Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, has announced first-to-market industry leading performance on several MLPerf Inference v5.0 benchmarks, using the 8-GPU. The 4U liquid-cooled and 10U air-cooled systems achieved the best performance in select benchmarks. Supermicro demonstrated more than 3 times the tokens per second (Token/s) generation for Llama2-70B and Llama3.1-405B benchmarks compared to H200 8-GPU systems. "Supermicro remains a leader in the AI industry, as evidenced by the first new benchmarks released by MLCommons in 2025," said Charles Liang, president and CEO of Supermicro. "Our building block architecture enables us to be first-to-market with a diverse range of systems optimized for various workloads. We continue to collaborate closely with NVIDIA to fine-tune our systems and secure a leadership position in AI workloads." Learn more about the new MLPerf v5.0 Inference benchmarks here.

Supermicro is the only system vendor publishing record MLPerf inference performance (on select benchmarks) for both the air-cooled and liquid-cooled NVIDIA HGX B200 8-GPU systems. Both air-cooled and liquid-cooled systems were operational before the MLCommons benchmark start date. Supermicro engineers optimized the systems and software to showcase the impressive performance. Within the operating margin, the Supermicro air-cooled B200 system exhibited the same level of performance as the liquid-cooled B200 system. Supermicro has been delivering these systems to customers while we conducted the benchmarks. MLCommons emphasizes that all results be reproducible, that the products are available and that the results can be audited by other MLCommons members. Supermicro engineers optimized the systems and software, as allowed by the MLCommons rules.

According to ComputerBase, NVIDIA now requires laptop makers to clearly share full graphics power details for its upcoming GeForce RTX 50 Series "Blackwell" GPUs. This aims to fix long-standing issues with hidden performance limits that have led to unexpected differences between laptops with the same GPU model. In the past, many laptop makers did not provide complete information about total graphics power (TGP). This often meant that some lower-powered models performed better than higher-end ones because the power limits were unclear. Under the new guidelines, manufacturers must list important details such as base TGP, Dynamic Boost limits, and clock speeds on their product pages. NVIDIA said, "We work with laptop manufacturers to ensure they list graphics power on their product websites."

Companies like ASUS, MSI, and XMG have already started to show full specifications for models such as the ROG Scar 18 and Titan 18 HX. While most companies are following the rules, some remain unchanged. For example, Razer's Blade 16 (2025) initially left out the base TGP from its main specifications, hiding it in the product description. This can confuse buyers, as thinner laptop designs might use lower-powered GPUs even in high-end models. The fix for this issue is simple, and listing TGP and TDP values will ensure that gamers who plan on getting a laptop with a new RTX 50 series Blackwell GPU will choose their desired TDP for performance and power on the go aspects.

The AMD Ryzen 5 9600 launched recently as a slightly more affordable variant of the popular Ryzen 5 9600X. Despite launching over a month ago, the 9600 still appears rather difficult to track down in retail stores. However, a recent PassMark benchmark has provided some insights as to the performance of the non-X variant of AMD's six-core Zen 5 budget CPU. Unsurprisingly, the Ryzen 5 9600X and the Ryzen 5 9600 are neck-and-neck, with the 9600X scraping past its non-X counterpart by a mere 2.2% in the CPU benchmark.

According to the PassMark result, the Ryzen 5 9600 scored 29,369, compared to the Ryzen 5 9600X's 30,016, while single-core scores were 4581 for the 9600X and 4433 points for the 9600, representing a 3.2% disparity between the two CPUs. The result is not surprising, since the only real difference between the 9600 and the 9600X is 200 MHz boost clock. All other specifications, including TDP, core count, cache amount and base clock speed, are identical. Both CPUs are also unlocked for overclocking, and both feature AMD Precision Boost 2. While the Ryzen 5 9600 isn't available just yet, it will seemingly be a good option for those who want to stretch their budget to the absolute maximum, since recent reports indicate that it will be around $20 cheaper than the Ryzen 5 9600X, coming in at around the $250-260 mark.

