Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

Intel today launched "locked" 65 W variants of its Core Ultra "Arrow Lake-S" desktop processors in the Socket LGA1851 package. The company also announced more affordable motherboard chipset models, namely the Intel B860 mid-range chipset, and the Intel H810 value-ended chipset. The processor lineup is led by the Intel Core Ultra 9 285 (8P+16E, up to 5.60 GHz P-core boost), followed by the Core Ultra 7 265 (8P+12E, up to 5.30 GHz P-core boost); and the Core Ultra 5 245 (6P+8E, up to 5.10 GHz P-core boost). All three come with suitable boxed cooling solutions in the retail channel.

The Intel B860 chipset comes with a 4-lane DMI 4.0 chipset bus (half the bandwidth of the 8-lane chipset bus of the Intel Z890). The PCH puts out 14 PCI-Express 4.0 general purpose lanes, exactly half the number put out by the Z890. Storage connectivity, besides the configurability of the PCIe GPP lanes, include four SATA 6 Gbps ports. Networking includes a 1 GbE MAC, and Wi-Fi 6E integrated MAC, with Bluetooth 5.3. You can have up to 16 USB 3.2 lanes (each worth 5 Gbps), which can be configured as 5 Gbps, 10 Gbps, or 20 Gbps ports. The B860 lacks CPU overclocking support, but retains memory overclocking, including the ability to apply XMP 3.0 profiles.

The Core Ultra 200H series of mobile processors is designed to cover the majority of mobile device use-cases from the next-generation. These chips are very much based on the latest "Arrow Lake" microarchitecture, but with a few clever design changes. This is a tile-based processor, just like the 200HX series; but the various tiles are different. The Compute tile, which packs the main CPU complex, is noticeably smaller, with 6 "Lion Cove" P-cores, and two "Skymont" E-core clusters with 8 E-cores sharing a 24 MB L3 cache, and a ringbus interconnect. Things get interesting with the SoC tile, which now contains two Low-power Island E-cores. At this point, it is unclear if these are "Skymont," or are older generation "Crestmont" cores, which would mean that Intel has carried over the SoC tile from "Meteor Lake-H."

The SoC tile also contains at 13 TOPS-class NPU, which means these chips miss out on Microsoft Copilot+ AI PC logo. The idea behind this could be that Intel is trying to promote the Core Ultra 200V series "Lunar Lake," which comes with a powerful 45 TOPS NPU. The company is announcing several new models of "Lunar Lake" today, including vPro ones. Switching focus back to "Arrow Lake-H," and our attention is drawn back to the SoC and I/O tiles, which miss out on the number of PCIe lanes, particularly Gen 5 ones, which the Core Ultra 200HX chips come with. The game changer for this chip, however, is the large Graphics tile. The iGPU of "Arrow Lake-H" is based on the same Xe-LPG graphics architecture as the one on "Meteor Lake," and not Xe2 "Battlemage" like on "Lunar Lake." However, this iGPU is vastly different from the one the "Arrow Lake-HX" comes with.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

Here are some of the first pictures of the retail boxes of the Intel Core Ultra 200-series "Arrow Lake-S" 65 W desktop processors. Intel debuted the series with Unlocked K-series SKUs in October 2024, and will expand it in January 2025 with 65 W models that lack unlocked multipliers. The unlocked models lack any included stock cooling solution, while the 65 W models come with them. There's no word on what the coolers look like, but if we were to guess, Intel will reuse its Laminar series fan-heatsinks that it debuted with its 12th Gen Core "Alder Lake."

