Samsung Electronics reported today KRW 52.97 trillion in consolidated revenue and KRW 8.15 trillion in operating profit for the second quarter ended June 30, 2020. Even as the spread of COVID-19 caused closures and slowdowns at stores and production sites around the world, the Company responded to challenges through its extensive global supply chain, while minimizing the impact of the pandemic by strengthening online sales channels and optimizing costs.

Quarterly operating profit rose 26 percent from the previous quarter and 23 percent from a year earlier, thanks to firm demand for memory chips and appliances, as well as a one-off gain at its Display Panel Business. A partial recovery in global demand since May also helped offset some COVID-19 effects, resulting in higher earnings than initially expected. Revenue in the quarter fell 4 percent from the previous quarter and 6 percent from a year earlier due to reduced sales of smartphones and other devices.

HyperX, the gaming division of Kingston Technology, Inc., today announced the release of new and updated speeds and capacities for HyperX Predator DDR4 RGB and HyperX FURY DDR4 RGB memory modules and kits. Featuring memory kits up 256 GB and speeds up to 4600MHz1, the Predator DDR4 RGB and FURY DDR4 RGB memory modules are designed to pass rigorous certification test procedures and are Intel XMP certified and AMD certified Ready for Ryzen.

HyperX Predator DDR4 delivers fast frequencies and low latencies with speeds up to 4800MHz1 and latencies from CL12 to CL19. Predator DDR4 utilizes a black aluminium heat spreader and matching black PCB to complement the look of the latest PC builds. Predator memory is available in 8 GB, 16 GB and 32 GB single modules and in kits of two, four, and eight.

PNY Technologies Asia Pacific Limited Technologies, the world's leading brand of extreme performance memory,NAND Flash products and professional/gaming graphic cards is pleased to announce the latest addition of its PC Memory assortment by adding the XLR8 Gaming RGB DDR4 Desktop Memory line-up.

The XLR8 Gaming RGB line provides a dynamic experience for gamers, modders and enthusiasts alike combining RGB customization with overclocking capability, XRL8 RGB DRAM uses selected aluminium alloy heat spreader with state of the art surface finish technique and design, create the extraordinary look and feel.

TEAMGROUP is proud to announce that T-FORCE broke the world record again. T-FORCE laboratory worked with the overclocker, LeeGH, using T-FORCE XTREEM ARGB DDR4 3200 MHz CL14 memory modules to win the world record on well-known overclocking platform, HWBOT. T-FORCE XTREEM ARGB DDR4 3200 MHz CL14 memory modules achieved the highest read/write speed of 136,678 /104,643 MB/s of quad channel kit as the world record currently.

T-FORCE laboratory and the overclocker LeeGH worked together on AIDA64, one of the significant overclocking competitions, reaching read/write speed of 136,678/104,643 MB/s as the world record currently with ASUS ROG Rampage VI Extreme Encore motherboard and X299 chipset. Meanwhile, the achievement was listed on HWBOT, an ultimate overclocking challenge site. The extremely high-speed performance of T-FORCE XTREEM ARGB has been witnessed by overckockers from all over the world.

Samsung Electronics today introduced its second-generation quad-level cell (QLC) flash drive, the 870 QVO SATA SSD, that is setting a new standard for high-capacity consumer storage. Featuring an industry-leading capacity of up to eight terabytes (TB), the new SSD delivers an uncompromising mix of speed, storage capacity and reliability for mainstream and professional PC users.

In the past, consumers have had to choose between SSDs - which provide superior performance - and HDDs, which traditionally offer greater capacity. Samsung's 870 QVO SSD, however, is able to reliably offer the best of both worlds, making it an optimal choice for mainstream PC users who prioritize performance and value, as well as for professional users who require high levels of capacity.

