Acer today announced its new Swift 5 notebook that offers a new take on productivity, powerful yet light enough to be carried around throughout the day. The ultraportable device is a beacon of both design and performance, sporting a professional aesthetic that is backed up by impressive functionality. This year's model features ultra-narrow bezels that allow for a 90% screen-to-body ratio, a touchscreen with Antimicrobial Corning Gorilla Glass and new colors, such as mist green.

"The new Swift 5 pushes the envelope on what thin-and-light notebooks can be," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "A productivity powerhouse housed in a sleek and ultraportable chassis, the Swift 5 is an excellent option for professionals who are always on the move and seeking a device capable of keeping up with them."

In what is possibly the first taste of Intel's Gen12 Xe iGPU running a AAA game, Ryan Shrout, chief performance strategist at Intel, showed off a prototype notebook running a "Tiger Lake" processor that is playing "Battlefield V" by itself (without discrete graphics). "Perks of the job! Took a prototype Tiger Lake system for a spin on Battlefield V to stretch its legs. Impressive thin and light gaming perf with Xe graphics! Early drivers/sw, but it's the first time I've seen this game run like this on integrated gfx. More later this year!," said Shrout.

The gameplay video (linked as source below), shows a playable experience for "Battlefield V" with Gen12 Xe, with 1080p at around 30 Hz. It only serves to appetize us for what would come next, when Intel scales up this IP to discrete GPUs. The Gen12 Xe iGPU appears capable of e-sports gaming with the right settings, and could spell serious trouble for cheap dGPU solutions such as the GeForce MX series or Radeon RX 530 series.

VLSI engineer and industry analyst, @chiakokhua, who goes by "Retired Engineer" on Twitter, was among the very first voices that spoke about 3rd gen Ryzen socket AM4 processors being multi-chip modules of core- and uncore dies built on different silicon fabrication processes, which was an unbelievable theory at the time. He now has a fantastic theory of what "Rocket Lake-S" could look like, dating back to November 2019, which is now re-surfacing on tech communities. Apparently, Intel is designing these socket LGA1200 processors to be multi-chip modules, similar to "Matisse" in some ways, but different in others.

Apparently, "Rocket Lake-S" is a multi-chip module of a 14 nm die that holds the CPU cores; and 10 nm die that holds the uncore components. AMD "Matisse" and "Vermeer" too have such a division of labor, but the CPU cores are located on dies with a more advanced silicon fabrication process (7 nm), than the die with the uncore components (12 nm).

Last week, reports of Intel's Gen12 Xe integrated graphics solution catching up with AMD's Radeon Vega 8 iGPU found in its latest Ryzen 4000U processors in higher-tier 3DMark tests sparked quite some intrigue. AMD's higher CPU core-count bailed the processor out in overall 3DMark 11 scores. Thanks to Thai PC enthusiast TUM_APISAK, we now have a face-off between the Core i7-1165G7 "Tiger Lake-U" processor (15 W), against AMD Ryzen 7 4800U (15 W), and the mainstream-segment Ryzen 7 4800HS (35 W), in 3DMark "Night Raid."

The "Night Raid" test is designed to evaluate iGPU performance, and takes advantage of DirectX 12. The Core i7-1165G7 falls behind both the Ryzen 7 4800U and the 4800HS in CPU score, owing to its lower CPU core count, despite higher IPC. The i7-1165G7 is a 4-core/8-thread chip featuring "Willow Cove" CPU cores, facing off against 8-core/16-thread "Zen 2" CPU setups on the two Ryzens. Things get interesting with graphics tests, where the Radeon Vega 8 solution aboard the 4800U scores 64.63 FPS in GT1, and 89.41 FPS in GT2; compared to just 27.79 FPS in GT1 and 32.05 FPS in GT2, by the Gen12 Xe iGPU in the i7-1165G7.

Now, take that title with the customary grain of salt, and remember: most mobile configurations aren't directly comparable due to different components, speed of the memory subsystem, and so on. Putting that salt aside, though, one thing remains: Intel beats AMD in the latest purported 3DMark benchmarks - and on the red team's home-field, so to speak: graphics performance. A benchmark posted by renowned leaker and benchmark scavenger rogame on twitter has turned up an Intel Tiger Lake-U (i7-1165G7) scoring 11879 (99.68%) in the Physics and 6912 (112.92%) in the Graphics score compared to AMD's R7 4800U 11917 Physics score and 6121 Graphics score.

