Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, introduces the B850MT-E PRO motherboard, designed to deliver exceptional performance for office professionals and casual use. The BIOSTAR B850MT-E PRO motherboard is designed to meet the diverse needs of various users, offering a perfect blend of performance and reliability. Built on AMD 's B850 chipset, this motherboard combines superior features at an affordable price. It supports the latest AMD Ryzen 9000, 8000, and 7000 series processors, enabling seamless multitasking and efficient power management.

The B850MT-E PRO is expertly engineered for versatility, making it the definitive solution for office professionals, small businesses, and system integrators. It guarantees stable and efficient performance for everyday tasks and document management. With BIOSTAR's renowned 55 A Dr. MOS and Digital PWM technology, you can expect steady power delivery that ensures consistent performance and enhanced durability, even during extended work sessions.

Advantech, a leader in embedded IoT computing solutions, is excited to introduce their AI-integrated desktop platform series: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms are powered by Intel Core Ultra Processors (Series 2) S-Series, featuring the first desktop processor with an integrated NPU, delivering up to 36 TOPS for superior AI acceleration. Designed for data visualization and image analysis, both models offer PCIe Gen 5 support for high-performance GPU cards and feature 6400 MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen 2 and 2.5GbE LAN ports for fast and accurate data transmission in real time.

The AIMB-2710 and AIMB-589 excel in high-speed computing and AI-driven performance, making them ideal for applications such as medical imaging, automated optical inspection, and semiconductor testing. Backed by comprehensive software support, these platforms are engineered for the next wave of AI innovation.

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX's booth (#9045) in the North Hall of the Las Vegas Convention Center.

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

ASRock announces a full line-up of Intel B860/H810 motherboards. New product comes in Phantom Gaming Series, the ever popular Steel Legend that comes in white PCB design and the feature filled but budget friendly Pro RS and Pro-A series. ASRock will also debut its first BMD (back mount design) motherboard, the B860M Pro BMD, elegant and stylish cable management is no longer a privilege for the high end.

Designed for Fast and Efficient Computing!
The new ASRock B860 motherboards are designed with 14 power phase for vCore, 2oz PCB and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. And on top of that, the B860/B860M Lightning Wi-Fi even comes with the patented Memory OC Shield to give excellent memory overclocking. The boards also geared with ample amount of next gen expansion possibility such as the latest PCI-Express Gen-5 for Graphics card and M.2 SSD, Thunderbolt 4 ports on the rear IO to enable lightning-fast data transfer up to 40 Gbps.

MSI introduces its newest lineup of motherboards built for the Intel B860 and H810 chipsets. Combining performance and innovation, these motherboards deliver exceptional reliability and user-friendly features. They are designed to empower mainstream users, gamers, and creators with advanced computing capabilities. The B860 chipset brings several advantages over the H810, making it a standout choice for high-performance computing. It supports PCIe 5.0 slot and M.2 storage, enabling faster speeds and enhanced efficiency for demanding workloads. Unlike the H810, the B860 chipset also allows for memory overclocking, giving users more flexibility and control over their system's performance. With the B860 chipset having 24 PCIe lanes compared to the H810's 16, the B860 delivers a significant boost in performance with its superior bandwidth and connectivity for peripherals and components.

Further enhancing its capabilities, both chipsets include Thunderbolt 4, ensuring high-speed connectivity for a seamless user experience. However, the B860 chipset supports up to 8 Direct Media Interface (DMI) Gen 4 lanes, doubling the data transfer capacity between the CPU and chipset compared to the H810's 4 lanes. MSI's motherboards built on the B860 chipset deliver exceptional performance, reliability, and versatility, instilling confidence in gamers, creators, and everyday users seeking cutting-edge technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, is excited to announce the launch of its Intel B860M-SILVER and B860MT-E PRO motherboards, designed with cutting-edge Intel B860 architecture.

Built to support Intel's advanced Core Ultra 9, 7, and 5 processors, the B860M-SILVER and B860MT-E PRO motherboards offer exceptional performance tailored for creators, gamers, and modern office setups. They are masterfully designed to harness the superior bandwidth and energy efficiency of DDR5 technology, and support up to 192 GB of memory with blazing overclocking speeds of up to 8000 MHz.

ASRock announces a full line-up of motherboards using the AMD B850 chipset. New products include high-end Phantom Gaming series line up covering Mini-ITX to ATX form factor, mainstream Steel Legend which features white PCB design and also Pro RS series for budget friendly users.

Ready to Power Everything!
The new ASRock B850 motherboards are designed with 14+2+1 power phase, 8-layer PCBs enabling excellent memory overclocking and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU. The boards also support the latest PCI-Express Gen-5 Graphics card and equipped with Blazing M.2 (Gen5x4) SSD ports.