The new Socket LGA1851 retains cooler compatibility with the previous LGA1700, which is why the company could reuse the Laminar series. The Core Ultra 9 65 W retail box appears the largest, and so it could include the Laminar RH1 cooler that's capable of cooling the processor as it draws its maximum turbo power. This cooler comes with some blue LED illumination. The Core Ultra 7 and Core Ultra 5 65 W retail boxes appear to have the same thickness, which means the two could include the mid-tier Laminar RM1 cooler. The RM1 has a slightly thinner heatsink, but comes with an illuminated ring along the bore of the fan-frame. If Intel launches a Core Ultra 3 series (successor to the Core i3), Intel will likely include the Laminar RS1, the lightest variant, which lacks any lighting. The first three pictures (below) show boxes of the standard variants of the 65 W SKUs, the 4th and 5th pics show the boxes of the "F" SKUs which lack integrated graphics.

Recent Geekbench results have surfaced for Intel's unreleased Core Ultra 5 225F processor without an integrated GPU, showcasing interesting performance improvements over its predecessors. The benchmark results, initially shared by Benchleaks on X, reveal that this new 10-core chip delivers performance comparable to the higher-core-count Core i5-13600. The Core Ultra 5 225F achieved a single-core score of 2,653 points and a multi-core score of 13,028 points. The processor combines six P-cores, four E-cores, and 20 MB of L3 cache. During testing, the chip reached a maximum frequency of 4.887 GHz. When compared to its direct predecessor, the Core i5-14400F, the new 225F demonstrates significant improvements with approximately 13% better performance in both single and multi-core tests.

More impressively, it manages to edge out the 14-core Core i5-13600 by 5% across both metrics despite having fewer cores and threads. However, the 225F falls behind its premium sibling with four more E-cores, the Core Ultra 5 245K, which outperforms it by 16% in single-core and 44% in multi-core operations. The Core Ultra 5 225F is expected to be part of Intel's new 65 W TDP lineup, targeting mainstream desktop systems with limited overclocking capabilities. This positions it as a more energy-efficient alternative to the current 125 W TDP Core Ultra 200 series processors. While we wait for more firmware updates to boost Arrow Lake performance, Intel could target the launch of the F-series SKUs for CES 2025, which is just a few weeks away now.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

ASUS today announced that the all-new Vivobook S 14 (Q423) is now available for purchase in the United States in store and online at Best Buy. Vivobook S 14 elevates your laptop experience, harmoniously blending advanced technology with a clean, minimalist design - making it the perfect companion for on-the-go productivity and entertainment.

Simplicity meets sophistication.
Featuring a 0.55 inch-thin, all-metal chassis, the ASUS Vivobook S 14 (Q423) weighs only 2.87 lbs, making it easy to carry around. It features ASUS IceCool thermal technology with two 97-blade IceBlade fans and two air vents, allowing for optimal performance even under demanding workloads. This Copilot+ PC is powered by up to Intel Core Ultra 5 processor 226V with an AI engine of up to 47 NPU TOPS, making it ideal for running AI applications efficiently. The laptop's ergonomic design includes a customizable single-zone RGB backlit keyboard and an ultra-large touchpad for enhanced comfort and control. It also offers ultrafast WiFi 7 connectivity, a wide array of I/O ports, a 16:10 OLED display, and a Harman Kardon-certified Dolby Atmos audio system, making it the perfect device for dynamic users seeking a powerful and reliable device.

iBUYPOWER, a leading system integrator specializing in high-performance custom and pre-built gaming computers, announced today the availability of Intel's latest Intel Core Ultra 200S series processors across its line of gaming PCs. Starting today, those interested in experiencing the latest in AI augmented desktop gaming can now integrate an Intel Core Ultra 200S series processor into an iBUYPOWER system backed by its extensive warranty that offers three-years labor and two-years parts for comprehensive post-purchase support.

The new Intel Core Ultra desktop processors are designed for a great gaming performance with AI at the forefront and industry-leading compute, at significantly lower power for desktop PCs, as iBUYPOWER customers with the new CPU can fully optimize their PC experience by offloading various tasks, auto-framing the Neural Processing Unit (NPU) for smooth game streaming, and accelerating creative tasks - all of which is powered by three AI accelerators built into the processor to keep the user's data protected and private. This new generation of desktop processors also comes equipped with 20 CPU PCIe 5.0 lanes, 4 CPU PCIe 4.0 lanes, support for 2 integrated Thunderbolt 4 ports, Wi-Fi 6E and Bluetooth 5.3. Intel Killer Wi-Fi delivers supercharged wireless performance and enables seamless, immersive online gameplay through application priority auto-detection, bandwidth analysis and management, and smart AP selection and switching.