For context, this pits a 4-core, 8-thread Intel Willow Cove design paired with Gen12 Xe graphics tech (2.8 GHz base, 4.4 GHz boost) against 8 of AMD's Zen 2 cores and Vega graphics. Also for context, it's expected that Intel's i7-1165G7 runs with a 28 W TDP, compared to AMD's R7 4800U 15 W envelope. Also of note is that 3D Mark isn't exactly the poster-child for CPU parallelization performance, as the benchmark scales up rather poorly as more cores are added. Perhaps more interesting as a comparison, these scores from Intel's Tiger Lake are comparable to the company's current i5-10300H (4C/8T 2.5 GHz base 4.5 GHz boost), which scores 10817 on the Physics side (making the i7-1165G7 9.8% faster with a 200 MHz slower base clock, 100 MHz higher boost & 17 W less TDP (28 W for the Tier Lake and 45 W for the i5-10300H).

Intel's 11th generation Core i7-1165G7 "Tiger Lake-U" processor armed with 4 "Willow Cove" cores and Gen12 Xe graphics fights a pitched battle against AMD Ryzen 7 4800U "Renoir" (8 "Zen 2" cores and Radeon Vega 8 graphics), courtesy of some digging by Thai PC enthusiast TUM_APISAK. The 4800U beats the i7-1165G7 by a wafer-thin margin of 1.9% despite double the CPU core-count and a supposedly advanced iGPU, with 6331 points as against 6211 points of the Intel chip, in 3DMark 11. A breakdown of the score reveals fascinating details of the battle.

The Core i7-1165G7 beats the Ryzen 7 4800U in graphics tests, with a graphics score of 6218 points, against 6104 points of the 4800U, resulting in a 1.9% lead. In graphics tests 1, 2, and 3, the Gen12 Xe iGPU is 7.3-8.9% faster than the Radeon Vega 8, through translating to 2-4 FPS. The Intel iGPU crosses the 30 FPS mark in these three tests. With graphics test 4, the AMD iGPU ends up 8.8% faster. Much of AMD's performance gains come from its massive 55.6% physics score lead thanks to its 8-core/16-thread CPU, which ends up beating the 4-core/8-thread "Willow Cove," with the 4800U scoring 12494 points compared to 8028 points for the i7-1165G7. This CPU muscle also plays a big role in graphics test 4. This battle provides sufficient basis to speculate that "Tiger Lake-U" will have a very uphill task matching "Renoir-U" chips such as the Ryzen 7 4800U, and the upcoming Ryzen 9 4900U (designed to compete with the i7-1185G7).

A roadmap slide from an Intel Partner Connect presentation suggests that the company's client-segment processor lineup will be unchanged for the rest of 2020, with the company briskly launching its 10th generation "Comet Lake-S" desktop processor lineup through May-June, and "Comet Lake-H" a month prior. The Core X "Cascade Lake-X" processor lineup will continue to lead the company in the high core-count HEDT segment, with no indications of new models, at least none higher than 18 cores.

More importantly, this slide dulls expectations of the company refreshing its desktop process segment just before Holiday 2020 with the 11th generation "Rocket Lake-S" silicon that has next-gen "Willow Cove" CPU cores, Gen12 Xe integrated graphics, and PCIe gen 4.0 connectivity, especially with engineering samples of the chips already hitting the radar. Intel is expected to launch 10 nm "Ice Lake-SP" Xeon enterprise processors in 2020, and there was hope for some of this IP to power Intel's next HEDT platform, the fabled "Ice Lake-X," especially with AMD's "Castle Peak" 3rd gen Threadrippers dominating this segment. While there's little doubt that the slide may have originated from Intel, its context must be studied. Partner Connect is a platform for Intel to interact with its channel partners (distributors, retailers, system integrators, etc), and information about future products is far more restricted on these slides, than presentations intended for large OEMs, motherboard manufacturers, etc. Then again, with the COVID-19 pandemic throwing supply chains off rails, it wouldn't surprise us if this slide spells Gospel.