Back in February, we reported on Intel considering a resurrection of the "Arrow Lake Refresh" Core Ultra 300 series of CPUs. However, it seems that @Jaykihn, a reliable source of Intel leaks, has confirmed that Intel will indeed push the refresh of Arrow Lake in the form of Core Ultra 300 series of CPUs, limited to K and KF SKUs only. This means we will likely see only overclockable SKUs being refreshed, with possibly enhanced boost frequency and/or core count. With 125 W TDP, these new SKUs would target high-end markets, passionate overclockers, and system integrators selling high-end builds with these CPUs. The refresh's journey to confirmation has been turbulent. Initial rumors in 2023 suggested an ambitious core-count bump for Arrow Lake-S, followed by speculation that Intel would prioritize NPU upgrades, potentially mirroring Lunar Lake's reported 48 TOPS capability—a massive leap from the current Core Ultra 9 285 K's 13 TOPS. By late 2023, leaks hinted at the project's cancellation, but insiders like Chinese leaker Golden Pig Upgrade later revived hopes, asserting that desktop-focused "ARL-S Refresh" had been quietly resurrected.

Jaykihn's latest intel narrows the scope: only K/KF-series chips will receive tweaks, leaving non-overclockable SKUs untouched. Intel is also reportedly developing new performance profiles for existing Arrow Lake CPUs, separate from warranty-voiding BIOS tweaks. These optimizations, alongside the upcoming Intel Performance Optimization (IPO) program, aim to help OEMs and system integrators push pre-built systems further via safer, stability-focused adjustments to clock speeds, power limits, and memory overclocking. While enthusiasts may still prefer manual overclocking, IPO could democratize performance gains for mainstream users. The Core Ultra 300 series will slot into Intel's LGA-1851 roadmap between the base Arrow Lake-S (Core Ultra 200) and 2026's next-gen Nova Lake-S (Core Ultra 400).

A ramped up flow of early-to-mid March period leaks—regarding upcoming NVIDIA GeForce RTX 5060 Ti and RTX 5060 graphics cards—suggested an official pre-GTC 2025 unveiling of lower-end Blackwell gaming GPUs. Speculative specifications appeared online earlier in the month, but some key technical talking points seemed to be missing. As reported yesterday, insiders believe that Team Green has adjusted its new product release schedule. Leaked roadmaps have outlined GeForce RTX 5060 Ti cards arriving by mid-April 2025, with less potent RTX 5060 models launching around the middle of May. Despite the alleged delay, VideoCardz has continued its investigation into pre-launch conditions. Their latest report points to full GeForce RTX 5060 Ti specifications being distributed to board partners, at least in the recent past.

Leaked details seemingly reconfirm the existence of 16 GB and 8 GB variants (on a 128-bit memory bus); both utilizing the same GB206-300-A1 GPU with 4608 CUDA cores. VideoCardz disclosed a couple of finer (new) details:"based on the specs we have, both models will ship with 28 Gbps memory. This means that the bandwidth is 448 GB/s, which is 55% higher than the last-gen model. Moving on to GPU clocks, NVIDIA has set a 2407 MHz base clock and a 2572 MHz boost clock for this GB206-based model. This means that the base clock is 97 MHz and the boost is 37 MHz higher than the RTX 4060 Ti." The fresh leak suggest that a few of Team Green's AIBs will be configuring their custom designs with 8-pin power connectors; sufficient for a reported 180 W TDP-rated product. VideoCardz anticipates that the vast majority of GeForce RTX 5060 Ti models will utilize 16-pin connectors. Unfortunately, finalized price guides were not discovered during recent sleuthing sessions.