As we await the launch of Intel's "Arrow Lake-S" Core Ultra 200S series of processors for desktops, we are getting some new leaks about Intel's mainstream mobile "Arrow Lake-H" update. A month ago, we got the specification table of the high-end mobile "Arrow Lake-HX," and now, thanks to Jaykihn X, we have the mainstream laptop chip specifications as well. The top-of-the-line includes Intel Core Ultra 9 285H, a 45 W TDP SKU with six P-cores, eight E-cores, and two LPE cores. The CPU packs integrated Xe2 graphics with eight cores and 24 MB of total L3 cache and has a maximum boost of 5.4 GHz for P-cores.

Moving down the stack, there are Core Ultra 7 265H and Core Ultra 5 255H SKUs, which feature the same P/E/LPE core configuration. However, these SKUs are rated for 28 W TDP, having lower maximum frequencies and the same iGPU configuration. This time, we also have two Core Ultra 3 SKUs, with Core Ultra 3 235H and 225H bringing four P-cores, eight E-cores, and two LPE-cores in the 28 W package. The Core Ultra 3 235H has eight Xe2 cores in its iGPU, while the lowest-end Core Ultra 3 225H has only seven Xe2 iGPU cores. For a complete set of specifications, including all clock speeds in base and boost, please check out the table below.

Ahead of its October 23 release, PC enthusiast and Twitch streamer Madness727 released some of the first pictures of a de-lidded Core Ultra "Arrow Lake-S" desktop processor. There's no word on which processor model this is, but it shouldn't matter—all models being released this month are based on the same exact configuration of tiles of the "Arrow Lake-S," which means a Compute tile with an 8P+16E core CPU complex, a Graphics tile with 4 Xe cores, and the larger version of the breakout I/O tile that features an integrated Thunderbolt 4 controller.

Intel already released information on its Core Ultra "Arrow Lake-H" mobile processor that comes out in Q1-2025, which is shown featuring a physically smaller Compute tile that has a 6P+8E core CPU complex, a larger Graphics tile with 8 Xe cores, and a smaller breakout I/O tile. You can see where this is going for some of the cheaper Core Ultra 5 and Core Ultra 3 desktop processor models that release in Q1-2025. De-lidding is the process of removing the integrated heatspreader of a desktop processor to enable direct contact between the chip below, and the cooling solution. It is preferred by professional overclockers that use extreme cooling solutions.

MSI proudly introduces the next generation of motherboards, designed to pair seamlessly with Intel brand-new Core Ultra Processors. The Z890 MEG Series, MPG Series, MAG Series, and PRO Series motherboards are designed to harness the power of Intel's latest technology, delivering enhanced AI computing efficiency compared to previous generations. These boards provide exceptional performance with advanced features, MSI innovations, premium components, and improved connectivity. But what truly sets them apart is their user-friendly DIY solutions, empowering you to take control of your computing experience. Built with gamers, creators, and all users in mind, MSI's Z890 motherboards offer the very best in computing power. On launch, there will be 5 models available, which are the Intel Core Ultra 9 285K, Intel Core Ultra 7 265K / 265KF, and Intel Core Ultra 5 245K / 245KF processors.

