average 5% slower than the RX 590, and performs halfway between the RX 580 and the original RX 590, which are differentiated by a roughly 10% performance gap. The 5% performance deficit would put the RX 590 GME on par with the new RX 5500 XT 4 GB, and trading blows with the GTX 1650 Super. Thankfully, the RX 590 GME is priced lower than RX 590 cards (about 7.7% cheaper), and could be very region-specific. The fact that the RX 590 GME is being sold with full AIB partner branding and retail packaging, shows that this isn't an OEM-only product. Read the complete review in the source link below.

AMD at its Financial Analyst Day 2020 presentation made a major clarification about its silicon fabrication process. It was previously believed that the company's upcoming "Zen 3" CPU microarchitecture and RDNA2 graphics architectures were based on TSMC's N7+ (7 nm EUV) silicon fabrication process because AMD would mark the two as "7 nm+" in its marketing slides. Throughout its Financial Analyst Day presentation, however, AMD avoided using that marker, and resorted to an amorphous "7 nm" marker, prompting one of the financial analysts to seek a clarification. At the time, AMD responded that they were aligning their marketing with that of TSMC, and hence chose to use "7 nm" in its new slides.

It turns out that the next step to TSMC N7, the company's current-generation 7 nm DUV silicon fabrication node, isn't N7+ (7 nm EUV), but rather it has a nodelet along the way, which the foundry refers to as N7P. This is a generational refinement of N7, but does not use EUV lithography, which means it may not offer the 15-20 percent gains in transistor densities offered by N7+ over N7. AMD clarified that "7 nm+" in its past presentations did not intend to signify N7+, and that the "+" merely denoted an improvement over N7. At the same time, it won't specify whether "Zen 3" and RDNA2 are based on N7P or N7+, so the company doesn't rule out N7+, either. We'll probably learn more as we near the late-2020 launch of "Zen 3" as EPYC "Milan."

At AMD CEO Dr Lisa Su's keynote address at the company's 2020 Financial Analyst Day, a curious slide element caught our eye - a never before seen graphics card design that bears AMD insignia. This is quite possibly AMD's upcoming reference design. The design fits into the language of sharp dark ridges and red accents the company adopted first with its Radeon RX 5700 XT MBA (made by AMD) graphics card, and the hypothetical RX 5600 XT reference design that never made it to the market as the SKU was a partner-exclusive.

In Reddit AMAs following the RX 5700 series launch, corporate vice-president and manager for Radeon, Scott Herkelman, mentioned that all subsequent Radeon RX products by the company would ditch the lateral-blower design in favor of an axial multi-fan design that's characteristic of most partner-designed cards. NVIDIA made that switch with its RTX 20-series Founders Edition cards, and AMD too implemented a triple axial fan design for its Radeon VII card, before switching back to a conventional lateral-blower design for its RX 5700 series. AMD would go on to give the reference design RX 5600 XT an axial dual-fan cooler.

With its 7 nm RDNA architecture that debuted in July 2019, AMD achieved a nearly 50% gain in performance/Watt over the previous "Vega" architecture. At its 2020 Financial Analyst Day event, AMD made a big disclosure: that its upcoming RDNA2 architecture will offer a similar 50% performance/Watt jump over RDNA. The new RDNA2 graphics architecture is expected to leverage 7 nm+ (7 nm EUV), which offers up to 18% transistor-density increase over 7 nm DUV, among other process-level improvements. AMD could tap into this to increase price-performance by serving up more compute units at existing price-points, running at higher clock speeds.

AMD has two key design goals with RDNA2 that helps it close the feature-set gap with NVIDIA: real-time ray-tracing, and variable-rate shading, both of which have been standardized by Microsoft under DirectX 12 DXR and VRS APIs. AMD announced that RDNA2 will feature dedicated ray-tracing hardware on die. On the software side, the hardware will leverage industry-standard DXR 1.1 API. The company is supplying RDNA2 to next-generation game console manufacturers such as Sony and Microsoft, so it's highly likely that AMD's approach to standardized ray-tracing will have more takers than NVIDIA's RTX ecosystem that tops up DXR feature-sets with its own RTX feature-set.

