A member of GIGABYTE's gaming subreddit has shared a worrying HWiNFO diagnostics readout accompanied by a simple title: "X870E AORUS XTREME AI TOP Chipset with AMD Ryzen 9 9950X3D—Chipset 2 (xHCI) 109.9 °C." Xabiro's initial post attracted replies that disclosed additional feedback regarding higher than expected temperature measurements. Another member—RyanOCallaghan01—exclaimed in the comments section: "damn. I am having the same problem, Chipset 2 is almost reaching 100 degrees Celcius, and I have not even got a high-powered GPU installed. I have seen your image and starting to suspect mine may be the same." The original poster proceeded to disassemble their thermally-challenged X870E AORUS XTREME AI TOP specimen, and quickly identified the root cause—affecting one of the board design's two daisy-chained Promontory 21 chipsets.

Xabiro described this problem-solving process: "I removed the heat sink and actually the top AMD chipset is not touching the heat sink no matter what I do...I didn't have any GPU installed yet, but I just solved (the temperature problem) yesterday, with thermal paste combined with Thermal Grizzly (TG) KryoSheet, just because I didn't have TG Putty Pro. Now the maximum temperature is 65 °C—also on the bottom one was just changed to TG Kryonaut, and it is under 50 °C. Quite ironically, GIGABYTE recently engaged in some public mocking of a troubled ASUS motherboard feature. Xabiro suspected that the X870E AORUS XTREME AI TOP mainboard's EZ Latch Plus GPU quick release system is preventing good contact between surfaces. They observed that: "the plastic ornament which goes from the PCIe to the release button is too high and the top part of the heat sink stays on it, and just simply cannot touch the chipset die."

Introducing an additional version of our North XL series, designed for builds with reverse connector motherboards.

In North XL RC, the interior has been reconfigured to accommodate ATX motherboards with rear-facing connectors. This includes motherboard series such as ASUS Back to the Future, GIGABYTE Stealth, and MSI Project Zero. By reducing cables and clutter from the main chamber, with compatible components connecting through the reverse side, users can effortlessly achieve a finish to their system that looks clean and accomplished.

At CES 2025, ASUS unveiled their elite-tier ROG Crosshair X870E Apex motherboard design. Additionally, early January press material teased another top contender: "ROG Crosshair X870E Extreme is also waiting in the wings, with details to be shared on the way to its expected release in the first quarter (of 2025)." As reported by VideoCardz, the Taiwanese manufacturer seems to be readying its mysterious ultra-premium model for an imminent launch. Last week, HWiNFO v8.23-5685 Beta release notes turned up—revealing the existence of "enhanced sensor monitoring on ASUS ROG Crosshair X870E Extreme." Concurrently, a smattering of retail/e-tail listings have turned up in Europe. The lowest observed asking price (including VAT) was €1202.80, courtesy of Max ICT's (Netherlands) premature publishing of a product page.

Hopping across the Atlantic, industry watchdogs noted that Newegg was demanding a cool $749 for ASUS ROG Crosshair X870E Apex pre-orders. Potential European customers will likely be greeted by a ~€827 (inc. VAT) price point. Since January, the Republic of Gamers marketing team has kept quiet on the X870E Extreme front. Their fancily-appointed board is still an unknown quantity in many regards; recent retail leaks lack technical information and visual representation. As noted by VideoCardz, time is running out for a Q1 2025 launch. As we head into April, Q2 looms in the near distance.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, thrilled to announce an extraordinary overclocking milestone achieved by the Z890 AORUS TACHYON ICE motherboard paired with the latest Intel Core Ultra (Series 2) processor. Leveraging its proprietary LN2 SWITCH technology - the critical innovation behind this breakthrough—and V-COLOR Manta XFinity RGB DDR5 memory, legendary overclocker HiCookie has established a groundbreaking world record of DDR5-12752. This remarkable achievement solidifies GIGABYTE's position at the forefront of extreme Overclocking performance.

⁠The Z890 AORUS TACHYON ICE is a motherboard designed exclusively for overclocking enthusiasts, offering exceptional capabilities with its advanced all-digital power design. Equipped with overclocking toolkit, convenient shortcut keys, toggle switches, and voltage detection functions, Z890 AORUS TACHYON ICE empowers overclockers to push beyond their boundaries effortlessly. This extraordinary achievement showcases GIGABYTE's ongoing commitment to the overclocking community.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

BIOSTAR, a leading manufacturer of IPC solutions, motherboards, graphics cards, and PC peripherals, is currently showcasing its latest technologies at Embedded World 2025, held from March 11-13 at Nurnberg Messe, Germany.

