Yesterday, Intel unveiled its latest Xeon data center processors, codenamed Emerald Rapids, delivering the new Xeon Platinum 8592+ flagship SKU with 64 cores and 128 threads. Packed into its fresh silicon, Intel promises boosted performance and reduced power hunger. The comprehensive tech benchmarking website Phoronix essentially confirms Intel's pitch. Testing production servers running the new 8592+ showed solid gains over prior Intel models, let alone older generations still commonplace in data centers. On average, upgrading to the 8592+ increased single-socket server performance by around 23.5% compared to the previous generation configs of Sapphire Rapid, Xeon Platinum 8490H. The dual-socket configuration records a 17% boost in performance.

However, Intel is not in the data center market by itself. AMD's 64-core offering that Xeon Platinum 8592+ is competing with is AMD EPYC 9554. The Emerald Rapids chip is faster by about 2.3%. However, AMD's lineup doesn't stop at only 64 cores. AMD's Genoa and Genoa-X with 3D V-cache top out at 96 cores, while Bergamo goes up to 128 cores. On the power consumption front, the Xeon Platinum 8592+ was pulling about 289 Watts compared to the Xeon Platinum 8490H average of 306 Watts. At peak, the Xeon Platinum 8592+ CPU managed to hit 434 Watts compared to the Xeon Platinum 8490H peak of 469 Watts. This aligns with Intel's claims of enhanced efficiency. However, compared to the 64-core counterpart from AMD, the EPYC 9554 had an average power consumption of 227 Watts and a recorded peak of 369 Watts.

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Today at the "AI Everywhere" event, Intel launched its 5th Gen Intel Xeon processors (code-named Emerald Rapids) that deliver increased performance per watt and lower total cost of ownership (TCO) across critical workloads for artificial intelligence, high performance computing (HPC), networking, storage, database and security. This launch marks the second Xeon family upgrade in less than a year, offering customers more compute and faster memory at the same power envelope as the previous generation. The processors are software- and platform-compatible with 4th Gen Intel Xeon processors, allowing customers to upgrade and maximize the longevity of infrastructure investments while reducing costs and carbon emissions.

"Designed for AI, our 5th Gen Intel Xeon processors provide greater performance to customers deploying AI capabilities across cloud, network and edge use cases. As a result of our long-standing work with customers, partners and the developer ecosystem, we're launching 5th Gen Intel Xeon on a proven foundation that will enable rapid adoption and scale at lower TCO." -Sandra Rivera, Intel executive vice president and general manager of Data Center and AI Group.

According to Tom's Hardware, today we are finding out that AMD Ryzen Threadripper 7000 series processors, codenamed Storm Peak, including Pro and non-Pro SKUs, blow a fuse on the chip when overclocking is enabled. Modern microprocessors have dozens of fuses that are used to store information inside the chip. For example, the factory stores the per-processor default voltage information in the fuses. On downgraded graphics chips, the shaders get disabled through such fuses, too. These fuses are not like your household circuit breakers—they will blow only when a specific command is sent to the processor, there is no way for them to break accidentally through system crashes or power spikes. In the case of Ryzen Threadripper 7000, the BIOS code will blow a fuse when the user enables overclocking in the BIOS settings, it reacts only to the user-initiated UI change, not to any kind of measurement. Before that happens a warning is shown. AMD uses this mechanism to see any indications if any kind of overclocking has been done to the processor.

While the messaging might suggest otherwise, just enabling overclocking does not void all warranties. In a statement to Tom's Hardware an AMD representative confirmed: "Threadripper 7000 Series processors do contain a fuse that is blown when overclocking is enabled. To be clear, blowing this fuse does not void your warranty. Statements that enabling an overclocking/overvolting feature will "void" the processor warranty are not correct. Per AMD's standard Terms of Sale, the warranty excludes any damage that results from overclocking/overvolting the processor. However, other unrelated issues could still qualify for warranty repair/replacement," noted the spokesperson. Ultimately, overclocking and overvolting by themselves will not cause the owner of AMD's Ryzen Threadripper 7000 series CPU to lose the right to repair and seek AMD's help. Other factors, such as damages induced by overclocking, will be a warranty-voiding factor though. These can occur from constant overheating, which significantly lowers the life expectancy of the CPU.