ASUS today announced that ASUS AI Advisor will now be available in select ASUS motherboard series. AI Advisor is a software tool that uses artificial intelligence to understand user needs and provide answers using natural language. Users can ask questions related to motherboard software, BIOS, and hardware, and receive clear and straightforward responses. This tool debuted with the ASUS Z890 motherboard series and is going mainstream with the value-oriented B860 motherboards. It's now also available to owners of the ASUS X870, B850, and B840 motherboards.

Enhancing customer interaction
ASUS AI Advisor is an AI tool designed to revolutionize how customers interact with ASUS products. It offers users an easy and intuitive way to learn about products, get technical support, and receive instant assistance.

The ASUS ROG Apex brand extension is reserved for motherboards with the best CPU and memory overclocking capabilities. Since Intel processors tended to overclock better than AMD, Apex remained confined to the Intel platform, until now. ASUS at CES showed off the ROG Crosshair X870E Apex, the first AMD platform motherboard to feature this brand extension. The board features a powerful CPU VRM solution meant for sub-zero overclocking of Ryzen 9000X3D processors that are fully capable of overclocking. It also comes with a 1 DIMM-per-channel memory topology, with just two DDR5 DIMM slots. 1DPC is the most optimal dual-channel topology for memory overclocking.

The topmost M.2 Gen 5 NVMe slot features an elaborate fan-heatsink solution. Right next to the two DDR5 DIMM slots, is a breakout DIMM.2 module that provides additional M.2 NVMe slots. There are a couple of more Gen 4 NVMe slots scattered across the board. The board features an I/O feature-set that's at least as good as the ROG Crosshair X870E Hero. The board draws power from two 8-pin EPS, a 24-pin ATX, and an additional 8-pin PCIe power input. The board is packed to the gills with features professional overclockers would look for, including onboard buttons, diagnostic readouts, a hydrophobic PCB surface treatment, dual-BIOS, and clearly labelled voltage domains.

ASUS today announced the B850 and B840 series of AM5 motherboards for AMD processors, which includes models from the ROG Strix, TUF Gaming and Prime families. These motherboards give builders higher speeds, more ports and more slots for USB devices and M.2 SSDs. Many ASUS B850 motherboards also break into the next generation of wireless networking with WiFi 7 support, and also provide robust support for fast DDR5 kits. In addition, each model makes the PC building process easier than ever with tool-free M.2 SSD installation, easy troubleshooting and hassle-free installation and removal of graphics cards.

Meanwhile, B840 motherboards are designed to serve the needs of builders who do not intend to overclock their CPUs or install a PCIe 5.0 M.2 SSD or graphics card. For anyone looking to build a very affordable and efficient PC—perhaps one centered around a CPU with powerful integrated graphics capabilities—ASUS B840 motherboards are a cost-effective choice. The first ASUS B840 motherboards all hail from the tried-and-true Prime family.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, proudly announces the launch of its cutting-edge B860 series motherboard, featuring the groundbreaking D5 Bionic Corsa technology and innovative AI-Driven capabilities that set new standards for memory performance and user-friendly experience.⁠

Infinite Memory Performance with AI-Driven Optimization
Building on the success of our Z890 series, the B860 AORUS motherboards achieve remarkable DDR5 speeds of up to 9466 MT/s on 4DIMM slot configurations. This exceptional performance is powered by our proven D5 Bionic Corsa technology, ensuring optimal memory efficiency across the entire lineup. D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards.
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ASUS today announced the B860 series of motherboards for Intel Core Ultra processors (Series 2), which includes models from the ROG Strix, TUF Gaming and Prime families. The value proposition of the ASUS B860 motherboard lineup is off the charts, thanks to its thoroughly modern platform. Users will find features that used to be exclusive to enthusiast-class ASUS motherboards. Every model supports the latest high-bandwidth CUDIMM DDR5 memory kits, ensuring that users can easily get a system up to speed with AEMP III profiles. And PCIe 5.0 connectivity abounds, giving users access to the fastest graphics cards of today and tomorrow.

Those looking to take advantage of the next generation of wireless networking can opt for an ROG Strix or TUF Gaming motherboard equipped with WiFi 7. Faster, smarter and ready for a low-interference connection to a compatible router over the wide-open 6 GHz band, WiFi 7 gives users a whole-home network upgrade. M.2 device support has also been bolstered. Previously released B760 motherboards typically offered two to three M.2 slots, and the fastest maxed out with PCIe 4.0 connectivity. The new ASUS B860 motherboard lineup now includes several options with four M.2 slots, and every model in the series features a PCIe 5.0 M.2 slot ready for a blazing-fast storage drive. Whether users are building a large gaming library, accelerating their creative efforts with dedicated drives for project storage or simply taking advantage of their stack of M.2 drives from previous builds, they will appreciate the comprehensive storage options available with ASUS B860 motherboards.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today unveils its groundbreaking B850 and B840 series motherboards, introducing a new era of performance optimization and EZ-friendly design for the latest AMD Ryzen processors with full-line PCIe Gen 5 x16 graphics cards support.⁠

