Team Group Inc., the world's leading memory brand has announced today the launch of our solid state drive TM4PS4/TM8PS4. This next generation high speed SSD M.2 (also known as the Next Generation Form Factor, NGFF), provides your mobile computing devices an excellent data saving performance with ultra compact size and lightweight for convenient portable use.

The Team M.2 SSD is exactly designed according to the M.2 specification. TM4PS4/TM8PS4 adopt a new generation of SATA III 6Gb/s transmission interface which has a stunning data transfer performance and compatibility. For different environment usage, TM4PS4/TM8PS4 comes in two sizes, 22x42mm and 22x80mm. It is designed for excellent performance and to satisfy all kinds of specification requirements for consumers' motherboards, notebooks, mobile devices and developing embedded devices.

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Toshiba Corporation today announced development of the world's first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-gigabit (16 gigabytes) device. Sample shipments of products using the new process technology start today. The BiCS is based on a leading-edge 48-layer stacking process, which enhances the reliability of write/erase endurance and boosts write speed, and is suited for use in diverse applications, primarily solid state drives (SSD).

Since making the world's first announcement of technology for 3D Flash memory, Toshiba has continued development towards optimizing mass production. To meet further market growth in 2016 and beyond, Toshiba is proactively promoting the migration to 3D Flash memory by rolling out a product portfolio that emphasizes large capacity applications, such as SSD.

SanDisk Corporation, a global leader in flash storage solutions, today announced that it has successfully developed its 48 layer second generation 3D NAND, also referred to as BiCS2. Pilot production will commence as planned in the second half of 2015 in the Yokkaichi joint venture facility, with meaningful commercial production targeted for 2016.

"We are very pleased to announce our second generation 3D NAND, which is a 48 layer architecture developed with our partner Toshiba," said Dr. Siva Sivaram, executive vice president, memory technology, SanDisk. "We utilized our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second generation 3D NAND, which we believe will deliver compelling storage solutions for our customers."

SanDisk plans to use the second generation 3D NAND technology across a broad range of solutions, from removable products to enterprise SSDs.

As one of our most exciting releases to date, the ExpressCage MB324SP-B brings to you our highly consumer-friendly enclosure made for anyone that requires affordable storage density. Fit up to 4 x 2.5" SATA/SAS HDD/SSD (7mm-12.5mm) into a single 5.25" bay with the ability to hot swap for easy drive replacement and single channel SAS support (SAS host required). Tool-less drive installation makes installing your drive more simple than ever and optional bottom tray screw holes are provided for extra protection and added stability. With a strategically placed 40mm cooling fan placed behind the unit and all around ventilation, your drives will stay cooler than the Arctic. An adjustable fan speed jumper lets you choose between HIGH, LOW, or AUTO smart cooling so you can set it based on your preference. Power users and system builders alike will enjoy the space saving, tool-less and hot-swap features provided by the ExpressCage MB324SP-B.

Our ExpressCage series is the latest addition to our lineup of ICY DOCK products and is catered to system builders and power users that require much more from their 5.25" bay. The MB324SP-B utilizes that 5.25" standard bay and converts it into 4 x 2.5" hot-swappable bays with support of 2.5" SATA and SAS HDD/SSD between 7mm to12.5mm in height. Our versatile enclosure supports SATA III 6Gb/s and single channel SAS (Requires SAS Controller Card). Extremely power efficient, the ExpressCage MB324SP-B can power all 4 drives with a single 15pin SATA power connector which can free up cable clutter and simplify your system build. In addition, our active power feature keeps your enclosure powered down until a drive is inserted minimizing energy usage.

OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new series of SATA III SSDs to add to its Intrepid 3000 enterprise portfolio. The new Intrepid 3700 SSD Series delivers superior performance and I/O latency responses that dramatically improve application performance and I/O efficiencies, and supports higher storage densities up to 2TB representing OCZ's largest capacity enterprise SATA SSDs to date.

"Datacenter customers have asked for larger solid state drives that do not make any sacrifices in performance or endurance to address the need to manage the ever growing amounts of data being generated by today's computing environments," said Daryl Lang, CTO at OCZ Storage Solutions. "Our new Intrepid 3700 Series is designed to meet these market requirements for an easy to deploy solid state solution that delivers the very best balance of features, endurance, and capacity."

HyperX, a division of Kingston Technology, the independent world leader in memory products, today, announced the HyperX Predator PCIe SSD. HyperX Predator PCIe SSD is the highest-end SSD with the fastest speeds in the HyperX lineup.