After years of delays, Chinese chipmaker Zhaoxin has finally launched its long-awaited KX-7000 series consumer CPUs, only one of its kind in China, based on the licensed x86-64 ISA. Zhaoxin claims the new 8-core processors based on "Century Avenue" uArch deliver double the performance of previous generations. Leveraging architectural improvements and 4X more cache, the KX-7000 represents essential progress for China's domestic semiconductor industry. While still likely lagging behind rival AMD and Intel chips in raw speed, the KX-7000 matches competitive specs in areas like DDR5 memory, PCIe 4.0, and USB4 support. For Chinese efforts to attain technological independence, closing feature gaps with foreign processors is just as crucial as boosting performance. Manufactured on a 16 nm process, the KX-7000 does not use the best silicon node available.

Other chip details include out-of-order execution (OoOE), 24 PCIe 4.0 lanes, a 32 MB pool of L3 cache and 4 MB L2 cache, a base frequency of 3.2 GHz, and a boost clock of 3.7 GHz. Interestingly, the CPU also has VT-x, BT-d 2.5, SSE4.2/AVX/AVX2 support, most likely also licensed from the x86 makers Intel and/or AMD. Ultimately, surpassing Western processors is secondary for China next to attaining self-reliance. Instructions like SM encryption catering to domestic data protection priorities underscore how the KX-7000 advances strategic autonomy goals. With its x86 architecture license giving software compatibility and now a vastly upgraded platform, the KX-7000 will raise China's chip capabilities even if it is still trailing rivals' speeds. Ongoing progress closing that performance gap could position Zhaoxin as a mainstream alternative for local PC builders and buyers.

Intel's upcoming Sierra Forest Xeon server chip has debuted on Geekbench 6, showcasing its potential in multi-core performance. Slated for release in the first half of 2024, Sierra Forest is equipped with up to 288 Efficiency cores, positioning it to compete with AMD's Zen 4c Bergamo server CPUs and other ARM-based server chips like those from Ampere for the favor of cloud service providers (CSP). In the Geekbench 6 benchmark, a dual-socket configuration featuring two 144-core Sierra Forest CPUs was tested. The benchmark revealed a notable multi-core score of 7,770, surpassing most dual-socket systems powered by Intel's high-end Xeon Platinum 8480+, which typically scores between 6,500 and 7,500. However, Sierra Forest's single-core score of 855 points was considerably lower, not even reaching half of that of the 8480+, which manages 1,897 points.

The difference in single-core performance is a matter of choice, as Sierra Forest uses Crestmont-derived Sierra Glen E-cores, which are more power and area-efficient, unlike the Golden Cove P-cores in the Sapphire Rapids-based 8480+. This design choice is particularly advantageous for server environments where high-core counts are crucial, as CSPs usually partition their instances by the number of CPU cores. However, compared to AMD's Bergamo CPUs, which use Zen 4c cores, Sierra Forest lacks pure computing performance, especially in multi-core. The Sierra Forest lacks hyperthreading, while Bergaamo offers SMT with 256 threads on the 128-core SKU. Comparing the Geekbench 6 scores to AMD Bergamo EPYC 9754 and Sierra Forest results look a lot less impressive. Bergamo scored 1,597 points in single-core, almost double that of Sierra Forest, and 16,455 points in the multi-core benchmarks, which is more than double. This is a significant advantage of the Zen 4c core, which cuts down on caches instead of being an entirely different core, as Intel does with its P and E-cores. However, these are just preliminary numbers; we must wait for real-world benchmarks to see the actual performance.

AMD today announced the new Ryzen 8040 mobile processor series codenamed "Hawk Point." These chips are shipping to notebook manufacturers now, and the first notebooks powered by these should be available to consumers in Q1-2024. At the heart of this processor is a significantly faster neural processing unit (NPU), designed to accelerate AI applications that will become relevant next year, as Microsoft prepares to launch Windows 12, and software vendors make greater use of generative AI in consumer applications.

