Monday, August 6th 2018
Yangtze Memory Technologies to Debut New, Ultra-Fast 3D NAND Architecture and Deliver Keynote at Flash Memory Summit 2018
Yangtze Memory Technologies Co., Ltd (YMTC), a new player in the NAND industry, will be joining Flash Memory Summit this year for the first time, delivering a much-anticipated keynote address to reveal its ground-breaking technology - Xtacking. YMTC is the first Chinese company to take part in the high-entry-barrier NAND flash memory industry with its new architecture for unprecedented performance, higher bit density, and faster time-to-market.
Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND's Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company's new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.The Xtacking technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, Xtacking will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.
The Xtacking technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.
About Yangtze Memory Technologies Co., Ltd (YMTC):
Founded in 2016 with $24B funding, Yangtze Memory Technologies Co., Ltd. (YMTC) is a memory solutions company headquartered in Wuhan, China. YMTC designs, manufactures and sells memory products and solutions for a broad range of applications including mobile devices, computing, data centers and consumer electronics for customers around the world.
Leveraging its wholly-owned subsidiary XMC's existing 12-inch IC fab in Wuhan, its more than 10 years of memory and specialty IC R&D experience, and international partnerships, YMTC successfully designed and manufactured the first 32-layer 3D NAND flash chip in 2017. With over 3,000 employees and worldwide R&D centers, YMTC is committed to becoming a world leading memory solutions provider through technology innovations.
Sources:
Yangtze Memory, YMTC Introduction video
Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND's Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company's new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.The Xtacking technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, Xtacking will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.
The Xtacking technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.
About Yangtze Memory Technologies Co., Ltd (YMTC):
Founded in 2016 with $24B funding, Yangtze Memory Technologies Co., Ltd. (YMTC) is a memory solutions company headquartered in Wuhan, China. YMTC designs, manufactures and sells memory products and solutions for a broad range of applications including mobile devices, computing, data centers and consumer electronics for customers around the world.
Leveraging its wholly-owned subsidiary XMC's existing 12-inch IC fab in Wuhan, its more than 10 years of memory and specialty IC R&D experience, and international partnerships, YMTC successfully designed and manufactured the first 32-layer 3D NAND flash chip in 2017. With over 3,000 employees and worldwide R&D centers, YMTC is committed to becoming a world leading memory solutions provider through technology innovations.
16 Comments on Yangtze Memory Technologies to Debut New, Ultra-Fast 3D NAND Architecture and Deliver Keynote at Flash Memory Summit 2018
onto the second point. people can be patriotic and when talking about the Chinese government this cant be overlooked. those involved and indoctrinated into a train of thought who also live comfortable lives will almost certainly ignore any other train of thought. its their way or the highway (sometimes the grave).
Good for YMT. I hope they bring real innovation to the market.
Not sure if this is just fantasy propaganda or not, but reaching 20GB/s it will trully be a challenge since PCI Express 3.0x16 lines max speed caps somewhere around 16GB/s, not including the overhead, so are they going to develop a new hyper-speed serial interface??
Your welcome.
Anyway, this technology that we haven't seen yet will reach the enterprise market first (since it will probably be really expensive), where PCIe 4.0 is arriving soon (if it hasn't already), so, if it works as advertised, drives with Xtacking technology could reach 16~20 GBs without collapsing the PCIe bus... Besides, current AMD and Intel CPUs and chipsets for server markets are capable of sustaining that much PCIe bandwidth.
Still, I would withhold judgement until actual products arrive.