Vulnerabilities in Qualcomm's DSP (Digital Signal Processor) present in the company's Snapdragon SoCs may render more than a billion Android phones susceptible to hacking. According to research reported this week by security firm Check Point, they've found more than 400 vulnerabilities in Snapdragon's DSP, which may allow attackers to monitor locations, listen to nearby audio in real time, and exfiltrate locally-stored photos and videos - besides being able to render the phone completely unresponsive.

The vulnerabilities (CVE-2020-11201, CVE-2020-11202, CVE-2020-11206, CVE-2020-11207, CVE-2020-11208 and CVE-2020-11209) can be exploited simply via a video download or any other content that's rendered by the chip that passes through its DSP. Targets can also be attacked by installing malicious apps that require no permissions at all. Qualcomm has already tackled the issue by stating they have worked to validate the issue, and have already issued mitigations to OEMs, which should be made available via software updates in the future. In the meantime, the company has said they have no evidence any of these flaws is being currently exploited, and advise all Snapdragon platform users to only install apps via trusted locations such as the Play Store.

MediaTek today announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones. The Dimensity 720, is part of MediaTek's 5G chipset family that includes range of chipsets from Dimensity 1000 for flagship 5G smartphones to the Dimensity 800 and 700 series for more accessible 5G mid-tier devices.

"The Dimensity 720 sets a new standard, delivering feature-packed 5G experiences and technology to devices that are more accessible to mass market consumers," said Dr. Yenchi Lee, Deputy General Manager, Wireless Communications Business Unit, MediaTek. "This chip is highly power-efficient, has impressive performance and advanced display and imaging technologies. All of that combined will help brands usher in differentiated 5G devices for consumers around the globe."

AMD today announced the appointment of methodology architect Alex Starr to AMD Corporate Fellow. The appointment recognizes Starr for his outstanding technical leadership and contributions pioneering advanced emulation methodologies that have accelerated product validation processes, reduced time to market and improved the overall quality of AMD products.

"Alex played a significant role placing AMD at the forefront of hardware emulation and virtual platform technology," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "The strategies and methodologies developed under his leadership have been adopted across all of AMD and are a defining marker in our company's culture of innovation. As a result of Alex and the team's efforts, we have significantly reduced silicon bring-up time and silicon revisions, enabling AMD to consistently bring our leadership products to market faster."

Starr, an AMD veteran of nearly 15 years, is an esteemed leader in verification methodologies for CPU and GPU processors and complex SoCs. His deep industry experience and innovations have enabled AMD to continue executing on its technology roadmap and enhancing its competitive position within the industry.

In the next big step toward complete silicon independence, Apple is planning to dump AMD as a supplier of discrete GPUs in the near future, closely following its decision to dump Intel and the x86 machine architecture in favor of its own SoCs based on the Arm machine architecture. The company is developing its own line of discrete GPUs under the "Metal GPU Family," a name borrowed from its own Metal graphics API.

This explosive bit of information comes from a WWDC 2020 presentation slide posted by Longhorn (@never_released) on Twitter. The slide suggests that along with the processor, Apple is making a clean break with its graphics hardware. The SoCs powering client-segment Macs, such as future iMacs or MacBooks, could feature iGPUs based on this graphics architecture, while larger platforms such as MacBook Pros, Mac Pros, and iMac Pros of the future could feature Apple's own discrete GPUs.

The first homebrew processor for Macs by Apple could leverage Arm big.LITTLE technology, according to a slide from a developer-relations presentation leaked by Erdi Özüağ of Donanim Haber. Apple is referring to the setup as "asymmetric cores" in its documentation, although it essentially is big.LITTLE, a technology that's been implemented by Arm SoC vendors since 2012. It combines groups of low-power (high-efficiency) and high-performance (low-efficiency) cores in response to processing demands by software, with the high-performance cores only been engaged when needed. Intel only recently introduced its rendition of this tech, called Hybrid Processing, with its Core "Lakefield" processor, and looks to scale it up with future chips such as "Meteor Lake."