With the introduction of MSI's Z890 motherboards, designed to push performance boundaries and with a completely redesigned, more intuitive BIOS, users can now maximize motherboard performance with ease. Powered by MSI's Ultra Engine, memory design optimization enables overclocking up to 9200+ MT/s across the entire Z890 motherboard lineup. And with the returning of the MEG Z890 UNIFY-X, built with overclocking in mind, takes memory frequencies even higher, reaching up to 9600 MT/s. The Z890 motherboards incorporate a number of powerful features like AI Boost with the ability to overclock the NPU further for AI enhancement capabilities, Game Boost, Performance Preset, enhanced XMP Memory Profiles, and Memory Try It!, allowing users to elevate their system's performance to new heights.

Noctua today confirmed that all its CPU coolers and mounting-kits that support Intel LGA1700 also support the new LGA1851 socket of the upcoming Core Ultra desktop processors (Series 2), also known under the code name Arrow Lake-S. Mounting upgrade kits for older heatsink models that do not yet support LGA1700 and LGA1851 will be provided to customers free of charge.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Intel Core Ultra Series 2 processors and their new LGA1851 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support LGA1851 out of the box and don't require any updates, customers will be able to upgrade most older coolers at no additional cost, so even the very first Noctua coolers from 2005 can be used on the latest Intel processors!"

Intel's Arrow Lake-S launch line-up has been confirmed courtesy of serial leaker @9550pro on X/Twitter and although the leaked Intel product slide doesn't contain any real surprises by now, it does confirm that Intel will launch five different SKUs later this month. The Core 200S-series should be unveiled on Thursday by Intel, but retail availability isn't expected until the 24th of October. The Initial five CPU SKUs will be the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF and finally the Core Ultra 5 245K and 245KF. As noted earlier today in the performance leak of the Core Ultra 9 285K, the entire Arrow Lake-S series will lack Hyper-Threading in favour of more E-cores. The Core Ultra 9 285K features eight Lion Cove P-cores and 16 Skymont E-cores, followed by the Core Ultra 7 265 SKUs which retain the Lion Cove core count, but ends up with only 12 Skymont cores. Finally, the Core Ultra 5 SKUs have six Lion Cove P-cores and eight Skymont E-cores. All the upcoming SKUs feature Intel's Thermal Velocity Boost, a feature that used to be exclusive to the Core i9 tier of CPUs in the past, but only the Core Ultra 9 and Ultra 7 SKUs support Intel Turbo Boost Max Technology 3.0. The Core Ultra 9 and Ultra 7 SKUs have a maximum TDP of 250 W, with the Core Ultra 5 SKUs peaking at 159 W. All five processors have a base power of 125 W.

As such, we're looking at boost speeds of up to 5.7 GHz for the Core Ultra 9, 5.5 GHz for the Core Ultra 7 and 5.2 GHz for the Core Ultra 5 processors. The Core Ultra 5 has the highest base frequency of the three SKUs with the P-cores clocking in at 4.2 GHz and the E-cores at 3.6 GHz. The Core Ultra 7 follows at 3.9 GHz for the P-Cores and 3.3 GHz for the E-cores and finally the Core Ultra 9 has a base frequency of 3.7 GHz for the P-Cores and 3.2 GHz for the E-cores. Intel has upped the JEDEC memory support to DDR5-6400, which is an 800 MHz jump in the officially supported memory speed from its 14th Gen Core i processors. Up to 192 GB of RAM is supported, which is the same as the previous generation of desktop CPUs from Intel. The IGP sports four Xe-cores across the board of the K SKU CPUs, with a base clock of 300 MHz and a boost clock of up to 2 GHz, although the Core Ultra 5 SKUs end up with an IGP that only boosts to 1.9 GHz. All SKUs also feature a third generation NPU capable of 13 TOPS, which is a lot weaker than the mobile Core Ultra 200V Lunar Lake CPUs which have an NPU capable of up to 48 TOPS, depending on the SKU. As this leak appears to be from the same original source as the performance figures that leaked earlier, we'd assume the information is correct, especially as it lines up with earlier leaks, but it should still be taken with a pinch of salt until everything has been confirmed by Intel.

