Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD84-B51: Embedded MultiMediaCard (e.MMC), Electrical Standard (5.1). e.MMC v5.1 defines new features and updates for this embedded mass-storage flash memory that is widely used in smartphones and other mobile devices. Intended to facilitate an enhanced end user experience, the new version of e.MMC offers command queueing for the first time, and also defines important security updates. JESD84-B51 is available for free download from the JEDEC website.

The new revision of the standard defines e.MMC Command Queueing, which supports the optimized execution of commands within the device, versus the single thread protocol defined in prior versions of the standard. Command Queueing will enable the device to analyze commands before executing them, thereby maximizing effectiveness of the e.MMC memory storage. This will result in a positive effect on random read performance and read latency, thereby improving the end user experience.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, today announced the expansion of its NVDIMM product line with its new 8GB and 16GB DDR4 NVDIMMs available in a single rank, four bit configuration. SMART's full lineup of DDR4 NVDIMMs now include two configurations; a single rank eight bit configuration in 4GB and 8GB densities, and the new 8GB and 16GB options. The new NVDIMMs are targeted for server and storage applications to improve performance.

NVDIMMs transform main DRAM memory into persistent memory resulting in higher performing servers by allowing big data, transaction logs, and other latency and performance-sensitive data to be accessed at DRAM speeds without the risk of data loss. Rather than reading and writing big data or transaction logs to traditional storage media such as SATA SSDs, PCIe NVMe SSDs, or HDDs, they can be written to and read from main memory without the risk of data being lost due to any sudden power loss (SPL) event. Server performance in terms of lower latency, higher IOPS, and greater endurance all increase dramatically with the use of SMART's NVDIMMs.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the launch of its DDR4 Mini-DIMM, one of the industry's first Mini-DIMM form factor utilizing next generation DDR4 technology.

SMART's initial lineup of DDR4-2133 Mini-DIMMs includes 8GB and 16GB VLP Mini-UDIMM along with 8GB and 16GB standard height Mini-RDIMMs, all of which comply with JEDEC 288-pin form factor and pin-out standards. Today, Mini-DIMMs are widely used across many application segments including networking, telecom, industrial, computing and storage by OEMs who are looking to save board space or source as an alternative to SO-DIMMs. The attractiveness of Mini-DIMMs is that they are versatile; it's a small form factor offered in high densities operating at high data transfer rates. For OEMs currently using DDR3 Mini-DIMMs, SMART is pleased to offer a migration path to DDR4.

ADATA showed off its third-generation XPG DDR3 memory module. A departure from its pointy gold heatsink design of the XPG Z1 series, the XPG V3 features a more conventional, 2-tone aluminium heatsink design, with three layers of fins projecting upward. The outer fins dissipate heat drawn from the DRAM chips, while the inner, colored ones (red, blue, green, gold, and orange), dissipate heat drawn a heat-spreading copper layer in the module's PCB. The module on display at CES featured a red inner heatsink, with an XMP 1.3 profile for DDR3-3100 MHz, with a 1600 MHz failsafe JEDEC profile.

Japanese company Century Micro launched the world's first low-profile (half-height) DDR4 DIMM (model: CK4GX4-D4RE2133VL81). With a module height of just 1.87 cm, the 4 GB module uses DRAM chips made by SK Hynix, and offers JEDEC-specified DDR4-2133 MHz speeds, with 15-15-15 timings, and 1.2V DRAM voltage. It sells in 16 GB kits of four modules, which sells at 51,980 JPY (US $428), including taxes.

The demand for industrial SSD is increasing significantly as the IoT and the need for mobility sweep across the world. According to Gartner market survey, the demand for relevant devices will increase to 26 billion sets, as the IoT market scale will reach USD1.09 trillion in 2020. Continuing the market heat of its reliable industrial SSDs, Apacer Technology has recently launched two brand new ultra slim industrial SATA3.0 SSDs: the SFD18SH-M complying with the JEDEC MO-297 standard and the mSATA H1-M, compliant with the MO-300 standard.

Both models made under 1ynm process are extremely price competitive for their ultra slim appearance, high speed, high stability, and wide temperature operation for industrial uses. In addition, most IoT devices require long-term, reliable operation in extreme environments and autotronics and medical devices ask for superb quality. Apacer industrial SSDs have passed market challenges, thus standing firm in the IoT, autotronics, medical electronics, and communication component markets and winning customer recognition for their outstanding quality and performance.

Transcend Information, Inc. (Transcend ), a leading manufacturer of industrial-grade products, is proud to announce the launch of three new DDR4 server-grade memory modules: 8GB and 16GB DDR4 2133MHz Registered DIMMs (RDIMMs), and 16GB DDR4 Very Low Profile (VLP) RDIMMs. Fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Transcend's DDR4 series features high capacities, superior performance, 1.2V ultra-low power consumption, and increased reliability; perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's server-grade DDR4 RDIMMs and VLP RDIMMs are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options of 8GB and 16GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 RDIMMs comprehensively promote the system performance.