AMD's 7 nm "Renoir" APU silicon, which features eight "Zen 2" CPU cores, has only a quarter of the L3 cache of the 8-core "Zen 2" CCD used in "Matisse," "Rome," and "Castle Peak" processors, with each of its two quad-core compute complexes (CCXs) featuring just 4 MB of it (compared to 16 MB per CCX on the 8-core "Zen 2" CCD). Chinese-language tech publication TecLab pubished a quick review of an alleged Ryzen 7 4700GE socket AM4 processor based on the "Renoir" silicon, and discovered that the chip offers significantly lower memory latencies than "Matisse," posting just 47.6 ns latency when paired with DDR4-4233 dual-channel memory.

In comparison, a Ryzen 9 3900X with these kinds of memory clocks typically posts 60-70 ns latencies, owing to the MCM design of "Matisse," where the CPU cores and memory controllers sit on separate dies, which is one of the key reasons AMD is believed to have doubled the L3 cache amount per CCX compared to previous-generation "Zeppelin" dies. TecLab tested the alleged 4700GE engineering sample on a ROG Crosshair VIII Impact X570 motherboard that has 1 DIMM per channel (the best possible memory topology).

Intel today introduced its 3rd Gen Intel Xeon Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of AI and analytics workloads running in data center, network and intelligent-edge environments. As the industry's first mainstream server processor with built-in bfloat16 support, Intel's new 3rd Gen Xeon Scalable processors makes artificial intelligence (AI) inference and training more widely deployable on general-purpose CPUs for applications that include image classification, recommendation engines, speech recognition and language modeling.

"The ability to rapidly deploy AI and data analytics is essential for today's businesses. We remain committed to enhancing built-in AI acceleration and software optimizations within the processor that powers the world's data center and edge solutions, as well as delivering an unmatched silicon foundation to unleash insight from data," said Lisa Spelman, Intel corporate vice president and general manager, Xeon and Memory Group.

XPG, a provider of high-performance products for gamers, e-sports pros, and tech enthusiasts, is pleased to announce that it has become the Official Gaming Notebook sponsor of the official Valve RMR CS:GO Online tournament series CS_SUMMIT 6.Organized by Beyond the Summit (BTS), the tournament will take place from June 22 to July 5. As a part of the sponsorship, the XPG XENIA will be the Official Gaming Notebook of the tournament.

CS_SUMMIT 6 will be broadcast internationally and is organized regionally with qualifying games in Europe and North America. XPG will be the major sponsor of the event in the Gaming Notebook category.This is the second time XPG has participated in a BTS-organized tournament as a sponsor. During CS_SUMMIT 5, XPG was the Official Keyboard sponsor.

XPG, a provider of high-performance products for gamers, esports pros, and tech enthusiasts, is pleased to announce that it has expanded its DDR4 overclocking testing program with a new working relationship with leading motherboard maker, GIGABYTE. Following the heels of the launch of the Intel Z490 chipset, XPG began testing and overclocking its new DDR4 modules with the latest Z490 platforms, as well as AMD B550 platforms, to ensure they meet the highest standards of overclocking performance and stability. This latest cooperation with GIGABYTE is a furtherance of this endeavor.

In cooperation with GIGABYTE, the XPG Overclocking Lab (XOCL) was able to overclock the XPG SPECTRIX D50 DDR4 module to 4800 MHz on the GIGABYTE Z490 AORUS XTREME WATERFORCE motherboard. Following this impressive result, the XOCL proceeded to test other XPG DDR4 modules on an array of other GIGABYTE motherboards to similar results.

The Taichung District Court in Taiwan ruled in favor of Micron Technology in a case dating back to 2017, against semiconductor foundry UMC and two of its former employees. Micron had alleged that UMC and three of Micron former employees stole Micron's trade secrets and conveyed them to Mainland Chinese DRAM maker Fujian Jinhua IC. One of the accused include Stephen Chen, former president for Micron Memory in Taiwan.

The Court ruled that the three former Micron employees serve 4.5-6.5 years in prison, in addition to paying NTD 4-6 million fines, each. As for UMC, it has been ordered to pay NTD 100 million (USD $3.4 million) in damages to Micron Technology, a parking ticket value compared to the commercial damage FJIC will inflict to Micron in the years to come.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing new extreme-speed DDR4 memory kits that push 16 GB and 8 GB modules up to DDR4-4400 with a low latency of CL17-18-18-38 across the board, under the Trident Z Royal family. Upgrading specifications across all three fronts of memory frequency speed, module capacity, and low memory latency, these specifications are engineered with Samsung B-die ICs and designed for the latest Intel Z490 platform to achieve higher performance for gaming and content creation.