Canadian online retailer ShopRBC put up listings of unreleased Intel Core Ultra 200-series "Arrow Lake-S" desktop processors. While the availability listed is zero, you can backorder these chips at the prices listed, so they are shipped when available. The flagship Intel Core Ultra 9 285K (8P+16E) processor is listed at CAD $852 (around USD $628). There is no "KF" variant of this part unlike with past generations of Intel flagship SKUs. The Core Ultra 7 265K (8P+12E) is next up, at CAD $589 (USD $435). Its KF variant, which lacks integrated graphics, is up for CAD $22 less than that (CAD $567 or USD $418).

Intel's middle-of-the-market part for this generation, the Core Ultra 5 245K (6P+8E) is next up, listed at CAD $450, or USD $331. You can back-order its KF variant for CA $23 less, at CA $427 (USD $315). The Core Ultra 200 "Arrow Lake-S" introduces the new Socket LGA1851, and so online retailers around the world should begin putting up compatible motherboards based on the Intel Z890 chipset, which is rumored to be the only chipset option available with these chips until Q1-2025, when Intel fleshes out the series with non-K SKUs and value chipsets such as the B860.

While the upcoming desktop versions of Intel's "Arrow Lake" processors are stealing all the hype, we are getting a leak about the high-performance "Arrow Lake-HX" chips for laptop space. Thanks to Jaykihn on X, we learn that Intel has prepared six SKUs for laptop enthusiasts to power workstations and gaming. The upcoming Core Ultra 200 series SKUs are 285HX, 275HX, 265HX, 255HX, 245HX, and 235HX. Starting with the lower-end Core Ultra Core Ultra 5 245HX / 235HX, we get six P-cores running at 3.1 and 2.9 GHz base speeds, respectively. For both SKUs, E-cores are clocked at 2.6 GHz at the base. Boosing the P-cores yields a maximum of 5.1 GHz, while E-cores top out at 4.5 GHz. For graphics, the 48 EUs inside the iGPU are clocked at 1.8 GHz on the 235 HX, while 245 HX runs at 1.9 GHz. THese models don't support Thermal Velocity Boost and Turbo Boost Max 3.0, while of the remaining SKUs support both features.

Moving to the middle of the stack, there are two SKUs: Core Ultra 7 265HX / 255HX. Both feature eight P-cores and twelve E-cores. The differentiator here is the clock speed. P-cores on the 255HX run at 2.4 GHz base and 5.2 GHz boost, while the P-cores on 265HX run at 2.6 GHz base and 5.3 GHz boost. E-cores have a wider gap with the 255HX running at 1.8 GHz base and 4.5 GHz boost, while 265HX has E-cores pinned at 2.3 GHz base and 4.6 GHz boost. Both of these SKUs have iGPU with 64 EUs set at 1.9 GHz.

Hot on the heels of yesterday's leak of the Core Ultra 9 285K "Arrow Lake" retail box, we have pictures of the boxes the Core Ultra 7 265K/KF, and the Core Ultra 5 245K/KF. These are simpler paperboard boxes that retain essential box-art design of the 285K, but lack the fancy jewel-case. The processor comes in the usual plastic blister inside the box, along with the case badge. This time around, Intel is not releasing a "KF" variant of the Core Ultra 9 285K, but if down the line it does, you can expect it to come in a similar simple retail package as the 265K/KF.

The Intel Core Ultra main brand is positioned prominently on the front face. Much like the 14th Gen Core, the Intel brand is displayed in the same font size as Core. Below the two, is the Unlocked designation, followed by "Series 2," which indicates the 200 processor model numbering sequence. The top-right corner has the brand extension (3, 5, 7, 9). Intel is expected to launch its Core Ultra 200-series "Arrow Lake-S" desktop processors in late-October, 2024.

