ZOTAC's website has been updated with technical specifications for its GeForce RTX 5090 GPU-based custom models—the Hong Kong-based hardware company is perhaps the first NVIDIA board partner to publicly disclose these details. According to VideoCardz, this discovery was made by a loyal reader—product pages for SOLID, SOLID OC and AMP Extreme INFINITY seemed to have appeared online within the past couple of days. A resultant report suggests that Team Green has only recently communicated (potentially) finalized specs with its AIBs.

The aforementioned discoverer of ZOTAC's GeForce RTX 5090 spec sheets noticed an unusual memory clock figure on the SOLID OC model's listing—30 Gbps instead of 28 Gbps. This was an error—ZOTAC has since amended that particular data point (see VideoCardz's screenshots below)—their presumably more expensive AMP Extreme INFINITY card's memory clock spec is set at 28 Gbps. Interestingly, ZOTAC's upcoming flagship is the first example of an NVIDIA GPU configured with a power consumption rating of 600 W. It is not immediately apparent whether this TDP figure is an out-of-the-box default—VideoCardz reckons that the GeForce RTX 5090 AMP Extreme INFINITY will arrive with dual-BIOS functionality. A high-performance mode could be user selected. Will rival flagship GeForce RTX 5090 custom cards roll out with similar TDPs? TechPowerUp anticipates the emergence of pre-launch technical details—from other brands/manufacturers—over the next two weeks.

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

According to two of the most accurate leakers, kopite7kimi and hongxing2020, NVIDIA's GeForce RTX 5090 and RTX 5080 will feature 575 W and 360 W TDP, respectively. Previously, rumors have pointed out that these GPU SKUs carry 600 W and 400 W TGPs, which translates into total graphics power, meaning that an entire GPU with its RAM and everything else draws a certain amount of power. However, TDP (thermal design power) is a more specific value attributed to the GPU die or the specific SKU in question. According to the latest leaks, 575 Watts are dedicated to the GB202-300-A1 GPU die in the GeForce RTX 5090, while 25 Watts are for GDDR7 memory and other components on the PCB.

For the RTX 5080, the GB203-400-A1 chip is supposedly drawing 360 Watts of power alone, while 40 Watts are set aside for GDDR7 memory and other components in the PC. The lower-end RTX 5080 uses more power than the RTX 5090 because its GDDR7 memory modules reportedly run at 30 Gbps, while the RTX 5090 uses GDDR7 memory modules with 28 Gbps speeds. Indeed, the RTX 5090 uses more modules or higher capacity modules, but the first-generation GDDR7 memory could require more power to reach the 30 Gbps threshold. Hence, more power is set aside for that. In future GDDR7 iterations, more speed could be easily achieved without much more power.

"Twin Lake" is codename for a line of low-power x86-64 processors by Intel, which succeed the Core i3 N-series and N200 series "Alder Lake-N" processors. These non-socketed (BGA) chips power a wide range of devices from entry level notebooks and mini PCs to consumer NAS servers, and other embedded applications. The chips feature only E-cores. While "Alder Lake-N" used "Gracemont" cores, "Twin Lake" uses the swanky new "Skymont" cores, which serve as E-cores in "Lunar Lake" and "Arrow Lake" hybrid processors. "Skymont" cores feature massive IPC and clock-speed gains over "Gracemont," of nearly 50%, which pulls up their performance levels to match the "Golden Cove" and "Raptor Cove" P-cores of "Alder Lake" and "Raptor Lake," although these cores can't boost up to 5.00 GHz. We got the first name-drop of "Twin Lake" way back in May 2024. Jaykihn leaked what the processor lineup could look like.