The Ryzen 8040 "Hawk Point" processor is almost identical in design and features to the Ryzen 7040 "Phoenix," except for a faster Ryzen AI NPU. While this is based on the same first-generation XDNA architecture, its NPU performance has been increased to 16 TOPS, compared to 10 TOPS of the NPU on the "Phoenix" silicon. AMD is taking a whole-of-silicon approach to AI acceleration, which includes not just the NPU, but also the "Zen 4" CPU cores that support the AVX-512 VNNI instruction set that's relevant to AI; and the iGPU based on the RDNA 3 graphics architecture, with each of its compute unit featuring two AI accelerators, components that make the SIMD cores crunch matrix math. The whole-of-silicon performance figures for "Phoenix" is 33 TOPS; while "Hawk Point" boasts of 39 TOPS. In benchmarks by AMD, "Hawk Point" is shown delivering a 40% improvement in vision models, and Llama 2, over the Ryzen 7040 "Phoenix" series.

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

Artificial intelligence has been a hot topic this year, and everything is now an AI processor, from CPUs to GPUs, NPUs, and many others. However, it was only a matter of time before we saw an integration of AI processing elements into the networking chips. Today, Broadcom announced its new Ethernet switching silicon called Trident 5-X12. The Trident 5-X12 delivers 16 Tb/s of bandwidth, double that of the previous Trident generation while adding support for fast 800G ports for connection to Tomahawk 5 spine switch chips. The 5-X12 is software-upgradable and optimized for dense 1RU top-of-rack designs, enabling configurations with up to 48x200G downstream server ports and 8x800G upstream fabric ports. The 800G support is added using 100G-PAM4 SerDes, which enables up to 4 m DAC and linear optics.

However, this is not only a switch chip on its own. Broadcom has added AI processing elements in an inference engine called NetGNT (Networking General-purpose Neural-network Traffic-analyzer). It can detect common traffic patterns and optimize data movement across the chip. Specifically, the company has listed an example of the system doing AI/ML workloads. In that case, NetGNT performs intelligent traffic analysis to avoid network congestion in these workloads. For example, it can detect the so-called "incast" patterns in real-time, where many flows converge simultaneously on the same port. By recognizing the start of incast early, NetGNT can invoke hardware-based congestion control techniques to prevent performance degradation without added latency.

Intel is slowly preparing to launch its next-generation Meteor Lake mobile processor family, dropping the Core i brand name in favor of Core Ultra. Today, we are witnessing some early Geekbench v6 benchmarks with the latest leak of the Core Ultra 7 155H processor, boasting an integrated Arc GPU featuring 8 Xe-Cores—the complete configuration expected in the GPU tile. This tile is also projected to be a part of the more potent Core 9 Ultra 185H CPU. The Intel Core Ultra 7 155H processor has been benchmarked in the new ASUS Zenbook 14, which houses a 16-core and 22-thread hybrid CPU configuration capable of boosting up to 4.8 GHz. Paired with 32 GB of memory, the configuration was well equipped to supply CPU and GPU with sufficient memory space.

Perhaps the most interesting information from the submission was the OpenCL score of the GPU. Clocking in at 33948 points in Geekbench v6, the GPU is running over AMD's Radeon 780M GPU found in APU solutions like AMD Ryzen 9 7940HS and Ryzen 9 7940U, which scored 30585 and 27345 points in the same benchmark, respectively. The GPU tile is millimeters away from closing the gap between itself and the desktop Intel Arc A380 discrete GPU, which scored 37105 points for less than a 10% difference. The Xe-LPG GPU version is bringing some interesting performance points for the integrated GPU platform, which means that Intel's Meteor Lake SKUs will bring more performance/watt than ever.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

Qualcomm Technologies, Inc. today announced the Snapdragon 7 Gen 3 Mobile Platform to amplify immersive experiences and bring premium performance to consumers' everyday life. The upgraded platform delivers across-the-board advancements to ignite on-device AI, fan-favorite mobile gaming, a creativity-charged camera and powerful 5G connectivity. The new platform is fully equipped to enable exciting new use-cases including up to 2.63 GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.

"Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series," said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "By working closely with our OEM partners, we're able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers." Snapdragon 7 Gen 3 will first be adopted by key OEMs including HONOR and vivo with the first device expected to be announced this month.

Rapidus Corporation, a company involved in the research, development, design, manufacture, and sales of advanced logic semiconductors, today announced an agreement with Tenstorrent Inc., a next-generation computing company building computers for AI, to jointly develop semiconductor IP (design assets) in the field of AI edge devices based on 2 nm logic semiconductors.

In addition to its AI processors and servers, Tenstorrent built and owns the world's most performant RISC-V CPU IP and licenses that technology to its customers around the world. Through this technological partnership with Rapidus, Tenstorrent will accelerate the development of cutting-edge devices to meet the needs of the ever-evolving digital society.

In collaboration with Microsoft, Durabook today announced the availability of Windows 11 Secured-core PCs for its mobile rugged computing portfolio. The Durabook S15 Rugged Laptop and U11 Rugged Tablet with advanced Windows 11 security are immediately available to protect sensitive data for professionals on the move.

Mobile, Rugged, Secure for a Perilous World
Executives, military officers, and other professionals who work in potentially hazardous environments are often responsible for highly sensitive data such as financial information, classified intelligence, and intellectual property. They are also often on the road where their computing devices are exposed to abundant cybersecurity threats, including malware and firmware attacks. These attacks are in addition to the physical perils such as being dropped, exposed to dust and potentially combustible fine particulate in the air, extreme temperatures, high humidity and water intrusion.

During its Ignite conference, Microsoft introduced a duo of custom-designed silicon made to accelerate AI and excel in cloud workloads. First of the two is Microsoft's Azure Cobalt 100 CPU, a 128-core design that features a 64-bit Armv9 instruction set, implemented in a cloud-native design that is set to become a part of Microsoft's offerings. While there aren't many details regarding the configuration, the company claims that the performance target is up to 40% when compared to the current generation of Arm servers running on Azure cloud. The SoC has used Arm's Neoverse CSS platform customized for Microsoft, with presumably Arm Neoverse N2 cores.

The next and hottest topic in the server space is AI acceleration, which is needed for running today's large language models. Microsoft hosts OpenAI's ChatGPT, Microsoft's Copilot, and many other AI services. To help make them run as fast as possible, Microsoft's project Athena now has the name of Maia 100 AI accelerator, which is manufactured on TSMC's 5 nm process. It features 105 billion transistors and supports various MX data formats, even those smaller than 8-bit bit, for maximum performance. Currently tested on GPT 3.5 Turbo, we have yet to see performance figures and comparisons with competing hardware from NVIDIA, like H100/H200 and AMD, with MI300X. The Maia 100 has an aggregate bandwidth of 4.8 Terabits per accelerator, which uses a custom Ethernet-based networking protocol for scaling. These chips are expected to appear in Microsoft data centers early next year, and we hope to get some performance numbers soon.

Researchers at Graz University of Technology and the Helmholtz Center for Information Security have released their paper on CacheWarp—the latest vulnerability affecting some of the prior generation AMD EPYC CPUs. Titled CVE-2023-20592, the exploit targets first-generation EPYC Naples, second-generation EPYC Rome, and third-generation EPYC Milan. CacheWarp operates by exploiting a vulnerability in AMD's Secure Encrypted Virtualization (SEV) technology, specifically targeting the SEV-ES (Encrypted State) and SEV-SNP (Secure Nested Paging) versions. The attack is a software-based fault injection technique that manipulates the cache memory of a virtual machine (VM) running under SEV. It cleverly forces modified cache lines of the guest VM to revert to their previous state. This action circumvents the integrity checks that SEV-SNP is designed to enforce, allowing the attacker to inject faults without being detected.

