An early PassMark entry posted on X by the account "X86 is dead&back" offers a glimpse of Intel's Core Ultra 5 245HX notebook processor. The 14-core "Arrow Lake-H" mobile chip quietly outpaced its desktop counterpart, the Core Ultra 5 245, in both single-core and multi-core tests. The numbers themselves are straightforward. The 245HX recorded 4,706 points in single-core and 41,045 points in multi-core runs. By comparison, the desktop Core Ultra 5 245 logged 4,409 and 37,930, respectively, handing the notebook silicon a 7% lead in single-core results and an 8% advantage when all cores are engaged. Against the Core i5-14500, the 245HX is 19% faster in single-core work and 30% faster in heavily threaded tasks.

The gap widens further versus last year's mobile i5-14500HX, where the newcomer enjoys a 30% single-core margin and a 41% multi-core edge. The explanation is partly thermal. Intel grants the 245HX a maximum turbo power envelope of 160 W, well above the 121 W ceiling of the desktop 245. Clock speeds peak at 5.1 GHz, and the core configuration remains identical, pairing six performance cores with eight efficient cores. The higher TDP gives the HX version a chance to run at higher clocks for longer. Notebook manufacturers are expected to reveal Arrow Lake-HX systems later this quarter. Real-world gaming is a different arena, and PassMark is only one ruler. Yet the signs are hard to ignore: a mid-range laptop processor now outworks desktop counterparts.

Intel's high-end "Arrow Lake" processors have just become significantly more affordable, with the Core Ultra 7 265K and 265KF now priced below $250 US at major American retailers. In recent weeks, Intel has officially reduced its suggested retail prices from $399 to $309 and from $384 to $294, and retailers have pushed the savings even further. Today, shoppers can pick up the unlocked Core Ultra 7 265K for $239.99 and the graphics-disabled 265KF for $229.99 at Micro Center, reflecting a roughly 40 percent discount off launch pricing. In addition to these cuts, Micro Center is bundling the 265K with an ASUS Z890 AYW Gaming Wi-Fi motherboard and a 32 GB G.Skill Ripjaws S5 DDR5-6000 memory kit for $499, saving buyers approximately $70 compared to purchasing the components separately. Newegg's deal includes a free 16 GB Patriot Viper Venom DDR5-6400 kit with the 265K, while Amazon's Spring Bundle features two full-price PC games, Dying Light: The Beast and Civilization VII, plus software licenses valued at $159.

Internationally, similar markdowns are appearing across Intel's Arrow Lake‑S lineup. In the UK, LambdaTek lists the Core Ultra 9 285 K at £481.18, the 265K at £234.04, and the 265KF at £230.97. The mid-range Core Ultra 5 245 K and 245KF both dip under £220. With their 20 cores and strong multithreaded performance, the Core Ultra 7 265K and 265KF now stand out in the sub‑$250 segment, especially when bundled with motherboards, memory, and games. Consumers should balance these productivity gains against expected Arrow Lake gaming results and keep an eye on AMD's upcoming 3D V‑Cache processors, which promise to intensify competition in the under‑$300 market later this year.

RuggON, a global provider of rugged computing solutions, announces the launch of the SOL 7, a groundbreaking 12-inch fully rugged tablet and the first powered by Intel Arrow Lake processors. Designed for high-performance computing in demanding environments, the SOL 7 delivers next-generation AI capabilities, robust durability and seamless connectivity for critical sectors including public safety, automotive applications, warehousing, logistics, and agricultural.

Unmatched AI Performance with Intel Arrow Lake
Powered by the latest the latest Intel Core Ultra 5/7 processor with integrated Intel AI Boost, the SOL 7 enables powerful on-device AI for real-time analytics, image recognition, and rapid decision-making. Equipped with a suite of data capture tools including optional 2D barcode scanner with OCR, NFC reader with FIDO2 security, smart card reader, fingerprint reader and UHF RFID reader, the SOL 7 empowers field professionals to operate smarter, faster, and more securely.