Intel has reportedly delayed the launch of its next-generation Core Ultra 200K series "Arrow Lake-S" desktop processors by a week. Originally slated for an October 17, 2024 launch, these chips are now releasing on October 24, according to HKEPC. There's no reason cited for the delay, it probably has to do with retailer stocking. The delay isn't significant. The Core Ultra 200K introduce a new CPU socket, the LGA1851, which means these chips need to launch alongside new motherboards based on the Intel 800-series.

The initial wave of processors is expected to include only SKUs targeting overclockers and enthusiasts. These include the Core Ultra 9 285K (8P+16E), the Core Ultra 7 265K (8P+12E), and the Core Ultra 5 245K (6P+8E), and their "KF" variants that lack integrated graphics. It's also expected that the first wave of compatible motherboards will only come with the premium Intel Z890 chipset, which supports CPU overclocking. Intel will likely expand its processor model selection, along with more affordable chipsets, such as the B860, around the 2025 International CES.

Intel is preparing at least twelve Core Ultra 200-series "Arrow Lake-S" desktop processor SKUs for the consumer segment, with more variants possible for the commercial desktop segment in the future. Q4 2024 could see the company debut its first SKUs targeting the PC enthusiast and gamer crowd with as many as five unlocked K or KF series SKUs. These, and finer details such as clock speeds, were revealed in a massive info dump by Jaykihn, a reliable source with Intel leaks. Intel is expected to debut the series later this year with the Core Ultra 9 285K, the Core Ultra 7 265K and 265KF; and the Core Ultra 5 245K and 245KF. The company is skipping a KF SKU for its top Core Ultra 9 part.

As has been consistent for several past generations of Intel processors, the top Core Ultra 9 (formerly Core i9) tier gets Thermal Velocity Boost, Turbo Boost Max 3.0, and classic Turbo Boost 2.0. The 285K maxes out the "Arrow Lake-S" B0 silicon, enabling all 8 "Lion Cove" P-cores, and all 16 "Skymont" E-cores. It comes with a P-core base frequency of 3.70 GHz, and an impressive 3.20 GHz E-core base frequency. The maximum P-core boost frequency achievable for up to two cores is 5.70 GHz, and 3-6 as well as 7-8 cores boost up to 5.40 GHz, making it the all-P-core boost frequency for this chip. The four E-core clusters are assured an all-E-core boost frequency of 4.60 GHz. The iGPU has 64 execution units, and ticks at up to 2.00 GHz.

Eurocom launches the Blitz Ultra, a 14-inch and 16-inch enterprise class laptop loaded with features related to security and manageability while carrying unmatched connectivity and expandability. It is powered by Intel's ultra-efficient 14th-gen Intel Ultra Meteor Lake Processor, a robust 73Wh 10hrs+ battery and a captivating 16:10 screen. Your productivity will soar to new heights. Heavy duty, yet lightweight 1.6 kg / 3.52 lbs design that meets military standard MIL-STD 810H. When it comes to security features, the Blitz Ultra has built-in TPM 2.0 data-encryption module, BIOS support for SED (Self Encrypting Drives) and a Kensington lock making it the ultimate enterprise-class laptop for security, connectivity and expandability.

"The Eurocom Blitz Ultra is designed for government, military, security, healthcare and corporate professionals engaged in mission-critical computing and/or handling corporate IP assets and/or customer's sensitive data. It provides secure access via data encryption via TPM 2.0 module. Blitz Ultra has a Factory- installed Offline Permanent Disconnect Option. This is an optional upgrade to physically remove all connectivity and communications components to ensure a 100% offline system for maximum security of sensitive data and protection of intellectual property. " - Mark Bialic, Eurocom President.

Vecow has launched its TGS-1000 series of mini PCs, featuring stackable expansion options for networking, wireless mobility, and additional capabilities. The Vecow TGS-1000 Series is an ultra-compact, fanless, stackable embedded computer lineup that includes the TGS-1000 and TGS-1500 models, powered by Intel Core Ultra Meteor Lake processors with integrated CPU, GPU, and NPU. This series supports up to 96 GB of DDR5 memory. Optimized for edge AI applications, it delivers up to a 14% boost in CPU performance and enhanced graphics capabilities.