HyperX Predator PCIe SSD offers large capacities (240GB, 480GB) and incredible speeds to take systems to the edge. Faster than SATA-based SSDs, the PCIe generation 2.0 x4 interface delivers speeds up to 1400MB/s read and 1000MB/s write for ultra-responsive multitasking and an overall faster system. It is powered by the Marvell 88SS9293 controller.

OCZ Storage Solutions, a Toshiba Group Company and the most awarded solid state drive (SSD) brand of all time, today announced the release of the next generation Vector 180 SSD series along with the all-new SSD Guru storage management solution. Worthy of flagship status, the new Vector 180 features enhanced reliability, technology, storage capacity, and superior customer support all while providing the Vector's original game-changing performance and endurance it's known for. The feature-rich SSD Guru software tool not only enables users to do routine monitoring and maintenance, but truly helps them unlock their SSD's full potential.

Designed to power today's high-end consumer systems, the Vector 180 series is optimized for hardcore gaming and data-intensive applications thanks to its powerful OCZ Barefoot 3 controller and in-house Toshiba A19nm MLC NAND flash technology. New to this particular Vector release is an advanced reliability protection feature called Power Failure Management Plus (PFM+). In the event of unexpected system power loss or instability, the PFM+ feature helps safeguard the SSD and its at-rest data.

MSI proudly announces the latest and smallest mini-PC to date: the MSI Cubi. This tiny desktop is built on a concept of nifty technology and a brilliant design to suit the needs of both consumers and businesses.

Thanks to the implementation of a wide range of Intel processors, users can benefit from a powerful handheld-size PC, also capable of carrying multiple modular hard disks that provide a large base for data storage. MSI Cubi is mountable to a wall by VESA standards or can be combined with an HDTV, so the user can enjoy Ultra High-Definition and high quality media entertainment at home.

For commercial applications, Cubi also comes with Intel vPro technology, ensuring a safe and easily manageable working environment. With plenty of ports to connect to external devices, Cubi is the essence of small, smart computing. A black and a white version of the MSI Cubi are globally available by end of March 2015.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

Aerocool Advanced Technologies, one of world's leading manufacturers of excellent gaming PC gear, presents the Aero-1000 chassis as part of its new PGS-A (Performance Gaming System) series. "A" stands for Airflow, which is one of the most important aspects, when it comes to building a PC case. All chassis from the PGS-A series stand out by extraordinary airflow capabilities, great cable management functions and much space for high-end water-cooling systems. The Aero-1000 is first to incorporate these great features in combination with an extraordinary design.

Aerocool launches the Aero-1000 in two color variations. Users are able to choose between the all-black and the black-and-white model, depending on their preference. The overall design is fresh and elegant at the same time. Huge metal mesh grids in both top and front panel indicate the great cooling potential and focus of the Aero-1000. Aerocool uses very solid steel with 0,8 mm thickness for the chassis to assure great stability. Curved top panel offers extra space for latest 240 mm or 280 mm water-cooling radiators with a thickness of 35 mm.

ASUS Republic of Gamers (ROG) today announced the G501 series gaming laptop. One of the thinnest laptops in its class, G501 is just 20.6mm tall and weighs as little as 2.06kg (for non-touchscreen models) - ideal for gaming on the go.

G501 is powered by the 4th-generation Intel Core i7 processor and the new NVIDIA GeForce GTX 960M graphics for an unrivalled gaming experience. This impressive power is supported by ASUS-exclusive Hyper Cool technology with dual independent fans, delivering smooth, stable performance for both gaming and professional content creation. In addition, G501 has a 15.6-inch 4K/UHD (ultra-high definition) display with 8.2-million pixels to treat users to incredibly detailed visuals and lifelike colors.

Elitegroup Computer System (ECS) is proud to show off whole new LIVA series mini PC in CeBIT! ECS LIVA series mini PC get over 50 recommendations and awards form worldwide media since 2014! New LIVA mini PC features with 14nm processors, provides better graphics performance! In addition, ECS will display whole new LIVA mini PC prototype which adopts with Intel Core M processors. It features with 14% smaller size, larger capacity of SSD, could upgrade up to 1TB, and faster Wi-Fi connection; a perfect balance between size, performance and extension. ECS focus in developing more powerful, multi-functional mini PC, and bring more and better choice to users.

ECS will display exclusive DURATHON technology motherboards also. Implement above and beyond industry standards components and testing to ensure durability and stability. Adopts with triple density PCB to provide better moisture proofing, high quality solid CAPs for longer lifespan; passing over 1500 test stages and extreme temperature resistance. ECS DURATHON motherboard brings best quality product to all users.

