During its Q3 earnings call, Samsung Electronics has provided everyone with an update on its foundry and node production development. In the past year or so, Samsung's foundry has been a producer of a 7 nm LPP (Low Power Performance) node as its smallest node. That is now changed as Samsung has started the production of the 5 nm LPE (Low Power Early) semiconductor manufacturing node. In the past, we have reported that the company struggled with yields of its 5 nm process, however, that seems to be ironed out and now the node is in full production. To contribute to the statement that the new node is doing well, we also recently reported that Samsung will be the sole manufacturer of Qualcomm Snapdragon 875 5G SoC.

The new 5 nm semiconductor node is a marginal improvement over the past 7 nm node. It features a 10% performance improvement that is taking the same power and chip complexity or a 20% power reduction of the same processor clocks and design. When it comes to density, the company advertises the node with x1.33 times increase in transistor density compared to the previous node. The 5LPE node is manufactured using the Extreme Ultra-Violet (EUV) methodology and its FinFET transistors feature new characteristics like Smart Difusion Break isolation, flexible contact placement, and single-fin devices for low power applications. The node is design-rule compatible with the previous 7 nm LPP node, so the existing IP can be used and manufactured on this new process. That means that this is not a brand new process but rather an enhancement. First products are set to arrive with the next generation of smartphone SoCs, like the aforementioned Qualcomm Snapdragon 875.

RISC-V architecture is a relatively new Instruction Set Architecture (ISA) developed at the University of California Berkeley. Starting as a "short, three-month project" the RISC-V ISA is a fifth generation of the Reduced Instruction Set Computing (RISC) ideology. A company working on this technology and helping to grow the ecosystem is SiFive. Today, they announced a big step forward for the ecosystem that will enable developers to make and optimize even more software for this architecture and platform. Called the HiFive Unmatched, the development board represents the first entry of RISC-V ISA to the world of personal computing, with its Mini-ITX form factor and PC-like connectors of power supply and I/O.

The board is home to SiFive's FU740 SoC, a five-core heterogeneous, coherent processor with four SiFive U74 cores, and one SiFive S7 core. This SoC is capable of smooth Linux OS operation, giving the developers a good platform to do their optimizations for. There is 8 GB of onboard DDR4 RAM (unknown frequencies and timing), a MicroSD card slot, and one PCIe 3.0 x4 M.2 slot for system storage. To connect the board to the outside world, you get one Gigabit Ethernet port. For user I/O there are four USB 3.2 Gen 1 Type-A ports (1 Charging port) and one MicroUSB Console port. To power the board, you need a proper power supply with a 24-pin power connector. If you plan to build a PC based on the Unmatched board, you would need a standard ITX case, as it comes in the standard Mini-ITX (170x170 mm) form factor. For more information, please check out SiFive's website.

Apple has established itself as a master of silicon integrated circuit design and has proven over the years that its processors deliver the best results, generation after generation. If we take a look at the performance numbers of the latest A14 Bionic, you can conclude that its performance is now rivaling some of the x86_64 chips. So you would wonder, what is inside this SoC that makes it so fast? That is exactly what ICmasters, a semiconductor reverse engineering and IP services company, has questioned and decided to find out. For starters, we know that Apple manufactures the new SoCs on TSMC's N5 5 nm node. The Taiwanese company promises to pack 171.3 million transistors per square millimeter, so how does it compare to an actual product?

ICmasters have used electron microscopy to see what the chip is made out of and to measure the transistor density. According to this source, Apple has a chip with a die size of 88 mm², which packs 11.8 billion N5 transistors. The density metric, however, doesn't correspond to that of TSMC. Instead of 171.3 million transistors per mm², the ICmasters measured 134.09 million transistors per mm². This is quite a difference, however, it is worth noting that each design will have it different due to different logic and cache layout.

Microsoft has today published another article on its Xbox Wire blog, dedicated to all the news regarding the Xbox consoles and its ecosystem. In the light of yesterday's launch of AMD Radeon RDNA 2 graphics cards, Microsoft has congratulated its partner and provider of processors SoCs for their next-generation consoles. Besides the celebrations and congratulations, Microsoft has proceeded to show off what the Xbox Series X and Series S consoles are capable of, and how they integrate the RDNA 2 architecture. The company notes that there are hardware accelerated DirectX Raytracing, Mesh Shaders, Sampler Feedback, and Variable Rate Shading units built-in, so game developers can take advantage of it.