AMD at its 2020 Financial Analyst Day event unveiled its upcoming CDNA GPU-based compute accelerator architecture. CDNA will complement the company's graphics-oriented RDNA architecture. While RDNA powers the company's Radeon Pro and Radeon RX client- and enterprise graphics products, CDNA will power compute accelerators such as Radeon Instinct, etc. AMD is having to fork its graphics IP to RDNA and CDNA due to what it described as market-based product differentiation.

Data centers and HPCs using Radeon Instinct accelerators have no use for the GPU's actual graphics rendering capabilities. And so, at a silicon level, AMD is removing the raster graphics hardware, the display and multimedia engines, and other associated components that otherwise take up significant amounts of die area. In their place, AMD is adding fixed-function tensor compute hardware, similar to the tensor cores on certain NVIDIA GPUs.

AMD Financial Analyst Day presents an opportunity for AMD to talk straight with the finance industry about the company's current financial health, and a taste of what's to come. Guidance and product teasers made during this time are usually very accurate due to the nature of the audience. In this live blog, we will post information from the Financial Analyst Day 2020 as it unfolds.20:59 UTC: The event has started as of 1 PM PST. CEO Dr Lisa Su takes stage.

AMD Radeon Software Adrenalin 20.2.2 got re-released as a WHQL-signed driver by AMD. The company had originally released it as a beta on February 28. The drivers come with optimization for "Zombie Army 4: Dead War," but more importantly, fix a large number of software bugs plaguing Adrenalin 2020 Edition since its December 2019 release. These include several black-screen errors, bugs with Radeon Software, its various game optimization, recording, and streaming features, and more. Version 20.2.2 WHQL otherwise has an identical change-log to the 20.2.2 beta.DOWNLOAD: AMD Radeon Software Adrenalin 20.2.2 WHQL

The change-log is identical to 20.2.2 beta.

AMD has been on a roll in both consumer, professional, and exascale computing environments, and it has just snagged itself another hugely important contract. The US Department of Energy (DOE) has just announced the winners for their next-gen, exascale supercomputer that aims to be the world's fastest. Dubbed "El Capitan", the new supercomputer will be powered by AMD's next-gen EPYC Genoa processors (Zen 4 architecture) and Radeon GPUs. This is the first such exascale contract where AMD is the sole purveyor of both CPUs and GPUs, with AMD's other design win with EPYC in the Cray Shasta being paired with NVIDIA graphics cards.

El Capitan will be a $600 million investment to be deployed in late 2022 and operational in 2023. Undoubtedly, next-gen proposals from AMD, Intel and NVIDIA were presented, with AMD winning the shootout in a big way. While initially the DOE projected El Capitan to provide some 1.5 exaflops of computing power, it has now revised their performance goals to a pure 2 exaflop machine. El Capitan willl thus be ten times faster than the current leader of the supercomputing world, Summit.

EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer, makes another push into the HEDT market by releasing the world's first Socket sTRX4 based monoblock made for made for the ROG Zenith II Extreme motherboard. This is a complete all-in-one (CPU and motherboard) liquid cooling solution for the ASUS motherboard that is based on AMD TRX40 chipset for AMD Ryzen Threadripper processors. This monoblock is compatible with the ASUS ROG Zenith II Extreme motherboard.

Designed and engineered in cooperation with ASUS, this monoblock uses Velocity sTR4 cooling engine to ensure the proper cooling of the large IHS that hides the spread-out chiplets. This water block directly cools AMD sTR4X type CPU, as well as the voltage regulation module (VRM). This kind of efficient VRM cooling on a TRX40 platform opens up even greater overclocking capabilities. Using a monoblock gets rid of the small fans that can be found on these TRX40 motherboards, hidden under the VRM heatsink grill.

Expreview has caught the sighting of an apparently upcoming AMD graphics card based around the RX 590 SKU. The new revision, being named the RX 590 GME, apparently features lower clocks than the base Polaris 30 RX 590 ~around 1,385 MHz boost compared to the vanilla RX590's 1545 MHz. That clockspeed puts the RX 590 GME slightly above the RX 580 in terms of specs, but way below the RX 590, which should lead to a distinct performance variation between the two.