Two years ago, Google introduced the first Chromebook Pixel. The idea was to bring together the best in hardware, software and design to inspire the next generation of Chromebooks. It's been exciting to see how the entire range of Chromebooks-from classroom-proof to high-end-has made a difference to people at school, at home, and at work. Today, we're introducing an updated and more powerful Pixel to fuel the imaginations of another wave of Chromebook enthusiasts. Plus, we've created a new, online Google Store where you can get the Pixel and other devices made with Google, all in one place.

These days, packing for a trip means remembering to bring all your different chargers-for your phone, laptop, tablet, watch, etc. We think you should be able to use just one charger for all your electronics. So for the new Pixel, we've joined forces with some of the biggest names in the industry to create a new standard for charging, called USB Type C. The Pixel is one of the first products to launch with this new standard, with more Chromebooks and Android devices following suit soon.

Mushkin Enhanced MFG, an industry-leading designer and manufacturer of high-performance and mission-critical computer products, is announcing a partnership with Newegg.com for the launch of its new ECO2 line of solid-state drives. No stranger to producing high performance SSDs with industry-leading value, Mushkin's ECO2 will be an expansion of its SSD lineup that emphasizes ECO-friendly performance and an efficient, ECO-nomical design.

The new SSD line will offer read speeds of up to 550 MB/s, write of up to 535 MB/s, and combines the energy efficiency of solid-state drives with an economical design for a product with unprecedented value. The ECO2 will be an ideal option for end-users looking for an SSD solution that will dramatically increase performance and boot times compared to a standard hard disk drive.

A fusion between PC hardware giant ASUS' Republic of Gamers (ROG) brand, and Valve's Steam Machines, was bound to happen. With the new ROG GR8S, ASUS has taken a plunge into the exciting new gaming platform that bridges living room gaming consoles, and full-blown gaming PCs, backed by Steam. The ROG GR8S is roughly as big as a modern console such as Xbox One, but features ASUS' signature red and black ROG product design.

The ROG GR8S is peppered with a lot more wired connectivity than a console, offering two USB 2.0 (for controllers, keyboards, mice), four USB 3.0 SuperSpeed ports, DisplayPort 1.2, HDMI 2.0 - both of support 4K Ultra HD at 60 Hz; gigabit Ethernet (Intel controller), digital and analog multi-channel audio connectivity. Under the hood, ASUS offers Intel Core i5 or Core i7 processors (options), GeForce GTX 900 "Maxwell" graphics (options), between 4 GB and 16 GB of DDR3 system RAM (options), either 500 GB to 1 TB HDD or 128 GB to 512 GB SSD storage, and an 802.11 ac WLAN controller with Miracast receiver.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the IHSS312, a high-performance SATA III 6Gbps 22-pin half-slim SSD of MO-297 form factor, which is available in 8/16/32/64/128/256GB capacities to meet the varying needs of IPC embedded systems, healthcare, medical devices, kiosk/POS and factory automation.

Utilizing high-speed MLC NAND flash, ADATA's IHSS312 provides excellent performance and reliability with a sequential read/write speed up to 500/125MB per second and MTBF of up to 1 million hours. Thanks to its industrial-grade operable temperature range of -40°C to +85°C, the IHSSS312 is ideal for harsh environments requiring long-term operation.

Phanteks introduce their first Mini ITX, a budget oriented chassis that uses metal exterior, to their EVOLV lineup in the Enthoo Series. The case has many useful features, such as a unique bracket solution for a radiator on top and a multi-functional mid plate bracket for a reservoir, pump, and SSD/HDD.

The Enthoo EVOLV ITX retains the minimalist design from the original EVOLV and features a metal exterior. The case measures at 9.1 x 14.8 x 15.6 inches and is equipped with 1x PH-F200SP fan, front I/O port, 1x SSD Bracket, and 2x 3.5" removable HDD bracket.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

Following the introduction of the XH97V and SH97R6 barebone PC models that have been prepared for the fifth generation of Intel Core processors, Shuttle today introduces a new member to the product family - the DS57U. This is the company's first barebone PC with a built-in Broadwell processor. As a successor to the DS47 and DS437 models, the DS57U also belongs to the 1 litre PC class. The DS57U is delivered as a barebone PC and includes the case, motherboard, cooling system and power supply unit as its core components as standard.

The system is powered by a pre-installed Intel Celeron 3205U dual-core processor (2x 1.5 GHz), which also is part of the delivery. The 14-nm architecture and power consumption of less than 15 W promise low energy costs together with improved performance. The completely fanless DS57U not only works remarkably quietly, it is almost maintenance-free, as the passive cooling ensures that no dust is sucked into the machine.