Unlike attacks that rely on specific guest VM vulnerabilities, CacheWarp is more versatile and dangerous because it does not depend on the characteristics of the targeted VM. It exploits the underlying architectural weaknesses of AMD SEV, making it a broad threat to systems relying on this technology for security. The CacheWarp attack can bypass robust security measures like encrypted virtualization, posing a significant risk to data confidentiality and integrity in secure computing environments. AMD has issued an update for EPYC Milan with a hot-loadable microcode patch and updated the firmware image without any expected performance degradation. And for the remaining generations, AMD states that no mitigation is available for the first or second generations of EPYC processor (Naples and Rome) since the SEV and SEV-ES features are not designed to protect guest VM memory integrity, and the SEV-SNP is not available.

Today, Lenovo announced the new ThinkStation P8 tower workstation powered by AMD Ryzen Threadripper PRO 7000 WX-Series processors and NVIDIA RTX GPUs. Designed to deliver unparalleled performance, reliability and flexibility for professionals who demand the best from their workstations, the bold new ThinkStation P8 builds on the success of the award-winning P620, the world's first workstation powered by AMD Ryzen Threadripper PRO processors. Featuring an optimized thermal design in a versatile Aston Martin inspired chassis, the ThinkStation P8 combines Lenovo's legendary reliability, customer experience and innovation with breakthrough compute architecture courtesy of AMD and NVIDIA. ThinkStation P8 raises the bar for intense workloads across multiple segments focused on outcome-based workflow agility.

"At Lenovo, we understand that our customers need high-quality workstations that can adapt to their changing and diverse needs. That's why we collaborated with AMD and NVIDIA to create the ThinkStation P8, a workstation that combines power, flexibility and enterprise-grade features," said Rob Herman, vice president and general manager, Workstation and Client AI Business Unit, Lenovo. "Designed to offer unparalleled performance and scalability, whether to run complex simulations, render stunning visuals, or develop cutting-edge AI applications, the ThinkStation P8 can handle it all. And with Lenovo's certifications, security and support, you can trust that the ThinkStation P8 will exceed expectations."

A curious piece of marketing material on the Chiphell forum has sent ripples through the tech community, featuring what appears to be an Alienware desktop equipped with an unannounced AMD Ryzen 9000-series processor. The authenticity of this flyer is up for debate, with possibilities ranging from a simple typo by Alienware to a fabricated image, or it could even suggest that AMD is on the cusp of unveiling its next-generation Ryzen CPUs for desktop PCs. While intrigue is high, it's important to approach such revelations cautiously, with a big grain of salt. AMD's existing roadmap points toward a 2024 release for its Zen 5-based Ryzen desktop processors and EPYC server CPUs, which casts further doubt on the Ryzen 9000 series appearing ahead of schedule.

We have to wait for AMD's major upcoming events, including the "Advancing AI" event on December 6, where the company will showcase how its partners and AMD use AI for applications. Next, we hope to hear from AMD about upcoming events such as CES in January and Computex in May, but we don't have any official information on product launches in the near term. If the company is preparing anything, the Alienware flyer pictured below should indicate it, if the source is confirmed. However, the doubt remains, and we should be skeptical of its truthfulness.

Bethesda has released its latest beta patch for Starfield, adding official support for NVIDIA DLSS 3 Frame Generation, fixing several issues, and implementing further CPU and GPU optimizations. The November 8th Beta Update, as it is called, is only available via Steam Beta Update, and it should go live to all Xbox and PC players later this month.

According to the release notes, the new update adds NVIDIA DLSS support with DLSS Super Resolution, Deep Learning Anti-aliasing (DLAA), Nvidia Reflex Low Latency, and DLSS Frame Generation. The update also fixes several performance and stability issues, including a fix for a number of memory related issues and leaks, additional GPU optimizations that will benefit higher-end graphics cards, and improvements to the renderer threading model that should improve CPU usage on higher-end systems. The update also includes various stability and performance improvements.

