Intel is packing a slightly improved stock heatsink-fan (HSF) cooling solution with some of its higher-end 10th generation Core desktop and select Xeon-W processors. The cooler, while nowhere close in size or weight to the TS15A, features a slightly thicker heatsink with a copper core, compared to the one included with lower-end parts such as the i5-10400. This heatsink's primary material is black anodized aluminium, with a copper core. The fan's cable is now black sleeved, instead of being a loose bunch of four ketchup-and-mustard wires. The hub of the fan, which usually had a white or blue label with ugly regulatory markings, now has a solid grey sticker with just the Intel logo.

There are no performance numbers, but the cooler looks physically similar to the copper core coolers Intel used to include with some of its oldest LGA115x processors, such as "Lynnfield" and " Sandy Bridge," capable of handling 95 W TDP. Intel is including the cooler with the Core i9-10900, the i9-10900F, i7-10700F, i7-10700; and Xeon W-1290, W-1270, and W-1250 boxed processors in the DIY retail channel.

There are apparently two steppings of the 10th generation Intel Core i5 desktop processor in circulation, and the two have major physical differences, even if their specifications are identical per SKU. These are Q0 and G1. The Q0 stepping of the 10th gen Core i5 is based on the 10-core variant of "Comet Lake-S" silicon, the 200-odd mm² die, which comes with Intel's die-thinning innovation, and more importantly, soldered thermal interface material (STIM). For these chips, four cores on the 10-core die are disabled by Intel to carve out the 6-core/12-thread Core i5 SKU. The G1 stepping, on the other hand, is based on the 6-core variant of "Comet Lake-S," which is similar in design to the 6-core "Coffee Lake" die. The G1-stepping chips lack STIM, and use a thermal paste.

What's more, Q0 and G1 steppings have different SPEC codes. For the Core i5-10400F, the Q0 stepping variant's SPEC code is "SRH79" and the G1 stepping variant's code is "SRH3D." The underside of the processor's package looks different between the two steppings (pictured below). You won't be able to tell the underside of the package through the little window in your processor's retail package, but the SPEC code is printed on the IHS. There's no geographic marker as to which stepping is found in what particular market. Both steppings appear to be distributed uniformly, wherever available. Since Intel is using this stepping-level differentiation only among non-K SKUs, we don't expect the two to have any different performance, but possibly different thermals.

ASUS with its Intel 400-series chipset motherboards is introducing APE, or ASUS Performance Enhancement, a feature rivaling ASRock Base Frequency Boost (BFB). What it essentially does is override PL1 (power level 1) for 65 W-rated on non-K Core processors, allowing the processor to sustain higher clock speeds after the Turbo Boost algorithm has exhausted Tau (a timing variable that allows the processor to stay within elevated boost states, before having to fall back to base frequency). Several of ASUS's Intel B460 chipset motherboards feature APE with maximum PL1 override values set at 125 W for most of the motherboard models listed in the slide below, except for the top ROG Strix B460-F Gaming, which allows you to dial the value all the way up to 210 W.

ASUS is introducing this feature through BIOS updates for boards that don't have it. The slide details the minimum BIOS version for each of the board that debuts APE. ASRock, on the other hand, introduced BFB for not just its entire Intel 400-series motherboard lineup, but also most of its Z390 and B365 lineups. To be fair to ASUS, this feature is more relevant to chipsets such as the B460, H470, and B365, since Z490 already features options that let you play with power limits. Intel gives motherboard vendors the freedom to set power limits and Tau value, but non-K processors would still be limited by their nameplate base- and boost frequencies, so raising PL1 beyond a point has no impact.

Intel sells a beefed up sibling of its stock heatsink-fan separately in the DIY retail channel, called the Thermal Solution TS15A, which was originally released when Intel launched its LGA115x socket. With the new LGA1200 socket retaining cooler compatibility with LGA115x, Intel issued a PCN (product change notification) apprising its retail supply chain that a newer batch of the cooler will come with updated packaging to reflect that the cooler supports LGA1200 in addition to LGA1151. The TS15A features a copper core making contact with the processor's IHS at the base, from which aluminium fins project radially. A high power fan ventilates the cooler axially, while the cooler's design spreads some of the air onto the CPU VRM and memory.