Besides a multi-core big.LITTLE CPU, the Apple SoC features dedicated AI acceleration hardware, including a neural engine and matrix-multiplication hardware (dubbed ML accelerators), a dedicated video hardware encoder and decoder, and memory controller that's optimized for UMA (unified memory) for the iGPU and system memory. Apple has already started shipping Mac Mini prototypes with an Arm-based processor to its ISVs along with a special version of MacOS "Big Sur" and a wealth of software development kit to help port their x86 Mac software over to the new machine architecture.

Performance benchmarks have started leaking for Intel-s upcoming Lakefield CPUs - low-power SoCs designed with Intel's latest technology. The Lakefield family of CPUs will make use of an Arm-similar big.LITTLE design, where this particular CPU, the Core i5-L16G7, will ship with four low-power "Tremond" cores and one large, high-performance "Sunny Cove" core for peak workloads. Built using Intel's Foveros stacking technology, these are the first chips to be built on Intel's modular platform, which should allow for pairing of I/O dies, chiplet-like CPU arrangements and memory in a 3D package. Physical distance reductions impact latency and power consumption, which should allow for an interesting design result.

Notebookcheck has tested an Intel Lakefield Core i5-L16G7 CPU that's being deployed on upcoming Samsung's Galaxy Book S, and the results are sort of a mixed bag. For one, Intel's Lakefield seems to be around 67% slower than the company's previous ultra-low-power architecture, Amber Lake. Something of this might have been caused by the fact that the Lakefield CPU didn't boost towards its advertised 3.0 GHz; it only managed to reach 2.4 GHz, which obviously hampered performance. Perhaps pre-release silicon is the culprit, or perhaps it's the galaxy Book S that's been configured with more restrictive thermal and power characteristics than the chip was actually designed to run at. The chip did manage to run the FireStrike test beating the Amber Lake-based Acer Swift 7 by 23%, though, so not all is looking bleak.

Microsoft is preparing to launch a competitive product to Google's Stadia and Amazon's Project Tempo, which are both game streaming services. To Microsoft's advantage, the company has experience in building gaming systems and using cloud technology to integrate them. While both Google and Amazon are cloud providers and have the infrastructure to implement game streaming services, Microsoft has its Xbox division, which has been in the gaming industry for a long time. Despite already owning the infrastructure, Microsoft wants to use the hardware from its Xbox consoles as a base of the upcoming game streaming service called Project xCloud.

According to sources of Tom Warren, senior editor at Verge, Microsoft will be re-using the Xbox SoCs found in their consoles. According to the source, in the beginning, Microsoft is going to use Xbox One S blades to power its game streaming service. After that, the company will upgrade its servers with more powerful Xbox Series X SoC. As a reminder, the Xbox Series X SoC has 8 Ryzen CPU cores based on "Zen 2" µarch, RDNA 2 GPU capable of delivering 12 TFLOPs, 16 GB of GDDR6 memory and a mighty fast SSD. This will be enough to satisfy game streaming service demands and power all of the AAA titles users will be playing once it is available.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today introduces the FX9830M SoC motherboard with a built-in AMD Bristol Ridge, 7th generation Quad Core processor. Highly Popular for their SoC motherboard range, BIOSTAR has yet again delivered a highly versatile motherboard catering to a variety of user requirements such as small business owners who are looking for a reliable and affordable solution that has the capability of running daily business operations with ease.

The BIOSTAR FX9830M SoC motherboard is arguably one of the best choices amongst its rivals, designed with a built-in Quad Core AMD FX-9830P processor and support for AMD Radeon R7 Graphics. It is undoubtedly a great investment to make when considering your next business workstation that can take advantage of the powerful multi-core platform and all its additional features.