The "Twin Lake" silicon features two "Skymont" E-core clusters sharing an L3 cache. At this point, the sizes of the shared L2 caches of the E-core clusters, and the size of the shared L3 cache are not known. On "Alder Lake-N," each "Gracemont" cluster features 2 MB of L2 cache, and the two clusters share a 6 MB L3 cache. The silicon also features an iGPU based on what is very likely the Xe-LPG graphics architecture, with four Xe cores worth 32 execution units (EU). The series is led by the Intel N355. This chip maxes out the "Twin Lake" silicon, enabling both "Skymont" clusters, for an 8-core/8-thread CPU configuration. The CPU comes with a base frequency of 3.00 GHz, and boosts up to 3.90 GHz. The chip comes with a configurable TDP of 9 W and 15 W. It comes with a maxed out iGPU, with all 32 EU being enabled, and a graphics frequency of 1.35 GHz.

Fresh details have surfaced about NVIDIA's upcoming flagship "Blackwell" graphics card, the GeForce RTX 5090, suggesting power delivery and board design changes compared to its predecessors. According to Benchlife, the new Blackwell-based GPU will feature a new 16+6+7 power stage design, departing from the RTX 4090's 20+3 phase configuration. The report confirms earlier speculation about the card's power requirements, indicating a TGP of 600 watts. This specification refers to the complete power allocation for the graphics subsystem, though the actual TDP of the GB202 chip might be lower. The RTX 5090 will ship with 32 GB of next-generation GDDR7 memory and utilize a 14-layer PCB, possibly due to the increased complexity of GDDR7 memory modules and power delivery. Usually, GPUs max out at 12 layers for high-end overclocking designs.

The upcoming GPU will fully embrace modern connectivity standards, featuring PCI Express 5.0 x16 interface compatibility and implementing a 12V-2×6 power connector design. We spotted an early PNY RTX 5090 model with 40 capacitors but an unclear power delivery setup. With additional power phases and more PCB layers, NVIDIA is pushing the power delivery and signal integrity boundaries for its next-generation flagship. While these specifications paint a picture of a powerful gaming and professional graphics solution, questions remain about the broader RTX 50 series lineup. The implementation of the 12V-2×6 connector across different models, particularly those below 200 W, remains unclear, so we have to wait for the CES-rumored launch.

Ventiva, the leader in thermal solutions, today announced its ICE9 thermal management suite can now cool laptops that operate at up to 40 watts TDP (Thermal Design Power), enabling thinner, faster, and utterly silent computing devices—without the compromises of traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next-generation of feature-rich, AI-enabled, high-performance laptops.

The ICE9 thermal management suite is based on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration.

It's an open secret by now that NVIDIA's GeForce RTX 5000 series GPUs are on the way, with an early 2025 launch on the cards. Now, preliminary details about the RTX 5070 Ti have leaked, revealing an increase in both VRAM and TDP and suggesting that the new upper mid-range GPU will finally address the increased VRAM demand from modern games. According to the leak from Wccftech, the RTX 5070 Ti will have 16 GB of GDDR7 VRAM, up from 12 GB on the RTX 4070 Ti, as we previously speculated. Also confirming previous leaks, the new sources confirm that the 5070 Ti will use the cut-down GB203 chip, although the new leak points to a significantly higher TBP of 350 W. The new memory configuration will supposedly run on a 256-bit memory bus and run at 28 Gbps for a total memory bandwidth of 896 GB/s, which is a significant boost over the RTX 4070 Ti.

Supposedly, the RTX 5070 Ti will also see a bump in total CUDA cores, from 7680 in the RTX 4070 Ti to 8960 in the RTX 5070 Ti. The new RTX 5070 Ti will also switch to the 12V-2x6 power connector, compared to the 16-pin connector from the 4070 Ti. NVIDIA is expected to announce the RTX 5000 series graphics cards at CES 2025 in early January, but the RTX 5070 Ti will supposedly be the third card in the 5000-series launch cycle. That said, leaks suggest that the 5070 Ti will still launch in Q1 2025, meaning we may see an indication of specs at CES 2025, although pricing is still unclear.