As 32 GB memory total capacity becomes the standard for gaming PC and performance PC builds, G.SKILL recognizes the importance of extreme performance 16 GB x2 memory kit configurations. Rising to the challenge, G.SKILL has created the DDR4-4400 CL17-18-18-38 memory kit with 32 GB (16 GB x2) capacity under the Trident Z Royal family. See the memory kit stress testing on the MSI MPG Z490 GAMING PLUS motherboard with an Intel Core i5-10600K processor in the screenshot below.

2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion, 10 percent higher than the previously forecast US$65.7 billion, and all product segments promising solid growth rates, according to the second-quarter 2020 update of the SEMI World Fab Forecast report. Memory fabs will lead worldwide semiconductor segments with US$30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with US$29 billion in investments.

The 3D NAND memory subsegment will help power the spending spree with a 30 percent jump in investments this year before tacking on 17 percent growth in 2021. DRAM fab investments will surge 50 percent next year after declining 11 percent in 2020, and fab spending on logic and foundry, mainly leading edge, will trace a similar but more muted trajectory, rising 16 percent 2021 after an 11 percent drop this year.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced ORION series memory for gamers and content creators providing high speed as well as massive memory capacity scalable up to 4000 MHz CL18 64 GB (2 x 32 GB) kit.

High speed and low latencies used to be gamers' favorite while massive memory capacity which greatly helps the multimedia creation is preferred for content creators. Scaling up to 2x 32 GB 4000 MHz CL18, GeIL ORION series memory is an exceptionally balanced choice designed to satisfy multiple needs, especially for users require both extraordinary performance for gaming and massive memory capacity for multimedia creation.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its record of leading the industry's innovation in specialty Flash memory with the introduction of a more flexible, high-speed read capability in its latest QspiNAND Flash products. Automotive and IoT device manufacturers are increasingly adopting high-performance Single-Level Cell (SLC) NAND Flash as a low-cost alternative at densities of 512 Mbits and higher to the NOR Flash traditionally used for code storage. Previous Winbond innovations in high-performance NAND Flash include the Quad SPI-NAND interface, which shares the same 6-pin signals and QSPI command set as Quad SPI-NOR, and the Continuous Read function, which achieves up to a 52 MB/s continuous data transfer rate at a 104 MHz clock frequency.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, proudly presents the first-ever product that combines memory and an AIO liquid cooler, the Floe RC360 / RC240 CPU & Memory Liquid Cooler. Thermaltake never stops to seek out possibilities to impress our users with a more efficient cooling solution for our memory modules. With the new Floe RC360 / RC240 CPU & Memory Liquid Cooler, users can acquire an unparalleled gaming experience.

Floe RC360 / RC240 CPU & Memory Liquid Cooler is compatible with TOUGHRAM RC memory modules (Sold separately) and grants further expandability which allows users to equip a high-quality all-in-one cooling system, including a water block, radiator, an ARGB controller, and three high airflow 120 mm fans on the RC360 version and two high airflow 120 mm fans on the RC240 version. Other than that, Floe RC360/RC240 CPU & Memory Liquid Cooler can be synchronized with motherboards equipped with 5 V addressable RGB headers such as ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, Biostar VIVID LED DJ and ASRock Polychrome, allowing users to control the lights directly from the motherboards RGB lighting software.

Corsair today unveiled the Dominator Platinum White RGB DDR4-Memory, an exclusive trim of its flagship PC memory offering. The White edition sees chunky matte white heatspreaders, gold colored faux heatsink fins, and a silicone addressable RGB diffuser at the very top. Gold rivets hold the two halves of the heatsink together. All the heavy lifting is done by the 10-layer black PCB underneath with Samsung B-die DDR4 DRAM chips, unchanged from the original Dominator Platinum RGB series. The series is available in 16 GB (2x 8 GB), 32 GB (4x 8 GB), 32 GB (2x 16 GB), 64 GB (4x 16 GB), and 128 GB (8x 16 GB), and in memory speeds of DDR4-3200 CL16, DDR4-3600 CL18, and DDR4-4000 CL19. Corsair is backing these with lifetime warranty.