Apple is planning to launch its own high-performance processors designed for Macs at the 2020 WWDC, held in the week of 22 June, 2020. This would be the the first step among many toward the replacement of Intel processors and the x86 machine architecture from the Apple Mac ecosystem, in the same fashion as the company replaced PowerPC with x86 last decade. Apple has codenamed the process of graduating to the new machine architecture "Kalamata," and besides detailing the new processor and its architecture, the company could announce a large-scale developer support initiative to help Mac software vendors to transition to the new architecture in time for the first Macs with the new processors to roll out in 2021.

A Bloomberg report on the new processors states that the chips will be based on the "same technology" as the company's A-series SoCs for iOS devices, meaning that Apple will leverage the Arm machine architecture, and has probably developed a high performance CPU core that can match Intel's x64 cores in IPC and efficiency. Macs based on the new processors, will however run MacOS and not iOS, which means much of the clean-break transition woes between PPC and x86 Macs are bound to return, but probably better managed by software vendors. It also remains to be seen how Apple handles graphics. The company could scale up the Metal-optimized iGPU found in its A-series SoCs on its new Mac processor, while also giving them the platform I/O capability to support discrete graphics from companies such as AMD.

Last year Samsung and AMD announced their collaboration which promises to deliver smartphone chips with AMD RDNA 2 graphics at its heart. This collaboration is set to deliver first products sometime at the beginning of 2021 when Samsung will likely utilize new SoCs in their smartphones. In previous leaks, we have found that the GPU inside this processor is reportedly beating the competition form Qualcomm, where the AMD GPU was compared to Adreno 650. However, today we have obtained more information about the new SoC which is reportedly called "Ryzen C7" smartphone SoC. A new submission to a mobile phone leaks website called Slash Leaks has revealed a lot of new details to us.

The SoC looks like a beast. Manufactured on TSMC 5 nm process, it features two Gaugin Pro cores based on recently announced Arm Cortex-X1, two Gaugin cores based on Arm Cortex-A78, and four cores based on Arm Cortex-A55. This configuration represents a standard big.LITTLE CPU typical for smartphones. Two of the Cortex-X1 cores run at 3 GHz, two of Cortex-A78 run at 2.6 GHz, while four little cores are clocked at 2 GHz frequency. The GPU inside this piece of silicon is what is amazing. It features four cores of custom RDNA 2 based designs that are clocked at 700 MHz. These are reported to beat the Adreno 650 by 45% in performance measurements.

MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek's latest multimedia, AI and imaging innovations.

"Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we're now making 5G much more accessible," said Dr. Yenchi Lee, Assistant General Manager of MediaTek's Wireless Communications Business Unit. "The Dimensity 820 stands out beyond competitors by offering four high-performance Arm Cortex-A76 cores at 2.60 GHz within its octa-core CPU, delivering superb performance and responsiveness, among its incredible AI, gaming and photography experiences."

Semiconductor Manufacturing International Corporation (SMIC), the state-backed Mainland Chinese semiconductor foundry, announced that it commenced mass-production of 14 nm FinFET SoCs for Huawei's HiSilicon subsidiary, a mere one month since Huawei shifting chip orders from TSMC to it. The company is manufacturing Kirin 710A is a revision of the original Kirin 710 SoC from 2018, built on SMIC's 14 nm node. The 4G-era SoC is capable of powering mid-range smartphones for Huawei's Honor brand, and uses an Arm big.LITTLE setup of Cortex A53 and Cortex A57 cores. This represents a major milestone not just for SMIC, but also Huawei, which has seen the company's isolation from cutting-edge overseas fabs such as TSMC. Much of Huawei's fate is riding on the success of SMIC's next-generation N+1 node, which purportedly offers a 57 percent energy-efficiency gain over 14 nm FinFET, rivaling sub-10 nm nodes such as 7 nm; enabling Huawei to build 5G-era SoCs.