The "Rocket Lake-S" microarchitecture by Intel sees the company back-port its next-generation "Willow Cove" CPU core to the existing 14 nm++ silicon fabrication process in the form of an 8-core die with a Gen12 Xe iGPU. An engineering sample of one such processor made it to the Futuremark database. Clocked at 3.20 GHz with 4.30 GHz boost frequency, the "Rocket Lake-S" ES was put through 3DMark "Fire Strike" and "Time Spy," with its iGPU in play, instead of a discrete graphics card.

In "Fire Strike," the "Rocket Lake-S" ES scores 18898 points in the physics test, 1895 points in the graphics tests, and an overall score of 1746 points. With "Time Spy," the overall score is 605, with a CPU score of 4963 points, and graphics score of 524. The 11th generation Core "Rocket Lake-S" processor is expected to be compatible with existing Intel 400-series chipset motherboards, and feature a PCI-Express gen 4.0 root complex. Several 400-series chipset motherboards have PCIe gen 4.0 preparation for exactly this. The increased IPC from the "Willow Cove" cores is expected to make the 8-core "Rocket Lake-S" a powerful option for gaming and productivity tasks that don't scale across too many cores.

To support its efforts to build a competitive consumer GPU lineup under the Xe brand, which Intel likes to call its "Odyssey," the company scored another higher-up from AMD, this time Ali Ibrahim. He joined Intel this month as a vice-president within the Architecture, Graphics and Software group, although the company didn't specify his responsibilities. "We are thrilled that Ali has joined Intel as Vice President, Platform Architecture and Engineering - dGPUs to be part of the exciting Intel Xe graphics journey," said an Intel spokesperson in a comment to CRN.

During his 13-year tenure at AMD, Ali Ibrahim was the chief-architect of the company's cloud gaming and console SoC businesses, which provides valuable insight into Intel's breakneck efforts to build high-end discrete GPUs (something it lacked for the past two decades). Intel is the only other company that is capable of building semi-custom chips for someone like Microsoft or Sony as the inventor of x86, provided it has a GPU that can match AMD's in the console space. Likewise, with gaming taking baby steps to the cloud as big players such as Google betting on it, Intel sees an opportunity for cloud gaming GPUs that aren't too different from its "Ponte Vecchio" scalar processors. The transfer of talent isn't one-way, as AMD recently bagged Intel's server processor lead Dan McNamara to head the EPYC brand.

New details have surfaced on Intel's next-generation NUC systems - built with the intention to carry the highest performance density per available chassis capacity in the computer market (the aim is a 1.35 L case). We already knew Intel's Panther Canyon NUC would bring about their Tiger Lake-U designs would be carrying the company's Tiger Lake-U CPUs, which should combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture. A new piece of data here, as has been reported, is that Intel is also working on an enthusiast-class NUC under the "Phantom Canyon" moniker, which should bring about increased graphics performance.

Even if Intel's graphics architecture is a mindblowing performance improvement over their current graphics technologies, there's only so much an integrated graphics solution can do. Now, we seemingly have confirmation, via a 3D Max Benchmark, that Intel's Panther Canyon will be paired with an NVIDIA GeForce 1660 Ti graphics card (scoring 5,355 points). The 3D Mark TimeSpy test system uses a TigerLake-U engineering sample clocked at 2.3 GHz base and 4.4 GHz boost, alongside an 80 W NVIDIA GTX 1660 Ti (Notebook) and 8 GB of RAM.

We have been hearing a lot about Intel's Rocket Lake lineup of processors. They are supposed to be a backport of Willow Cove 10 nm core, adapted to work on a 14 nm process for better yielding. Meant to launch sometime around late 2020 or the beginning of 2021, Rocket Lake is designed to work on the now existing LGA1200 socket motherboards, which were launched just a few days ago along with Intel Comet Lake CPUs. Rocket Lake is there to supply the desktop segment and satisfy user demand, in light of lacking 10 nm offers for desktop users. The 10 nm node is going to present only on mobile/laptop and server solutions before it comes to the desktop.

