Intel today announced that it has begun shipments of the first Intel Agilex field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom. These customers are using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.

"The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These unmatched assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link," said Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, is proud to launch an edgy addition to its 4th generation of RACING motherboards with the gaming ready BIOSTAR RACING B365GTA. Built for gamers who want an A-Grade motherboard equipped with A+ gaming features, the RACING B365GTA is equipped with premium quality components that ensure professional level performance without compromising on durability. While remaining affordable, the new motherboard features a refreshing and futuristic new design that pushes the conventional norm, enthusiasts will be able to build a PC that outshines the others and set a new standard for PC design.

The BIOSTAR RACING B365GTA, equipped with the latest Intel B365 chipset, brings support for the 9th & 8th Generation Intel Core processors for the most modern features available on the market. Namely, PCI-E M.2 32 Gb/s (with Intel Optane Technology Ready) for faster boot time as well as a bandwidth boost to your traditional stored device for rapid access to your game, USB 3.1 Gen1 support (5 Gb/s) for an easy plug-and-play experience with your external devices and faster transfer speed (compared with USB 2.0), and HDMI 4K resolution for a better than life visual gameplay. Up to 64 GB of DDR4 memory spread over 4-DIMMs give the user plenty of RAM to multitask without compromise, and with such a bold grey and black design and futuristic heatsink, it is sure to make heads turn and eyes sparkle with envy.

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

Intel Corporation today reported first-quarter 2019 financial results. "Results for the first quarter were slightly higher than our January expectations. We shipped a strong mix of high performance products and continued spending discipline while ramping 10nm and managing a challenging NAND pricing environment. Looking ahead, we're taking a more cautious view of the year, although we expect market conditions to improve in the second half," said Bob Swan, Intel CEO. "Our team is focused on expanding our market opportunity, accelerating our innovation and improving execution while evolving our culture. We aim to capitalize on key technology inflections that set us up to play a larger role in our customers' success, while improving returns for our owners."

In the first quarter, the company generated approximately $5.0 billion in cash from operations, paid dividends of $1.4 billion and used $2.5 billion to repurchase 49 million shares of stock. In the first quarter, Intel achieved 4 percent growth in the PC-centric business while data-centric revenue declined 5 percent.

Today, Intel launched the most powerful generation of Intel Core mobile processors ever: the new 9th Gen Intel Core mobile H-series processors, designed for gamers and creators who want to push their experience to the next level. "Our new 9th Gen platform is designed to delight gamers, creators and performance users by giving them more of what they want. We are bringing desktop-caliber performance with up to 5 GHz and 8 cores in a range of thinner systems and new level of connectivity with Wi-Fi 6 (Gig+) so users can game or create where they want," said Fredrik Hamberger, general manager of the Premium and Gaming Laptop Segments at Intel.

There are 580 million enthusiast PC gamers and 130 million PC-based content creators today who care about raw performance as much as they do responsiveness of their PC. They require PCs that can handle everything from demanding AAA games to taxing creative workloads like editing, rendering and transcoding massive 4K video - all while on the go. The 9th Gen Intel Core mobile processors deliver desktop-caliber performance in a mobile form factor and feature amazing performance; the fastest, most reliable wireless with Intel Wi-Fi 6 AX200 (Gig+); the most versatile wired connectivity with Thunderbolt 3; and support for Intel Optane memory technology.

Colorful Technology Company Limited, professional manufacturer of motherboards, graphics cards, and high-performance storage solutions is proud to announce its latest motherboard featuring Intel Z390 chipset which supports unlocked 8-core 9th-gen as well 8th-gen processors from Intel. The new COLORFUL CVN Z390M GAMING V20 is aimed at enthusiasts, system builders, and gamers looking for a serious foundation for an mATX build. This motherboard allows mainstream to high-end builds without breaking the bank while still delivering a performance and features for a wide range of use.

The new COLORFUL CVN Z390M GAMING V20 will feature support for both 8th-gen and 9th-gen Intel processors in the LGA1151 package. This allows users to upgrade from Intel's 8th-generation processor to the 9th-gen CPU that increases core count to give you a performance upgrade. The motherboard also supports DDR4 memory higher bandwidth so applications can run as fast as possible. The motherboard also supports overclocking on unlocked processors for increased performance.

Intel today revealed details about Intel Optane memory H10 with solid-state storage - an innovative device that combines the superior responsiveness of Intel Optane technology with the storage capacity of Intel Quad Level Cell (QLC) 3D NAND technology in a single space-saver M.2 form factor. "Intel Optane memory H10 with solid-state storage features the unique combination of Intel Optane technology and Intel QLC 3D NAND - exemplifying our disruptive approach to memory and storage that unleashes the full power of Intel-connected platforms in a way no else can provide," said Rob Crooke, Intel senior vice president and general manager of the Non-Volatile Memory Solutions Group.