In an exclusive report, Windows Central has claimed that Microsoft is collaborating with an unnamed "PC gaming OEM" on an Xbox handheld console. Jez Corden has heard from several insiders; they reckon that a "later in 2025" launch is possible, if development goes smoothly enough. A leak from Winter 2024 indicated that Microsoft's gaming division was "targeting a handheld gaming experience," but Phil Spencer has freely disclosed his ambitions for his team's portable project. Last November, he confirmed that something was in pipeline—with a view to take on very visible competition: Steam Deck, ASUS ROG Ally and Lenovo Legion Go. The latest Windows Central investigative piece divulges some unprecedented details about: "codename 'Keenan,' this gaming handheld will look unmistakably 'Xbox' we're told, complete with an official Xbox guide button, and Xbox design sensibilities. Given that this is a partner device, similar to Lenovo's SteamOS partnership with Valve, I expect this handheld to be more PC-oriented. Keenan is almost definitely running full Windows, putting the Microsoft Store and PC Game Pass front and center, alongside the ability to install things like Steam."

Based on inside track knowledge, Corden anticipates operating system innovations: "I expect the handheld will test new Windows 11 'device aware' capabilities, while reducing third-party OEM bloatware that are typical of devices like the Lenovo Legion Go and ASUS ROG Ally. I expect Microsoft will leverage widgets on the Xbox Game Bar on PC for controlling things like TDP and fan speed, while hopefully having a more streamlined OS experience for controller use. Of course, existing PC gaming OEMs will benefit from these efforts as well—but the research will also help with Microsoft's further-out plans." Almost a month and a half ago, Spencer outlined a sort of wishlist for "innovative" future Xbox hardware—given that Sony is rumored to be devising a "standalone PlayStation handheld," he was likely envisioning next-gen home consoles. Windows Central's sources have provided additional insights into potential Xbox Series X|S successors.

Recent engineering prototype leaks reveal NVIDIA's power delivery design for its RTX 5090 flagship GPU featured a jaw-dropping quad 12V-2x6 connector configuration. The prototype board, while not publicly photographed, is significantly different from the final version we have today. The quad-connector design serves multiple purposes beyond raw power delivery. Each 12V-2x6 connector, capable of delivering up to 600 W individually, creates a theoretical power ceiling far beyond reasonable requirements. More likely, the implementation allows for separate voltage rails and enhanced power stability, crucial for the card's reported 575 W TDP - a 125 W increase from the RTX 4090's specifications. This overengineered piece follows NVIDIA's historical engineering practices, where early prototypes typically feature expanded power delivery systems that are later optimized for production.

The timing of this leak happens just in time with ongoing discussions about 12V-2x6 connector reliability, particularly following documented failures. While the quad-connector design may seem excessive, it distributes power load more evenly across multiple connection points, potentially addressing thermal concentration issues that plagued single-connector implementations. Board partners like ASUS have already implemented sophisticated current monitoring solutions in their custom designs, using shunt resistors to detect overcurrent conditions across individual pins. Established hardware leaker, Panzerlied confirmed the prototype's existence on Chinese forums, alongside images of other engineering samples featuring similar power delivery experiments across multiple GPU generations.

NVIDIA's high-TDP flagship GPU, the GeForce RTX 5090, appears to cause additional headaches for users, not including the high power bill. According to a Reddit user, we now have the first documented case of a melted power connector on NVIDIA's flagship GeForce RTX 5090 Founders Edition, reigniting concerns over high-wattage GPU safety from the last generation. While playing Battlefield 5, Reddit user ivan6953 detected a burning odor and immediately shut down their system, only to discover severe damage to both the RTX 5090's 12V-2×6 connector and their ASUS ROG Loki SFX-L PSU. The user had employed a Moddiy 12VHPWR cable, marketed as ATX 3.0/PCIe 5.0-compliant and rated for RTX 5090's 600 watts of power. Despite claims of secure installation—audible clicks at both ends—the cable melted at 500-520 W load, charring connectors on the GPU and PSU.

Notably, the same cable had powered an RTX 4090 FE for two years without issue. NVIDIA's RTX 5090 FE ships with a redesigned adapter featuring a longer, more flexible cable and an angled connector to reduce strain in compact builds. NVIDIA asserts that no incidents have occurred with its bundled adapter, emphasizing compliance with the updated 12V-2×6 standard, which shortens sensing pins to prevent power flow if connections loosen. Hence, an older connector can not provide 100% secure usage despite the user thinking that the sensing pins are touching properly.

