Wednesday, December 11th 2019

Intel's Process Roadmap Gets Updated with Plans to go Back to Two Year Cadence

During the IEDM event hosted by the IEEE organization, ASML's CEO, Martin van den Brink, took the stage to elaborate more on ASML's vision of the future of semiconductors. When talking about the future of semiconductors, Mr. Brink started talking about Intel and their vision for the future. Intel's slides were showing many things including backporting of IP to older processes and plan to go back to "tick-tock" two-year cadence to restore the previous confidence in Intel's manufacturing capabilities.

Perhaps one of the most interesting notes about the presentation is the fact that Intel is working hard to realize its plans of bringing back a two-year cadence of "tick-tock" process realization. That means that in the future, presumably after 10 nm debut problems are solved, Intel wants to do the old process and optimization tactics. A slide (shown below) titled "In Moore We Trust" is speaking a lot about Intel's future plans, showing few things in particular: Intel's upcoming 10 nm++ and 10 nm+++ nodes, and the possibility of backporting.
When it comes to 10 nm++ and 10 nm+++ nodes, Intel is displaying that they are already working on improved versions of 10 nm+ node used in Ice Lake chips so that new and improved versions of 10 nm node will be ready for higher frequencies and better performance. The current version of 10 nm+ node is not very capable frequency wise, as there is currently only one Ice Lake SKU that can reach 4 GHz, while current 14 nm products are capable of reaching 5 GHz with ease. These upcoming nodes are supposed to address this problem by providing faster transistors.

Additionally, backporting is now going to node manufacturing, not IP only anymore. So far Intel spoke of backporting as a means to deliver new IP built for 10 nm for example to older process like 14 nm if needed. However, the new slide shows the intention of Intel to apply backporting techniques to a semiconductor process. For example, 7 nm can get backported to 10 nm node in form of 10 nm+++ so that it still officially is 10 nm by Intel's standards, but features overall transistor improvements that were supposed to be released on 7 nm node.

Intel is also developing new nodes that are going to be released as far as ten years from now. Shown above is the 1.4 nm node, scheduled for release in 2029 when it will supposedly be launched. The 1.4 nm node is supposed to have a density of 1.6 billion transistors per square millimeter, which is equivalent to many of the early 14 nm Broadwell CPUs. It is unimaginable to think about such distant technologies now, plus, as the roadmap shows, all the information displayed is subject to change.
Source: WikiChip
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33 Comments on Intel's Process Roadmap Gets Updated with Plans to go Back to Two Year Cadence

#26
Flanker
I'll be happy for Intel to go back to their tick-tock both companies making good progress each year would be nice. I'll believe it when I see it though...
Posted on Reply
#27
Mistral
Well, I'm glad at least the roadmap is back to a two year cadence...
Posted on Reply
#28
semantics
BonesI love it - "Easiest Path Design" when they can't design anything that works with the size nodes shown (Well, except 10nm) but definitely no easy way out of that node going foward!

Backport opportunity is just another escape hatch to find solid ground when their research efforts blow up in their face like it's been as of late.
Optimal cost (Profit) path they're still wishing for shown.
EUV and "New Features", "New Features", "New Features", ....... What new features?
Would be beyond sad to say that in...... 2025 right?

This looks like a thing taken from one of the boardroom meeting slideshow presentations and posted here.
I mean seriously, that's what it looks like.
"new features" does look like someone made a template and couldn't get answers from R&D or who ever they're asking to fill in the blanks. Seems like that's the spot for things like "gate-last" "double-patterning" "finfet" things of that nature.

The whole slide reeks of someone was told to make a slide so a slide was made
Posted on Reply
#29
somethinggeneric
Jokes about Intel's tick tock tock tock tock tock tock+ cadence aside, it's interesting to see how much refinement can be done at the same process level. When we inevitably hit the lowest size we can get with silicon it's good to know we will still see performance increases while new tech is developed.
Posted on Reply
#30
lemonadesoda
Yes, "backporting", aka fix bugs on CPUs allowing users to perform simple CPU swaps on existing or older hardware without needing to upgrade their entire system to a new platform with its own feature set of bugs. Should have been committed to as soon as meltdown hit the industry. Goodwill, trust, brand loyalty, lost through Intels poor policy decisions at the time.
Posted on Reply
#31
Candor
It's amazing to me that a company like Intel could drop the ball so hard. They dropped the ball in a murky lake and their dive teams can't find it. :rolleyes:
Posted on Reply
#33
Bones
semantics"new features" does look like someone made a template and couldn't get answers from R&D or who ever they're asking to fill in the blanks. Seems like that's the spot for things like "gate-last" "double-patterning" "finfet" things of that nature.

The whole slide reeks of someone was told to make a slide so a slide was made
There ya go.
That accounts for one who actually delivered on time and earned their pay.
CandorIt's amazing to me that a company like Intel could drop the ball so hard. They dropped the ball in a murky lake and their dive teams can't find it. :rolleyes:
o_O
:roll:
Gee - You just qualifed for the R&D team.
Namely for being the guy that gets to decide what lake it is so R&D can tell the board "something" is in development whenever asked about it.

I hear that pays well..... For now.
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