BIOSTAR's showcase features AI-powered industrial PCs and edge computing platforms that provide secure, efficient, and scalable solutions for industries like automation, smart cities, and human-machine interfaces (HMI) at this year's exhibition. With cutting-edge solutions such as IPC motherboards, panel PC, and edge computing systems, and NVIDIA Jetson Orin edge AI system, the products demonstrate BIOSTAR's capabilities on edge AI and edge computing area for critical industrial applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, has observed reports on Reddit from users experiencing unexpected boot issues and error codes when using ASRock AM5 motherboards paired with minority proportion of AMD Ryzen 9000 series processors. To enhance user experience, ASRock promptly released the latest 3.20 Beta BIOS for its AM5 series motherboards, further improving AMD Ryzen 9000 series processors boot issues.

Users can download and install the BIOS from the official ASRock website or use the BIOS Flashback function on their motherboard for a quick update. ASRock also promises to continue enhancing the compatibility of its products.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

Maxsun has just launched its MS-iCraft B860M CROSS "Aiga" Micro-ATX motherboard series for Intel CPUs, which includes both a standard and a Pro version. While both models share similarities—such as an all-white design—they also have key differences. The Pro version of the MS-iCraft B860M CROSS "Aiga" motherboard features a 3.4-inch display on the upper-left I/O armor, capable of showing real-time system information as well as custom graphics. In contrast, the standard version has a smaller screen that displays Aiga animations. Another distinction is that the Pro version is equipped with an Intel BE200 wireless network card, whereas the standard version uses the Intel AX211.

Aside from these differences, both motherboards have similar specifications. They support up to 192 GB of DDR5 RAM across four DIMM slots, with overclocking speeds reaching up to 9066 MT/s. Power delivery is handled by a 16+1+1 phase power supply design with 50 A DrMOS. Additionally, both models include a PCIe 5.0 x16 slot for high-performance graphics cards, and one PCIe 4.0 x4 slot.

Late last week, Colorful Technology revealed a brand-new series of "CVN" motherboards—the manufacturer's Bilibili account hinted at an upcoming launch and uploaded three highly-stylized promotional images. As reported by ITHome, Colorful's debut AMD X870 chipset-based board will be: "equipped with Colorful's first-generation graphics card quick-release device." Western press outlets have covered the functional validity of similar systems in recent times, but Colorful's teaser seems to be poking fun at a rival's current predicament. The incoming CVN X870 series will sport a unique selling point; its GPU removal system features an "ON or OFF" switch. Colorful advertises this proprietary design as being "really safe."

CVN X870 or X870E product pages have not appeared online, but ITHome reckons that this new range will sit in-between Colorful's familiar iGame and Tomahawk motherboard lines. The intended target audience appears to be "mainstream DIY" builders. According to one of the teaser images, Colorful reckons that its silver/white-tinted CVN X870 boards will "live up to expectations." The Chinese manufacturer has devised a new "Frost Armor" structure that covers a board's VRM sections—sporting "composite heat dissipation grooves and heat pipes." Lower-end CVN B840 and B850 models could be in the pipeline, but Colorful is likely testing the waters with its initial launch of X870-equipped fare.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

MSI introduced an impressive number of new AMD B850 and B840 chipset-based motherboards at January's CES trade event. According to a Wccftech report, the company's AM5—socketed lineup will expand in the near future—a leaked presentation slide provides an early preview of (allegedly) incoming budget-friendly offerings. MSI's leaked roadmap (Q1 to Q2 2025) shows new additions—mostly smaller form factor—across performance (MPG) and Pro Series product ranges. Their Arsenal Gaming (MAG) B850 range seems to be fully released, as of the first quarter of this year—consisting of models already unveiled at CES.

Five new models are seemingly lined up for release within the next couple of months—the Wccftech article listed the following SKUs: MPG B850I Edge WIFI (Mini-ITX), PRO B850M-P WIFI (M-ATX), PRO B850M-B (M-ATX), B850 Gaming PLUS WIFI PZ (ATX) and PRO B850M-A WIFI PZ (M-ATX). The publication commented on its discoveries: "as you can see, MSI will have at least one new variant within the MPG lineup which will feature a Mini-ITX design. The company has already released the full ATX-sized version of the EDGE TI WIFI, and it's nice to know that we will get a Mini-ITX variant too." The report proposes that MSI has prepped its new budget models with the latest connectivity features—most notably, Wi-Fi 7 rated at the full 320 MHz band. Support for Zen 4 and 5 Ryzen X3D CPUs is expected upon launch.