Combining Intel Optane technology with Intel QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors - such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

Optane Persistent Memory is being touted by Intel as the "hottest" storage medium between DRAM and NVMe SSDs in the short-term, and a successor to DRAM-based memory in the long-term, aided by its ability to hold data even in the absence of power. The company's latest Xeon Scalable "Cascade Lake" processors support Optane Persistent Memory, allowing data-centers to cram larger amounts of data accessible at DRAM-like speeds, even if at much higher latencies. It remains significantly faster than NVMe SSDs. Component retails began listing 512 GB modules of the Optane Persistent Memory, and its prices are nothing like your 512 GB NVMe SSD. CompSource lists the 512 GB module (model: NMA1XXD512GPSU4) for a whopping USD $7,816, although the product is out of stock.

Intel announced today a brand-new product family, the Intel Agilex FPGA. This new family of field programmable gate arrays (FPGA) will provide customized solutions to address the unique data-centric business challenges across embedded, network and data center markets. "The race to solve data-centric problems requires agile and flexible solutions that can move, store and process data efficiently. Intel Agilex FPGAs deliver customized connectivity and acceleration while delivering much needed improvements in performance and power for diverse workloads," said Dan McNamara, Intel senior vice president, Programmable Solutions Group.

Customers need solutions that can aggregate and process increasing amounts of data traffic to enable transformative applications in emerging, data-driven industries like edge computing, networking and cloud. Whether it's through edge analytics for low-latency processing, virtualized network functions to improve performance, or data center acceleration for greater efficiency, Intel Agilex FPGAs are built to deliver customized solutions for applications from the edge to the cloud. Advances in artificial intelligence (AI) analytics at the edge, network and the cloud are compelling hardware systems to cope with evolving standards, support varying AI workloads, and integrate multiple functions. Intel Agilex FPGAs provide the flexibility and agility required to meet these challenges and deliver gains in performance and power.

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

Intel Tuesday unveiled a new portfolio of data-centric solutions consisting of 2nd-Generation Intel Xeon Scalable processors, Intel Optane DC memory and storage solutions, and software and platform technologies optimized to help its customers extract more value from their data. Intel's latest data center solutions target a wide range of use cases within cloud computing, network infrastructure and intelligent edge applications, and support high-growth workloads, including AI and 5G.

Building on more than 20 years of world-class data center platforms and deep customer collaboration, Intel's data center solutions target server, network, storage, internet of things (IoT) applications and workstations. The portfolio of products advances Intel's data-centric strategy to pursue a massive $300 billion data-driven market opportunity.

Colorful Technology Company Limited, professional manufacturer of motherboards, graphics cards, and high-performance storage solutions is proud to announce its latest motherboard featuring Intel B365 chipset to support both Intel 9th-gen and 8th-gen processors from Intel, the new COLORFUL CVN B365M Gaming Pro V20. This motherboard allows mainstream-to-entry level builds to avoid breaking the bank while still delivering a wide range of performance.

The new COLORFUL CVN B365M Gaming Pro V20 will feature support for both 8th-gen and 9th-gen Intel processors in the LGA1151 package. This allows users to upgrade from Intel's 8th-generation processor to the 9th-gen CPU that increases core count to give you a performance upgrade. The motherboard also supports DDR4 memory with higher bandwidth so applications can run as fast as possible.

Intel and Micron Technology have parted ways from the IMFlash Technology joint-venture that set out to win the emerging non-volatile memory market with limited success. The two are now locked in numerous legal skirmishes arising from the disjointing of a major high-technology alliance, as employees migrate to either company. One such former Intel engineering-manager is in the middle of a legal spat, named Doyle Rivers. Rivers jumped ship from Intel to Micron Technology, allegedly carrying with him a large amount of trade-secrets and IP related to Intel's 3D XPoint memory and Optane products.

Intel Tuesday secured a preliminary injunction from the US District Court for the Eastern District of California, Sacramento Division, which tells Rivers to not possess, use, or disclose any confidential Intel information related to the company's 3D XPoint or Optane products, including personnel working on those products; and to return any such possessions to Intel. Rivers' defense claims Intel gets nothing from this injunction. In a telephonic interview with The Register, Daniel Sakaguchi, a partner at Alto Litigation in San Francisco, representing Rivers, stated "Mr. Rivers doesn't have anything to return," adding "We continue to take the position that Intel's claims are greatly exaggerated."