The TGS-1000 Series can drive up to five independent displays through two HDMI and three DisplayPort (DP) ports. It features a variety of I/O connections, including up to five USB 3.0 ports (four Type-A and one Type-C) and a 2.5GbE LAN port with TSN support. Its modular design allows for flexible expansion with options for USB, isolated DIO, COM, LAN, or 4G/LTE, making it suitable for AI, smart retail, office communication, and gaming. The TGS-1500 model adds support for MXM graphics cards up to RTX 5000 Ada.

Intel has officially confirmed the upcoming Core Ultra 200V "Lunar Lake" CPU generation is arriving on September 3rd. The official media alert states: "Ahead of the IFA 2024 conference, join Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group, and Jim Johnson, senior vice president and general manager of the Client Business Group, and Intel partners as they launch the next generation of Intel Core Ultra processors, code-named Lunar Lake. During the livestreamed event, they will reveal details on the new processors' breakthrough x86 power efficiency, exceptional core performance, massive leaps in graphics performance and the unmatched AI computing power that will drive this and future generations of Intel products."

With IFA happening in Berlin from September 6th to 10th, Intel's Lunar Lake launch is also happening in Berlin just a few days before, on September 3rd at 6 p.m. CEST (9 a.m. PDT). We expect to see nine SKUs: Core Ultra 9 288V, Core Ultra 7 268V, Core Ultra 7 266V, Core Ultra 7 258V, Core Ultra 7 256V, Core Ultra 5 238V, Core Ultra 5 236V, Core Ultra 5 228V, and Core Ultra 5 226V. All of the aforementioned models feature four P-cores and four E-cores, with varying Xe2 GPU core counts and clocks. We also expect to see Intel present its design wins and upcoming Lunar Lake devices like laptops during the launch.

Intel is preparing a complete refresh of its desktop platform this year, with the introduction of the Core Ultra 200 series processors based on the "Arrow Lake" microarchitecture. The company skipped a desktop processor based on "Meteor Lake," probably because it didn't meet the desired multithreaded performance targets for Intel as it maxed out at 6P+8E+2LP, forcing Intel to come up with the 14th Gen Core "Raptor Lake Refresh" generation to see it through 2H-2023 and at least three quarters of 2024. The company, in all likelihood, will launch the new "Arrow Lake-S" Core Ultra 200 series toward late-Q3 or early-Q4 2024 (September-October). The first wave will include the overclocker-friendly K- and KF SKUs, alongside motherboards based on the top Intel Z890 chipset. 2025 will see the series ramp to more affordable processor models, and mainstream chipsets, such as the B860. These processors require a new motherboard, as Intel is introducing the new Socket LGA1851 with them.

Core configurations of the "Arrow Lake-S" chip surfaced on the web thanks to Jaykihn, a reliable source with Intel leaks. In its maximum configuration, the chip is confirmed to feature 8 P-cores, and 16 E-cores. There are no low-power island E-cores. Each of the 8 P-cores is a "Lion Cove" featuring 3 MB of dedicated L2 cache; while each the E-cores are "Skymont," arranged in 4-core modules that share 4 MB L2 caches among them. Intel claims that the "Lion Cove" P-core offers a 14% IPC increase over the "Redwood Cove" P-core powering "Meteor Lake," which in turn had either equal or a 1% IPC regression compared to "Raptor Cove." This would put "Lion Cove" at a 13-14% IPC advantage over the "Raptor Cove" cores. It's important to note here, that the "Lion Cove" P-cores lack HyperThreading, so Intel will be banking heavily on the "Skymont" E-cores to shore up generational multithreaded performance increase. "Skymont" was a show-stopper at Intel's Computex event, with a nearly 50% IPC gain over previous generations of Intel E-cores, which puts it at par with the "Raptor Cove" cores in single-thread performance.

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