Following the enthusiastic market response and positive reviews of the revolutionary Flashstor series NAS, ASUSTOR Inc. has released all-new all-M.2 SSD NAS, the Flashstor Gen2 series, which includes both the Flashstor 6 Gen2 and Flashstor 12 Pro Gen2. The Flashstor Gen2 series brings radical hardware upgrades to meet the demands of enthusiasts and professionals. The Flashstor Gen2 series brand new hardware to achieve ultimate performance. The new Flashstor Gen2 series is powered by AMD's 6 nm Quad-Core Ryzen Embedded V3C14 which clocks up to 3.8 GHz. This new CPU delivers efficient, yet high performance, which along with high-speed I/O connectivity enables you to make the most out of your ASUSTOR NAS.

The Flashstor Gen2 series come with 10-Gigabit Ethernet, dual USB4 ports in an ASUSTOR first. USB4 is so fast, that it helps to fully unleash the high speeds offered by the M.2 SSDs. The USB4 ports are also compatible with Thunderbolt devices, as well as direct attach technology, extended possibilities that surpass the imagination of professionals and creators.

KIOXIA America, Inc. today announced that it has begun mass production of the industry's first Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

QLC UFS offers a higher bit density than traditional TLC UFS, making it suitable for mobile applications that require higher storage capacities. Advancements in controller technology and error correction have enabled QLC technology to achieve this while maintaining competitive performance. KIOXIA's new 512 gigabyte (GB) QLC UFS achieves sequential read speeds of up to 4,200 megabytes per second (MB/s) and sequential write speeds of up to 3,200 MB/s, taking full advantage of the UFS 4.0 interface speed.

With Industry 4.0, the rapid rise of Artificial Intelligence (AI), digitized manufacturing and the age of IoT everything, the demand for wireless connectivity in commercial and industrial applications is growing at an exceptional pace. These applications typically require reliable connectivity that can withstand extreme environments that are exposed to high temperatures, background noise and obstructions. To help meet this need, Microchip Technology has added 20 products to its Wi-Fi portfolio. Expanding one of the industry's most extensive wireless connectivity product lines, Microchip offers high-performance Wi-Fi microcontrollers (MCUs), network and link controllers and plug-and-play modules designed to simplify development and speed time to market.

The company's Wi-Fi solutions are designed to support various application needs and developer skill levels. The selection ranges from modules that are regulatory certified in several countries that require no Radio Frequency (RF) expertise and little programming to robust Systems-on-Chip (SoCs) with industrial-level features.

At an industry event in Austin today, Thundercomm announces RUBIK Pi, the first Pi built on Qualcomm SoC platforms for developers. RUBIK Pi is an innovative tool that aims to lower the barriers application development with AI inference, allowing developers to access high-performance, easy-to-deploy AI R&D tools.

The Pi product is a must-have for electronics enthusiasts and developers. It can be seen as a microcomputer, integrating a processor, memory, storage, and various interfaces on a credit card-sized board. Thundercomm, a world-leading IoT product and solution provider, building on its expertise in ICT technologies and developer workflows, launched RUBIK Pi, aiming to create the most user-friendly AI R&D tools.

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.

AMD continually sets the industry standard with its EPYC Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors.

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering exceptional performance for high-demand workloads while maximizing power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability. Engineered to excel in the most demanding embedded environments, the AMD EPYC Embedded 8004 Series is perfectly suited for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring seamless handling of dynamic workloads.

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

AAEON, a leading provider of industrial PC solutions, has introduced two new models to its comprehensive Fanless Embedded Box PC portfolio: the BOXER-6645U-RPL and the BOXER-6406U-ADN. The concurrent launch of these two products underscores AAEON's dedication to delivering high-quality industrial computing systems that cater to diverse application requirements, while leveraging the full spectrum of Intel processing technology.