In the latest report on 3D Mark, the hardware leaker TUM APISAK has found a Rocket Lake CPU running the benchmark and we get to see first specifications of the Rocket Lake-S platform. The benchmark ran on 6 core model with 12 threads, that had a base clock of 3,5 GHz. The CPU managed to boost up to 4,09 GHz, however, we are sure that these are not final clocks and the actual product should have even higher frequencies. Paired with Gen12 Xe graphics, the Rocket Lake platform could offer a very nice alternative to AMD offerings if the backport of Willow Cove goes well. Even though it is still using a 14 nm node, performance would be good. The only things that would be sacrificed (from backporting) are die space and efficiency/heat.

Intel Xe graphics architecture makes its commercial debut as an iGPU solution in the company's upcoming "Tiger Lake" mobile processors. The iGPU can be configured along three tiers, with GT1 featuring 48 execution units (EUs), GT2 80 EUs, and GT3 leading the pack with 96 EUs, all within a 15 W envelope (for the total chip). There's a higher tier still of GT3 that comes with higher boost frequencies, tapping into the chip's overall increased 28 W TDP, but this variant of "Tiger Lake" could likely be an Apple-exclusive like its "Ice Lake" based predecessor.

NotebookCheck compiled a 3DMark FireStrike comparison between the various tiers of the Xe iGPU, and compared it to the Gen11 iGPU found with current-generation "Ice Lake-U" processors. The graph doesn't put out scores, but relative performance. Apparently, the 48 EU version of Gen12 Xe is a little over twice as fast as Gen11 GT1, and faster than even the 64 EU Gen11 GT2. The Gen12 GT2 with 80 EUs is around 1.7x faster than the Gen11 GT2 (64 EU). The 96 EU GT3 trim is over twice as fast, and its 28 W variant faster still. These performance give Gen12 a shot against AMD's Radeon Vega-based iGPU solution found in "Renoir." AMD has slimmed the number of CUs down to 8 (512 SP) with "Renoir," down from 11 CUs in the previous generation, compensating for it with higher GPU engine clocks.

Intel's ambitious Xe graphics architecture is expected to make its first commercial debut as an iGPU that's part of the company's 11th gen Core "Tiger Lake" mobile processors, but it already received a non-commercial distribution as a discrete GPU called the DG1, with Intel shipping it to its independent software vendor ecosystem partners to begin exploratory work on Xe. One such ISV paired the card with a Core i7-8700 processor, and put it through Geekbench. While the Geekbench device identification doesn't mention "DG1," we lean toward the possibility looking at its 96 EU configuration, and 1.50 GHz clock speed, and 3 GB memory.

The Geekbench run only covers OpenCL performance of the selected device: "Intel(R) Gen12 Desktop Graphics Controller." The total score is 55373 points, with 3.53 Gpixels/s in "Sorbel," 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. These scores roughly match the 11 CU Radeon Vega iGPU found in AMD "Picasso" Ryzen 5 3400G processors.

An unnamed Intel "Tiger Lake-U" quad-core processor was spotted on Futuremark database by _rogame, featuring 2.80 GHz nominal clock-speeds. Barring the 28 W i7-1068NG7 and i5-1038NG7, which are exclusive for MacBooks and aren't considered U-segment, all current-gen "Ice Lake" client chips have their nominal clock speeds ranging between 1.00 to 1.30 GHz. Given this, 2.80 GHz would qualify as a big jump for a U-segment "Tiger Lake" chip. We know from a separate report that "Tiger Lake" could also offer Turbo Boost frequencies as high as 4.70 GHz for the top Core i7-1185G7 part, a similar jump from the 3.90 GHz max boost of the current-gen i7-1065G7, all while retaining a 15 W nameplate TDP.

The Futuremark database listing only mentions nominal clock of 2.80 GHz, and the CPU core configuration of 4-core/8-thread. The hardcoded CPU name string of this prototype specifies "Tiger Lake U," confirming this is a 15 W part, and not a 28 W part that will be gobbled down by Apple. Intel's newfound clock-speed headroom could be attributed to the company's refined 10 nm+ silicon fabrication node. "Tiger Lake" combines "Willow Cove" CPU cores with an iGPU based on the company's ambitious new Xe graphics architecture, marking its commercial debut. "Tiger Lake" is expected to launch around September-October, 2020.