GIGABYTE B550 AORUS Master is the company's most premium socket AM4 motherboard based on the upcoming AMD B550 chipset. We described this board in some detail in our older article covering an assortment of top B550 motherboards from manufacturers, but missed a key bit. At the time we assumed that the PCI-Express lane switches located below the board's main PCI-Express slot merely split its x16 connection from the AM4 SoC down to two x8 connections to share between two slots, given that AMD allows multi-GPU (including SLI) with the B550. Apparently, the lane switches are there for a different, more fascinating reason.

A BenchLife.info report points to the possibility of all three M.2 slots on this motherboard having PCI-Express gen 4.0 wiring - something that shouldn't normally be possible, since all downstream PCIe lanes put out by the B550 are gen 3.0. The way we see it, the topmost M.2 slot has a direct PCI-Express 4.0 x4 connection from the AM4 socket (as it normally should). The second- and third slots, however, pull their wiring from a series of lane switches that split the main x16 PEG slot to gen 4.0 x8/x4/x4. It's possible that one of the two x16 (electrical x4) slots has a further lane sharing arrangement with one of the two M.2 slots.

MediaTek today announced enhancements to its Dimensity 5G chipset family with the Dimensity 1000+, an enhanced 5G-integrated chip with a number of leading technologies and upgrades for gaming, video and power-efficiency.

Dimensity 1000+ is based on the flagship performance of the Dimensity 1000 series and delivers a high-end, premium user experience. With years of accumulated experience in integrated chip technologies, MediaTek has made breakthroughs and innovations in all aspects and has become a pioneer in the 5G era.

Both Sony and Microsoft are expected to soon launch their next-generation consoles, which are highly anticipated among console gamers as they will bring some of the latest advancements in graphics, like ray tracing. The current situation in the world is that everything is slowed down due to the COVID-19 outbreak. Companies across the world have mostly slowed down their production lines due to the less demand, however, AMD has done exactly the opposite for their custom SoC customers. In wake of expected high demand, AMD has ramped up its production lines so it can supply Sony and Microsoft for their next-generation consoles—PlayStation 5 and Xbox Series X. This is an encouraging sign that the demand is going to be strong - and that AMD is up to the task of delivering.

MediaTek has announced it will enable YouTube video streams using the cutting-edge AV1 video codec on the MediaTek Dimensity 1000 5G SoC. The MediaTek Dimensity 1000 is the world's first smartphone SoC to integrate an AV1 hardware video decoder, enabling it to play back AV1 video streams up to 4K resolution at 60 fps. With its improved compression efficiency, AV1 gives users incredible visual quality and smoother video experiences, while using less data.

Video streaming is the number one activity in smartphone use, so by using the Dimensity 1000's more power efficient hardware-based AV1 video decoder, users can enjoy longer battery life while still streaming at the best quality settings. Combined with its ultra-fast 5G connectivity in a single chip, the Dimensity 1000 leads the industry in design and capability.

According to the report of DigiTimes, which talked about TSMC's 5 nm silicon manufacturing node, they have reported that NVIDIA is also going to be a customer for it and they could use it in the near future. And that is very interesting information, knowing that these chips will not go in the next generation of GPUs. Why is that? Because we know that NVIDIA will utilize both TSMC and Samsung for their 7 nm manufacturing nodes for its next-generation Ampere GPUs that will end up in designs like GeForce RTX 3070 and RTX 3080 graphics cards. These designs are not what NVIDIA needs 5 nm for.

Being that NVIDIA already has a product in its pipeline that will satisfy the demand for the high-performance graphics market, maybe they are planning something that will end up being a surprise to everyone. No one knows what it is, however, the speculation (which you should take with a huge grain of salt) would be that NVIDIA is updating its Tegra SoC with the latest node. That Tegra SoC could be used in a range of mobile devices, like the Nintendo Switch, so could NVIDIA be preparing a new chip for Nintendo Switch 2?

In a recent report by Bloomberg it was revealed that Apple is planning to start selling Mac computers featuring their upcoming in-house A14 ARM chip which will power the next generation iPhone & iPad in 2021. According to sources familiar with the matter Apple is developing three new processors based on the A14 to power some 2021 Mac products, these chips will be manufactured on TSMCs 5 nm process. One of these new processors is expected to be more powerful then the iPhone version.