D5 Bionic Corsa: Redefining Memory Overclocking
At the heart of GIGABYTE's new B850/ B840 motherboard series lies the innovative D5 Bionic Corsa technology, a game-changing approach to memory performance. This breakthrough technology has achieved remarkable up to 8600 MT/s DDR5 speeds, setting a new standard for memory overclocking. Through the intelligent AORUS AI SNATCH software, users can now effortlessly enhance their system's performance with unprecedented ease. The AI-powered EXPO AI BOOST feature eliminates the traditional time-consuming trial and error process, delivering optimized memory profiles that balance performance and stability with just a few clicks.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and PC peripherals, proudly introduces two new additions to its AMD motherboard lineup, the B850M-SILVER and the B850MT-E PRO motherboards. Built around the latest AMD B850 chipset, these motherboards deliver next generation technology and reliable performance, perfectly fitting office professionals, home entertainment enthusiasts, system integrators, and gamers.

The B850M-SILVER and B850MT-E PRO motherboards are expertly engineered to support the cutting-edge AMD Ryzen 9000, 8000, and 7000 series processors, delivering unparalleled computing power for any application. They are optimized for peak memory performance, accommodating up to 192 GB of DDR5 RAM at impressive overclocking speeds of up to 8000 MHz, boasting significantly higher bandwidth and enhanced energy efficiency compared to DDR4.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, is set to captivate global tech enthusiasts at CES 2025 with its latest groundbreaking innovations, ASRock will unveil a meticulously curated lineup that includes state-of-the-art motherboards, gaming monitors, graphics cards, compact systems, and an all-new power supply series. This comprehensive showcase underscores ASRock's unwavering commitment to delivering high-performance solutions designed to meet the exacting standards of competitive gamers and technology professionals. With a focus on innovation, precision engineering, and industry leadership, ASRock is poised to shape the future of PC hardware and redefine what's possible in the world of computing.

ASRock's New BMD Motherboards Are Game Changers for Empowering Your Next-Gen PCs
ASRock will showcase the new motherboards for the mainstream and budget segment that are based on the upcoming Intel & AMD chipset. The new motherboards include the Phantom Gaming series, the ever popular Steel Legend that comes in a white PCB design and the feature filled but budget friendly Pro RS and Pro-A series. ASRock will also be debuting its first BMD (back mount design) motherboard during CES 2025.

Elitegroup Computer Systems (ECS) is excited to announce its participation in CES 2025, taking place at the Bellagio Hotel in Las Vegas, NV, USA, from January 7 to 10. At the event, ECS will showcase its full lineup of cutting-edge products, including motherboards, mini PCs, and notebooks, designed to meet the needs of home entertainment, office, school, and commercial applications.

Unleash Your Potential with the Ultimate LEET Gaming Motherboards
ECS new models of LEET gaming motherboards - Z890 series marks a significant advancement in motherboard technology, offering notable improvements in performance, stability, scalability, and user-focused design, all tailored to meet the evolving needs of consumers. ECS Z890 motherboards are compatible with the latest Intel Core Ultra processors for the Intel LGA 1851 socket and feature four DDR5 DIMM slots, supporting up to 256 GB of total memory with impressive overclocking capabilities, including speeds of up to 8800 MHz. These motherboards also offer advanced connectivity options, including two PCIe 5.0 graphics slots, four PCIe 4.0 slots, ultra-fast 5 Gb Ethernet LAN, and the latest wireless networking technologies.

Earlier today, ASUS uploaded a first sneak peek of several upcoming AMD AM5 motherboards—which we assume will feature the B850 and B840 chipsets—which according to the post on Facebook, will be launching within a couple of weeks. The boards will most likely be on display at CES, which kicks off on the 7th of January. The picture is obfuscated for obvious reasons, but what is clear is that there will be several different SKUs from all of ASUS' typical sub-brands such as TUF Gaming and ROG.

What we can also make out is that there will be at least one Mini-ITX board and one micro-ATX board, with the latter being the TUF Gaming branded board. We tried to clean up the picture a bit, but ASUS has managed to hide all details of possible models names and most of the text is kind of hard to make out. Nothing really sticks out in terms of features, although it's clear we'll end up seeing some higher-end B850 boards, judging by the fact that there are at least three ROG Strix SKUs coming. The question is if there's a market for these boards, considering the B850 chipset is pretty much the same as the B650E chipset, but with optional PCIe 5.0 support for the M.2 slots and no USB4, unlike its X870 counterpart.