Another interesting point Microsoft made was that "Xbox Series X|S are the only next-generation consoles with full hardware support for all the RDNA 2 capabilities AMD showcased today." What this translates into is that Microsoft is the only console maker that uses the full RDNA 2 potential. This could leave Sony out in the dark with its PlayStation 5 console, meaning that it does not support all the features of AMD's new GPU architecture. There are not any specific points, however, we have to wait and see what Sony has left out, if anything.

DIALOG SEMICONDUCTOR, a leading provider of battery and power management, Wi-Fi and Bluetooth low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog's CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX platform, with the plan to extend to other platforms.

Dialog's proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.

A leaked presentation slide by AMD for its Ryzen 5000 series "Zen 3" processors reveals details of the processor's memory interface. Much like the Ryzen 3000 series "Matisse," the Ryzen 5000 series "Vermeer" is a multi-chip module of up to 16 CPU cores spread across two 8-core CPU dies, and a unified I/O die that handles the processor's memory-, PCIe, and SoC interfaces. There are three configurable clock domains that ensure the CPU cores are fed with data at the right speed, and to ensure that the MCM design doesn't pose bottlenecks to the memory performance.

The first domain is fclk or Infinity Fabric clock. Each of the two CCDs (8-core CPU dies) has just one CCX (CPU core complex) with 8 cores, and hence the CCD's internal Infinity Fabric cedes relevance to the IFOP (Infinity Fabric over Package) interconnect that binds the two CCDs and the cIOD (client I/O controller die) together. The next frequency is uclk, or the internal frequency of the dual-channel DDR4 memory controller contained in the cIOD. And lastly, the mclk, or memory clock is the industry-standard DRAM frequency.

Editor's Note: This is written by Arm vice president and general manager Paul Williamson.

Over the last year, I have been inspired by the innovators who are dreaming up solutions to improve and enrich our daily lives. Tomorrow's mobile applications will be even more imaginative, immersive, and intelligent. To that point, the industry has come such a long way in making this happen. Take app stores for instance - we had the choice of roughly 500 apps when smartphones first began shipping in volume in 2007 and today there are 8.9 million apps available to choose from.

Mobile has transformed from a simple utility to the most powerful, pervasive device we engage with daily, much like Arm-based chips have progressed to more powerful but still energy-efficient SoCs. Although the chip-level innovation has already evolved significantly, more is still required as use cases become more complex, with more AI and ML workloads being processed locally on our devices.

Today, Toshiba has announced that it will officially be leaving the systems LSI (large scale integration) business. With this business unit, Toshiba used to provide design proposals and specifications for systems used for things like image processing, sensors, etc. However, it turns out that the unit is not profitable and Toshiba will be dissolving it. With this move, about 770 employees of the unit will be moved to another work place or be provided with an early retirement plan. Despite ending the business in making SoCs, Toshiba is still going to support existing customers. What is going to be next for Toshiba is the area of analog ICs and microcontrollers for motors, which is supposedly more profitable than the past business unit. All of the resources used in the LSI group will be redirected to the new plan.

In big corporate mergers and acquisitions involving multi-national corporations, money is the easy part, with the hard part being competition regulators of major markets giving their assent. The NVIDIA-Arm deal could get entangled in the US-China tech trade-war, with Beijing likely to use its approval of the deal as a bargaining chip against the US. Former Lenovo chief engineer Ni Guangnan predicts that the Chinese government's position would be to try and fight the deal on anti-trust grounds, as it could create a monopoly of chip-design tools. China's main concern, however, would be Arm IP falling into the hands of a US corporation, the California-based NVIDIA, which would put the IP under US export-control regulations.

Both Arm and NVIDIA announced an agreement for the latter to acquire Arm from SoftBank in a deal valued at USD $40 billion. NVIDIA CEO has been quoted as calling it the "deal of the century," as it would put NVIDIA in control of the biggest CPU machine architecture standard after Intel's x86, letting it scale the IP from low-power edge SoCs, to large data-center processors. Chinese regulators could cite recent examples of US export controls harming the Chinese tech industry, such as technology bans over Huawei and SMIC, in its action against the NVIDIA-Arm deal. Arm's 200-odd Chinese licensees have shipped over 19 billion chips based on the architecture as of mid-September 2020.

