Avalue Technology Inc., a global leader in industrial computing solutions, announces the release of its new EPS-RPR fanless rugged embedded system. As AI inference migrates from the cloud to edge devices, there is an increasing demand for fanless systems. Market research indicates that the global Edge AI Box PC market will grow from USD 1.141 billion in 2024 to USD 2.283 billion by 2033, at a compound annual growth rate (CAGR) of 6.2%. Designed in response to this trend, the EPS-RPR offers a high-performance, stable, and flexible embedded platform that is ideal for smart manufacturing, autonomous vehicles, and intelligent retail applications.

The EPS-RPR fanless industrial PC is powered by the 14th Gen Intel Core i9/i7/i5/i3 processors and supports DDR5-5600 memory, delivering robust computing power. Its fanless thermal solution and wide temperature tolerance (from -10°C to 55°C) ensure stable operation in harsh environments. In terms of I/O capabilities, the EPS-RPR model offers four 4K display outputs, dual Intel LAN ports (2.5GbE and 1GbE), six COM ports, and eight USB ports. This configuration is designed to meet the diverse needs of a wide range of industrial applications. The system also supports versatile expansion with 1× M.2 Key-B, 1× Key-E, 1× Key-M, and 1× mPCIe, enabling seamless integration with Wi-Fi, LTE/5G, and various I/O modules.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products - is pleased to introduce the KIWI330, an ultra-compact 1.6" embedded board built to accelerate AIoT development and streamline device integration. Powered by the Intel processor N50, the KIWI330 is equipped with 4 GB of onboard LPDDR5 memory and a 64 GB NVMe SSD, delivering energy-efficient performance in an ultra-small form factor - ideal for space-constrained applications. With its high integration, flexible expansion capabilities, and consistent industrial-grade quality, the KIWI330 is the perfect solution for developers building the next generation of compact AIoT systems.

"The KIWI330 is purpose-built for developers who require performance, modularity, and compactness in a single reliable embedded board," said Irene Su, Product Manager of the IDS Division at Axiomtek. "With powerful computing capabilities, USB Type-C expandability, and flexible MIO module support, the KIWI330 significantly shortens development cycles and time to market."

ADLINK Technology Inc., a global leader in edge computing solutions, has unveiled brand-new series of expandable DLAP Edge AI platforms, including 3 products—DLAP-5200, DLAP-4100, and DLAP-8100—each engineered to meet the evolving demands of edge computing, AI inference, and industrial automation. These platforms feature latest Intel Core processors for powerful computing performance, and support dedicated GPU acceleration through MXM or PEG (PCIe Graphics) slots to unlock advanced AI capabilities.

The expandable DLAP Edge AI platforms feature comprehensive I/O including USB 3.2 Gen 2, 2.5GbE Ethernet, HDMI, DisplayPort, serial and digital I/O, along with PCIe Gen 4/Gen 5 slots, M.2 expansions, and SATA SSD trays for versatile integration and expansion. Certified GPU support delivers up to 91.1 TFLOPS AI performance using NVIDIA RTX 6000 ADA GPUs. The platforms' rugged, fanless design ensures reliable operation from -20°C to +60°C, with anti-shock, vibration resistance, and corrosion-resistant stainless steel, ideal for harsh environments like oil & gas, industrial automation, and healthcare.

MSI IPC is proud to unveil the MS-CF23, a high-performance Mini-ITX motherboard designed for mainstream embedded and industrial applications. Powered by the latest 15th Gen Intel Arrow Lake-S Core Ultra 9/7/5 Series processors and integrated with the Intel H810 chipset, the MS-CF23 delivers exceptional processing power, enhanced connectivity, and maximum flexibility in a compact size.

Notably, the Arrow Lake Core Ultra processors are Intel's first to include an integrated Neural Processing Unit (NPU), bringing dedicated AI acceleration directly on the chip for smarter and faster edge computing. Engineered to meet diverse application needs such as digital signage, automation, and edge computing, the MS-CF23 offers rich I/O, scalable memory support, and advanced display capabilities, all with robust reliability and simple integration. Ideal for applications such as automation, digital signage, and edge computing, the MS-CF23 is packed with features to support robust computing and connectivity.