Rumors of Intel's "Nova Lake-S" processors are increasing, meaning that the design is nearing completion. Expected to arrive in the second half of 2026, Nova Lake‑S will offer configurations ranging from mainstream quad‑core models to a flagship with 52 cores. Initial information suggests that Intel will employ a tile-based design, separating LPE cores from P-Cores and E-Cores to optimize flexibility and yield. At the top of the lineup is the rumored Core Ultra 9 model, possibly designated 385K. It will combine 16 P-cores, 32 E-cores, and four LPE-cores for a total of 52 cores, as previously rumored. With a TDP of 150 W, it will be the most powerful SKU Intel prepared for this generation. Below the flagship, Intel appears to be planning a Core Ultra 7 SKU with 14 P-cores, 24 E-cores, and four LPE cores, totaling 42 cores.

The Core Ultra 5 series may include three variants: a 28-core version with eight P-cores, 16 E-cores, and four LPE-cores; a 24-core version with eight P-cores, 12 E-cores, and four LPE-cores; and an 18-core model with six P-cores, eight E-cores, and four LPE-cores. Entry-level Core Ultra 3 parts would feature either a 16-core configuration with four P-cores, eight E-cores, and four LPE-cores, or a 12-core option with four P-cores, four E-cores, and four LPE-cores, both targeting a 65 W power envelope. All desktop SKUs are expected to feature four LPE cores on a separate die, suggesting a multi-tile package similar to Meteor Lake. Power demands will range from 65 W in entry-level segments to 150 W for high-end parts. Intel is reportedly preparing a new LGA 1954 socket even as it readies an Arrow Lake-S refresh for late 2025. Intel has also reportedly designated Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties.

Intel has revised the recommended retail prices for two of its Core Ultra 7 200S series desktop processors, making the most significant adjustment to its "Arrow Lake‑S" lineup since it launched six months ago. As of right now, the Core Ultra 7 265K carries an MSRP of $299 instead of $399, and the unlocked 265KF model is now $284, down from $384. Intel notes these are suggested prices only—actual costs will vary by retailer, region, taxes, and other factors. These price changes come alongside Intel's Spring Bundle promotion, where buyers receive blockbuster game keys and professional software licenses with qualifying purchases of Core Ultra Series 2 and 14th Gen processors. Intel emphasizes that the new MSRPs are separate from these bundles, so combining both savings opportunities is still possible. Interestingly, Intel has left the pricing for its top‑end Core Ultra 9 285/285K ($549/$589) and its mainstream Core Ultra 5 245/245K/245KF ($270/$309/$294) unchanged.

This suggests the company is focusing on mid‑range SKUs to win back market share rather than adjusting the entire Arrow Lake‑S family. This move also reflects market pressure—early stability issues with the 14th Gen chips and strong performance from AMD's Ryzen 9000X3D series have made Intel's task tougher. A glance at retailer listings shows not everyone has updated prices yet; in some cases, the Core Ultra 7 265K can already be found for under $299. Whether these cuts will drive more gamers, creators, and professionals to Arrow Lake‑S remains to be seen, but Intel is clearly betting on a winning combination of price, recently boosted performance, and bundled extras.

GIGABYTE, a global leader in technology, today announced the availability of its flagship ultra-compact mini-PC, the New BRIX Mainstream series, accompanied by an exclusive product video release. This series is powered by the latest Intel Core Ultra processors (Series 2) and boasts an integrated GPU with a remarkable 20% performance increase over the previous generation. Furthermore, it unleashes exceptional AI performance, delivering up to 96 Tera Operations Per Second (TOPS), making it perfectly suited for demanding generative AI tasks and intensive multitasking scenarios.

⁠Designed to meet the growing needs of smart home solutions, commercial deployments, content creation, and edge computing, the BRIX Mainstream series packs this impressive performance into a remarkably compact 0.46-liter chassis with a sleek 3.5 cm profile. Despite its size, it offers top-tier computing power, flexible expansion options, and an eco-conscious, energy-efficient design - delivers performance that exceeds expectation.

Simply NUC, a global leader in customized computing solutions, proudly adds ASUS's NUC 15 Pro Cyber Canyon to its product lineup, setting a new benchmark for AI-optimized performance in a compact form factor. Engineered with Intel Core Ultra Series 2 processors and Intel Arc Graphics, the Cyber Canyon is designed to accelerate AI workloads, empower edge computing, and deliver seamless business productivity.

"The NUC 15 Pro Cyber Canyon is not just a step forward—it's a leap into the future of AI computing," said Ed Barkhuysen, VP of Product at Simply NUC. "With the latest Intel Core Ultra processors, Wi-Fi 7 connectivity, and cutting-edge security, Cyber Canyon is built for professionals and businesses looking for a powerful yet compact computing solution."