KINGMAX, a leading memory brand, showcased its DDR4 memory module during COMPUTEX Taipei, held in June 2014. After a period of integration, KINGMAX now officially announces its DDR4 application solution has entered mass production. In response to market trends, four types of memory clock speeds have been launched: 1866/2133/2400/3200MHz, with speeds that meet 14.9GB/s to 25.6GB/s requirements, and have exceptionally high transmission efficiency. With the setting of memory standards for the next-generation DDR4 RAM by JEDEC, many companies have taken a wait-and-see approach for the right opportunity. With the launch of Intel's Haswell-E processor platform, which supports DDR4, it is believed that computer products with DDR4 will gradually appear in the market, triggering a rapid increase in a spectacular rise in usage of DDR4 in 2015.

Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMCTM embedded NAND flash memory products that are among the world's smallest.The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15 nm process technology and a controller to manage basic control functions for NAND applications into a single package.

Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow. By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller than comparable Toshiba products and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

Japanese memory maker Century Micro announced its entry-level DDR4 ECC registered memory modules. Compatible with Intel Xeon E5-2600 v3 and Core i7-5000 HEDT processors, the modules come in density of 8 GB (model: CD8G-D4RE2133L82), making up single-module and four-module (32 GB) kits. The CD8G-D4RE2133L82 complies with JEDEC specifications, and runs at DDR4-2133 MHz speeds, with a module voltage of 1.2V, and timings of 15-15-15. The module features an 8-layer PCB, and appears to use DRAM chips made by SK Hynix. The modules will start selling in a couple of weeks from now.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD229-2 Wide I/O 2. Wide I/O 2 offers a significant speed increase over Wide I/O, while retaining Wide I/O's vertically stacked through silicon via (TSV) architecture and optimized packaging. Combined, these characteristics position Wide I/O 2 to deliver the ever-increasing speed, capacity, and power efficiency demanded by mobile devices such as smartphones, tablets and handheld gaming consoles. JESD229-2 may be downloaded free of charge from the JEDEC website here.

Wide I/O 2 provides four times the memory bandwidth (up to 68GBps) of the previous version of the standard, but at lower power consumption (better bandwidth/Watt) with the change to 1.1V supply voltage. From a packaging standpoint, the Wide I/O 2 die is optimized to stack on top of a system on chip (SOC) to minimize power consumption and footprint.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4). Designed to significantly boost memory speed and efficiency for mobile computing devices such as smartphones, tablets, and ultra-thin notebooks, LPDDR4 will eventually operate at an I/O rate of 4266 MT/s, twice that of LPDDR3.

The new interface promises to have an enormous impact on the performance and capabilities of next-generation portable electronics. "LPDDR4 represents a dramatic performance increase," said Mian Quddus, Chairman, JEDEC Board of Directors. "It is intended to meet the power, bandwidth, packaging, cost and compatibility requirements of the world's most advanced mobile systems." Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the JESD209-4 LPDDR4 standard can be downloaded from the JEDEC website for free by clicking here.

Wanna build a Haswell-E HEDT build on the "cheap?" Then this could make it to your list. ADATA is ready with its no-frills Premier line of DDR4 memory modules, which are sold in single-module packs of 4 GB and 8 GB. The modules stick to JEDEC specifications of DDR4-2133 MHz (PC4-17000), with CAS latencies of 15T, and voltage of 1.2 Volt. The modules use DRAM chips made by SK Hynix. Inclusive of all taxes, the 4 GB module is priced at the equivalent of $75 USD in Japan; and the 8 GB module goes for the equivalent of $150.

Resistance to shock, low noise and low power consumption - these are the superior physical properties of SSDs, which have become essential for satisfying the storage requirements of industrial computers. The application scope of SSDs on industrial computers has also expanded due to increasingly harsh market demands and advancing process technologies.

With the increasing prevalence of the concept of security, Unmanned Aerial Vehicles (UAVs) have gradually been used for the purpose of national defense and monitoring. It will be further developed in commercial applications, such as oil pipe monitoring, environment observation, aviation, communication transmission and other commercial applications. The importance of stability of a storage device is thus in top priority with such an exciting prospect.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the introduction of its next generation DDR4 NVDIMMs. Offering non-volatile memory functionality while utilizing the latest DDR4 DRAM technology, this memory solution is designed to improve application performance and data integrity in server environments.

Unique to these new DDR4-2133 NVDIMMs is SMART's proprietary SafeStor technology, the engine which initiates backup and restore operations upon command from the host controller. The NVDIMM modules also support multiple command delivery options to trigger SafeStor backup during a host-detected power outage and recovery events. The SafeStor engine employs multi-channel fast NAND and high-speed switching circuitry to provide robust backup and restore capability, all while functioning as a JEDEC standard DDR4 RDIMM during normal operation. Temporary power is provided to the NVDIMM during a power loss by a hybrid supercap module, which can be tailored to individual application environments. The new NVDIMMs also feature an end-to-end error checking and correction capability to ensure a high level of data integrity during backup and restore operations.