MSI IPC, a global leader in industrial computing and AI-driven solutions, is set to unveil its latest innovations at COMPUTEX 2025, held from May 20 to 23 at the Taipei Nangang Exhibition Center. Visitors can explore MSI IPC's cutting-edge technologies at Booth J0506, Hall 1, 1F.

Introducing the EdgeXpert MS-C931: A Desktop AI Supercomputer
MSI IPC will unveil the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGX Spark platform. Powered by the NVIDIA GB10 Grace Blackwell Superchip, the EdgeXpert MS-C931 delivers 1,000 AI TOPS FP4 performance, equipped with high-speed ConnectX 7 networking, 128 GB unified memory, and support for large language models. Designed for AI developers and researchers, it is ideal for applications in education, finance, and healthcare industries.

GIGABYTE Technology, a global leader in computing innovation, will return to COMPUTEX 2025 from May 20 to 23 under the theme "Omnipresence of Computing: AI Forward." Demonstrating how GIGABYTE's complete spectrum of solutions spanning the AI lifecycle, from data center training to edge deployment and end-user applications reshapes the infrastructure to meet the next-gen AI demands.

⁠As generative AI continues to evolve, so do the demands for handling massive token volumes, real-time data streaming, and high-throughput compute environments. GIGABYTE's end-to-end portfolio - ranging from rack-scale infrastructure to servers, cooling systems, embedded platforms, and personal computing—forms the foundation to accelerate AI breakthroughs across industries.

At today's Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery. To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems.

In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and Intel Foundry is advancing the semiconductor industry with silicon to system design solutions to meet the evolving needs for AI and high-performance computing applications. Our production-ready EDA flows, IP, and multi-die solution, provides our mutual customers with comprehensive technologies to accelerate the development of chip designs that meet or exceed their requirements."

Micron Technology, Inc. (Nasdaq: MU), a leader in innovative memory and storage solutions, today announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

Micron has maintained multiple generations of industry leadership in DRAM and NAND technology and has the strongest competitive positioning in its history. Micron's industry-leading product portfolio, combined with world-class manufacturing execution enables the development of differentiated solutions for its customers across end markets. As high-performance memory and storage become increasingly vital to drive the growth of AI, this Business Unit reorganization will allow Micron to stay at the forefront of innovation in each market segment through deeper customer engagement to address the dynamic needs of the industry.

SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, has announced the launch of the HoneyComb Ryzen V3000 development platform. This innovative Mini-ITX board, built around SolidRun's Ryzen Embedded V3000 COM Express 7 (CX7) module, provides outstanding performance, reliability, and flexibility for prototyping and expediting time to market for industrial, networking, and edge computing solutions.

Combining SolidRun's AMD Ryzen V3000 CX7 Module, equipped with the AMD Ryzen Embedded 8-core V3C18I processor running at 1.9 GHz (base) and up to 3.8 GHz (boost) and 64 GB DDR5 memory, the HoneyComb Ryzen V3000 Mini-ITX development platform, equipped with fast and reliable PCIe Gen 4 NVMe storage, delivers exceptional computing power and performance in an ultra-compact form factor. Designed to withstand extreme conditions this system includes a powered CPU cooler, to support operating in environments ranging from -40°C to 85°C and can be configured to run at 15 to 45 Watts.

MSI IPC, a leading provider of industrial computing solutions, is set to exhibit at Japan IT Week Spring 2025, held from April 23-25 at Tokyo Big Sight, Booth East Hall 3 #21-2. The company will showcase its latest innovations in AI computing, embedded systems, and edge intelligence, designed for smart manufacturing, medical, transportation, and industrial applications.

Explore the Future of Industrial Computing
MSI IPC will host a static demo featuring Intel Twin Lake, Raptor Lake, and Arrow Lake, allowing attendees to experience next-gen performance and AI acceleration. Key platforms include:

• MS-CF20 ATX (W880 chipset)- Built for high-performance workloads with expandability for industrial applications.
• MS-CF23 Mini-ITX (H810 chipset) - Compact yet powerful, ideal for space-sensitive deployments.
• MS-C927 Embedded Box PC (Arrow Lake-U & Meteor Lake-U) - Fanless, wide-temp system for industrial and embedded environments.

ADLINK Technology Inc., a global leader in edge computing, proudly announces that its newly released EMP-520 Series industrial compact box PC has been recognized for its excellence, securing the Best-in-Show award in the Computer Boards, Systems, Components & Peripherals category at embedded world 2025. It was selected for its innovative design, user-centric features, and exceptional performance in industrial environments.