Update Jan 1st: ASUS posted a picture of their upcoming mid-range Intel boards on Facebook as well, but as with the AMD boards, ASUS obfuscated the image, although not quite as badly this time around. For its Intel lineup, there's also a lower-end Prime board included, in addition to the TUF Gaming and ROG Strix boards. ASUS didn't reveal any launch window for the Intel boards.

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

Minisforum has decided to expand the series of motherboards used in its own mini-PCs with two new models, namely the BD795M (M-ATX) and BD795i SE (Mini-ITX). In principle, these motherboards are almost identical to those in the BD790i series, keeping the included AMD Ryzen 9 7945HX 16 cores processor with frequency of up to 5.4 GHz and integrated AMD Radeon 610M graphics. However, both have some minor physical differences. As for specifications, they offer two M.2 2280 SSD slots (one PCIe 5.0), support for DDR5 SODIMM memory with speeds up to 5200 MT/s, and a maximum capacity of 96 GB. The motherboards offer a full-size PCIe 5.0 x16 slot for users who want to add a dedicated video card.

Unlike the BD790i model, Minisforum decided not to include a CPU cooler for the BD795M model, leaving the cooling solution to the users' choice, a decision that has the collateral effect of a lower price. The motherboards even include an AIO pump connector, so users aren't limited to air cooling. Minisforum confirmed that the CPU has a TDP of 100 W and can also operate at 120 W. Also in the series of minor changes, the BD795M motherboard lacks the SSD heatsink and SSD fan connector but includes an internal antenna adapter.

Here are some of the first pictures of ASRock's upcoming Live Mixer series motherboards based on mid-range chipsets from AMD and Intel. The Live Mixer brand of motherboards has a similar positioning in ASRock's product stack as Steel Legend, but with a variation in product design, and a mid-range onboard audio solution that uses audio codecs such as the ALC1200 or ALC4080. There's nothing that particularly stands out in this audio solution (no fancy amp circuits or exotic I/O). The B850 Live Mixer Wi-Fi is an ATX board based on the AMD B850 chipset. This is essentially a re-brand of the popular B650, but with out-of-the-box support for the latest Ryzen 9000 series processors, including the 9000X3D series. The board offers three M.2 NVMe slots, one of which is Gen 5, and the others Gen 4. The WLAN solution is very likely Wi-Fi 6E.

Next up, is the ASRock B860 Live Mixer Wi-Fi. This Socket LGA1851 motherboard is based on Intel's mid-range chipset for its "Arrow Lake" processors, the Intel B860. Much like the previous generation B760, it is expected to lack CPU overclocking support. This board visually looks a lot similar to its AMD B850-based sibling, you could almost confuse the two if you're not looking at the CPU socket. You get three M.2 NVMe slots here, too; one of which is Gen 5, and doesn't eat into the x16 PEG slot. We expect this board to offer Wi-Fi 6E, just like the B850 Live Mixer Wi-Fi. Lastly, there's the B860M Live Mixer Wi-Fi, a Micro-ATX variant of this board, with mostly the same feature-set, it's just that the third M.2 slot is without a heatsink; and the second PCIe slot is physically x8 instead of x16, which shouldn't matter since the slot is likely electrical x4 on both motherboard models. Intel and AMD are expected to debut the B850 and B860 in January.

In Q1 2025, AMD is expected to expand its Ryzen 9000 series "Granite Ridge" desktop processor family with new 65 W processor models, alongside the introduction of the new cost-effective AMD B850 motherboard chipset. The B850 is expected to be a single-chip solution, just like the X870, but makes PCIe Gen 5 optional for the x16 PEG slot. You still get at least one Gen 5 M.2 NVMe slot. USB4 is made optional for this chipset model, too. The B850, hence, is essentially a rebadged B650. CPU and memory overclocking are supported, so you can expect features like "X3D Boost" to carry over from the X870 series motherboards. Videocardz scored clear images of one of the first production AMD B850 chipset motherboards, the GIGABYTE B850M AORUS Elite Ice. This particular variant comes with integrated Wi-Fi 6E, and the "Ice" denotes a white PCB, along with white slots and connectors. You can expect variations of this board with black PCB, and other wireless networking solutions, or lacking one altogether.

The Micro-ATX board appears feature-packed, including an easy ejection lever for the PCIe x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors. Expansion slots include what is very likely a Gen 4 PCI-Express x16 slot, a Gen 4 x4 (physical x16) PCIe slot, and the space between them being dominated by an M.2 SSD heatsink that very likely conceals a Gen 5 M.2 slot wired to the CPU, and a Gen 4 M.2 slot that's either wired to the CPU (since there's no discrete USB4 controller), or the FCH. USB connectivity consists of 20 Gbps USB 3.2 for a few type-C ports (including a type-C header), and a combination of 10 Gbps and 5 Gbps USB 3.x ports.