As documented on the Linus Tech Tips (LTT) subreddit, a lucky customer presented their freshly-delivered Founders Edition (FE) GeForce RTX 5080 graphics card model. Newly registered member, EssDee3D, had much to celebrate—having acquired launch stock, presumably at a non-scalped price—but they were confused by their package's contents. A question was pushed out to the LTT community: "can someone explain what happened here? Direct from NVIDIA...I ordered an RTX 5080, and I got a graphics card with 5090 engraved on it. The outer box has the 5080 SKU on it. Wondering if anyone else has seen something like this before?" Unique circumstances—possibly caused by a mix-up during the manufacturing process—have produced an oddball hybrid. EssDee3D proceeded to add this curiosity to their PC build—following an absorption of (very mixed) feedback from other LTT members. Basic diagnostics—performed in a Windows OS environment—revealed that the card in question housed a bog-standard GeForce RTX 5080 GB203-based GPU.

NVIDIA's two Founders Edition shroud designs—for its GeForce RTX 5090 and 5080 SKUs—look nigh identical. TechPowerUp's resident graphics card reviewer extraordinaire—W1zzard—captured a handful of comparison shots for usage in his evaluation of NVIDIA's GeForce RTX 5080 Founders Edition model. The GeForce RTX 5090 FE's cooling solution—utilizing liquid metal, instead of thermal paste—is more robust when compared to the one present on its step-down sibling—rated for a TDP of 575 W (versus 360 W). Evidently, designed to temper any radiance emitted by Team Green's GB202 GPU. EssDee3D's "chimera" card was placed in the correct packaging; a 5080-labelled paper-fiber box—but the shroud's backside advertises itself as a GeForce RTX 5090 FE. PC hardware news outlets and Redditors are wondering whether additional examples—of jumbled up "Blackwell" GPU Founders Edition parts—will appear online over the next month or two, or three...or more.

Yes, the title is correct. One of NVIDIA's GeForce RTX 5090D "China" edition GPUs, not the regular RTX 5090, managed to run at 3.4 GHz under liquid nitrogen. With a staggering 575 W default TDP, Tony Yu, ASUS China's general manager, has performed physical modifications that allow the card to run up to 1000 W TDP. The RTX 5090D is a China-exclusive variant with virtually no difference from the regular RTX 5090, just limited general AI capability due to US export regulations. ASUS China used its top-end Astral OC variant for this stunt, which, as we proved in our review of the regular ASUS RTX 5090 Astral OC, has some pretty good chip binning, allowing the card to reach the highest overclock. We pushed the regular RTX 5090 Astral OC GPU on air to 3086 MHz, a +277 MHz over the stock boost setting. However, the RTX 5090D equivalent under LN2 manages to reach 3,390 MHz at peak loads, which is a +581 MHz difference.

For memory, the overclock is equally impressive with 34 Gbps. Regarding performance, the LN2-overclocked RTX 5090D surpassed stock performance by approximately 16%. During benchmark tests, the GPU outperformed multiple previous-generation graphics cards, including a dual RTX 3090 Ti configuration in Port Royal and a quad GTX 1080 Ti setup in Fire Strike. Power consumption figures indicate that 1,760 W was used in total for a rig with ASUS ROG Astral RTX 5090D, which is paired with the Ryzen 7 9800X3D on the ASUS ROG X870E Hero motherboard. This roughly yields a 1,000 W power consumption by the card, which has seen its PCB get physical modifications to output such high power.

ZOTAC's website has been updated with technical specifications for its GeForce RTX 5090 GPU-based custom models—the Hong Kong-based hardware company is perhaps the first NVIDIA board partner to publicly disclose these details. According to VideoCardz, this discovery was made by a loyal reader—product pages for SOLID, SOLID OC and AMP Extreme INFINITY seemed to have appeared online within the past couple of days. A resultant report suggests that Team Green has only recently communicated (potentially) finalized specs with its AIBs.