Today, Arm unveiled new computing solutions to accelerate autonomous decision-making with safety capability across automotive and industrial applications. The new suite of IP includes the Arm Cortex -A78AE CPU, Arm Mali -G78AE GPU, and Arm Mali-C71AE ISP, engineered to work together in combination with supporting software, tools and system IP to enable silicon providers and OEMs to design for autonomous workloads. These products will be deployed in a range of applications, from enabling more intelligence and configurability in smart manufacturing to enhancing ADAS and digital cockpit applications in automotive.

"Autonomy has the potential to improve every aspect of our lives, but only if built on a safe and secure computing foundation," said Chet Babla, vice president, Automotive and IoT Line of Business at Arm. "As autonomous decision-making becomes more pervasive, Arm has designed a unique suite of technology that prioritizes safety while delivering highly scalable, power efficient compute to enable autonomous decision-making across new automotive and industrial opportunities."

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF's industry-leading 22FDX (22 nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF's new 22FDX+ builds on the company's 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.

NUVIA, a leading-edge silicon design company, today announced the close of its Series B funding round, raising $240M. The funding round was led by Mithril Capital in partnership with Sehat Sutardja and Weili Dai (founders of Marvell Technology Group), funds and accounts managed by BlackRock, Fidelity Management & Research Company LLC., and Temasek, with additional participation from Atlantic Bridge, Redline Capital, Capricorn Investment Group, Dell Technologies Capital, Mayfield, Nepenthe LLC and WRVI Capital. The closure of NUVIA's Series B round builds on a $53M Series A round, raised in November 2019. NUVIA was founded in February 2019 by John Bruno, Manu Gulati and Gerard Williams, with the vision to create the world's leading server processor.

Ten years ago, Arm set its sights on deploying its compute-efficient technology in the data center with a vision towards a changing landscape that would require a new approach to infrastructure compute.

That decade-long effort to lay the groundwork for a more efficient infrastructure was realized when we announced Arm Neoverse, a new compute platform that would deliver 30% year-over-year performance improvements through 2021. The unveiling of our first two platforms, Neoverse N1 and E1, was significant and important. Not only because Neoverse N1 shattered our performance target by nearly 2x to deliver 60% more performance when compared to Arm's Cortex-A72 CPU, but because we were beginning to see real demand for more choice and flexibility in this rapidly evolving space.

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced that Dr. Yunsup Lee, CTO of SiFive, and Dr. Krste Asanovic, Chief Architect of SiFive, will present at the technology industry's premier processor conference, the Linley Fall Virtual Processor Conference. The conference will be held on October 20th - 22nd and 27th - 29th, 2020 and will feature high-quality technical content from leading semiconductor companies worldwide.

"Industry demand for AI performance has skyrocketed over the last few years driven by rapid adoption from the data center to the edge. This year's Linley Fall Processor Conference will feature our biggest program yet and will introduce a host of new technology disclosures and product announcements of innovative processor architectures and IP technologies," said Linley Gwennap, principal analyst and conference chairperson. "In spite of the challenges posed by the pandemic, development of these technologies continues to accelerate and we're excited to be sharing these presentations with a global audience via our live-streamed format."

Today we have found out that Sony has reportedly cut PlayStation 5 launch supply due to bad yields of the SoC powering the console. Previously, we reported that Sony has doubled production of the new console amid high demand, where the company expected to sell 10 million units in the fiscal year. The original plan was to have around 15 million units of the new console available by March 31st, 2021. Sony has been spending a lot of resources to get as many units out to consumers, however, the bad SoC yields have held the company back significantly.

It is reported by Bloomberg that instead of the original 15 million units Sony plans to supply, there will be only 11 million of them. That represents a massive reduction of 4 million units. And you are wondering how bad the yields of the new SoC are to have that big reduction. According to the source, TSMC and Sony are seeing only 50% yields on the production run. It is reported that the yields are gradually improving but have not yet reached the level needed to have a stable supply. This represents a big problem for the company and we don't know who is to blame. TSMC has been very good at manufacturing 7 nm silicon, however, it could be bad design from AMD and Sony that is making the production difficult. We are waiting for more information.