From April 6-9th, UGREEN, a global leader in consumer electronics and charging technology, is showcasing its innovative NASync series at the NAB Show in Las Vegas. The UGREEN NASync iDX6011 and iDX6011 Pro have been the highlights of the display at Booth SL9210 in the Las Vegas Convention Center. These latest UGREEN NASync iDX models revolutionize data management and security for content creators through advanced AI technology, setting a new standard as the world-first AI-powered NAS.

UGREEN NASync is a series of network-attached storage devices tailored for personal, home, or business use. In March 2024, UGREEN launched a 44-day crowdfunding campaign on Kickstarter for the NASync DXP series, successfully raising over $6.6 million achieved No.1 in the NAS category. This remarkable support highlights the strong demand for advanced storage solutions.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its new 2025 pre-configured MG-1 gaming systems, equipped with NVIDIA's cutting-edge GeForce RTX 50-Series GPUs and powered by the latest AMD Ryzen 9000 Series CPUs and Intel Core Ultra Series 2 processors. This exciting lineup offers gamers a significant leap in power, performance, and value, reinforcing MAINGEAR's commitment to redefining the gaming experience across all levels of play.

"2025 is bound to be the best year yet for PC gamers, and the introduction of our newest MG-1 systems continues to drive MAINGEAR's mission to deliver the ultimate gaming experience," said Wallace Santos, CEO of MAINGEAR. "With NVIDIA's RTX 50-Series GPUs, and the latest AMD Ryzen and Intel Core Ultra processors, we've got more options than ever before, ensuring the perfect fit for gamers of all skill levels and budgets."

Eurocom launches the new BLITZ Ultra 2, a lightweight, robust, and fully customizable laptop designed for engineers, military and defense contractors, content creators, and all kinds of computer users who require lightweight professional-grade computing on the go. Combining the latest Intel Core Ultra 7 255H processors with military-tested MIL-STD 810H durability and a long-lasting 10hr battery, the BLITZ Ultra 2 is engineered for users who demand lightweight, performance, long battery life and mobility without compromise.

Powered by Intel Core Ultra 7 255H - Fast, Efficient, and Ready for Modern Workloads
At the heart of the BLITZ Ultra 2 is the latest Intel Core Ultra 7 255H processor, featuring 16 cores, 16 threads, and Intel Arc 140T integrated graphics, pushing up to 5.1 GHz for demanding tasks. Also available with the Intel Core Ultra 5 225H variant, this platform delivers exceptional single-core and multi-core performance for professionals working on code compilation, 3D modeling, virtual machines, and everyday productivity.

Dynabook recently made headlines with its X30W laptop, which was claimed to be one of the lightest laptops available on the market. Now, the company has introduced the Z40L-N laptop, also with Intel's Lunar Lake-equipped internals and an impressively lightweight chassis. However, the Z40L-N packs yet another trick up its sleeve - the laptop boasts a battery that is relatively easy to replace, at least by modern standards. At its core, the Z40L-N laptop is powered by Intel's Core Ultra 200V Lunar Lake CPUs, up to the Core Ultra 7 258V with 32 GB of onboard memory. Clearly, the laptop packs plenty of computing horsepower, and the integrated Arc 140 V GPU should be enough for non-intensive workloads and casual gaming.

At the front, a 14-inch display with a resolution of 1920 x 1200 is on offer. With a sub-1-kg (~2.2 lbs) weight, the 14-inch laptop is effortless to carry around in a backpack, and the 56 Whr battery should provide for decently long runtimes away from the wall. As stated previously, the battery is not glued to the chassis, and is therefore relatively easy to replace simply by removing the back panel and then the battery itself. The base configuration starts at $1,699, and ships with the Core Ultra 5 226V CPU with 16 GB of memory and a 512 GB NVMe SSD. There are a plenty of ports on offer, including a selection of USB-A and USB-C (including Thunderbolt 4) ports, microSD slot, audio jack, as well as a RJ45 gigabit LAN port. For wireless communication, Wi-Fi 7 as well as Bluetooth is present. The higher-end variant with the Intel Core Ultra 7 258V CPU with 32 GB of memory commands a $500 premium over the standard variant, which is to be expected.