The aforementioned discoverer of ZOTAC's GeForce RTX 5090 spec sheets noticed an unusual memory clock figure on the SOLID OC model's listing—30 Gbps instead of 28 Gbps. This was an error—ZOTAC has since amended that particular data point (see VideoCardz's screenshots below)—their presumably more expensive AMP Extreme INFINITY card's memory clock spec is set at 28 Gbps. Interestingly, ZOTAC's upcoming flagship is the first example of an NVIDIA GPU configured with a power consumption rating of 600 W. It is not immediately apparent whether this TDP figure is an out-of-the-box default—VideoCardz reckons that the GeForce RTX 5090 AMP Extreme INFINITY will arrive with dual-BIOS functionality. A high-performance mode could be user selected. Will rival flagship GeForce RTX 5090 custom cards roll out with similar TDPs? TechPowerUp anticipates the emergence of pre-launch technical details—from other brands/manufacturers—over the next two weeks.

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

According to two of the most accurate leakers, kopite7kimi and hongxing2020, NVIDIA's GeForce RTX 5090 and RTX 5080 will feature 575 W and 360 W TDP, respectively. Previously, rumors have pointed out that these GPU SKUs carry 600 W and 400 W TGPs, which translates into total graphics power, meaning that an entire GPU with its RAM and everything else draws a certain amount of power. However, TDP (thermal design power) is a more specific value attributed to the GPU die or the specific SKU in question. According to the latest leaks, 575 Watts are dedicated to the GB202-300-A1 GPU die in the GeForce RTX 5090, while 25 Watts are for GDDR7 memory and other components on the PCB.

For the RTX 5080, the GB203-400-A1 chip is supposedly drawing 360 Watts of power alone, while 40 Watts are set aside for GDDR7 memory and other components in the PC. The lower-end RTX 5080 uses more power than the RTX 5090 because its GDDR7 memory modules reportedly run at 30 Gbps, while the RTX 5090 uses GDDR7 memory modules with 28 Gbps speeds. Indeed, the RTX 5090 uses more modules or higher capacity modules, but the first-generation GDDR7 memory could require more power to reach the 30 Gbps threshold. Hence, more power is set aside for that. In future GDDR7 iterations, more speed could be easily achieved without much more power.

"Twin Lake" is codename for a line of low-power x86-64 processors by Intel, which succeed the Core i3 N-series and N200 series "Alder Lake-N" processors. These non-socketed (BGA) chips power a wide range of devices from entry level notebooks and mini PCs to consumer NAS servers, and other embedded applications. The chips feature only E-cores. While "Alder Lake-N" used "Gracemont" cores, "Twin Lake" uses the swanky new "Skymont" cores, which serve as E-cores in "Lunar Lake" and "Arrow Lake" hybrid processors. "Skymont" cores feature massive IPC and clock-speed gains over "Gracemont," of nearly 50%, which pulls up their performance levels to match the "Golden Cove" and "Raptor Cove" P-cores of "Alder Lake" and "Raptor Lake," although these cores can't boost up to 5.00 GHz. We got the first name-drop of "Twin Lake" way back in May 2024. Jaykihn leaked what the processor lineup could look like.

The "Twin Lake" silicon features two "Skymont" E-core clusters sharing an L3 cache. At this point, the sizes of the shared L2 caches of the E-core clusters, and the size of the shared L3 cache are not known. On "Alder Lake-N," each "Gracemont" cluster features 2 MB of L2 cache, and the two clusters share a 6 MB L3 cache. The silicon also features an iGPU based on what is very likely the Xe-LPG graphics architecture, with four Xe cores worth 32 execution units (EU). The series is led by the Intel N355. This chip maxes out the "Twin Lake" silicon, enabling both "Skymont" clusters, for an 8-core/8-thread CPU configuration. The CPU comes with a base frequency of 3.00 GHz, and boosts up to 3.90 GHz. The chip comes with a configurable TDP of 9 W and 15 W. It comes with a maxed out iGPU, with all 32 EU being enabled, and a graphics frequency of 1.35 GHz.