New details have surfaced on Intel's next-generation NUC systems - built with the intention to carry the highest performance density per available chassis capacity in the computer market (the aim is a 1.35 L case). We already knew Intel's Panther Canyon NUC would bring about their Tiger Lake-U designs would be carrying the company's Tiger Lake-U CPUs, which should combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture. A new piece of data here, as has been reported, is that Intel is also working on an enthusiast-class NUC under the "Phantom Canyon" moniker, which should bring about increased graphics performance.

Even if Intel's graphics architecture is a mindblowing performance improvement over their current graphics technologies, there's only so much an integrated graphics solution can do. Now, we seemingly have confirmation, via a 3D Max Benchmark, that Intel's Panther Canyon will be paired with an NVIDIA GeForce 1660 Ti graphics card (scoring 5,355 points). The 3D Mark TimeSpy test system uses a TigerLake-U engineering sample clocked at 2.3 GHz base and 4.4 GHz boost, alongside an 80 W NVIDIA GTX 1660 Ti (Notebook) and 8 GB of RAM.

One of the first Intel "Lakefield" heterogenous processor-powered devices, a Samsung Galaxy Book S model, is listed by Samsung on its Canadian online store. The Galaxy Book series typically consists of Arm-powered clamshell/convertible notebooks that use Windows 10 (Arm version). The device in question is a Galaxy Book S 13.3-inch notebook bearing model number NP767XCM-K01CA, and comes in two color trims - "Mercury Gray" and "Earthy Gold."

Under the hood is an Intel Core i5-L16G7 "Lakefield" heterogenous processor that has four "Tremont" low-power cores, and a "Sunny Cove" high-performance cores, in an arrangement rivaling Arm big.LITTLE, the first of many such chips from the company, as it taps into new technologies such as heterogenous cores and advanced Foveros chip packaging to design its future processors. The notebook offers Full HD resolution, 8 GB of RAM, 256 GB or 512 GB of solid-state NVMe storage, 802.11ax 2x2 WLAN, and a 42 Wh battery, possibly with double-digit hour battery life. All of this goes into a 6.2 mm (folded) device weighing under a kilogram.

We have been hearing a lot about Intel's Rocket Lake lineup of processors. They are supposed to be a backport of Willow Cove 10 nm core, adapted to work on a 14 nm process for better yielding. Meant to launch sometime around late 2020 or the beginning of 2021, Rocket Lake is designed to work on the now existing LGA1200 socket motherboards, which were launched just a few days ago along with Intel Comet Lake CPUs. Rocket Lake is there to supply the desktop segment and satisfy user demand, in light of lacking 10 nm offers for desktop users. The 10 nm node is going to present only on mobile/laptop and server solutions before it comes to the desktop.

In the latest report on 3D Mark, the hardware leaker TUM APISAK has found a Rocket Lake CPU running the benchmark and we get to see first specifications of the Rocket Lake-S platform. The benchmark ran on 6 core model with 12 threads, that had a base clock of 3,5 GHz. The CPU managed to boost up to 4,09 GHz, however, we are sure that these are not final clocks and the actual product should have even higher frequencies. Paired with Gen12 Xe graphics, the Rocket Lake platform could offer a very nice alternative to AMD offerings if the backport of Willow Cove goes well. Even though it is still using a 14 nm node, performance would be good. The only things that would be sacrificed (from backporting) are die space and efficiency/heat.

Intel is preparing to launch its next-generation Tiger Lake lineup of processors for the middle of 2020. The processors are based on the new "Willow Cove" CPU core, which supposedly brings even more IPC gains compared to previous "Golden Cove" CPU cores found in Ice Lake processors. The Tiger Lake lineup will use Intel's advanced 10 nm+ manufacturing process. This alone should bring some gains in frequency compared to the 10 nm Ice Lake processor generation, which was spotting a maximum of 4.1 GHz boost frequency on 28 W TDP model named Core i7-1068NG7. This processor is labeled as the highest-performing Ice Lake parts available today and the best 10 nm products available so far from Intel.

Thanks to the popular hardware leaker Rogame, we have evidence that the gains from 10 nm+ manufacturing process are real and that Tiger Lake will show us an amazing boost frequency of 5 GHz. In the benchmark, an unknown OEM laptop was spotted running the benchmark with a Tiger Lake CPU. This CPU is a 4 core, 8 threaded model with a base frequency of 2.3 GHz and a surprising boost frequency of 5 GHz. This information should, of course, be taken with a grain of salt until we get more information about the Tiger Lake lineup and their specifications.