This marks a significant move for Apple as they shift from x86 to in-house ARM designs across their entire product lineup, we have an editorial on the rise of ARM here. This development is part of Apple's plan to increase control over their products in an attempt to fully unify the Apple ecosystem and reduce reliance on Intel who has struggled to offer significant performance increases in recent years, this will come as a major blow to Intel who benefited greatly from Apple's demand. Apple will need to adapt MacOS for an ARM based design and ensure their is compatibility for third party x86 applications. The first processor is expected to feature 8 "Firestorm" cores and at least four energy-efficient "Icestorm" cores, Apple is also exploring options for up to 12 core processors based on the same design for use in future Macs.

Intel Corporation today reported first-quarter 2020 financial results. "Our first-quarter performance is a testament to our team's focus on safeguarding employees, supporting our supply chain partners and delivering for our customers during this unprecedented challenge," said Bob Swan, Intel CEO."The role technology plays in the world is more essential now than it has ever been, and our opportunity to enrich lives and enable our customers' success has never been more vital. Guided by our cultural values, competitive advantages and financial strength, I am confident we will emerge from this situation an even stronger company."

In the first quarter, Intel achieved 34 percent data-centric revenue growth and 14 percent PC-centric revenue growth YoY. The company maintained essential factory operations with greater than 90 percent on-time delivery while supporting employees, customers and communities in response to the COVID-19 pandemic. This includes a new Intel Pandemic Response Technology Initiative to combat the virus where we can uniquely make a difference with Intel technology, expertise, and resources.

With an introduction of new iPad Pro tablets, Apple has brought another new silicon to its offerings in the form of A12Z SoC. Following the previous king in tablet space, the A12X SoC, Apple has decided to update its silicon and now there is another, more advanced stepping in form of an A12Z SoC. Thanks to the report from TechInsights, their analysis has shown that the new SoC used in Apple's devices is pretty much the same compared to the A12X SoC of last year, except the GPU used. Namely, the configuration of A12X is translated into the A12Z - there are four Apple Vortex and four Apple Tempest cores for the CPU. There is a 128-bit memory bus designed for LPDDR4X memory, the same as the A12X.

What is different, however, is the GPU cluster configuration. In A12X there was a cluster filled with 7 working and one disabled A12-gen GPU core. In A12Z SoC all of the 8 GPUs present are enabled and working, and they are also of the same A12 generation. The new SoC is even built using the same N7 7 nm manufacturing process from TSMC. While we don't know the silicon stepping revision of the A12Z, there aren't any new features besides the additional GPU core.

Huawei's subsidiary, HiSilicon, which designs the processors used in Huawei's smartphones and telecommunications equipment, has reportedly moved its silicon orders from Taiwan Semiconductor Manufacturing Company (TSMC) to Semiconductor Manufacturing International Corporation (SMIC), according to DigiTimes. Why Huawei decided to do is move all of the 14 nm orders from Taiwanese foundry to China's largest silicon manufacturing fab, is to give itself peace of mind if the plan of the US Government goes through to stop TSMC from supplying Huawei. At least for the mid-tier chips built using 14 nm node, Huawei would gain some peace as a Chinese fab is a safer choice given the current political situation.

When it comes to the high-end SoCs built on 7 nm, and 5 nm in the future, it is is still uncertain how will Huawei behave in this situation, meaning that if US cuts off TSMC's supply to Huawei, they will be forced to use SMIC's 7 nm-class N+1 node instead of anything from TSMC. Another option would be Samsung, but it is a question will Huawei put itself in risk to be dependant on another foreign company. The lack of 14 nm orders from Huawei will not be reflecting much on TSMC, because whenever someone decides to cut orders, another company takes up the manufacturing capactiy. For example, when Huawei cut its 5 nm orders, Apple absorbed by ordering more capacity. When Huawei also cut 7 nm orders, AMD and other big customers decided to order more, making the situation feel like there is a real fight for TSMC's capacity.

