Tuesday, August 2nd 2016
SoC Powering Xbox One S Leverages 16 nm FinFET from TSMC
Microsoft's new slim Xbox One S console achieves its slimness - including its inbuilt power-supply, by significantly reducing thermal load of its key components. This begins at the heart of the console, its SoC. A semi-custom chip by Microsoft and AMD, the SoC powering the Xbox One S is built on the 16 nm FinFET process at TSMC. The chip powering the original Xbox One was built on the same foundry's 28 nm node.
The new SoC isn't merely an optical shrink of the original 28 nm chip down to 16 nm FinFET, Microsoft added a few components to the chip, including an HEVC hardware decoder, hardware CODECs for Blu-ray UHD with HDR; and a revamped display controller with HDMI 2.0 and HDCP 2.2. The chip also performs 1080p to 4K UHD upscaling, with a native upscaling algorithm. The eSRAM memory bandwidth is increased slightly from 204 GB/s from 219 GB/s.
Source:
Eurogamer
The new SoC isn't merely an optical shrink of the original 28 nm chip down to 16 nm FinFET, Microsoft added a few components to the chip, including an HEVC hardware decoder, hardware CODECs for Blu-ray UHD with HDR; and a revamped display controller with HDMI 2.0 and HDCP 2.2. The chip also performs 1080p to 4K UHD upscaling, with a native upscaling algorithm. The eSRAM memory bandwidth is increased slightly from 204 GB/s from 219 GB/s.
6 Comments on SoC Powering Xbox One S Leverages 16 nm FinFET from TSMC
The increased memory bandwidth is proberly to overcome the Xbox's one performance issues, where the PS4 is just a tad faster and better in many aspects.
@arbiter what? Xbox One has two different memory types. ddr3 and eSRAM flash. The eSRAM is much much faster and now with the higher clocks its getting about 15gb/s more bandwidth.