Read the TechPowerUp review of the 32 GB (4x 8 GB) DDR4-4000 kit.

Samsung Electronics, the world leader in advanced memory technology, today announced plans to expand its NAND flash production capacity in Pyeongtaek, Korea, reinforcing the company's ability to meet demands from emerging technologies. Construction, which began this May, will pave the way for mass production of Samsung's cutting-edge V-NAND memory in the second half of 2021.

"The new investment reaffirms our commitment to sustain undisputed leadership in memory technologies, even in uncertain times," said Cheol Choi, executive vice president of Memory Global Sales & Marketing at Samsung Electronics. "We will continue to serve the market with the most optimized solutions available, while contributing to growth of the overall IT industry and the economy in general."

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces that its XPG Overclocking Lab (XOCL), in conjunction with MSI, has overclocked the SPECTRIX D50 and D60G 32 GB RGB DDR4 memory modules to a frequency of 5000 MHz on an Intel Z490 platform. This achievement not only signifies the compatibility of XPG and ADATA DRAM modules with the latest Intel Z490 platforms, but also their ability to bring out their full performance potential. XPG reached the milestone with an Intel Core i9-10900K chipset and MSI MEG Z490 gaming motherboard. XPG also tested the D60G and D50 with Z490 platforms from other manufactures with similar results.

The D60G sports more RGB lighting per mm² than any other memory module out there, which equates to over 60% of the module's surface area. The fully exposed light diffusers are extra-wide for maximum effect, and combined with a mesmerizing multi-colored flow effect users will outshine their competition! The unique avant garde styling of the D60G will also turn heads. It includes XPG's signature X-light design with a diamond-inspired, multi-faceted surface that is a cut above the rest.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, announced today the launch of AORUS RGB MEMORY 4400 MHz. The all new design memory kit features the highly-praised Hynix D die, providing high bandwidth and high performance of DDR4 XMP 4400 MHz under 8 GB x2 mainstream specifications with a friendly price tag. The AORUS RGB MEMORY 4400 MHz is qualified by the high-end platform of INTEL Z490 and AMD X570, offering distinguished quality and stability with a lifetime warranty. Through RGB 2.0 support, users can create personal stylish lighting among DRAM and system components with balance of performance, budget, and fashion.

Following the innovation of computer platforms, the support of high memory XMP increases as well. GIGABYTE AORUS RGB MEMORY has won most credits consistently from the industry, and brings extra to the plate with the latest AORUS RGB MEMORY 4400 MHz 16 GB, with the specification of 8 GB x2 DDR4 XMP 4400 MHz and 19-26-26-46 timing. AORUS RGB MEMORY 4400 MHz 16 GB adopts Hynix D die which is the latest optimized option that memory overclockers highly recommend, and chose this level of product when purchasing. GIGABYTE implements this high quality material on AORUS RGB MEMORY 4400 MHz memory for overclockers who chase high memory frequency and enthusiasts can take full advantage of the various performance boosts.

Antec, a leading provider of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, broadens its range of memory with the new Katana DDR4 Memory. Inspired by the Japanese Samurai sword and its blade, the Antec Katana features a soft silhouette with metallic shine and lighting, adding extra style to the dream builds. "With our Katana memory modules, Antec aims at enthusiasts buying their stylish gaming cases and looking to add stylish designed components by the same brand", explains Eric Chen, Vice President at Antec. "Katana shows off a metallic shine on the silver lighting bar, while, lit up, Katana glows with soft and harmonious light effects."

The distinctive aluminium heatsink offers excellent thermal conductivity to ensure great cooling performance even during overclocking. Katana provides extensive freedom of customization with a vast array of modes and ARGB functions via motherboard synchronization.