Intel has today released the 43rd edition of its x86/x64 ISA developer manual designed to help developers see what's new in x86 world and make software optimizations for Intel's platform. In the latest edition of the manual, Intel has revealed the details of its low-power x86 "Tremont" architecture designed for 10 nm efficient, low-power computing. Announced last year in October, Intel promised to deliver a big IPC increase compared to the previous generation low-power CPU microarchitecture like the Goldmont Plus family. To achieve extra performance, Intel has implemented a lot of new solutions.

For starters, Tremont boasts better branch prediction unit, with increased capacity for instruction queue and better path-based conditional and indirect prediction. The front-end fetch and decode pipeline have been updated as well. Now the design is a 6-wide Out of Order Execution (OoOE) pipeline which can process 6 instructions per cycle. The Data cache is now upgraded to 32 KB. The load and store execution pipelines are now doubled and they are capable of two loads and two stores, or one load and one store, depending on the application. Tremont also updates on one important point and that is a dedicated store data port for integer and vector integer/floating-point data. Another big improvement is happening in the cryptography department. Tremont now features Galois-field instructions labeled as the GFNI family of instructions. There are two AES units for faster AES encryption and decryption. The already implemented SHA-NI cryptography standard was enhanced and it now is much faster as well. For mode in-depth report please check out Intel's x86/x64 manual.

As we reported earlier this week, the release of Adobe Premiere Pro 14.2 brought GPU acceleration to select NVIDIA and AMD GPUs taking advantage of NVIDIA's NVENC chips to boost encoding and decoding speeds. Intel has now showcased the improvements to encoding and decoding with Intel Quick Sync Video (QSV) on 11th generation iGPUs found in mobile Ice Lake chips with Adobe Premiere Pro 14.2.

Compared to the previous 9th generation graphics found in Skylake and Kabylake CPUs the new 11th generation iGPUs perform anywhere from 49-82% better. While impressive, these performance gains can only be found on limited low power 10 nm mobile chips with a maximum of four cores and are yet to arrive on desktop platforms.

MSI, the world-leading motherboard manufacturer, proudly announces Intel B460 series motherboards. Since the current Intel 10th Gen processor has doubled the efficiency of the thread, it is an excellent match with the B460 series chipset on the mainstream i5 / i7 processor, this time MSI launched 4 models of MAG series at a time, including MAG B460 TOMAHAWK in ATX size and three mATX size models including MAG B460M MORTAR, MAG B460M MORTAR WIFI, and MAG B460M BAZOOKA. This completes an enriching amount of choices for mainstream gamers.

MAG B460 TOMAHAWK is equipped with MSI Extended Heatsink Design, which is well-prepared for the potential rise in temperature. Turbo M.2 with M.2 shield Frozr allows for maximum performance without throttling condition. Adopted ASMedia 3241 controller chip brings up to 20 Gbps transfer speed with Type-C connector. 2.5G Gigabit LAN with the LAN manager offers faster networking experiences. 12+1+1 Duet Rail Power System gives more stability for entry-level gamers.

AMD marshaled its retailer ecosystem to cut the pricing of its 12-core/24-thread Ryzen 9 3900X processor down to USD $410. At this price, the 3900X is poised to threaten both the 10-core/20-thread Core i9-10900K and the 8-core/16-thread Core i7-10700K. Although bearing a $489 MSRP, the i9-10900K is seen going for upwards of $510. The i7-10700K, on the other hand, is being priced around the $410 mark. The iGPU-devoid i9-10900KF is expected to be around $20 cheaper, which should put its retail pricing around $480, while the i7-10700KF could go for around $380.

Pricing of both chips are along expected lines, as retail pre-tax prices typically end up 5% above the 1,000-unit tray pricing Intel announces for its processors. The Hardware Unboxed review of the i9-10900K shows it taking a roughly 7% lead in gaming performance over the 3900X (averaged), while falling 12% behind in multi-threaded compute performance. The i7-10700K is expected to be slightly faster than the i9-9900K. Adding value to the AMD chip is the fact that it includes a cooling solution in the retail package, which Intel doesn't, for the i9-10900K/KF and the i7-10700K/KF. A February 2020 report postulated that AMD has significant headroom to cut prices of its 3rd generation Ryzen processors to maintain competitiveness against Intel, until they are relieved by the "Zen 3" based 4th gen Ryzen "Vermeer" processors in September 2020.