There is expected to be more than 79 zettabytes of IoT data in 2025, but the real value of this data is found in the insights it generates. The closer to the data source we can produce these insights the better, because of the improved security, latency and energy efficiency enabled. Computational storage is emerging as a critical piece of the data storage puzzle because it puts processing power directly on the storage device, giving companies secure, quick and easy access to vital information.

Our expertise and legacy in storage puts Arm in a strong position to address the changing needs of this market - with around 85% of hard disk drive controllers and solid-state drive controllers based on Arm, we are already a trusted partner for billions of storage devices. Today, we're announcing Arm Cortex-R82, our first 64-bit, Linux-capable Cortex-R processor designed to accelerate the development and deployment of next-generation enterprise and computational storage solutions.

TSMC on Monday announced the N12e silicon fabrication node. An enhancement of its 12 nm FinFET node, N12e is designed for value 5G application processors, MODEMs, and IoT edge devices, such as true-wireless earbuds, smartwatch processors, wearables, VR HMDs, entry-level and mainstream SoCs, etc. The node has been derived from the company's 12FFC+_ULL node, and fits into the 12-16 nm class of nodes. It's intended to succeed the company's 22ULL node (in terms of pricing), offering a 76% increase in logic density, 49% increase in clock speed at a given power, 55% improvement in power draw at a given speed, 50% reduction in SRAM leakage current, and low Vdd, with support for logic voltages as low as 0.4 V. That last bit in particular should make the node suitable for tiny, battery-powered devices such as wearables.

Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA's Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA's programs to quickly and easily take advantage of Arm's leading IP, tools and support, accelerating innovation in a variety of fields.

"The span of DARPA research activity opens up a huge range of opportunities for future technological innovation," said Rene Haas, president, IP Products Group, Arm. "Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world's largest ecosystem of tools, services and software."

Microsoft in its Hot Chips 32 presentation detailed the SoC at the heart of the upcoming Xbox Series X entertainment system. The chip mostly uses AMD IP blocks, and is built on TSMC N7e (enhanced 7 nm) process. It is a 360.4 mm² die with a transistor count of 15.3 billion. Microsoft spoke about the nuts and bolts of the SoC, including its largest component - the GPU based on AMD's new RDNA2 graphics architecture. The GPU takes up much of the chip's die area, and has a raw SIMD throughput of 12 TFLOP/s. It meets DirectX 12 Ultimate logo requirements, supporting hardware-accelerated ray-tracing.

The RDNA2 GPU powering the Xbox Series X SoC features 52 compute units spread across 26 RDNA2 dual compute units. The silicon itself physically features two additional dual CUs (taking the total physical CU count to 56), but are disabled (possibly harvesting headroom). We've detailed first-generation RDNA architecture in the "architecture" pages of our first AMD Radeon RX 5000-series "Navi" graphics card reviews, which explains much of the SIMD-level innovations from AMD that help it drive a massive SIMD IPC gain over the previous-generation GCN architecture. This hierarchy is largely carried over to RDNA2, but with the addition of a few SIMD-level components.

MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek's Dimensity series family. The 7 nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology. With Dimensity 800U MediaTek continues to accelerate the rollout of 5G technology and deliver premium experiences on mid-tier 5G smartphones.

"MediaTek has always focused on enhancing the user experience with our leading semiconductor technology, whether consumers are streaming, gaming or taking photos," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "MediaTek's Dimensity 800U brings cutting-edge, next-gen technology to the Dimensity SoC series, bringing MediaTek's advanced 5G, imaging and multimedia technologies to high-performance 5G smartphones that deliver incredible 5G experiences."

Samsung Electronics has reportedly laid out a plan to become the number one Android application processor (AP) vendor in the industry with its plan to join forces with AMD and Arm. The report of Business Korea indicates that Samsung wants to use both company's knowledge and IP to produce the best possible silicon. In early November of last year, Samsung has decided to shut down its division responsible for making custom CPU designs, and to start licensing IP from Arm. Also last year, Samsung has announced a strategic partnership with AMD to use its RDNA graphics processors in smartphones.