ChangXin Memory Technology (CXMT) is playing catch up with competitors based in neighboring nations—as reported earlier today, this Chinese memory module manufacturer is making advancements in the field of commercial DDR5 products. Reports from the region suggest that a well-known motherboard manufacturer has embraced some of ChangXin new portfolio. According to a recent ITHome article, MSI has implemented a multitude of optimizations for new-ish Intel "Arrow Lake" Core Ultra Series 2 CPU-oriented motherboards—notably the MAG B860 TOMAHAWK WIFI, MAG B860M MORTAR WIFI, and PRO B860M-A WIFI models.

The publication provided evidence of MSI enabling transfer rates of 6800 MT/s across four engaged modules—a welcome step up from the usual twin-stick setup. ITHome also points out that the motherboard specialist has prepared a new BIOS version for B860 chipset mainboards: "specially optimized for the recently popular DDR5 domestic memory particles of ChangXin Storage, which undoubtedly gives the gaming community (in China) more choices." MSI appears to be the first major international vendor to enable support for CXMT's DDR5 modules—thus, representing a significant achievement for the Chinese memory industry.

Last week, important figures from the PC hardware community posted photo and video evidence of damaged GPU interfaces—seemingly inflicted by the ASUS PCIe Q-Release Slim system. Reports suggest that scratches and scrapes—on PCIe connectors—are the result of frequent engagement and disengagement. For example, the owner of a ROG Strix B850-A Gaming Wi-Fi S motherboard model performed sixty quick release cycles—eventually chipping away at the physical interface present on their GALAX RTX 4070 Ti HOF OC LAB card. The most vocal of critics believe that ASUS did not fully test its latest quick release mechanism—reserved mainly for inclusion on high-end motherboards. Feedback posted on Bilibili prompted Tony Wu—general manager at the company's China office—to look into the matter. In the meantime, his colleagues in North America have responded to Western news reports.

Approximately eighteen hours ago, the "ASUS_MKTLeeM" account posted a lengthy and highly comprehensive public service announcement (PSA) on NVIDIA's subreddit. The ASUS USA rep stated: "we know that many of you have ASUS products including our GeForce graphics cards and motherboards and likely saw the news recently regarding usage marks on a couple graphics cards that were installed in one of our motherboards featuring the new PCIe Q-Release Slim feature." They noted that they would welcome feedback from users on Reddit—through comments or private messages. The company messenger pointed out that the reported problems stemmed from unique user cases—professional reviewers (of expensive graphics cards) will not enjoy reading this response: "in our internal testing and evaluation of the extremely small number of cases reported, we found no damage to the motherboard or graphics card that would affect functionality and/or performance....However, it is important to emphasize that any type of PCIe add-in card will exhibit signs of usage and wear marking after 60 continuous insertions and removals."

ASRock has quietly updated its CPU Support List with entries for the upcoming AMD Ryzen 9 9950X3D and 9900X3D desktop processors—starting off with motherboard BIOS versions 3.15 and 3.16. The Taiwanese manufacturer seems to be the very first company to add these "Zen 5" models to public-facing motherboard compatibility databases—according to yesterday evening's VideoCardz report, the likes of MSI, GIGABYTE, and ASUS have not yet followed suit (at the time of writing). The appearance of Team Red's "Granite Ridge" 16-core and 12-core 3D V-Cache-equipped processors on ASRock's website has set off chatter across PC hardware discussion communities.

AMD has not officially revealed a specific launch date (or pricing details) for its Ryzen 9 9950X3D and 9900X3D CPUs—instead, a loose March window has been marked down on this year's calendar. Industry watchdogs believe that ASRock's freshly updated database is proof of an imminent launch—a couple of insiders predicted a January rollout, but this seems unlikely to occur by the end of this working week. Given the reported scarcity of Team Red's already released and highly-praised Ryzen 7 9800X3D gaming processor, many folks will welcome the addition of two alternative options. Team Red has already set expectations for the (presumably) more expensive models—recently, a product manager disclosed that their "new chips will provide similar overall gaming performance" to the current champion.

HXL/9550pro and HardwareLuxx's Andreas Schilling shared evidence of the ASUS PCIe Q-Release Slim—the manufacturer's latest ejection mechanism—causing damage to graphics card PCIe connectors. Recent feedback suggests that repeated usage can scrape or grind off material present on a card's interface. HXL gathered critiques from multiple sources (owners of Intel 800 and AMD 800 series boards), and linked a relevant Bilibili video. The footage presents a damaged GALAX RTX 4070 Ti HOF OC LAB model, following sixty quick release cycles—paired with a ROG Strix B850-A Gaming Wi-Fi S motherboard. Tony Wu, ASUS China's general manager, eventually weighed in on community discussions—stating that he will investigate this matter and report back with his findings.