The mini PC market has grown substantially in the past few years, in no small part thanks to the commendable performance and efficiency improvements brought to the table by the x86 giants. Gigabyte has unveiled its fair share of such systems, with its latest offering sporting an Intel Core Ultra 5 225H CPU paired with up to a whopping 96 GB of memory. As of right now, we do not have any concrete information regarding when the system will be made available to the public, and at what price. But given the system specifications and Gigabyte's track record, we can expect the system to command an affordable price tag.

As mentioned, the mini PC, dubbed the GB-BRU5-225H, is powered by the Intel Core Ultra 5 225H CPU including four high-performance "Lion Cove" cores, eight high-efficiency "Skymont" cores, as well as two additional "low power" cores for a total of 14 cores and 14 threads. The 12.6 x 3.4 x 11.9 cm mini PC has no room for discrete graphics, and has to rely on the integrated Arc 130T iGPU with eight Xe cores. The system can be equipped with up to 96 GB of DDR5-6400 memory courtesy of its dual SO-DIMM slots. Considering the specifications, the mini PC should be sufficiently potent for the vast majority of moderately intensive workloads thrown its way.

Intel tends to release exclusive desktop processor SKUs for the Chinese market, which tend to come with core configurations and other specs not found in regular SKUs available in the West. The latest such SKU is the Core Ultra 5 230F "Arrow Lake." This chip comes with a unique IHS (integrated heat spreader) design that sees the bulge over the die contracted to a corner. It still has the metal flanks that receive pressure from the socket's retention module. The chip is positioned a notch above the Core Ultra 5 225F, but with an identical core configuration of 6P+4E.

The China-exclusive Core Ultra 5 230F comes with clock speeds of 3.40 GHz base and 5.00 GHz boost for the P-cores, while its E-cores tick at 2.90 GHz base, and 4.40 GHz boost. In comparison, the generally available Core Ultra 5 225F does 3.30 GHz base and 4.90 GHz boost for the P-cores, and 2.70 GHz base with 4.40 GHz boost for the E-cores. Both the 230F and 225F lack integrated graphics. As non-K SKUs, both lack unlocked base frequency multipliers. Each of the six "Lion Cove" P-cores comes with 3 MB of dedicated L2 cache; while the sole "Skymont" E-core cluster shares 4 MB of L2 cache among its cores. The P-cores and E-core cluster share 20 MB of L3 cache. What's with the oddly shaped IHS? We have a theory. It's likely that the chip underneath has the same compact Compute tile as the "Arrow Lake-H" mobile processor, which physically only has 6P+8E cores and 24 MB of L3 cache. The modular nature of "Arrow Lake" also makes it possible for the Graphics tile to be physically absent on F-SKUs. We can't wait for someone to delid this chip.

Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

Intel today launched "locked" 65 W variants of its Core Ultra "Arrow Lake-S" desktop processors in the Socket LGA1851 package. The company also announced more affordable motherboard chipset models, namely the Intel B860 mid-range chipset, and the Intel H810 value-ended chipset. The processor lineup is led by the Intel Core Ultra 9 285 (8P+16E, up to 5.60 GHz P-core boost), followed by the Core Ultra 7 265 (8P+12E, up to 5.30 GHz P-core boost); and the Core Ultra 5 245 (6P+8E, up to 5.10 GHz P-core boost). All three come with suitable boxed cooling solutions in the retail channel.

The Intel B860 chipset comes with a 4-lane DMI 4.0 chipset bus (half the bandwidth of the 8-lane chipset bus of the Intel Z890). The PCH puts out 14 PCI-Express 4.0 general purpose lanes, exactly half the number put out by the Z890. Storage connectivity, besides the configurability of the PCIe GPP lanes, include four SATA 6 Gbps ports. Networking includes a 1 GbE MAC, and Wi-Fi 6E integrated MAC, with Bluetooth 5.3. You can have up to 16 USB 3.2 lanes (each worth 5 Gbps), which can be configured as 5 Gbps, 10 Gbps, or 20 Gbps ports. The B860 lacks CPU overclocking support, but retains memory overclocking, including the ability to apply XMP 3.0 profiles.

The Core Ultra 200H series of mobile processors is designed to cover the majority of mobile device use-cases from the next-generation. These chips are very much based on the latest "Arrow Lake" microarchitecture, but with a few clever design changes. This is a tile-based processor, just like the 200HX series; but the various tiles are different. The Compute tile, which packs the main CPU complex, is noticeably smaller, with 6 "Lion Cove" P-cores, and two "Skymont" E-core clusters with 8 E-cores sharing a 24 MB L3 cache, and a ringbus interconnect. Things get interesting with the SoC tile, which now contains two Low-power Island E-cores. At this point, it is unclear if these are "Skymont," or are older generation "Crestmont" cores, which would mean that Intel has carried over the SoC tile from "Meteor Lake-H."