This here is an interesting piece of tech news for sure, in that Intel has already scored a pretty massive design win for not one, but two upcoming products. Intel's "Future Xeon Scalable Processors" and the company's "Xe Compute Architecture" have been tapped by the U.S. Department of Energy for incorporation into the new AURORA Supercomputer - one that will deliver exascale performance. AURORA is to be developed in a partnership between Intel and Cray, using the later's Shasta systems and its "Slingshot" networking fabric. But these are not the only Intel elements in the supercomputer design: Intel's DC Optane persistent memory will also be employed (in an as-of-yet-unavailable version of it as well), making this a full win across the prow for Intel.

Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the "Cascade Lake" microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new "Cascade Lake-X" silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of "Meltdown" and "Spectre."

Elsewhere in the industry, and sticking with Intel, we've known since November 2018 of the existence of "Comet Lake," which is a 10-core silicon for the LGA1151 platform, and which is yet another "Skylake" derivative built on existing 14 nm process. This chip is real, and will be Intel's last line of defense against AMD's first 7 nm "Zen 2" socket AM4 processors, with core-counts of 12-16.

EK Water Blocks, the premium computer cooling gear manufacturer, is releasing a passive heatsink for the M.2 version of the Intel Optane 905P NVMe SSD. The passive heatsink ensures lower operating temperatures which expands the lifespan and improves the sustained performance of the drive. It ensures that the Intel Optane 905P NVMe SSD operates at its maximum possible performance by preventing thermal throttling during heavy workload cycles.

The 905P Intel Optane Drive uses around 9.35 W of power under load, which is challenging to dissipate without a dedicated cooling solution like the EK-M.2 Intel Optane Heatsink. The cooling performance of this solution by EK is achieved via thermal pads that transfer heat to the aluminum heatsink that is finned for a larger dissipation area. The design of the heatsink ensures that it is easy to install, it is low profile, easily reusable and aesthetically not intrusive.

SUSE today announced support for Intel Optane DC persistent memory with SAP HANA . Running on SUSE Linux Enterprise Server for SAP Applications, SAP HANA users can now take advantage of high-capacity Intel Optane DC persistent memory in the data center. Users can optimize their workloads by moving and maintaining larger amounts of data closer to the processor and minimizing the higher latency of fetching data from system storage during maintenance. Support for Intel Optane DC persistent memory, currently available in beta from multiple cloud service providers and hardware vendors, is another way SUSE is helping customers transform their IT infrastructures to reduce costs, deliver higher performance and compete more efficiently.

"Persistent memory technology will spark new applications for data access and storage," said Thomas Di Giacomo, SUSE CTO. "By offering a fully supported solution built on Intel Optane DC persistent memory, businesses can take greater advantage of the performance of SAP HANA. SUSE continues to partner with companies like SAP and Intel to serve customers worldwide who are looking to fuel growth by transforming their IT infrastructure. It is their needs that drive the direction of our innovation."

Intel Corporation today reported third-quarter 2018 financial results. Third-quarter revenue of $19.2 billion was an all-time record, up 19 percent YoY driven by broad business strength and customer preference for performance-leading products. The Client Computing Group (CCG), the Data Center Group (DCG), the Internet of Things Group (IOTG), the Non-volatile Memory Solutions Group (NSG) and Mobileye all achieved record revenue. Collectively, data-centric businesses grew 22 percent, led by 26 percent YoY growth in DCG. PC-centric revenue was up 16 percent on continued strength in the commercial and gaming segments. Excellent operating margin leverage and a lower tax rate drove record quarterly EPS.

"Stronger than expected customer demand across our PC and data-centric businesses continued in the third quarter. This drove record revenue and another raise to our full-year outlook, which is now up more than six billion dollars from our January expectations. We are thrilled that in a highly competitive market, customers continue to choose Intel," said Bob Swan, Intel CFO and Interim CEO. "In the fourth quarter, we remain focused on the challenge of supplying the incredible market demand for Intel products to support our customers' growth. We expect 2018 will be another record year for Intel, and our transformation positions us to win share in an expanded $300 billion total addressable market."

Intel today introduced 1.5 TB variants of the Optane 905p SSD that implements 3D XPoint memory. The drive comes in half-height PCI-Express 3.0 x4 add-on card, and 15 mm-thick 2.5-inch form-factor with U.2 interface. Both variants offer sequential transfer rates of up to 2,600 MB/s reads, with up to 2,200 MB/s writes. Random access speeds are rated at up to 575,000 IOPS reads, with up to 550,000 IOPS writes. A function of its sheer capacity and 3D XPoint, endurance for these drives is rated at 27.37 PB (bytes written). The drives retain the feature set of their less capacious siblings, including 256-bit AES native encryption. The company didn't release pricing.

AKITIO, in a partnership with Intel will be releasing a special edition of the popular Node Lite PCIe box, bundled with the recently announced Intel Optane 905P, 960GB SSD as well as other higher capacity drives as they become available.