Update Dec 16th: Kopite7kimi, ubiquitous hardware leaker, has since responded to the RTX 5070 Ti leaks, stating that 350 W may be on the higher end for the RTX 5070 Ti: "...the latest data shows 285W. However, 350W is also one of the configs." This could mean that a TBP of 350 W is possible, although maybe only on certain graphics card models, if competition is strong, or in certain boost scenarios.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

A few days ago, we reported on AMD's newest expansion plans for Serbia. The company opened two new engineering design centers with offices in Belgrade and Nis. We were invited to join the opening ceremony and got an exclusive interview with one of AMD's top executives, Andrej Zdravkovic, who is the senior vice president and Chief Software Officer. Previously, we reported on AMD's transition to become a software company. The company has recently tripled its software engineering workforce and is moving some of its best people to support these teams. AMD's plan is spread over a three to five-year timeframe to improve its software ecosystem, accelerating hardware development to launch new products more frequently and to react to changes in software demand. AMD found that to help these expansion efforts, opening new design centers in Serbia would be very advantageous.

We sat down with Andrej Zdravkovic to discuss the purpose of AMD's establishment in Serbia and the future of some products. Zdravkovic is actually an engineer from Serbia, where he completed his Bachelor's and Master's degrees in electrical engineering from Belgrade University. In 1998, Zdravkovic joined ATI and quickly rose through the ranks, eventually becoming a senior director. During his decade-long tenure, Zdravkovic witnessed a significant industry shift as AMD acquired ATI in 2006. After a brief stint at another company, Zdravkovic returned to AMD in 2015, bringing with him a wealth of experience and a unique perspective on the evolution of the graphics and computing industry.Here is the full interview:

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

Details have emerged about Intel's upcoming "Panther Lake" processors, set to be the third generation of Core Ultra mobile chips. Called the Core Ultra 300 series, these CPUs are expected to succeed "Lunar Lake". According to recent leaks, Panther Lake-H will be manufactured using Intel's cutting-edge 18A process node. The chips are said to feature a combination of Cougar Cove P-Cores, Skymont E-Cores, and Xe3 (Celestial) integrated graphics. This architecture builds upon Intel's hybrid core design, refining it for even better performance on mobile devices. The leaked information suggests a range of configurations for Panther Lake-H, the high-perfomance variant of the lineup. These include models with varying core counts and power envelopes, from efficient 25 W parts to more interesting 45 W options. Notably, some SKUs reportedly feature up to 18 cores in total, combining P-cores, E-cores, and LP E-cores in a five-tile package. This is an increase from previously believed 16 cores.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

In the age of AI, computing power has become a vital component for driving innovation. For most industries, using professional-grade workstations as the computing engine enables efficient computing and infinite creativity. A workstation is a multi-purpose computer that supports high-performance computing in a distributed network setting. It excels at graphics processing and task parallelism, making it suitable for a wide range of AI applications as well as common visual design tasks.

For example, the workstation can fully meet the requirements for multi-task processing, such as 3D modeling, large-scale industrial drawing, advertising rendering output, non-linear video editing, file rendering production and acceleration, and so on. The computer can also perform effectively in a wide range of model loadings and professional software, as well as remote system maintenance and monitoring in unsupervised settings, which has the potential to revolutionize the application domain.

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

Chinese tech company GMKtec is preparing to unveil a new Mini-PC powered by an AMD Ryzen processor, featuring an enhanced cooling system. The company's product lineup already includes a variety of AMD and Intel-based compact computers, with their K-series representing their most powerful offerings. Now, GMKtec teased a new addition to their lineup on Weibo, China's popular social media platform. The upcoming model will support a 70 W TDP and is likely to feature the Ryzen 9 8945HS processor, based on the "R9" mentioned in the post title. This distinction is important as the next-generation processors (Strix Point) use "Ryzen AI 9" branding.

A standout feature of this upcoming model is its vapor chamber cooling system, which is uncommon in the Mini-PC market. However, GMKtec hasn't mentioned the use of a secondary fan or other cooling features, which some competitors employ. The new Mini-PC will include an OCuLink connector for external device compatibility, including graphics cards. Other features include dual 2.5GbE networking, USB ports, HDMI 2.1 and DisplayPort 2.0 outputs. While full specifications are yet to be disclosed, more details are expected to be revealed in the near future. GMKtec has not announced a specific release date or price for this new Mini-PC.