The BOXER-6645U-RPL is a high-performance embedded PC with cross-generation CPU compatibility, as indicated by its support for 12th, 13th, and 14th Generation Intel Core socket-type processors, up to 65 W. Consequently, AAEON anticipates that the BOXER-6645U-RPL will serve as an optimal solution for customers seeking robust and easily deployable hardware capable of managing highly demanding workloads.

MSI is excited to introduce the MS-C907, a robust and versatile embedded Box IPC designed to meet the demanding requirements of various industries. Beyond its suitability for the chemical industry, the MS-C907 is ideal for applications in factory automation, transportation, digital signage and retail.

Meeting the Needs of Multiple Industries
The MS-C907 offers robust performance, extensive connectivity, and durable design, making it an ideal solution for a wide range of industrial applications. Whether it's automating factory processes, powering digital signage, or managing smart building systems, the MS-C907 provides the reliability and efficiency needed for continuous operation.

Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.

Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base.

Following the success of the de next form factor, which included the world's smallest single board computers to host Intel Core and AMD Ryzen V2000 Series processors, AAEON has announced de next brand's first edge system, the de next-TGU8-EZBOX. Mirroring its record-breaking SBC counterparts, the de next-TGU8-EZBOX is the world's smallest edge PC with an embedded Intel Core processor, measuring just 95.5 mm x 69.5 mm x 42.5 mm with a heatsink, and 95.5 mm x 69.5 mm x 45.4 mm with an active cooler. The system is suitable for edge computing and IoT gateway solutions, especially in scenarios with there is limited space. Furthermore, the benefits that come with fanless heat dissipation, such as low noise and protection against dust, will appeal to customers in both the digital signage and industrial markets.

The system retains many of the I/O features of its board counterparts, including multiple high-speed interfaces for industrial-grade performance. Two LAN ports, operating at both 2.5GbE and GbE speeds, are conveniently grouped together with two USB 3.2 Gen 2 ports and one HDMI 1.4b port for easy interface access during operation.

AMD classified the Zenbleed vulnerability, CVE-2023-20593, as a medium-level threat about a year ago. AMD has acknowledged that it could potentially allow an attacker to access sensitive information under certain microarchitectural circumstances. Today, MSI has released new BIOS updates featuring AMD's AM4 AGESA 1.2.0.Ca firmware update. This update addresses the Zenbleed vulnerability affecting AMD's Ryzen 4000 series Zen 2 APUs. MSI is proactively rolling out the new BIOS updates across its range of compatible motherboards. The updates are currently available for almost all X570 motherboards, with support for other chipsets and 400 series motherboards expected to follow soon.

The AGESA 1.2.0.Ca firmware update specifically targets the Zenbleed vulnerability in the Zen 2 microarchitecture. Although the vulnerability primarily affects Ryzen 4000 "Renoir" APUs, it also exists in other Zen 2 processors, including the Ryzen 3000 series and certain EPYC and Threadripper CPUs. AMD has already addressed the Zenbleed vulnerability in previous AGESA microcode updates for Ryzen 3000 processors and other platforms, such as EPYC server CPUs and Ryzen mobile CPUs. However, the Ryzen Embedded V2000 CPUs are still awaiting the EmbeddedPi-FP6 1.0.0.9 AGESA firmware update, which is expected to be released by April. While AMD has not explicitly stated whether the security update will impact performance, previous testing of Zenbleed fixes has shown potential performance drops of up to 15% in certain workloads, although gaming performance remained relatively unaffected. Users with AM4 chips based on architectures other than Zen 2, such as Zen+ or Zen 3, do not need to update their BIOS as they are not affected by this specific vulnerability.

Aetina, a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany. This groundbreaking product is a small form factor PCIe graphics card powered by the high-performance Intel Arc A380E GPU.

Unmatched Power in a Compact Design
The Aetina IA380E-QUFL delivers workstation-level performance packed into a low-profile, single-slot form factor. This innovative solution consumes only 50 W, making it ideal for space and power-constrained edge computing environments. Embedded system manufacturers and integrators can leverage the power of 4.096 TFLOPs peak FP32 performance delivered by the Intel Arc A380E GPU.