It's unclear as to what GPU die this new Polaris-based graphics card will be using. If I were a betting man, I'd say these are being harvested from 12 nm Polaris 30 dies that haven't been able to sustain the 1545 MHz clockspeeds rated for RX 590 chips - but still being put to use and very likely with a better power/performance ratio than the RX 590. For now, the model is only available for pre-order through a Chinese e-tailer, which could mean this is a China-only release.

ID-Cooling today updated its Zoomflow line of all-in-one liquid CPU cooler series with the new Zoomflow 360X Snow. As with most PC hardware names that use the term "snow," the 360X Snow is a white trim of the Zoomflow 360. White dominates the pump-block's body, the nylon sleeve around the tubing, the radiator (including its fins), and the three included fans. ID-Cooling claims the cooler is capable of handling thermal loads of up to 350 W thanks to its high coolant pressure and large 360 mm x 120 mm radiator.

The three included 120 mm hydraulic-bearing fans each spin at speeds ranging between 700 to 1,500 RPM, pushing up to 62 CFM of air, with noise output ranging between 18 to 26.4 dBA. A single 3-pin ARGB connection from the motherboard lights up the three fans and the RGB ornament on the pump-block. Among the CPU socket types supported are AMD TR4, sTRX4, and AM4; and Intel LGA2066 and LGA115x. The company didn't reveal pricing, although we expect it to be priced around the $130-mark.

AMD today released version 20.2.2 of their Radeon Adrenalin Edition driver suite. The new version brings with it support for the launch of Zombie Army 4: Dead War, so users can experience the latest and greatest performance available for AMD graphics cards on the new release.Perhaps more importantly, the new release also features a number of fixes for Black Screen errors in a number of scenarios and games, of which much has already been written over the internet. There are still a number of instances where black screens can occur listed on AMD's "Known Issues" checklist for this driver release, however, so make sure to check the release notes to see if this driver looks to fix your particular scenario. Of course, you're likely always better off updating to this latest driver version.DOWNLOAD: AMD Radeon Adrenalin Edition 20.2.2 Drivers

Jon Peddie Research have released their report on the overall market outlook for GPU shipments for Q4'2019, and the news are great for AMD. Due to the launch of more affordable Navi-based 7 nm graphics cards, the company managed to achieve a growth of 22.6% in shipment volume for the last quarter of 2019, compared to Q3 of the same year. This 22.6% volume increase is pretty significant (and is miles ahead of competitors NVIDIA (whose shipments decreased by -1.9%) and Intel (a 0.2% increase), having increased AMD's overall market share by 3%. This means that AMD now commands 19% of the overall GPU market share, surpassing NVIDIA (which counts with 18%) but both being dwarfed by Intel (with a commanding 63% share). It's important to note here that the numbers include integrated- and discrete-GPUs, and AMD's numbers could be assisted by its mobile processor and APU sales, just as iGPUs make up all of Intel's numbers.

Those numbers are skewed, of course, when we look solely at the discrete GPU market share, with NVIDIA commanding a huge, 73% chunk of the market against AMD's paltry (by comparison) 27%. All in all, Jon Peddie Research reports that the overall PC market increased by 1.99% quarter-to-quarter and increased by 3.54% year-to-year, thus resulting a good performance for these "little" chips.

At its 2020 IEEE ISSCC keynote, AMD presented two slides that detail the extent of cost savings yielded by its bold decision to embrace the MCM (multi-chip module) approach to not just its enterprise and HEDT processors, but also its mainstream desktop ones. By confining only those components that tangibly benefit from cutting-edge silicon fabrication processes, namely the CPU cores, while letting other components sit on relatively inexpensive 12 nm, AMD is able to maximize its 7 nm foundry allocation, by making it produce small 8-core CCDs (CPU complex dies), which add up to AMD's target core-counts. With this approach, AMD is able to cram up to 16 cores onto its AM4 desktop socket using two chiplets, and up to 64 cores using eight chiplets on its SP3r3 and sTRX4 sockets.