AMD's Ryzen 9000 "Granite Ridge" family of Socket AM5 desktop processors based on the "Zen 5" microarchitecture arrive in July, with four processor models in the lead—the 9950X 16-core, the 9900X 12-core, the 9700X 8-core, and the 9600X 6-core. AMD is building the CCDs (CPU core dies) of these processors on the slightly newer 4 nm foundry node, compared to the 5 nm node that the Ryzen 7000 series "Raphael" processors based on "Zen 4" are built on; and generally lowered the TDP values of all but the top 16-core part. The company is reportedly reconsidering these changes, particularly in wake of company statements that the 9000X series may not beat the 7000X3D series in gaming performance, which may have sullied the launch, particularly for gamers.

From the company's Computex 2024 announcement of the Ryzen 9000 series, the 9950X has the same 170 W TDP as its predecessor, the 7950X. The 9900X 12-core part, however, comes with a lower 120 W TDP compared to the 170 W of the 7900X. Things get interesting with the 8-core and 6-core parts. Both the 9700X 8-core, and the 9600X 6-core chips come with 65 W TDP. The 9700X succeeds the 7700X, which came with a 105 W TDP, while the 9600X succeeds the 7600X that enjoys the same 105 W TDP. The TDP and package power tracing (PPT) values of an AMD processor are known to affect CPU boost frequency residence, particularly in some of the higher core-count SKUs. Wccftech reports that AMD is planning to revise the specifications of at least the Ryzen 7 9700X.

At Computex 2024, FSP had a powerful presence with the unveiling of its new VITA, ADVAN, and MEGA series PSUs. The VITA 850 W and 1000 W series targets budget-conscious builds, offering efficiency ratings from bronze to gold. These PSUs feature premium bulk capacitors, ensuring reliability and longevity, and some models include silent fans for quiet operation without sacrificing cooling performance. The ADVAN series is tailored for gamers and professionals who seek a balance of performance and affordability. Available in Bronze, Gold, and Platinum efficiency ratings, these PSUs cater to mainstream gaming rigs and workstations. Notable features include a semi-fanless design for quiet operation at low loads, sleek black cables for efficient cable management, and multiple voltage protection safeguards.

AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena. The latest AMD Siena CPU is produced with 5 nm manufacturing technology to have up to 64 cores (extreme density of 2CCX/CCD) and 225 W TDP with lower energy consumption compared to EPYC SP5. Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.

SCB-1945 (1U) and SCB-1947A (2U) are two performant Network Appliances supporting 12x DDR5 sockets and 4x/8x PCIe Gen 5 slots for AEWIN self-design NICs with 1G to 100G copper/fiber interfaces (with/without bypass function) or other accelerators and NVMe SSDs. Both models provide the flexibility to change 2x front panel PCIe slots to 1x PCIe x16 slot for installing off-the-shelf add-on card for additional functions required. It can support 400G NIC card installed such as NVIDIA Mellanox PCIe 5.0 NIC.

CaseKing.de has started to sell a gigantic Lamptron ST060 dual-tower CPU air cooler for €299.90 (~$325) with VAT added. Many PC hardware news sites have predicted that this sizable—153 × 152 × 120 mm (W x H x D)—cooling solution is worthy of taking on similarly proportioned competition. CaseKing's listing includes some hype material: "(the ST060) offers extremely high cooling performance thanks to its six heat pipes and two PWM RGB fans. With a 260 W TDP, the cooler is also very quiet and has immense cooling reserves for overclocked CPUs and, despite its size, can be installed even with the mainboard installed." The integrated 6-inch 1920x1080 screen is the ST060's other selling point—DeepCool's (recently TPU reviewed) AK620 dual-tower cooler sports a large-ish top-mounted mini monitor, although its functionality is quite limited. Lamptron states that their new model is prepped for full AIDA64 integration; a license for this software suite is bundled in.