The SoC tile also contains at 13 TOPS-class NPU, which means these chips miss out on Microsoft Copilot+ AI PC logo. The idea behind this could be that Intel is trying to promote the Core Ultra 200V series "Lunar Lake," which comes with a powerful 45 TOPS NPU. The company is announcing several new models of "Lunar Lake" today, including vPro ones. Switching focus back to "Arrow Lake-H," and our attention is drawn back to the SoC and I/O tiles, which miss out on the number of PCIe lanes, particularly Gen 5 ones, which the Core Ultra 200HX chips come with. The game changer for this chip, however, is the large Graphics tile. The iGPU of "Arrow Lake-H" is based on the same Xe-LPG graphics architecture as the one on "Meteor Lake," and not Xe2 "Battlemage" like on "Lunar Lake." However, this iGPU is vastly different from the one the "Arrow Lake-HX" comes with.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

Here are some of the first pictures of the retail boxes of the Intel Core Ultra 200-series "Arrow Lake-S" 65 W desktop processors. Intel debuted the series with Unlocked K-series SKUs in October 2024, and will expand it in January 2025 with 65 W models that lack unlocked multipliers. The unlocked models lack any included stock cooling solution, while the 65 W models come with them. There's no word on what the coolers look like, but if we were to guess, Intel will reuse its Laminar series fan-heatsinks that it debuted with its 12th Gen Core "Alder Lake."

The new Socket LGA1851 retains cooler compatibility with the previous LGA1700, which is why the company could reuse the Laminar series. The Core Ultra 9 65 W retail box appears the largest, and so it could include the Laminar RH1 cooler that's capable of cooling the processor as it draws its maximum turbo power. This cooler comes with some blue LED illumination. The Core Ultra 7 and Core Ultra 5 65 W retail boxes appear to have the same thickness, which means the two could include the mid-tier Laminar RM1 cooler. The RM1 has a slightly thinner heatsink, but comes with an illuminated ring along the bore of the fan-frame. If Intel launches a Core Ultra 3 series (successor to the Core i3), Intel will likely include the Laminar RS1, the lightest variant, which lacks any lighting. The first three pictures (below) show boxes of the standard variants of the 65 W SKUs, the 4th and 5th pics show the boxes of the "F" SKUs which lack integrated graphics.

Recent Geekbench results have surfaced for Intel's unreleased Core Ultra 5 225F processor without an integrated GPU, showcasing interesting performance improvements over its predecessors. The benchmark results, initially shared by Benchleaks on X, reveal that this new 10-core chip delivers performance comparable to the higher-core-count Core i5-13600. The Core Ultra 5 225F achieved a single-core score of 2,653 points and a multi-core score of 13,028 points. The processor combines six P-cores, four E-cores, and 20 MB of L3 cache. During testing, the chip reached a maximum frequency of 4.887 GHz. When compared to its direct predecessor, the Core i5-14400F, the new 225F demonstrates significant improvements with approximately 13% better performance in both single and multi-core tests.

More impressively, it manages to edge out the 14-core Core i5-13600 by 5% across both metrics despite having fewer cores and threads. However, the 225F falls behind its premium sibling with four more E-cores, the Core Ultra 5 245K, which outperforms it by 16% in single-core and 44% in multi-core operations. The Core Ultra 5 225F is expected to be part of Intel's new 65 W TDP lineup, targeting mainstream desktop systems with limited overclocking capabilities. This positions it as a more energy-efficient alternative to the current 125 W TDP Core Ultra 200 series processors. While we wait for more firmware updates to boost Arrow Lake performance, Intel could target the launch of the F-series SKUs for CES 2025, which is just a few weeks away now.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

ASUS today announced that the all-new Vivobook S 14 (Q423) is now available for purchase in the United States in store and online at Best Buy. Vivobook S 14 elevates your laptop experience, harmoniously blending advanced technology with a clean, minimalist design - making it the perfect companion for on-the-go productivity and entertainment.