Today the Hot Chips program committee officially announced the August conference line-up, posted to hotchips.org. For this first-ever live-streamed Hot Chips Symposium, the program is better than ever!

In a session on deep learning training for data centers, we have a mix of talks from the internet giant Google showcasing their TPUv2 and TPUv3, and a talk from startup Cerebras on their 2nd gen wafer-scale AI solution, as well as ETH Zurich's 4096-core RISC-V based AI chip. And in deep learning inference, we have talks from several of China's biggest AI infrastructure companies: Baidu, Alibaba, and SenseTime. We also have some new startups that will showcase their interesting solutions—LightMatter talking about its optical computing solution, and TensTorrent giving a first-look at its new architecture for AI.

Not long ago, Intel's Raja Koduri claimed that the Xe HP "Ponte Vecchio" silicon was the "big daddy" of Xe GPUs, and the "largest chip co-developed in India," larger than the 35 billion-transistor Xilinix VU19P FPGA co-developed in the country. It turns out that NVIDIA is in the mood for setting records. The "Ampere" A100 silicon has 54 billion transistors crammed into a single 7 nm die (not counting transistor counts of the HBM2E memory stacks).

NVIDIA claims a 20 Times boost in both AI inference and single-precision (FP32) performance over its "Volta" based predecessor, the Tesla V100. The chip also offers a 2.5X gain in FP64 performance over "Volta." NVIDIA has also invented a new number format for AI compute, called TF32 (tensor float 32). TF32 uses 10-bit mantissa of FP16, and the 8-bit exponent of FP32, resulting in a new, efficient format. NVIDIA attributes its 20x performance gains over "Volta" to this. The 3rd generation tensor core introduced with Ampere supports FP64 natively. Another key design focus for NVIDIA is to leverage the "sparsity" phenomenon in neural nets, to reduce their size, and improve performance.

TSMC is working hard to bring a new 5 nm (N5 and N5+) despite all the hiccups the company may have had due to the COVID-19 pandemic happening. However, it seems like nothing can stop TSMC, and plenty of companies have already reserved some capacity for their chips. With mass production supposed to start in Q3 of this year, 5 nm node should become one of the major nodes over time for TSMC, with predictions that it will account for 10% of all capacity for 2020. Thanks to the report of ChinaTimes, we have a list of new clients for the TSMC 5 nm node, with some very interesting names like Intel appearing on the list.

Apple and Huawei/HiSilicon will be the biggest customers for the node this year with A14 and Kirin 1000 chips being made for N5 node, with Apple ordering the A15 chips and Huawei readying the Kirin 1100 5G chip for the next generation N5+. From there, AMD will join the 5 nm party for Zen 4 processors and RDNA 3 graphics cards. NVIDIA has also reserved some capacity for its Hopper architecture, which is expected to be a consumer-oriented option, unlike Ampere. And perhaps the most interesting entry to the list is Intel Xe graphics cards. The list shows that Intel might use the N5 process form TSMC so it can ensure the best possible performance for its future cards, in case it has some issues manufacturing its own nodes, just like it did with 10 nm.

An Intel Gen12 Xe GPU, possibly a discrete- DG1 prototype, showed up on the SiSoft SANDRA online database. The GPU is detailed by SANDRA as having 768 unified shaders across 96 execution units (EUs), a 1.50 GHz GPU clock speed, 1 MB of on-die L2 cache, and 3 GB of dedicated video memory of an unknown type (likely GDDR6). This is probably a different chip from the DG1-SDV, which caps out at 900 MHz GPU clock, although its SIMD muscle is identical.

At a clock-speed of 1.50 GHz, the chip would feature an FP32 throughput of 2,303 GFLOPs (we know this from the DG1-SDV offering 1382 GFLOPs at 900 MHz). If the software-side optimization backs this hardware, the resulting product could end up with performance in the league of the 8 CU Radeon "Vega" solution found in the AMD "Renoir" APU, or the Radeon RX 560 discrete GPU, which are just about enough for PUBG at 1080p with medium settings.