VisionTek Products LLC, (VisionTek), a leading manufacturer of award-winning, high-performance upgrades and accessories for PCs and Macs, today announced the new VisionTek Wallet Drive leather external drive enclosure. Designed for ultra-portable convenience, the Wallet Drive's leather cover with magnetic flap closure conceals a hot-swappable, screw-less drive tray with an integrated 7" long USB 3.0/2.0 connecting cable. Any SATA hard drive or solid state drive can simply be slid into the Wallet Drive to deliver data transfer speeds up to 600 MB/s with nearly any Windows or Mac OS X based computer with a USB 3.0/2.0 interface.

To start storing, sharing, and/or backing up documents, music, videos, photos, and other data with the Wallet Drive, just slide any 2.5" 7mm or 9mm SATA I/II/III hard drive or solid state drive, including VisionTek's Go Drive and Racer series of SSDs, into the hot-swappable drive tray. The snap tight, pressure fit tray securely holds the drive without the need for tools or screws.

Fixstars Solutions Inc., an innovator in flash storage solutions, today announced the start of sales for 3TB SSD, SSD-3000M, and 1TB SSD, SSD-1000M, in North America. The products feature enterprise level reliability and unprecedented sequential read/write performance aimed at professional content creation, advanced driver assistance systems (ADAS), HPC, and Datacenters.

The 3TB SSD-3000M has the world's highest capacity for 2.5" SATA SSD. High capacity SSDs help reduce the number of drives required in professional setups reducing operational costs such as maintenance, energy, and chassis/rack infrastructure. More importantly a more reliable workflow with minimum handling failures is of significantly valuable. These disks integrate Fixstars' proprietary NAND controller preventing latency spikes and performance deterioration ensuring consistent high performance. Applications for which fast and stable disk writes are crucial such as 4K video recording/editing and encrypted storage for film will benefit the most from Fixstars solid state disks.

Not all devices are created equal, and this can be seen with the ToughArmor M998SP-B which skews the realm of possibilities. It boasts the ability to house an unprecedented 8 x 2.5" SATA drives with 7mm height into a single 5.25" drive bay, making it the ultimate solution for storage dense applications. Our unique hot-swappable 2.5" EZ Slide Nano trays let you painlessly and quickly swap out drives. Dual 40mm fans keep your drives nice and cool while ventilated openings located on the front and sides maximize airflow. The MB998SP-B features a heavy duty full metal housing which is commercially designed for Medical & Military systems, IPC, enterprise, and industrial settings.

Utilizing the standard 5.25" bay form factor, the compact design allows the cage to be used in various applications such as advanced RAID. With the MB998SP-B it's possible to build dual RAID 5 or RAID 10 arrays or use 4 drives in a high performance RAID 0 array plus two RAID 1 arrays for backups. The MB998SP-B is extremely useful for workstations, compact servers, gaming rigs, home servers or HTPC's due to its high capacity and space saving design. It is also perfect for users that need non-RAID JBOD storage to save different content in different drive locations. It supports a wide-range of applications which makes the MB998SP-B invaluable.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, announces its DuraDrive ZT4 solid state drive for commercial and industrial storage solutions.

The DuraDrive ZT4 is the successor to the highly popular DuraDrive ZT3 that utilizes a 40-pin Zero Insertion Force connector with an IDE interface. The ZT4 is commonly used in aerospace, enterprise computing, and medical systems to provide reliable and high application performance. The smaller form factor allows the ZT4 to fit into smaller enclosures ensuring that precious device real estate is available for expansion and cooling.

ASUS today announced the elegant and powerful ZenBook UX305, which is the world's slimmest 13.3-inch ultraportable laptop at 0.48-inch thin. The UX305 weighs 2.6lbs and features crisp and vibrant in-plane switching (IPS) anti-glare displays. Powered by the all-new Intel Core M processor for seamless multitasking and standard solid state storage, the UX305 is the ultimate ultraportable laptop for discerning users. Up to 10 hours of battery life gives users true all-day computing.

A wedge-shaped design crafted from solid aluminum and enhanced with diamond-cut highlights gives the ZenBook UX305 a sleek look while a new obsidian stone color finishes the elegant design. The award winning ZenBook UX305 is the recipient of a 2014 Good Design Award from the Japan Institute of Design Promotion (JDP) and also included in the Good Design Best 100 list, which is a selection of products receiving special recognition from the jury of industry experts for their exceptional and forward-looking designs.