Smart, Reliable, and Efficient Industrial Computing Solution
Designed to meet the needs of modern industrial applications, the EMP-520 Series delivers high computing performance with minimal maintenance, helping businesses maximize productivity and reduce downtime. Powered by Intel 14th Gen Core processors, it ensures energy-efficient operation, making it ideal for high-demand environments that require continuous, reliable computing. Supporting four simultaneous 4K video outputs and EDID emulation, users can achieve seamless visual performance. The compact design enables easy integration into space-constrained environments while ensuring reliable operation in mission-critical applications.

Unlock Infinite Possibilities in AV-over-IP with Kiloview X86-64 Compute Card powered by AMD. At Kiloview, we design solutions that empower AV professionals with unmatched flexibility and seamless operation. That's why we created the X86-64 Compute Card for the Cradle Series RF02—bringing the power of a PC into a professional AV server to simplify workflows and maximize expandability. Powered by AMD Ryzen Embedded 8645HS and Radeon 780M GPU, this high-performance computing module allows users to run Kiloview's software ecosystem or any third-party applications—from Multiview, Routing, Recording to Mixing, Switching and production, and more—all on a unified platform. With this, your AV workflow is no longer limited by hardware constraints. With software-defined flexibility and AMD's processing power, we've made AV-over-IP easier than ever.

Modern media workflows demand uncompromising performance. From 4K multi-channel encoding/decoding to ultra-low latency streaming, broadcasters and content creators need solutions with both raw power and flexibility. This is where Kiloview's latest X86-64 Compute Card, advanced by AMD, comes into play. By integrating a high-performance computing architecture from AMD with Kiloview's KiloLink Server Technology, users can significantly enhance overall efficiency for their AV production and device management. The KiloLink Server optimizes the process of IP-based video transmission to remotely bulk upgrade, restore, reset, or restart any paired Kiloview products with just a few clicks.

Accordance Systems Inc., a leading global provider of RAID box, unveiled its latest innovation, the ARAID M6 series RAID Box for PCIe 4.0 NVMe M.2, at Embedded World 2025 in Nuremberg, Germany, from March 11-13. Accordance has been delivering easy, user-friendly RAID solutions worldwide for over a quarter of a century, providing businesses worldwide with instantaneous backup for their OS and data. The new M6 series aims to provide reliable, high-speed backup for edge computing and edge AI applications across industries.

High-Speed Data Backup and Storage for PCIe 4.0 NVMe M.2 Drives
Making its debut at Embedded World was Accordance's M6 series RAID box. This latest addition to the company's long-running ARAID product line supports multiple drive interfaces, including 2.5" SATA, SAS, U.2, U.3 and NVMe M.2 (PCIe Gen 4x4). The ARAID RAID box automatically backs up a PC's system and data into a second drive, ensuring critical systems keep running in the event of boot drive failure, OS corruption or ransomware attacks. The new M6 series is designed to support the high data speeds needed in AI applications growing more common across industries, such as finance, agriculture, transportation, and manufacturing. Keeping with the original vision for ARAID—a RAID box as easy to use as a point-and-shoot camera—the M6 series requires no IT knowledge to use, enabling all users to quickly upgrade their systems with RAID 1.

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

At Embedded World 2025, Congatec unveiled an acetone-based heat pipe cooling solution explicitly engineered for sub-zero operating environments. The system addresses thermal management challenges in extreme cold conditions where traditional cooling mechanisms risk freezing and component damage. Yes, even at sub-zero environments the CPU still needs a dissipation medium as its heat density is still a problem. Operating reliably at temperatures as low as -40°C, the technology utilizes acetone's -95°C freezing point to maintain thermal transfer functionality in arctic environments. The solution resolves a fundamental limitation of water-based systems, which become inoperable at their 0°C freezing threshold. Despite water's superior latent heat of vaporization (2,260 J/g), its physical properties render it unsuitable for extreme cold applications.