The Intel Optane 905P SSD is a new technology that is different from NAND flash memory. The Optane is a hybrid between DRAM and typical storage memory. By connecting the Intel Optane drive inside the Akitio Node Lite via Thunderbolt 3, we are able to fully utilize the Thunderbolt 3 bandwidth to achieve incredibly fast performance of up to 2200MB/s in both read and write. Unlike NAND flash based SSD's that provide fast performance in only large sized random read/write operations, the Optane drive provides the same phenomenal speeds in both large and small file transfers.

With no end to its 10 nm transition woes in sight (at least not until late-2019), Intel is left with refinement of its existing CPU micro-architectures on the 14 nanometer node. The client-desktop segment sees the introduction of the "Whiskey Lake" (aka Coffee Lake Refresh) later this year; while the enterprise segment gets the 14 nm "Cascade Lake." To its credit, Cascade Lake introduces a few major platform innovations, such as support for Optane Persistent Memory, silicon-level hardening against recent security vulnerabilities, and Deep Learning Boost, which is hardware-accelerated neural net building/training, and the introduction of VNNI (Variable Length Neural Network Instructions). "Cascade Lake" makes its debut towards the end of 2018. It will be succeeded in 2019 by Ice Lake the new "Cooper Lake" architecture.

"Cooper Lake" is a refresh of "Cascade Lake," and a stopgap in Intel's saga of getting 10 nm right, so it could build "Ice Lake" on it. It will be built on the final (hopefully) iteration of the 14 nm node. It will share its platform with "Cascade Lake," and so Optane Persistent Memory support carriers over. What's changed is the Deep Learning Boost feature-set, which will be augmented with a few new instructions, including BFLOAT16 (a possible half-precision floating point instruction). Intel could also be presented with the opportunity to crank up clock speeds across the board.

Toshiba at the Flash Memory Summit announced that it's developing 3D XL-Flash technology - an approach towards the creation of low-latency, 3D NAND that can take on the surging Optane and 3D XPoint memory technologies. Toshiba says the new approach to low-latency NAND could bring latency values down to just 1/10 of current consumer, TLC NAND pricing.

The bet here is on economies of scale - a revised NAND architecture and deployment will still be able to take advantage of the huge fabrication capacity that Toshiba already enjoys (and Samsung, with its Z-NAND, similar in purpose to what Toshiba want to do with XL-Flash), thus avoiding the need for technology and production ramp-up that brought Optane's pricing up. Toshiba will be using its BiCS flash technology, but XL-Flash will be - at least at first - deployed in SLC implementations, so as to improve performance (7 microseconds program time against QLC's 30 microsecond). Of course, this will bring storage density down, but remember the target here is offering Optane-like performance and equal or better density at lower pricing.

Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

The companies have agreed to complete joint development for the second generation of 3D XPoint technology, which is expected to occur in the first half of 2019. Technology development beyond the second generation of 3D XPoint technology will be pursued independently by the two companies in order to optimize the technology for their respective product and business needs.

The two companies will continue to manufacture memory based on 3D XPoint technology at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah.

Intel today announced the release of the new Intel Xeon E-2100 processor. The Intel Xeon E processor, successor to the Intel Xeon E3 processor, is designed for entry-level workstations that provide creators with powerful, single-threaded application performance with a platform optimized for reliability and affordability.

"With today's workloads, aging workstations impede productivity, collaboration and creativity. The release of the Intel Xeon E processor is intended to deliver the essential performance and visuals for entry workstations, as well as optimizing the innovative form factors, designs and diverse requirements of our customers," said Jennifer Huffstetler, vice president and general manager, data center product management, Intel Corporation.

Intel is giving finishing touches to a new wave of Xeon Scalable processors based on its new "Cascade Lake" silicon. One of its first parts is a 28-core chip with a 6-channel DDR4 memory interface, support for 3 DIMMs per channel, resulting in 18 DIMM slots per socket. Its integrated memory controllers support a theoretical maximum of 3.84 TB of memory. The best part? The memory needn't be DRAM-based.

With its next-generation of enterprise processors, Intel is introducing support for Optane Persistent Memory. This 3D X-point based memory module has a performance footprint between NAND flash SSDs and volatile DRAM; while being close enough to the latter to work as primary memory. Its USP is persistence - the ability to not lose data after power loss or reboot; allowing large data centers to quickly power down/up nodes in response to load, without wasting several dozen minutes in repopulating DRAM with data from a hibernation image. Optane Persistent DIMMs come in capacities of up to 512 GB. This is simply 512 GB of 3D X-point memory wired to a special on-DIMM controller that interfaces with standardized DDR4 interface.