Intel Xe graphics architecture makes its commercial debut as an iGPU solution in the company's upcoming "Tiger Lake" mobile processors. The iGPU can be configured along three tiers, with GT1 featuring 48 execution units (EUs), GT2 80 EUs, and GT3 leading the pack with 96 EUs, all within a 15 W envelope (for the total chip). There's a higher tier still of GT3 that comes with higher boost frequencies, tapping into the chip's overall increased 28 W TDP, but this variant of "Tiger Lake" could likely be an Apple-exclusive like its "Ice Lake" based predecessor.

NotebookCheck compiled a 3DMark FireStrike comparison between the various tiers of the Xe iGPU, and compared it to the Gen11 iGPU found with current-generation "Ice Lake-U" processors. The graph doesn't put out scores, but relative performance. Apparently, the 48 EU version of Gen12 Xe is a little over twice as fast as Gen11 GT1, and faster than even the 64 EU Gen11 GT2. The Gen12 GT2 with 80 EUs is around 1.7x faster than the Gen11 GT2 (64 EU). The 96 EU GT3 trim is over twice as fast, and its 28 W variant faster still. These performance give Gen12 a shot against AMD's Radeon Vega-based iGPU solution found in "Renoir." AMD has slimmed the number of CUs down to 8 (512 SP) with "Renoir," down from 11 CUs in the previous generation, compensating for it with higher GPU engine clocks.

Wi-Fi connectivity has become more essential than ever as we rely on it to work, teach, learn and stay connected to colleagues and loved ones. Fast, reliable and secure Wi-Fi connectivity is a necessity for keeping up as we add more connected devices and higher bandwidth applications for gaming, video streaming and content creation, as well as for processing increasingly larger file sizes. In today's homes there are an average of 11 Wi-Fi-enabled devices. Over the past few months, Comcast has reported that Wi-Fi-connected video calls and video conferencing have increased over 283%, and Charter Communications reports that over 90% of the traffic on its ISP network is Wi-Fi-based. Even in the case of your phone, more than 70% of your mobile (cellular) data traffic runs on Wi-Fi.

Intel has been investing and contributing to the evolution of Wi-Fi for more than 20 years, and today we're excited to announce another leap forward. We are acquiring Rivet Networks, a leader in software and cloud-based technologies for networking connectivity. Rivet Networks is a terrific complement to our existing Wi-Fi products and helps us further our vision of delivering PC platforms that power every person's greatest contribution. Rivet Networks' products deliver speed, intelligence and control for gamers and performance users. Its products maximize Wi-Fi bandwidth utilization and optimize the wireless network connection on your platform. In addition, Rivet Networks' products can also utilize the combination of Ethernet and Wi-Fi to prioritize traffic over both connections.

Dell Technologies unveiled the world's most intelligent and secure business PCs across its award-winning Latitude, Precision and OptiPlex portfolios to make work more efficient and safe - no matter the location. As the industry's most sustainable commercial PC portfolio, the new devices further advance Dell's commitment to sustainability with recycled materials, sustainable packaging, energy efficient designs and EPEAT Gold registrations.

Professionals can work smarter with Dell Optimizer, the automated Artificial Intelligence (AI)-based optimization technology, now available across Latitude, Precision and OptiPlex devices. The built-in software learns how each person works and adapts to their behavior to help them focus on the tasks that matter most. It works behind the scenes to improve overall application performance; enable faster log-in and secure lock outs; eliminate echoes and reduce background noise on conference calls; and extend battery run time.

Intel's ambitious Xe graphics architecture is expected to make its first commercial debut as an iGPU that's part of the company's 11th gen Core "Tiger Lake" mobile processors, but it already received a non-commercial distribution as a discrete GPU called the DG1, with Intel shipping it to its independent software vendor ecosystem partners to begin exploratory work on Xe. One such ISV paired the card with a Core i7-8700 processor, and put it through Geekbench. While the Geekbench device identification doesn't mention "DG1," we lean toward the possibility looking at its 96 EU configuration, and 1.50 GHz clock speed, and 3 GB memory.

The Geekbench run only covers OpenCL performance of the selected device: "Intel(R) Gen12 Desktop Graphics Controller." The total score is 55373 points, with 3.53 Gpixels/s in "Sorbel," 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. These scores roughly match the 11 CU Radeon Vega iGPU found in AMD "Picasso" Ryzen 5 3400G processors.