Acetone's thermal properties prevent ice formation and reduce condensation risks, creating a stable heat transfer mechanism for polar research, high-altitude infrastructure, cold storage, and industrial automation in harsh climates. Imagine an edge server operating in the North Pole, needing to collect and process data locally before getting it to the research/scientist team. The solution integrates directly with Congatec's Computer-on-Module (COM) portfolio, including COMe, COM-HPC, and COM-HPC mini designs, eliminating the need for custom cooling system development. An optional heat pipe adapter will be available for specialized implementations. The company clarified that acetone-based cooling is purpose-built exclusively for extreme cold environments rather than general applications, as water remains superior for conventional temperature ranges due to its greater heat dissipation capacity, lower cost, and widespread availability.

Intel representatives have placed a Panther Lake demonstration sample unit on an actual pedestal; as reported by PC Games Hardware (PCGH). German press outlets and other visitors were greeted by Team Blue's dedicated showcase plinth at this week's Embedded World 2025 expo/trade fair. The Nuremberg-based event is advertised as a "world-leading conference presenting state-of-the art technology and forward-looking research." Attendees and industry watchdogs reckon that the prominently displayed demo piece is an example of Intel's Panther Lake-H (PTL-H) mobile-oriented chip design. Last October, Pat Gelsinger (now ex-CEO) unveiled a physical PTL-H sample on-stage during his special guest appearance at Lenovo Tech World 2024. During a CES 2025 keynote presentation, Michelle Johnston Holthaus (Intel's interim co-boss) confirmed a 2025 launch window, while holding up another (or the same) Panther Lake chip.

Recent industry insider whispers have suggested that the Intel Foundry is encountering problems with their 18A node process; thus causing a shift in Panther Lake's release schedule. One prominent leaker claims that Team Blue's opening salvo of PTL-H products will roll out in 2026, but rumors were dismissed by an official source (last week). John Pitzer—Corporate Vice President of Investor Relations at Intel—insisted on multiple occasions, during a fireside chat, that his team's Core Ultra 300 series (aka Panther Lake-H) is on track for launch within the second half of 2025. Intel's Embedded World 2025 booth does not feature any technical rundowns relating to the showcased next-gen offering; their minimalist plinth is simply adorned with blue text spelling out: "Panther Lake." NDA-busting details have emerged online, courtesy of insider leaks—the top-most PTL-H SKU could appear with a 4P+8E+4LP+12Xe3 configuration.

A global leader in intelligent IoT systems and embedded platforms, is excited to introduce its latest AIR series Edge AI systems, powered by the comprehensive AMD compute portfolio. These next-generation solutions leverage AMD Ryzen and EPYC processors alongside Instinct MI210 accelerators and Radeon PRO GPUs, delivering exceptional AI computing performance for demanding edge applications.

"Advantech and AMD continue to strengthen our collaboration in the Edge AI era, integrating advanced CPU platforms with high-performance AI accelerators and GPU solutions," said Aaron Su, Vice President of Advantech Embedded IoT Group. "This joint effort enables cutting-edge computing power to meet the demands of the rapidly evolving embedded AI applications.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries.

"As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN."

At Embedded World Germany, Qualcomm Technologies, Inc. announced the entry into an agreement to acquire EdgeImpulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT. The closing of this deal is subject to customary closing conditions. This acquisition is anticipated to complement Qualcomm Technologies' strategic approach to IoT transformation, which includes a comprehensive chipset roadmap, unified software architecture, a suite of services, developer resources, ecosystem partners, comprehensive solutions, and IoT blueprints to address diverse industry needs and challenges.

"We are thrilled about the opportunity to significantly enhance our IoT offerings with Edge Impulse's advanced AI-powered end-to-end platform that will complement our strategic approach to IoT transformation," said Nakul Duggal, group general manager, automotive, industrial and embedded IoT, and cloud computing, Qualcomm Technologies, Inc. "We anticipate that this acquisition will strengthen our leadership in AI and developer enablement, enhancing our ability to provide comprehensive technology for critical sectors such as retail, security, energy and utilities, supply chain management, and asset management. IoT opens the door for a myriad of opportunities, and success is about building real-world solutions, enabling developers and enterprises with AI capabilities to extract intelligence from data, and providing them with the tools to build the applications and services that will power the digital transformation of industries."

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is currently showcasing its latest technologies at Embedded World 2025, held from March 11-13 at Nurnberg Messe, Germany.

BIOSTAR's showcase features AI-powered industrial PCs and edge computing platforms that provide secure, efficient, and scalable solutions for industries like automation, smart cities, and human-machine interfaces (HMI) at this year's exhibition. With cutting-edge solutions such as IPC motherboards, panel PC, and edge computing systems, and NVIDIA Jetson Orin edge AI system, the products demonstrate BIOSTAR's capabilities on edge AI and edge computing area for critical industrial applications.