The integrated screen requires connection to USB Type-A and HDMI ports—perhaps a major annoyance—fortunately mini USB to USB and HDMI cables are included in the box. Additionally, software and digital instructions are uploaded onto a bundled USB-A flash drive. The base Lamptron ST060 model is joined by ARGB equipped alternatives—CaseKing has a product page for a black fan version (LAMP-ST060AB, also priced at €299.90), but it is not available to purchase yet. Tom's Hardware believes that a white fan model (LAMP-ST060AW) is also incoming—they documented some basic aesthetic differences: "In addition to the fans being different, the ARGB versions have a silver heatsink as opposed to the black heatsink on the regular version." Lamptron's ST060 air cooler appears to be an Intel socket-centric product, with support for LGA1366, LGA1200, LGA115x, LGA1700, and LGA2011. Team Red enthusiasts will be disappointed about compatibility being limited to AM4. Overclocking.com expressed surprise regarding Lamptron's re-emergence with new products—many assumed that the company was in a dormant state for a long time.

Intel's upcoming high-end desktop (HEDT) processor lineup for enthusiasts and prosumers is around the corner, and today, we managed to see the flagship SKU - the Xeon W9-3595X. Spotted recently on Geekbench benchmarks, this new chip packs a whopping 60 cores and 120 threads, making it Intel's highest core count HEDT offering yet. The Xeon W9-3595X is based on Intel's advanced Sapphire Rapids architecture, built using the Intel 7 process node. It succeeds the previous flagship 56-core W9-3495X, with four additional cores crammed into the new 350 Watt TDP envelope. Clock speeds have taken a slight hit to accommodate the extra cores, with the maximum turbo frequency lowered from 4.8 GHz on the 3495X to 4.6 GHz on the new 3595X.

However, with more cores, the 3595X should still offer a significant multi-threaded performance uplift for heavily parallel workloads. The Xeon W9-3595X will drop into existing LGA-4677 motherboards, like the ASUS PRO WS 790-ACE, after a BIOS update. It features 112 MB of L3 cache, 120 MB of L2 cache (2 MB per core), and continues Intel's push towards higher core counts for enthusiasts, content creators, and workstation users who need maximum multi-threaded horsepower. Pricing and availability details remain unannounced as of now. But with an appearance on public databases, an official launch of the 60-core HEDT juggernaut seems imminent. These new Sapphire Rapids SKUs will likely have extra AI features, like dedicated AI acceleration engines, in the same manner that server-class SKUs do.

Alleged full specifications leaked for NVIDIA's upcoming GeForce RTX 3050 6 GB graphics card show extensive reductions beyond merely reducing memory size versus the 8 GB model. If accurate, performance could lag the existing RTX 3050 8 GB SKU by up to 25%, making it weaker competition even for AMD's budget RX 6500 XT. Previous rumors suggested only capacity and bandwidth differences on a partially disabled memory bus between 3050 variants, which would reduce the memory to 6 GB and 96-bit bus, from 8 GB and 128-bit bus.. But leaked specs indicate CUDA core counts, clock speeds, and TDP all see cuts for the upcoming 6 GB version. With 18 SMs and 2304 cores rather than 20 SMs and 2560 cores at lower base and boost frequencies, the impact looks more severe than expected. A 70 W TDP does allow passive cooling but hurts performance versus the 3050 8 GB's 130 W design.

Some napkin math suggests the 3050 6 GB could deliver only 75% of its elder sibling's frame rates, putting it more in line with the entry-level 6500 XT. While having 50% more VRAM helps, dramatic core and clock downgrades counteract that memory advantage. According to rumors, the RTX 3050 6 GB is set to launch in February, bringing lower-end Ampere to even more budget-focused builders. But with specifications seemingly hobbled beyond just capacity, its real-world gaming value remains to be determined. NVIDIA likely intends RTX 3060 6 GB primarily for less demanding esports titles. Given the scale of cutbacks and the modern AAA title's recommended specifications, mainstream AAA gaming performance seems improbable.