Google is planning to take the Apple route in designing its own SoCs for its hardware. The company kicked off "Project Whitechapel," an initiative with technical assistance from Samsung (and possibly silicon-fabrication), to design Arm-based SoCs with specialized hardware to power Google's machine-learning tech. The first such chip will be 8-core Arm SoCs powering next-generation Pixel premium smartphones, but in the future, Google could use Arm-based SoCs to power Chromebooks.

Google has, in the past, collaborated with Intel and Qualcomm to put specialized hardware on smartphone SoCs, although the resulting chips would still be supplied by the two. "Project Whitechapel" would see Google play a dominant role in the SoC's design, with Samsung only providing technical inputs. It wouldn't be far-fetched to predict Google using lightweight variants of the SoC on its own IoT hardware, such as Chromecast and Home smart-speakers.

The unprecedented demand for ventilators in the wake of the COVID-19 pandemic, has pushed many firms from various industries to re-tool their production-lines to make them. A big chunk of these makeshift ventilator manufacturers are from the automobile and aerospace industries. A ventilator isn't as simple a device as it sounds. It's not a mechanized ambu bag. It is an intelligent device that assists in respiration by precisely combining oxygen and ambient air specific to the patient's needs, and assists them in expiration. This requires a microprocessor-based control. Established biomedical equipment manufacturers use their own ASIC-based electronics for their ventilators; but the likes of General Motors don't have time to develop custom electronics. Enter the immensely versatile Raspberry Pi.

By leveraging Arm-based SBCs (single-board computers) such as Raspberry Pi, with its plethora of modern- and legacy I/O options, makeshift ventilator manufacturers are able to quickly design functional devices. All they have to do is write code for it. Even the cheapest $5 Pi Zero board with its GPIO interface suffices to run embedded Linux and code that runs the ventilator's hardware. Eben Upton, CEO and Founder of Raspberry Pi, says that demand for the Pi Zero is at an all-time high. The company manufactured over 192,000 units of the SBC in Q1-2020, and plans to scale up production to 250,000 per quarter, going forward. The Pi Zero features a Broadcom BCM2835 single-core Arm SoC and 512 MB of RAM, with a microSD slot for storage. That's plenty of brains to run a ventilator and save lives.

Today BIOSTAR announced the A10N-9830E SoC motherboard a small form factor board with a built in Quad Core FX-9830P AMD Bristol Ridge processor and integrated AMD Radeon R7 graphics. This board could be a good fit for a HTPC or light office build, featuring a M.2 slot, support for 32 Gb ram and USB 3.2 Gen1.

Small in its form yet amazing performance output, the BIOSTAR A10N-9830E SoC motherboard is easily one of the best SoC motherboards in the market. Ideal for gamers and casual home users, the A10N-9830E has a built-in Quad Core FX-9830P AMD Bristol Ridge processor and integrated AMD Radeon R7 graphics that offers strong performance, power efficiency and graphics to make the ideal light gaming PC in a compact and lightweight Mini-ITX form factor.

Intel's x86 processor architecture has been the dominant CPU instruction set for many decades, since IBM decided to put the Intel 8086 microprocessor into its first Personal Computer. Later, in 2006, Apple decided to replace their PowerPC based processors in Macintosh computers with Intel chips, too. This was the time when x86 became the only option for the masses to use and develop all their software on. While mobile phones and embedded devices are mostly Arm today, it is clear that x86 is still the dominant ISA (Instruction Set Architecture) for desktop computers today, with both Intel and AMD producing processors for it. Those processors are going inside millions of PCs that are used every day. Today I would like to share my thoughts on the demise of the x86 platform and how it might vanish in favor of the RISC-based Arm architecture.

Both AMD and Intel as producer, and millions of companies as consumer, have invested heavily in the x86 architecture, so why would x86 ever go extinct if "it just works"? The answer is that it doesn't just work.