Simplicity meets sophistication.
Featuring a 0.55 inch-thin, all-metal chassis, the ASUS Vivobook S 14 (Q423) weighs only 2.87 lbs, making it easy to carry around. It features ASUS IceCool thermal technology with two 97-blade IceBlade fans and two air vents, allowing for optimal performance even under demanding workloads. This Copilot+ PC is powered by up to Intel Core Ultra 5 processor 226V with an AI engine of up to 47 NPU TOPS, making it ideal for running AI applications efficiently. The laptop's ergonomic design includes a customizable single-zone RGB backlit keyboard and an ultra-large touchpad for enhanced comfort and control. It also offers ultrafast WiFi 7 connectivity, a wide array of I/O ports, a 16:10 OLED display, and a Harman Kardon-certified Dolby Atmos audio system, making it the perfect device for dynamic users seeking a powerful and reliable device.

iBUYPOWER, a leading system integrator specializing in high-performance custom and pre-built gaming computers, announced today the availability of Intel's latest Intel Core Ultra 200S series processors across its line of gaming PCs. Starting today, those interested in experiencing the latest in AI augmented desktop gaming can now integrate an Intel Core Ultra 200S series processor into an iBUYPOWER system backed by its extensive warranty that offers three-years labor and two-years parts for comprehensive post-purchase support.

The new Intel Core Ultra desktop processors are designed for a great gaming performance with AI at the forefront and industry-leading compute, at significantly lower power for desktop PCs, as iBUYPOWER customers with the new CPU can fully optimize their PC experience by offloading various tasks, auto-framing the Neural Processing Unit (NPU) for smooth game streaming, and accelerating creative tasks - all of which is powered by three AI accelerators built into the processor to keep the user's data protected and private. This new generation of desktop processors also comes equipped with 20 CPU PCIe 5.0 lanes, 4 CPU PCIe 4.0 lanes, support for 2 integrated Thunderbolt 4 ports, Wi-Fi 6E and Bluetooth 5.3. Intel Killer Wi-Fi delivers supercharged wireless performance and enables seamless, immersive online gameplay through application priority auto-detection, bandwidth analysis and management, and smart AP selection and switching.

As we await the launch of Intel's "Arrow Lake-S" Core Ultra 200S series of processors for desktops, we are getting some new leaks about Intel's mainstream mobile "Arrow Lake-H" update. A month ago, we got the specification table of the high-end mobile "Arrow Lake-HX," and now, thanks to Jaykihn X, we have the mainstream laptop chip specifications as well. The top-of-the-line includes Intel Core Ultra 9 285H, a 45 W TDP SKU with six P-cores, eight E-cores, and two LPE cores. The CPU packs integrated Xe2 graphics with eight cores and 24 MB of total L3 cache and has a maximum boost of 5.4 GHz for P-cores.

Moving down the stack, there are Core Ultra 7 265H and Core Ultra 5 255H SKUs, which feature the same P/E/LPE core configuration. However, these SKUs are rated for 28 W TDP, having lower maximum frequencies and the same iGPU configuration. This time, we also have two Core Ultra 3 SKUs, with Core Ultra 3 235H and 225H bringing four P-cores, eight E-cores, and two LPE-cores in the 28 W package. The Core Ultra 3 235H has eight Xe2 cores in its iGPU, while the lowest-end Core Ultra 3 225H has only seven Xe2 iGPU cores. For a complete set of specifications, including all clock speeds in base and boost, please check out the table below.

Ahead of its October 23 release, PC enthusiast and Twitch streamer Madness727 released some of the first pictures of a de-lidded Core Ultra "Arrow Lake-S" desktop processor. There's no word on which processor model this is, but it shouldn't matter—all models being released this month are based on the same exact configuration of tiles of the "Arrow Lake-S," which means a Compute tile with an 8P+16E core CPU complex, a Graphics tile with 4 Xe cores, and the larger version of the breakout I/O tile that features an integrated Thunderbolt 4 controller.

Intel already released information on its Core Ultra "Arrow Lake-H" mobile processor that comes out in Q1-2025, which is shown featuring a physically smaller Compute tile that has a 6P+8E core CPU complex, a larger Graphics tile with 8 Xe cores, and a smaller breakout I/O tile. You can see where this is going for some of the cheaper Core Ultra 5 and Core Ultra 3 desktop processor models that release in Q1-2025. De-lidding is the process of removing the integrated heatspreader of a desktop processor to enable direct contact between the chip below, and the cooling solution. It is preferred by professional overclockers that use extreme cooling solutions.