Fresh details have surfaced about NVIDIA's upcoming flagship "Blackwell" graphics card, the GeForce RTX 5090, suggesting power delivery and board design changes compared to its predecessors. According to Benchlife, the new Blackwell-based GPU will feature a new 16+6+7 power stage design, departing from the RTX 4090's 20+3 phase configuration. The report confirms earlier speculation about the card's power requirements, indicating a TGP of 600 watts. This specification refers to the complete power allocation for the graphics subsystem, though the actual TDP of the GB202 chip might be lower. The RTX 5090 will ship with 32 GB of next-generation GDDR7 memory and utilize a 14-layer PCB, possibly due to the increased complexity of GDDR7 memory modules and power delivery. Usually, GPUs max out at 12 layers for high-end overclocking designs.

The upcoming GPU will fully embrace modern connectivity standards, featuring PCI Express 5.0 x16 interface compatibility and implementing a 12V-2×6 power connector design. We spotted an early PNY RTX 5090 model with 40 capacitors but an unclear power delivery setup. With additional power phases and more PCB layers, NVIDIA is pushing the power delivery and signal integrity boundaries for its next-generation flagship. While these specifications paint a picture of a powerful gaming and professional graphics solution, questions remain about the broader RTX 50 series lineup. The implementation of the 12V-2×6 connector across different models, particularly those below 200 W, remains unclear, so we have to wait for the CES-rumored launch.

Ventiva, the leader in thermal solutions, today announced its ICE9 thermal management suite can now cool laptops that operate at up to 40 watts TDP (Thermal Design Power), enabling thinner, faster, and utterly silent computing devices—without the compromises of traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next-generation of feature-rich, AI-enabled, high-performance laptops.

The ICE9 thermal management suite is based on Ventiva's patented Ionic Cooling Engine (ICE) technology, which eliminates the need for mechanical fans, using intelligent software control to enable optimal performance in electronics devices—without any moving parts, noise or vibration.

It's an open secret by now that NVIDIA's GeForce RTX 5000 series GPUs are on the way, with an early 2025 launch on the cards. Now, preliminary details about the RTX 5070 Ti have leaked, revealing an increase in both VRAM and TDP and suggesting that the new upper mid-range GPU will finally address the increased VRAM demand from modern games. According to the leak from Wccftech, the RTX 5070 Ti will have 16 GB of GDDR7 VRAM, up from 12 GB on the RTX 4070 Ti, as we previously speculated. Also confirming previous leaks, the new sources confirm that the 5070 Ti will use the cut-down GB203 chip, although the new leak points to a significantly higher TBP of 350 W. The new memory configuration will supposedly run on a 256-bit memory bus and run at 28 Gbps for a total memory bandwidth of 896 GB/s, which is a significant boost over the RTX 4070 Ti.

Supposedly, the RTX 5070 Ti will also see a bump in total CUDA cores, from 7680 in the RTX 4070 Ti to 8960 in the RTX 5070 Ti. The new RTX 5070 Ti will also switch to the 12V-2x6 power connector, compared to the 16-pin connector from the 4070 Ti. NVIDIA is expected to announce the RTX 5000 series graphics cards at CES 2025 in early January, but the RTX 5070 Ti will supposedly be the third card in the 5000-series launch cycle. That said, leaks suggest that the 5070 Ti will still launch in Q1 2025, meaning we may see an indication of specs at CES 2025, although pricing is still unclear.

Update Dec 16th: Kopite7kimi, ubiquitous hardware leaker, has since responded to the RTX 5070 Ti leaks, stating that 350 W may be on the higher end for the RTX 5070 Ti: "...the latest data shows 285W. However, 350W is also one of the configs." This could mean that a TBP of 350 W is possible, although maybe only on certain graphics card models, if competition is strong, or in certain boost scenarios.