In the slides below, AMD compares the cost of its current 7 nm + 12 nm MCM approach to a hypothetical monolithic die it would have had to build on 7 nm (including the I/O components). The slides suggest that the cost of a single-chiplet "Matisse" MCM (eg: Ryzen 7 3700X) is about 40% less than that of the double-chiplet "Matisse" (eg: Ryzen 9 3950X). Had AMD opted to build a monolithic 7 nm die that had 8 cores and all the I/O components of the I/O die, such a die would cost roughly 50% more than the current 1x CCD + IOD solution. On the other hand, a monolithic 7 nm die with 16 cores and I/O components would cost 125% more. AMD hence enjoys a massive headroom for cost-cutting. Prices of the flagship 3950X can be close to halved (from its current $749 MSRP), and AMD can turn up the heat on Intel's upcoming Core i9-10900K by significantly lowering price of its 12-core 3900X from its current $499 MSRP. The company will also enjoy more price-cutting headroom for its 6-core Ryzen 5 SKUs than it did with previous-generation Ryzen 5 parts based on monolithic dies.

AMD today announced the expansion of the AMD Ryzen Embedded ecosystem with two new AMD Ryzen Embedded R1000 low-power processors that provide customers with a new TDP range of 6 up to 10 W. AMD also announced new customers offering Mini PCs based on the AMD Ryzen Embedded processors from Sapphire, SECO, Simply NUC and others.

"AMD is ushering in a new age of high-performance computing for the embedded industry," said Rajneesh Gaur, corporate vice president and general manager, Embedded Solutions, AMD. "We are doing this with cutting-edge technology to display immersive graphics in 4K resolution with AMD Ryzen Embedded processors, and we are now offering access to high performance in power-efficient solutions with these new low-power Ryzen Embedded R1000 processors."

If you overlook the fact that it uses a TN-film panel, the new AGON AG273QZ has some otherwise impressive specs relevant to gamers. This 27-inch monitor offers WQHD (2560 x 1440 pixels) resolution, with staggering 0.5 ms response time, 240 Hz refresh-rate, support for AMD FreeSync Premium Pro, and DispplayHDR 400 certification. The panel is mounted onto a stylish tripod stand, and comes with RGB LED embellishments behind. Other key panel specs include 170°/160° viewing-angles (H/V), 1000:1 static contrast ratio with dynamic mega-contrast, and a WLED backlight that uses a non-PWM method of dimming (flicker-free). Inputs include HDMI 2.0 and DisplayPort 1.4, from which you need at least DP1.2 HBR2 to support 1440p @ 240 Hz. The company didn't reveal pricing.

SAPPHIRE Technology builds on the reputation and strength of its embedded systems business division by announcing a new series of embedded motherboards with a compact footprint that deliver improved levels of performance, features and stability to customers. Powered by the latest AMD Ryzen Embedded Processor which feature the AMD Radeon "Vega" graphics combined with the high-performance "Zen" CPU, the BP-FP5 and NP-FP5 embedded platforms provide a stable balance of low power consumption and optimized performance for the embedded markets.

According to Paul Smith, Director of SAPPHIRE's Embedded Business Division, "the versatile and effective design of these boards with low power compute and high-resolution multimedia display capability make them perfect for a wide variety of industry applications in the Embedded space such as industrial PC, interactive digital signage, thin clients and POS terminals".

Lenovo announced today the latest additions to the ThinkPad portfolio: the new T series, X series and L series are built leveraging the core tenets of design, innovation and quality. Focused on providing a broad customer choice and a smarter workforce experience, the updated ThinkPad portfolio delivers modern IT solutions with emerging technology features to meet the needs and desires of end users. Innovations across the range include Modern Standby, Wake on Voice, WiFi 6, Dolby Audio Speaker System and Dolby Vision, plus customers can optimize select models with either 10th Gen Intel Core vPro processors or the next generation AMD Ryzen 4000 PRO Mobile processors. Lenovo will be the first PC vendor to offer the AMD Ryzen PRO 4000 Mobile processors.