A comprehensive review of the Intel Core i9-10900K 10-core/20-thread processor by Chinese tech publication TecLab leaked to the web on video sharing site bilibili. Its testing data reveals that Intel has a fighting chance against the Ryzen 9 3900X both in gaming- and non-gaming tasks despite a deficit of 2 cores; whereas the much pricier Ryzen 9 3950X only enjoys leads in multi-threaded synthetic- or productivity benchmarks.

Much of Intel's performance leads are attributed to a fairly high core-count, significantly higher clock speeds than the AMD chips, and improved boosting algorithms, such as Thermal Velocity Boost helping the chip out in gaming tests. Where Intel loses hard to AMD is power-draw and energy-efficiency. TecLab tested the three chips with comparable memory- and identical graphics setups.More charts follow.

ASUS today announced the all-new ASUS - Google Meet hardware kit, a smart video-conferencing solution that enables stunning HD visuals. The original ASUS - Google Meet hardware kit first launched in 2014, delivering a simple and intuitive video-conferencing solution. After the success of this product, ASUS is excited to continue working with Google on a redesigned hardware kit that delivers an enhanced user experience.

The new ASUS - Google Meet hardware kit includes the compact ASUS - Google Meet Compute System, which is designed with a magnetic chassis for easy installation and the ports all on one side for efficient cable management, while the slim design allows for installation in environments with restricted access. To ensure long-term reliability under prolonged use, the newly designed Meet Compute System is built and tested to exceed industry requirements.

Intel is preparing to update its low-end segment designed for embedded solutions, with a next-generation CPU codenamed Jasper Lake. Thanks to the popular hardware finder and leaker, _rogame has found a benchmark showing that Intel is about to bless low-end with a lot of neat stuff. The benchmark results show a four-core, four threaded CPU running at 1.1 GHz base clock with a 1.12 GHz boost clock. Even though these clocks are low, this is only a sample and the actual frequency will be much higher, expecting to be near 3 GHz. The CPU was spotted in a configuration rocking 32 GB of DDR4 SODIMM memory.

Jasper Lake is meant to be a successor to Gemini Lake and it will use Intel's Tremont CPU architecture designed for low-power scenarios. Designed on a 10 nm manufacturing node from Intel, this CPU should bring x86 processors to a wide range of embedded systems. Although the benchmark didn't mention which graphics the CPU will be paired with, _rogame speculates that Intel will use Gen11 graphics IP. That will bring a nice update over Gemini Lake's Gen9.5 graphics. That alone should bring better display output options and more speed. These CPUs are designed for Atom/Pentium/Celeron lineup, just like Gemini Lake before them.

Update: Updated the article to reflect the targeted CPU category.

Intel's silicon fabrication technological edge over TSMC and Samsung may have buckled, but the company appears to have made big advances in chip packaging. We've known for some time about EMIB (embedded multi-die interconnect bridge), Intel's cost-effective alternative to using full-fledged interposers; and Foveros heterogenous multi-die packaging; but the company has apparently invented more forms of 3-D chip stacking, as detailed by a WikiChip Fuse report. By leveraging ODI (omni-directional interconnect), an evolutionary next-step to EMIB and Foveros, Intel is able to stack multiple chips above the fiberglass substrate, above each other; and inside indentations and cavities of the substrate.

ODI consists of EMIB-like silicon dies that enable high-density wiring between two dies (think a GPU and its memory stack, or an SoC and core-logic); and copper poles that serve as extensions of the bumps of silicon dies getting to the substrate. There are two types of ODI. Type-1 refers to an interconnect running between two top dies, with the ODI die sitting between them and the substrate at the point of the inter-die connection region; while copper poles compensate for the Z-height difference. In scenarios without copper poles, chip designers can opt for substrates with cavities (regions with fewer layers), where the ODI die can be slotted in. In type-2 ODI, the interconnect die sits completely under a top die, providing high-density wiring either between two regions of the same die, or between two dies. The two types can be mixed and matched to achieve extremely complex MCMs.

Today the Hot Chips program committee officially announced the August conference line-up, posted to hotchips.org. For this first-ever live-streamed Hot Chips Symposium, the program is better than ever!