HP unveiled its V8 RGB line of DDR4 memory modules targeted at the DIY market. The full-height UDIMM module is characterized by dark aluminium heatspreaders and an RGB LED silicone diffuser crown. The module comes in 8 GB single-rank, and 16 GB dual-rank densities, and speeds of DDR4-3000, DDR4-3200, DDR4-3466, and DDR4-3600. The lighting supports ARGB control through popular apps such as ASUS Aura, GIGABYTE RGB Fusion, MSI Mystic Light, and ASRock Polychrome. HP intends to sell the V8 RGB in single-module kits. The company didn't reveal pricing.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is now announcing more excellent news for those who want to try out the NeonMaker software on other Thermaltake products. Besides Riing Quad, Riing Trio, and Floe DX series products, Thermaltake aims to expand the fun of NeonMaker to other product lines; hence, NeonMaker software now supports the TOUGHRAM RGB Series!

If users want to pair up their TOUGHRAM RGB Series lighting with cooling products, now is the time to do so. Users are able to personalize their lighting effects freely by utilizing the NeonMaker software, and users can also find out more information on the TOUGHRAM RGB Series products through AR technology by using our exclusive ARTT app. Other than that, users can also synchronize TOUGHRAM RGB Series products with the TT RGB Plus software to maximize the control of RGB effects.

Samsung announced today in an OCP Virtual Summit keynote that it has developed a solid state drive (PM9A3 SSD) with a SNIA-based E1.S form factor and full PCIe Gen 4 support to harness the production efficiencies of the company's sixth-generation (1xx-layer), three-bit V-NAND. At the same time, the company said that it has introduced a comprehensive reference design for its E1.S-based storage system.

The keynote, in addition to announcing the PM9A3, highlighted a new approach to open source multi-industry storage collaboration that spotlighted the development of an open-source platform (OSP) fundamentally tied to cloud-scale infrastructure deployments. It was presented by Jongyoul Lee, senior vice president of Samsung's Memory Software Development Team at the Open Compute Project Virtual Global Summit.

ZADAK, a leading provider of enthusiast PC gaming components and innovative water cooling solutions, announces the TWIST, a new DDR4 memory series featuring a low profile design with clock speeds ranging from 2666 MHz to 4133 MHz at a latency of 19-21-21-42 1.4 V, and capacity from 8 GB to 256 GB. Engineered for performance and compatibility, the TWIST DDR4 memories support Intel XMP 2.0 profiles for effortless overclocking, and offer superior heat dissipation with their aluminium alloy heat sink. With a low-profile design and extensive Qualified Vendor List (QVL) certification, they are sure to fit any build. The TWIST Series DDR4 memory modules achieve the maximum capacity of 32 GB for single slot with impressive stability.

Sporting a slim anodized aluminium alloy heat sink, the TWIST Series comes in a matte black and brushed aluminium finish for an elegant and sleek look. The refined low profile and compact design of the TWIST is well thought out to provide optimal heat dissipation without compromising on style.

The world's leading memory brand, TEAMGROUP today announces two new products, the T-FORCE SPARK RGB USB Flash Drive and the ELITE SDXC Memory Card. The T-FORCE SPARK RGB USB Flash Drive has a soft RGB lighting effect and a smart capacity display design to supports multiplatform operation. The ELITE SDXC Memory Card uses UHS-I U3 V30 specification, which is suitable for 4K Ultra HD video recording and shooting with DSLR cameras. It also has waterproof, shockproof, anti-X ray and anti-static functions. The two new products will bring fresh new look to storage devices and jumpstart new digital smart lifestyle for consumers.

TEAMGROUP launches the T-FORCE SPARK RGB USB Flash Drive with a capless design and a sliding connector to avoid the problem of losing the cap. The RGB lighting effect is designed with gaming elements and smart capacity status indicator. When connecting to Windows, the blue, yellow and red light will flash to display the capacity ratio during reading and writing. It shows current storage status easily, and this practical function can make a big leap forward in storage efficiency. The SPARK RGB USB Flash Drive is even more suitable for gaming consoles such as PS4, PS3, Xbox One and Xbox 360, satisfying gamers' storage needs at once with colorful RGB lighting.