Today at Embedded World, Altera Corporation, a leader in FPGA innovations, unveiled its latest programmable solutions tailored for embedded developers who are pushing the boundaries of innovation at the intelligent edge. Altera's latest Agilex FPGAs, Quartus Prime Pro software, and FPGA AI Suite enable the rapid development of highly customized embedded systems deployed across a broad range of edge applications, including robotics, factory automation systems, and medical equipment.

Altera's programmable solutions meet the stringent power, performance and size requirements of embedded and intelligent edge applications. These hardware solutions, along with Altera's FPGA AI Suite, enable machine learning engineers, software developers, and FPGA designers to create custom FPGA AI platforms using industry-standard frameworks such as TensorFlow and PyTorch, and development tools such as OpenVINO and Quartus Prime software.

Embedded World is one of the most influential exhibitions in the global embedded technology sector, attracting numerous experts in industrial computing, automotive electronics, IoT, and AI technologies each year. Phison Electronics (8299TT), a leading innovator of NAND controller and NAND storage solutions, will participate in the Taiwan Excellence Pavilion at Embedded World 2025 in Germany from March 11 to 13.

Phison will showcase its exclusive AI solution aiDAPTIV+, the enterprise ultra-high-capacity PASCARI PCIe 5.0 122.88 TB SSD, and its latest automotive storage technology, the MPT5 Automotive PCIe Gen 4 SSD, demonstrating over 15 years of technical expertise in the embedded market.

Advantech, a leading provider of edge computing and edge AI solutions, is pleased to announce their high-performance server and network appliances are now powered by the latest AMD EPYC Embedded 9005 Series processors. By leveraging these cutting-edge platforms, Advantech is driving edge computing and AI to new heights—making solutions ideal for 5G edge cloud, AI, machine learning, and enhanced data security.

"We are excited about the launch of Advantech's latest generation of innovative edge computing and AI solutions powered by AMD EPYC Embedded 9005 Series processors," said Amey Deosthali, Senior Director of embedded core markets at AMD. "Optimized for embedded markets, EPYC Embedded 9005 provides exceptional compute performance for edge AI applications while delivering enhanced IO capabilities, product longevity, and system resiliency."

Realtek Semiconductor will participate in the globally acclaimed top technology event—the Embedded World 2025 in Nuremberg, Germany, from March 11 to 13. Highlighted exhibits will include networking multimedia applications, Ethernet solutions for various transmission media, industrial Ethernet switch application solutions, as well as Bluetooth and Wi-Fi/IoT solutions. These exhibits will demonstrate Realtek's innovation in multimedia and communication networks, combined with AI-powered smart applications, providing customers with stable, reliable, and high-performance solutions.

Networked Multimedia Application
Realtek provides end customers with a highly secure, sustainably upgradeable, open-source, and shared Linux platform. Designed to meet the needs of SoCs, it leverages an advanced 12 nm process, a high-performance CPU/GPU, and Edge AI computing with NPU to fully support 4K video decoding and all HDMI 2.1 functions. It also enables audio and video transmission via DisplayPort. Additionally, the platform features high integration with multiple interfaces, including USB, PCIe, GPIO, UART, and SDIO. For system integration, Realtek incorporates its NICs (1G/2.5G/10 Gbps) and Wi-Fi/BT chips. SoCs are able to seamlessly connect to panels of various sizes via built-in MIPI or eDP, ensuring compatibility with networked multimedia applications.

MSI IPC, a global leader in computing and AI-driven solutions, is set to unveil its latest Edge AI Computing innovations at Booth No. 1-389, Embedded World 2025 in Nuremberg, Germany. Powered by the latest Intel platform, MSI's cutting-edge technologies will drive advancements in automation, digital signage management, and AI-driven customer interactions.

Several MSI's partners, including Alptech, Spo-comm, Spectra, and Elmark, are joining this event to showcase their cutting-edge solutions powered by MSI IPC products. Their demonstrations will feature a diverse range of applications, including 4U rackmount systems, Panel PCs (PPC), and KIOSK solutions, highlighting the versatility and performance of MSI's industrial computing technology in various sectors.