In a session on deep learning training for data centers, we have a mix of talks from the internet giant Google showcasing their TPUv2 and TPUv3, and a talk from startup Cerebras on their 2nd gen wafer-scale AI solution, as well as ETH Zurich's 4096-core RISC-V based AI chip. And in deep learning inference, we have talks from several of China's biggest AI infrastructure companies: Baidu, Alibaba, and SenseTime. We also have some new startups that will showcase their interesting solutions—LightMatter talking about its optical computing solution, and TensTorrent giving a first-look at its new architecture for AI.

Dynabook Americas, Inc., today announced the availability of the new 10th Gen Intel Core Processors with vPro technology on the company's premium Portégé X Series (X30-G, X30L-G, X40-G & X50-G) and performance Tecra A Series (A30-G & A40-G). The addition of the Intel vPro platform powered 10th Gen Intel Core processors deliver better overall system performance, faster data compression, stronger security and faster Wi-Fi bandwidth. Dynabook will begin shipping these laptops with the vPro platform by the end of the second quarter this year.

"The new 10th Gen Intel Core vPro processors are built to power the next generation of computing innovation which our Portégé X Series and Tecra A Series represent," said Phil Osako, vice president, marketing and engineering, Dynabook Americas, Inc. "By incorporating the latest generation of Intel commercial processors, Dynabook will deliver business solutions with technologies to address new and emerging challenges for IT and users."

ASRock Industrial Computer Corporation, the world's leader in Industrial PC motherboards, unveils a broad range of industrial motherboards powered by the Intel 10th Generation Core Processors (Comet Lake-S) with up to 10 Cores and supporting Intel 400-series Q470E, H420E, and W480E chipsets. Featuring improved multi-threaded computing performance and rich I/O functionality, ASRock Industrial's new series of product lineup covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards, are ideal for diverse applications, such as industrial automation, retail kiosks, digital signage, and AIoT solutions.

ASRock Industrial introduces the industry's first Intel 10th Gen Core Processors Industrial Motherboards with Q470E chipset, including the IMB-1220-L/IMB-1220-D and IMB-1222/IMB-1222-WV Mini-ITX motherboards, the IMB-1313 Micro-ATX motherboard and the IMB-1711 ATX motherboard. For value and cost-effective options, there are also new Mini-ITX motherboards with H420E chipset, the IMB-1221-L/IMB-1221-D comes with high-rise IO and the IMB-1223/IMB-1223-WV with thin IO.

PTT leaked some juicy details of the upcoming Intel "Rocket Lake" and "Alder Lake" processor generations. "Rocket Lake" will power Intel's 11th generation Core processor series in the LGA1200 package, and are rumored to be a "back port" of Intel's advanced "Willow Cove" CPU cores to a 14 nm-class silicon fabrication node, with core-counts ranging up to 8. The idea for Intel is to sell high IPC, high clock-speed desktop processors for gaming.

According to the PTT report, there will be three kinds of SKUs for "Rocket Lake" based on TDP: 8-core parts with 95 W TDP rating; and 8-core, 6-core, and 4-core parts in 80 W TDP and 65 W TDP variants. For the 95 W (PL1) parts, the power-levels PL2, and PL4 are reportedly set at 173 W and 251 W, respectively, and a 56-second Tau (a timing variable that dictates how long a processor can stick around at an elevated power-state before retreating to PL1, which is interchangeable with the TDP value on the box). The 80 W TDP parts feature 146 W PL2, 191 W PL3, and 251 W PL4, but a lower Tau value of 28 seconds. For the 65 W parts, the PL2 is 128 W, PL3 is 177 W, and PL4 251 W, and the Tau value 28 seconds.

Intel today introduced its new 10th Gen Intel Core vPro processors, built to power the next generation of business computing innovation for the increasingly remote workforce. The new mobile and desktop PC processors deliver increased productivity improvements, connectivity, security features and remote manageability - all to empower IT to deliver amazing experiences, helping employees stay connected, more productive, more secure and in the flow with minimal interruptions.

"Built for business, the Intel vPro platform is a comprehensive PC foundation for performance, hardware-enhanced security, manageability and stability. With our new 10th Gen Intel Core vPro processors, we've enhanced that solid PC foundation to help tackle not only today's challenges, but also those of future work environments across the PC lifecycle," said Stephanie Hallford, Intel vice president of the Client Computing Group and general manager of Business Client Platforms.