So Samsung plans to license IPs from both companies and just put them in SoC that will be up to the task to deliver the best performance, as the company predicts. The CPU is reportedly going to be based on Arm's Cortex-X custom design that should deliver high-performance Samsung wants. In the past, the company had some problems with the heat-management of its CPUs as they were designed a bit inefficiently. To cover everything, Samsung also plans to increase the number of employees working on a neural processing unit (NPU) and make a good performing NPUs as well, to combine with the rest of IPs.

A Nikkei investigative report uncovered that two Chinese semiconductor fabrication firms, namely Quanxin Integrated Circuit Manufacturing (QXIC), and Hongxin Semiconductor Manufacturing Co (HSMC), have poached over 100 veteran semiconductor engineers from TSMC since last year. Both firms are recipients of government funding under China's ambitious plan of complete electronics hardware industry independence by 2025. Both firms were floated as recently as 2017, and began hiring specialist engineers and executives with connections across the semiconductor industry, from TSMC. The two began development of a 14 nm-class FinFET node that would support manufacturing of a wide variety of electronics components, including SoCs, ASICs, transceivers, and storage products.

Nikkei estimates that in a span of a year, Taiwan lost more than 3,000 semiconductor engineers to various start-ups in the mainland, including large semiconductor fabs. Sources in TSMC tell the Japanese publication that the company is "very concerned" about the flight of talent toward China, although it didn't believe that there is any immediate danger to the company's output or technological edge. The source advocated a national-level strategy by various Asian governments to retain talent, not through coercion, but by offering better incentives and pay than the Chinese firms flush with public investment.

Last year, in November of 2019, a startup company called NUVIA Inc. broke out of the stealth mode and decided to reveal itself to the public. Focused on "re-imagining silicon", the company is led by some of the brightest minds in the semiconductor industry. Some people like Gerard Williams III, the CEO of the company, previously served as a chief CPU architect at Apple and has spent over 10 years at Arm before that. Others like Manu Gulati and John Bruno serve as senior vice presidents of silicon and system engineering respectively. Together, their people are forming a company full of well-known industry names. Of course, there are more and you should check out this page.

NUVIA Inc. promises to deliver only the best performance and "re-imagine silicon" as they say. Today, we got some bold claims from the company regarding the performance of their upcoming Phoenix SoC. Using Geekbench 5, the company has provided some simulated results of how the Phoenix SoC will perform. Being that it runs on Arm ISA, the SoC can run at very low power and achieve good performance. NUVIA has run some simulations and it expects its Phoenix SoC to be 40-50% faster in single-threaded performance than Zen 2/Sunny Cove at just a third of the power, 33% of the percent of power to be precise. In the graph below, NUVIA has placed its SoC only in 5 W range, however, the company said that they have left the upper curve to be disclosed at later date, meaning that the SoC will likely compete in high-performance markets and at higher power targets. While these claims are to be taken with a grain of salt, it is now a waiting game to see how NUVIA realizes its plans.

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

"Global demand for storage and memory in the data center is increasing as AI-powered business intelligence and data processing growth continues", said Youjong Kang, VP of Growth Strategy, SK hynix. "SiFive is well-positioned to grow with opportunities created from data center, enterprise, storage and networking requirements for workload-focused processor IP."

Vulnerabilities in Qualcomm's DSP (Digital Signal Processor) present in the company's Snapdragon SoCs may render more than a billion Android phones susceptible to hacking. According to research reported this week by security firm Check Point, they've found more than 400 vulnerabilities in Snapdragon's DSP, which may allow attackers to monitor locations, listen to nearby audio in real time, and exfiltrate locally-stored photos and videos - besides being able to render the phone completely unresponsive.

The vulnerabilities (CVE-2020-11201, CVE-2020-11202, CVE-2020-11206, CVE-2020-11207, CVE-2020-11208 and CVE-2020-11209) can be exploited simply via a video download or any other content that's rendered by the chip that passes through its DSP. Targets can also be attacked by installing malicious apps that require no permissions at all. Qualcomm has already tackled the issue by stating they have worked to validate the issue, and have already issued mitigations to OEMs, which should be made available via software updates in the future. In the meantime, the company has said they have no evidence any of these flaws is being currently exploited, and advise all Snapdragon platform users to only install apps via trusted locations such as the Play Store.