ADATA's claim of being the first memory maker with DDR4 overclocking modules wouldn't fly with anyone, if they weren't using a live Haswell-E HEDT platform to show it off. The system appears to be using a prototype Intel X99 chipset micro-ATX motherboard by ASRock, and a Haswell-E engineering sample. The module comes with JEDEC SPD profile of 2133 MHz, but claims to offer tons of overclocking headroom. The system was wired to a display, and evidently, CPU-Z can't read the memory config. It can, however, read out DRAM clock and timings. The system was doing 1373 MHz (2746 MHz DDR), with timings of 14-14-14-36-CR2T.

Panram unveiled its first consumer DDR4 memory modules, ready for upcoming Haswell-E HEDT platform, the Ninja-V. Equipped with simple and contemporary looking heatspreaders that aren't much taller than the module itself, the first Ninja-V modules will stick to JEDEC standard speeds of DDR4-2133. They'll run at 2133 MHz, with standard timings, and module voltage of 1.2V. The company will launch the Ninja-V towards the end of this year, when Intel launches the Haswell-E HEDT platform, which features a quad-channel DDR4 IMC, which could offer system memory bandwidths in excess of 80 GB/s.

Here is the first picture of ADATA's XPG V3 DDR3 DRAM module. It will be launched alongside the company's first enthusiast-grade DDR4 modules. ADATA's XPG Z1 DDR4 modules will come in densities as high as 16 GB, clocked at JEDEC-standard DDR4-2133 MHz, and run at module voltages of 1.2V. The same heatspreader design as the one pictured below, will also be used on the company's new XPG V3 line of DDR3 modules, and will come in a number of color options, to match your motherboard's color scheme. The first client platforms with support for DDR4 memory include Intel "Broadwell," and "Haswell-E" HEDT.

Team Group, the global leading brand of memory storage launched on a brand new mSATA MP1 with only 1/8 size of general 2.5" SSD, which can meet JEDEC mSATA size specification. Focused on the lightest and thinnest volume and outstanding performance, it becomes perfect collocation of Notebook, Ultrabook, Tablet PC and NUC, etc.

Even though a small mechanism, mSATA MP1 SSD combines all the advantages of SSD in one- high speed, low power consumption, high stability and zero noise. mSATA MP1 supports SATA III, having 6Gb/s transmission rate, reading speed up to 530 MB/sec and writing speed up to 440 MB/sec. Compared with traditional mechanic HDD, it sharply decreases the time to wait for boot up, running program and windows operating and effectively increases operation efficiency. Meanwhile, parts of Ultrabook and PC/Notebook are either changed to built-in small capacity mSATA or installed with mSATA slot to respond market trend of pursuing light mobile device. Consumers have choice to purchase mSATA MP1 as system boot disk or go with HDD, which is used for disk cache to strengthen traditional disk performance. To compare with traditional HDD, mSATA MP1 can save you about 2 times boot operation time and significantly boost overall computer performance.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard, SPD4_01_02_11: SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules (Release 6), describes new memory timing parameters and enables higher capacity memory modules, and may be downloaded free of charge from the JEDEC website.

"The DDR3 memory module market is in its full stride, with new applications pushing the technology into an ever-widening array of offerings, and the Serial Presence Detect is a reliable and consistent way to document the features of these new modules so that system software can tune system performance," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "This release of the DDR3 SPD standard adds support for memory modules with up to 8 ranks of DDR3 SDRAMs, enabling 64GB per slot using mainstream 4Gb memory chips."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has developed the industry's first eight gigabit (Gb), low power double data rate 4 (LPDDR4), mobile DRAM.

"This next-generation LPDDR4 DRAM will contribute significantly to faster growth of the global mobile DRAM market, which will soon comprise the largest share of the entire DRAM market," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "We will continue introducing the most advanced mobile DRAM one step ahead of the rest of the industry so that global OEMs can launch innovative mobile devices with exceptional user convenience in the timeliest manner."

Samsung's new high-speed 8Gb LPDDR4 mobile DRAM will provide the highest level of density, performance and energy efficiency for mobile memory applications, enabling end users to have faster, more responsive applications, more advanced features, and higher resolution displays while maximizing battery life.

G.Skill announced the AEGIS line of high-performance, standard-height DDR3 memory modules, for gaming PC builds. The modules are available with JEDEC-approved SPD profiles of DDR3-1333 MHz, and DDR3-1600 MHz; and in densities of up to 8 GB. The modules could make up solo and dual-channel kits. The modules are designed to run at DDR3-1333 at voltages of 1.35V, and rather timings of 9-9-9-24; and DDR3-1600 at 1.50V, and rather loose timings of 11-11-11-28. The modules feature black PCBs with heatspreaders that are basically sheets of aluminium, with die-cast prints on them. The modules are backed by lifetime warranties, G.Skill didn't announce pricing.