The 11th generation Intel Core "Tiger Lake" mobile processor and pioneering "Lakefield" heterogenous x86 processor could debut around September or October, 2020, according to a leaked Lenovo internal slide posted by NotebookCheck. It also points to Intel denoting future processors' lithography with Foveros 3D Packaging as simply "3D," and not get into a nanometer number-game with AMD (which is now in 7 nm and on course to 5 nm in 2022). This makes sense as Foveros allows the combination of dies built on different silicon fabrication nodes.

"Tiger Lake" is still denoted as a 10 nm as it's a planar chip. Intel is developing it on a refined 10 nm+ silicon fabrication process, which apparently enables Intel to increase clock speeds without breaking the target power envelope. "Tiger Lake" sees the commercial debut of Intel's ambitious Xe graphics architecture as an iGPU solution. "Lakefield," on the other hand, is a 5-core processor combining four "Tremont" low power x86-64 cores with a "Sunny Cove" high-powered core, in a setup rivaling Arm big.LITTLE, enabling the next generation of mobile computing form-factors, which Intel and its partners are still figuring out under Project Athena.

The Intel Graphics Twitter account was on fire today, because they posted an update on the development of the Xe graphics processor, mentioning that samples are ready and packed up in quite an interesting package. The processor in question was discovered to be a Xe-HP GPU variant with an estimated die size of 3700 mm², which means we sure are talking about a multi-chip package here. How we concluded that it is the Xe-HP GPU, is by words of Raja Koduri, senior vice president, chief architect, general manager for Architecture, Graphics, and Software at Intel. He made a tweet, which was later deleted, that says this processor is a "baap of all", meaning "big daddy of them all" when translated from Hindi.

Mr. Koduri previously tweeted a photo of the Intel Graphics team at India, which has been working on the same "baap of all" GPU, which suggests this is a Xe-HP chip. It seems that this is not the version of the GPU made for HPC workloads (this is reserved for the Xe-HPC GPU), this model could be a direct competitor to offers like NVIDIA Quadro or AMD Radeon Pro. We can't wait to learn more about Intel's Xe GPUs, so stay tuned. Mr. Koduri has confirmed that this GPU will be used only for Data Centric applications as it is needed to "keep up with the data we are generating". He has also added that the focus for gaming GPUs is to start off with better integrated GPUs and low power chips above that, that could reach millions of users. That will be a good beginning as that will enable software preparation for possible high-performance GPUs in future.

Update May 2: changed "father" to "big daddy", as that's the better translation for "baap".
Update 2, May 3rd: The GPU is confirmed to be a Data Center component.

Intel earlier today published its Q1 2020 financial results. In its slide deck, the company illustrated many of the facts and numbers detailed in its earnings release, but one item caught our eye: a slide confirms that the company plans to launch its "Tiger Lake" client processor by mid-year (we would place that between June to August, 2020. Intel is quite ambitious about "Tiger Lake," as it forms the microarchitecture behind its most advanced 11th generation Core mobile processors. A slide from a November 2019 investor meet details the key design goals. "Tiger Lake" implements Intel's new "Willow Cove" CPU core design that succeeds "Sunny Cove" cores found inside its "Ice Lake" processors.

"Willow Cove" sees a new cache design, implementation of new transistor optimizations from Intel's 10 nm+ silicon fabrication process, and new security features. Besides "Willow Cove" CPU cores, "Tiger Lake" sees the market debut of the company's ambitious Xe graphics architecture as its iGPU solution. The chip will also support next-generation I/O. Here's hoping Intel is able to step up CPU core-counts with "Tiger Lake." The company was forced to tap into "Comet Lake" for both its 15 W and 45 W markets due to their higher core counts, despite an older CPU core and iGPU architecture than "Ice Lake." In the same slide, Intel mentions that it commenced sampling for "Ice Lake-SP" line of high core-count enterprise processors.

Intel Corporation today reported first-quarter 2020 financial results. "Our first-quarter performance is a testament to our team's focus on safeguarding employees, supporting our supply chain partners and delivering for our customers during this unprecedented challenge," said Bob Swan, Intel CEO."The role technology plays in the world is more essential now than it has ever been, and our opportunity to enrich lives and enable our customers' success has never been more vital. Guided by our cultural values, competitive advantages and financial strength, I am confident we will emerge from this situation an even stronger company."