Schilling expressed similar frustrations—his chosen platform is producing unwanted results: "I'm not happy with the solution either. We use the Strix X870E-E Gaming for testing the graphics cards. So I have had to remove graphics cards from the slot a few dozen times. This didn't always go smoothly and very often the (GeForce RTX 5090) card got stuck in the slot. First damage visible." Press outlets have picked up on the recent surge in Q-Release Slim user feedback—several publications have gathered additional examples of the new mechanism inflicting damage on a variety of graphics card models.

Advantech, a global leader in embedded IoT computing, is excited to launch its latest Edge AI solutions featuring the advanced AMD Ryzen Embedded 8000 Series processors. The SOM-6873 (COMe Compact), AIMB-2210 (Mini-ITX motherboards), and AIR-410 (AI Inference System) deliver exceptional AI performance leveraging the first AMD embedded devices with integrated Neural Processing Units. These integrated NPUs are optimized to enhance AI inference efficiency and precision. Together with traditional CPU and GPU elements, the architecture delivers performance up to 39 TOPS. They also support dual-channel DDR5 memory and PCIe Gen 4, providing ample computing power with flexible TDP options and thermal solutions.

Within value-added software services, such as the Edge AI SDK that integrates the AMD Ryzen AI software, the model porting procedure is accelerated. These features make the solutions ideal for edge applications such as HMI, machine vision in industrial automation, smart management and interactive services in urban entertainment systems, and healthcare devices such as ultrasound machines.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents our lineup of Intel B860 Series motherboards in the ULTRA, CVN GAMING FROZEN, and BATTLE-AX models.

The Intel B860 chipset is aimed at the mid-range level price segment for the Intel Core Ultra 200 series desktop processors. The COLORFUL B860 motherboards features DDR5 memory support, support for up to PCIe Gen 5 SSDs, high-speed 40 Gbps USB4 ports, fast Wi-Fi 7 wireless networking, and more.

MSI has provided a detailed look into its motherboard production facilities through a new interactive webpage. The company has outlined the 15-step manufacturing process that transforms bare circuit boards into complete motherboards. The process begins with solder paste printing, where a precise layer of conductive paste is applied to the bare PCB. This is followed by automated inspection using imaging systems to verify proper paste placement. High-speed machines then position electronic components onto the board before they move through reflow ovens that permanently bond the components. Multiple inspection stages are integrated throughout the assembly line, including automated optical systems that check both sides of the board. Specialized machines handle routing, component insertion, wave soldering, and alloy welding.

Each board undergoes circuit testing and receives mechanical components through automated screw-locking systems before final functional testing and molding. The complexity of modern motherboard manufacturing requires rigorous quality checks and final power tests before the motherboard leaves manufacturing facilities. For interested enthusiasts, MSI's new landing page is here. The manufacturing reveal accompanies MSI's launch of two new motherboard series—Z790 and B860. To celebrate this launch, MSI has announced promotional events running from January 20 to March 31, 2025, including Steam game codes with select product purchases. A new reward program offers points for product reviews and referrals.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, introduces the B850MT-E PRO motherboard, designed to deliver exceptional performance for office professionals and casual use. The BIOSTAR B850MT-E PRO motherboard is designed to meet the diverse needs of various users, offering a perfect blend of performance and reliability. Built on AMD 's B850 chipset, this motherboard combines superior features at an affordable price. It supports the latest AMD Ryzen 9000, 8000, and 7000 series processors, enabling seamless multitasking and efficient power management.

The B850MT-E PRO is expertly engineered for versatility, making it the definitive solution for office professionals, small businesses, and system integrators. It guarantees stable and efficient performance for everyday tasks and document management. With BIOSTAR's renowned 55 A Dr. MOS and Digital PWM technology, you can expect steady power delivery that ensures consistent performance and enhanced durability, even during extended work sessions.

Advantech, a leader in embedded IoT computing solutions, is excited to introduce their AI-integrated desktop platform series: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms are powered by Intel Core Ultra Processors (Series 2) S-Series, featuring the first desktop processor with an integrated NPU, delivering up to 36 TOPS for superior AI acceleration. Designed for data visualization and image analysis, both models offer PCIe Gen 5 support for high-performance GPU cards and feature 6400 MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen 2 and 2.5GbE LAN ports for fast and accurate data transmission in real time.

The AIMB-2710 and AIMB-589 excel in high-speed computing and AI-driven performance, making them ideal for applications such as medical imaging, automated optical inspection, and semiconductor testing. Backed by comprehensive software support, these platforms are engineered for the next wave of AI innovation.

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX's booth (#9045) in the North Hall of the Las Vegas Convention Center.

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.