Ventana Micro Systems Inc. today announced the second generation of its Veyron family of RISC-V processors. The new Veyron V2 is the highest performance RISC-V processor available today and is offered in the form of chiplets and IP. Ventana Founder and CEO Balaji Baktha will share the details of Veyron V2 today during his keynote speech at the RISC-V Summit North America 2023 in Santa Clara, California.

"Veyron V2 represents a leap forward in our quest to lead the industry in high-performance RISC-V CPUs that are ready for rapid customer adoption," said Balaji Baktha, Founder and CEO of Ventana. "It substantiates our commitment to customer innovation, workload acceleration, and overall optimization to achieve best in class performance per Watt per dollar. V2 enhancements unleash innovation across data center, automotive, 5G, AI, and client applications."

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

Intel's next-generation Emerald Rapids Xeon lineup is just around the corner, and we are now receiving more leaks as the launch nears. Today, we get to see leaks of two models: a 64-core Xeon 8592+ Platinum and a 48-core Xeon 8558U processor. First is the Xeon 8592+ Platinum, which is possibly Intel's top-end design with 64 cores and 128 threads. Running at the base frequency of 1.9 GHz, the CPU can boost up to 3.9 GHz. This SKU carries 488 MB of total cache, where 120 MB is dedicated to L2 and 320 MB is there for L3. With a TDP of 350 Watts, the CPU can even be adjusted to 420 Watts.

Next up, we have the Xeon 8558U processor, which has been spotted in Geekbench. The Xeon 8558U is a 48-core, 96-threaded CPU with a 2.0 GHz base clock whose boost frequency has yet to be shown or enabled, likely because it is an engineering sample. It carries 96 MB of L2 cache and 260 MB of L3 cache, making for a total of 356 MB of cache (which includes L1D and L1I as well). Both of these SKUs should launch with the remaining models in the Emerald Rapids family, dubbed 5th generation Xeon Scalable, on December 14 this year.

Today marks the end of support for Itanium's IA-64 architecture in the Linux kernel's 6.7 update—a significant milestone in the winding-down saga of Intel Itanium. Itanium, initially Intel's ambitious venture into 64-bit computing, faced challenges and struggled throughout its existence. It was jointly developed by Intel and HP but encountered delays and lacked compatibility with x86 software, a significant obstacle to its adoption. When AMD introduced x86-64 (AMD64) for its Opteron CPUs, which could run x86 software natively, Intel was compelled to update Xeon, based on x86-64 technology, leaving Itanium to fade into the background.

Despite ongoing efforts to sustain Itanium, it no longer received annual CPU product updates, and the last update came in 2017. The removal of IA-64 support in the Linux kernel will have a substantial impact since Linux is an essential operating system for Itanium CPUs. Without ongoing updates, the usability of Itanium servers will inevitably decline, pushing the (few) remaining Itanium users to migrate to alternative solutions, which are most likely looking to modernize their product stack.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

During the Q3 2023 earnings call, Intel CEO Pat Gelsinger was answering some questions from analysts regarding the company's future and its position on emerging competition. One of the most significant problems the company could face is the potential Arm-based chip development not coming from x86 vendors like Intel and AMD. Instead, there could be fierce competition in the near future with the recently announced Qualcomm Snapdragon Elite X, possible NVIDIA Arm-based PC processor, and in the future, even more Arm CPU providers that Intel would have to compete against in the client segment. During the call, Pat Gelsinger noted that "Arm and Windows client alternatives, generally, they've been relegated to pretty insignificant roles in the PC business. And we take all competition seriously. But I think history as our guide here, we don't see these potentially being all that significant overall. Our momentum is strong. We have a strong roadmap."

Additionally, the CEO noted: "When thinking about other alternative architectures like Arm, we also say, wow, what a great opportunity for our foundry business." If the adoption of Arm-based CPUs for Windows PCs becomes more present, Intel plans to compete with its next-generation x86 offerings like Meteor Lake, Arrow Lake, Lunar Lake, and even Panther Lake in the future. As stated, the CEO expects the competition to manufacture its chips at Intel's foundries so that Intel can provide a platform for these companies to serve the PC ecosystem.