In the first quarter, Intel achieved 34 percent data-centric revenue growth and 14 percent PC-centric revenue growth YoY. The company maintained essential factory operations with greater than 90 percent on-time delivery while supporting employees, customers and communities in response to the COVID-19 pandemic. This includes a new Intel Pandemic Response Technology Initiative to combat the virus where we can uniquely make a difference with Intel technology, expertise, and resources.

Intel is revisiting the concept of asymmetric multi-GPU introduced with DirectX 12. The company posted an elaborate technical slide-deck it originally planned to present to game developers at the now-cancelled GDC 2020. The technology shows promise because the company isn't insulting developers' intelligence by proposing that the iGPU lying dormant be made to shoulder the game's entire rendering pipeline for a single-digit percentage performance boost. Rather, it has come up with innovating augments to the rendering path such that only certain lightweight compute aspects of the game's rendering be passed on to the iGPU's execution units, so it has a more meaningful contribution to overall performance. To that effect, Intel is on the path of coming up with SDK that can be integrated with existing game engines.

Microsoft DirectX 12 introduced the holy grail of multi-GPU technology, under its Explicit Multi-Adapter specification. This allows game engines to send rendering traffic to any combinations or makes of GPUs that support the API, to achieve a performance uplift over single GPU. This was met with lukewarm reception from AMD and NVIDIA, and far too few DirectX 12 games actually support it. Intel proposes a specialization of explicit multi-adapter approach, in which the iGPU's execution units are made to process various low-bandwidth elements both during the rendering and post-processing stages, such as Occlusion Culling, AI, game physics, etc. Intel's method leverages cross-adapter shared resources sitting in system memory (main memory), and D3D12 asynchronous compute, which creates separate processing queues for rendering and compute.

Intel's upcoming Rocket Lake-S desktop platform is expected to arrive sometime later this year, however, we didn't have any concrete details on what will it bring. Thanks to the exclusive information obtained by VideoCardz'es sources at Intel, there are some more details regarding the RKL-S platform. To start, the RKL-S platform is based on a 500-series chipset. This is an iteration of the upcoming 400-series chipset, and it features many platform improvements. The 500-series chipset based motherboards will supposedly have an LGA 1200 socket, which is an improvement in pin count compared to LGA 1151 socket found on 300 series chipset.

The main improvement is the CPU core itself, which is supposedly a 14 nm adaptation of Tiger Lake-U based on Willow Cove core. This design is representing a backport of IP to an older manufacturing node, which results in bigger die space due to larger node used. When it comes to the platform improvements, it will support the long-awaited PCIe 4.0 connection already present on competing platforms from AMD. It will enable much faster SSD speeds as there are already PCIe 4.0 NVMe devices that run at 7 GB/s speeds. With RKL-S, there will be 20 PCIe 4.0 lanes present, where four would go to the NVMe SSD and 16 would go to the PCIe slots from GPUs. Another interesting feature of the RKL-S is the addition of Xe graphics found on the CPU die, meant as iGPU. Supposedly based on Gen12 graphics, it will bring support for HDMI 2.0b and DisplayPort 1.4a connectors.

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announces the ratification and public release of the Vulkan Ray Tracing provisional extensions, creating the industry's first open, cross-vendor, cross-platform standard for ray tracing acceleration. Primarily focused on meeting desktop market demand for both real-time and offline rendering, the release of Vulkan Ray Tracing as provisional extensions enables the developer community to provide feedback before the specifications are finalized. Comments and feedback will be collected through the Vulkan GitHub Issues Tracker and Khronos Developer Slack. Developers are also encouraged to share comments with their preferred hardware vendors. The specifications are available today on the Vulkan Registry.

Ray tracing is a rendering technique that realistically simulates how light rays intersect and interact with scene geometry, materials, and light sources to generate photorealistic imagery. It is widely used for film and other production rendering and is beginning to be practical for real-time applications and games. Vulkan Ray Tracing seamlessly integrates a coherent ray tracing framework into the Vulkan API, enabling a flexible merging of rasterization and ray tracing acceleration. Vulkan Ray Tracing is designed to be hardware agnostic and so can be accelerated on both existing GPU compute and dedicated ray tracing cores if available.