ASUS IoT, the global AIoT solution provider, today announced PE8000G at Embedded World 2024, a powerful edge AI computer that supports multiple GPU cards for high performance—and is expertly engineered to handle rugged conditions with resistance to extreme temperatures, vibration and variable voltage. PE8000G is powered by formidable Intel Core processors (13th and 12th gen) and the Intel R680E chipset to deliver high-octane processing power and efficiency.

With its advanced architecture, PE8000G excels at running multiple neural network modules simultaneously in real-time—and represents a significant leap forward in edge AI computing. With its robust design, exceptional performance and wide range of features, PE8000G series is poised to revolutionize AI-driven applications across multiple industries, elevating edge AI computing to new heights and enabling organizations to tackle mission-critical tasks with confidence and to achieve unprecedented levels of productivity and innovation.

According to the latest report from ComputerBase, Intel had a strong presence at the recently concluded Embedded World 2024 conference. The company officially showcased its Arc series of GPUs for the embedded market, based on the existing Alchemist chips rebranded as the "E series." However, industry whispers hint at a more significant development—the impending launch of Intel's second-generation Arc Xe² GPUs, codenamed "Battlemage," potentially before the lucrative Black Friday shopping season. While Alchemist serves as Intel's current offering for embedded applications, many companies in attendance expressed keen interest in Battlemage, the successor to Alchemist. These firms often cover a broad spectrum, from servers and desktops to notebooks and embedded systems, necessitating a hardware platform that caters to this diverse range of applications.

Officially, Intel had previously stated that Battlemage would "hopefully" arrive before CES 2025, implying a 2024 launch. However, rumors from the trade show floor suggest a more ambitious target—a release before Black Friday, which falls on November 29th this year. This timeline aligns with Intel's historical launch patterns, as the original Arc A380 and notebook GPUs debuted in early October 2022, albeit with a staggered and limited rollout. Intel's struggles with the Alchemist launch serve as a learning experience for the company. Early promises and performance claims for the first-generation Arc GPUs failed to materialize, leading to a stuttering market introduction. This time, Intel has adopted a more reserved approach, avoiding premature and grandiose proclamations about Battlemage's capabilities.

AMD today announced the expansion of the AMD Versal adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

These initial devices in the Versal Series Gen 2 portfolio build on the first generation with powerful new AI Engines expected to deliver up to 3x higher TOPs-per-watt than first generation Versal AI Edge Series devicesi, while new high-performance integrated Arm CPUs are expected to offer up to 10x more scalar compute than first gen Versal AI Edge and Prime series devicesii.

DFI, the world's leading brand in embedded motherboards and industrial computers, proudly announced the launch of its innovative product lineup featuring Windows on Arm (WoA) at Embedded World 2024. DFI NXP products deliver high power efficiency and seamlessly integrate Windows on Arm, introducing a new era in computing where the traditional stronghold of Windows on x86 processors is evolving.

Arm and Microsoft revealed a compelling study that projected an 81% growth in the Windows on Arm market within the next five years. DFI's commitment to embracing this dynamic landscape is evident in its latest product offerings, designed to unlock the true potential of WoA. The diverse NXP product lineup included Single Board Computers, system-embedded Box PCs, and Panel PCs tailored to various customer needs.

AMD has introduced the Ryzen Embedded 8000 Series processors, the first AMD embedded devices to combine NPUs based on the AMD XDNA architecture with traditional CPU and GPU elements, optimized for workload versatility and adaptability targeting industrial AI applications. Embedded solution engineers and developers can harness the processing power and leadership features for a variety of industrial AI applications including machine vision, robotics, and industrial automation. AI is widely used in machine vision applications today to enhance quality control and inspection processes.