The ubiquitous DDoS-mitigation and CDN provider, Cloudflare, announced that its latest Gen X servers implement AMD EPYC processors ditching Intel Xeons with its older Gen 9 servers. Cloudflare uses multi-functional servers (just like Google), in which each server is capable of handling any kind of the company's workloads (DDoS mitigation, content delivery, DNS, web-security, etc.). The company minimizes server hardware configurations so they're easier to maintain and lower TCO. The hardware specs of its servers are periodically updated and classified by "generations."

Cloudflare's Gen X server is configured with a single-socket 2nd gen AMD EPYC 7642 processor (48-core/96-thread, 256 MB L3 cache), and 256 GB of octa-channel DDR4-2933 memory, along with NVMe flash-based primary storage. "We selected the AMD EPYC 7642 processor in a single-socket configuration for Gen X. This CPU has 48-cores (96 threads), a base clock speed of 2.4 GHz, and an L3 cache of 256 MB. While the rated power (225 W) may seem high, it is lower than the combined TDP in our Gen 9 servers and we preferred the performance of this CPU over lower power variants. Despite AMD offering a higher core count option with 64-cores, the performance gains for our software stack and usage weren't compelling enough," Cloudflare writes in its blog post announcing Gen X. The new servers will go online in the coming weeks.Many Thanks to biffzinker for the tip.

Microsoft has confirmed the official specs for the Xbox Series X games console, due Holiday 2020 (think November). The new specs announcement confirms the powerhouse of a console this will be, with its peak 12 TFLOPs compute being 8 times that of the original Xbox One, and twice that of the Xbox One X, which already quite capable of powering true 4K experiences. This 12 TFLOPs figure is a mighty impressive one - just consider that AMD's current highest-performance graphics card, Radeon VII, features a peak 13.4 TFLOPs of computing power - and that's a graphics card that was launched just a year ago.

The confirmation also mentions support for Hardware-Accelerated raytracing, something that all but confirms the feature being built into AMD's RDNA 2 microarchitecture (of which we are expecting news anytime now). this, alongside Variable Rate Shading (VRS) support, brings AMD to feature parity with NVIDIA's Turing, and should allow developers to optimize their performance and graphical targets without any discernible quality loss.

The Core i7-10700F is an upcoming 8-core/16-thread processor that's expected to be significantly affordable compared to the i7-10700K. Unlike the i7-10700K targeted at overclockers, the i7-10700F is multiplier locked, has lower nominal clock speeds of 2.90 GHz, and lacks integrated graphics (hence the "F" extension). PC enthusiasts on Korean tech community QuasarZone posted a screenshot of an alleged i7-10700F test run on Cinebench R20. The chip is shown scoring 4781 points in the multi-threaded test, and 492 points single-threaded. These scores roughly compare with AMD's Ryzen 7 3700X processor. No other details such as motherboard or memory configuration were put out.

AMD has scored yet another design win for usage of its high-performance EPYC processors in the Cray Shasta supercomputer. The Cray Shasta will be deployed in the US Navy's Department of Defense Supercomputing Resource Center (DSRC) as part of the High Performance Computing Modernization Program. The peak theoretical computing capability of 12.8 PetaFLOPS, or 12.8 quadrillion floating point operations per second supercomputer will be built with 290,304 AMD EPYC (Rome) processor cores and 112 NVIDIA Volta V100 General-Purpose Graphics Processing Units (GPGPUs). The system will also feature 590 total terabytes (TB) of memory and 14 petabytes (PB) of usable storage, including 1 PB of NVMe-based solid state storage. Cray's Slingshot network will make sure all those components talk to each other at a rate of 200 Gigabits per second.

Navy DSRC supercomputers support climate, weather, and ocean modeling by NMOC, which assists U.S. Navy meteorologists and oceanographers in predicting environmental conditions that may affect the Navy fleet. Among other scientific endeavors, the new supercomputer will be used to enhance weather forecasting models; ultimately, this improves the accuracy of hurricane intensity and track forecasts. The system is expected to be online by early fiscal year 2021.