Intel is expanding its Core Ultra 200S lineup with seven new SKUs, a recent leak by @momomo_us shows. The leak gives details on non-K, T, and F versions across the Core Ultra 5 7, and 9 families. The top-end Core Ultra 9 285 will come in 65 W and 35 W versions. These match the 285K's 24-core setup but run at lower speeds. The 285T keeps the 4-core Xe built-in graphics.

The Core Ultra 7 series adds three models: 265 265F, and 265T. All share a 30 MB L3 cache being differentiated by different clock speeds. The T version has much lower base clocks. For the Core Ultra 5 series, the leak shows two models: 225 and 225F. Both have 10 cores running at 3.3/4.9 GHz (P-cores) and 2.7/4.4 GHz (E-cores), with 2 Xe GPU cores and a 65 W TDP. Unlike their higher-end models, this tier doesn't plan to have a T version right now.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

A few days ago, we reported on AMD's newest expansion plans for Serbia. The company opened two new engineering design centers with offices in Belgrade and Nis. We were invited to join the opening ceremony and got an exclusive interview with one of AMD's top executives, Andrej Zdravkovic, who is the senior vice president and Chief Software Officer. Previously, we reported on AMD's transition to become a software company. The company has recently tripled its software engineering workforce and is moving some of its best people to support these teams. AMD's plan is spread over a three to five-year timeframe to improve its software ecosystem, accelerating hardware development to launch new products more frequently and to react to changes in software demand. AMD found that to help these expansion efforts, opening new design centers in Serbia would be very advantageous.

We sat down with Andrej Zdravkovic to discuss the purpose of AMD's establishment in Serbia and the future of some products. Zdravkovic is actually an engineer from Serbia, where he completed his Bachelor's and Master's degrees in electrical engineering from Belgrade University. In 1998, Zdravkovic joined ATI and quickly rose through the ranks, eventually becoming a senior director. During his decade-long tenure, Zdravkovic witnessed a significant industry shift as AMD acquired ATI in 2006. After a brief stint at another company, Zdravkovic returned to AMD in 2015, bringing with him a wealth of experience and a unique perspective on the evolution of the graphics and computing industry.Here is the full interview:

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

Details have emerged about Intel's upcoming "Panther Lake" processors, set to be the third generation of Core Ultra mobile chips. Called the Core Ultra 300 series, these CPUs are expected to succeed "Lunar Lake". According to recent leaks, Panther Lake-H will be manufactured using Intel's cutting-edge 18A process node. The chips are said to feature a combination of Cougar Cove P-Cores, Skymont E-Cores, and Xe3 (Celestial) integrated graphics. This architecture builds upon Intel's hybrid core design, refining it for even better performance on mobile devices. The leaked information suggests a range of configurations for Panther Lake-H, the high-perfomance variant of the lineup. These include models with varying core counts and power envelopes, from efficient 25 W parts to more interesting 45 W options. Notably, some SKUs reportedly feature up to 18 cores in total, combining P-cores, E-cores, and LP E-cores in a five-tile package. This is an increase from previously believed 16 cores.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today the latest BIOS release to include TDP to 105 W option for AMD Ryzen 7 9700X and Ryzen 5 9600X processors, which can boost CPU performance up to 13%.⁠

The September latest BIOS version AGESA 1.2.0.1a provides a new option enabling users to raise the CPU TDP from 65 W to 105 W with just one click for Ryzen 9600X and 9700X on GIGABYTE 600 series motherboards. This new BIOS has been verified to show an approximately 13% multicore performance boost compared to default TDP 65 W by Cinebench R23 test results.

MSI is excited to announce the upcoming release of the AMD AGESA BIOS PI 1.2.0.1 update, designed to enhance power delivery performance for the AMD Ryzen 5 9600X and Ryzen 7 9700X processors on our 600 Series motherboards. This new BIOS will include an option that allows users to increase the original CPU TDP to 105 W on these two Ryzen processors, providing an extra boost in performance.

With this new feature allowing the TDP of the new Ryzen 7 9700X and Ryzen 5 9600X processors to be increased to 105 W, as seen with the picture below, performance actually gain at approximately of 13% compared to the original 65 W TDP.