AI can also help robots make real-time, route-planning decisions and adapt to dynamic environments. In industrial automation, AI processing helps intelligent edge devices perform complex analysis and decision-making without relying on cloud connectivity. This allows for real-time monitoring, predictive maintenance, and autonomous control of industrial processes, enhancing operational efficiency and reducing downtime.

SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6 nm "Zen 3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

"Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line as it represents a significant leap forward in embedded computing and offers unmatched performance and scalability for networking and edge applications," said Dr. Atai Ziv, CEO at SolidRun. "By leveraging the power of AMD's Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing."

Simply NUC, Inc, a leading computing solutions company focused on small form factor PCs, announced the launch of Bravo Canyon (ASUS NUC 13 Rugged), the newest addition to the Intel-based Rugged NUC lineup. Set to revolutionize embedded computing with its robust features, unparalleled versatility, and engineered to excel in demanding environments, Bravo Canyon offers a range of processor variants and customization options to meet the diverse needs of industrial applications.

"Bravo Canyon represents a significant leap forward in embedded computing," said Aaron Rowsell, Founder & President of Simply NUC. "With its powerful processor variants, rugged design, and extensive customization options, it's a game-changer for industries seeking reliable and adaptable computing solutions. We're proud to introduce a product that sets a new standard in the field."

AMD today announced the launch of AMD Embedded+, a new architectural solution that combines AMD Ryzen Embedded processors with Versal adaptive SoCs onto a single integrated board to deliver scalable and power-efficient solutions that accelerate time-to-market for original design manufacturer (ODM) partners. Validated by AMD, the Embedded+ integrated compute platform helps ODM customers reduce qualification and build times for faster time-to-market without needing to expend additional hardware and R&D resources. ODM integration using Embedded+ architecture enables the use of a common software platform to develop designs with low power, small form factors, and long lifecycles for medical, industrial, and automotive applications.

"In automated systems, sensor data has diminishing value with time and must operate on the freshest information possible to enable the lowest latency, deterministic response," said Chetan Khona, senior director of Industrial, Vision, Healthcare and Sciences Markets, AMD. "In industrial and medical applications, many decisions need to happen in milliseconds. Embedded+ maximizes the value of partner and customer data, with energy efficiency and performant computing that enables them to focus in turn on addressing their customer and market needs."

Today, AMD announced it will showcase automotive innovation at CES 2024 and expand its portfolio with the introduction of two new devices, the Versal AI Edge XA adaptive SoC and Ryzen Embedded V2000A Series processor. The devices underscore AMD automotive technology leadership and are designed to serve key automotive focus segments including infotainment, advanced driver safety and autonomous driving. Working alongside a growing automotive partner ecosystem, AMD will demonstrate at CES 2024 the broad range of capabilities and applications for these new devices in automotive solutions available today and in the future.

Versal AI Edge XA adaptive SoCs add an advanced AI Engine, enabling the devices to be further optimized for numerous next-generation advanced automotive systems and applications including: forward cameras, in-cabin monitoring, LiDAR, 4D radar, surround-view, automated parking and autonomous driving. Versal AI Edge XA adaptive SoCs are also the first AMD 7 nm device to be auto-qualified, bringing hardened IP and added security to automotive applications where safety is paramount.

DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is announcing that it has surpassed 40 customers for its flagship chip solution, DX-M1—the only AI accelerator on the market to combine low power consumption, high efficiency and performance, and cost-effectiveness. The groundbreaking solution has been deployed for a hands-on trial to this customer pool, which spans global companies and domestic Korean enterprises across various sectors.

DEEPX is currently running an Early Engagement Customer Program (EECP) to provide customers with early access to its small camera module, a one-chip solution featuring DX-V1; M.2 module featuring DX-M1; and DXNN, the company's developer environment. This allows customers to receive pre-production validation of DEEPX's hardware and software, integrate them into mass-produced products, and realize AI technology innovations with the brand's technical support.

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."