Monday, May 31st 2021
ASUS Teases Four Upcoming X570 Motherboards with Fanless Chipset Cooling
ASUS teased what is possibly its final round of Socket AM4 motherboards based on the AMD X570 chipset. The boards are based on the X570 chipset with the latest AGESA update that runs the chipset cooler, so thay can made do with fanless heatsink cooling. The teaser pic reveals at least four models—one based in the coveted ProArt line of creator motherboards; one from the TUF Gaming line of value-ended gaming motherboards; one form the ROG Strix series of premium gaming motherboards; and the last from the ROG Crosshair series of enthusiast/overclocking motherboards.
The motherboard in the bottom-right quadrant isn't the Crosshair VIII Dark Hero, but very likely a next-gen Crosshair Formula product. The bottom-left board could be a successor to the ROG Strix X570-E Gaming. The top-right board could be a TUF Gaming X570 Pro successor; while the top-left could be an all new product based in the ProArt series.
Update May 31st: ASUS clarified in a Facebook post that these motherboards use the same X570 chipset, but take advantage of the latest AGESA firmware that lowers TDP of the chipset just enough for motherboard designers to use fanless heatsinks.
Source:
HXL (Twitter)
The motherboard in the bottom-right quadrant isn't the Crosshair VIII Dark Hero, but very likely a next-gen Crosshair Formula product. The bottom-left board could be a successor to the ROG Strix X570-E Gaming. The top-right board could be a TUF Gaming X570 Pro successor; while the top-left could be an all new product based in the ProArt series.
Update May 31st: ASUS clarified in a Facebook post that these motherboards use the same X570 chipset, but take advantage of the latest AGESA firmware that lowers TDP of the chipset just enough for motherboard designers to use fanless heatsinks.
76 Comments on ASUS Teases Four Upcoming X570 Motherboards with Fanless Chipset Cooling
edit: and theres all those OEM model APUs that might become mainstream later too, despite not being new launches. Zen 3 APUs would shake up the ITX and low end gaming world.
I agree though, more money and design care for X570 could have found room for both M.2 slots and a better/larger passive cooler.
Especially considering that the original X570 chipsets weren't ready in time from the usual chipset maker(s), so they just ripped off the I/O from their EPYCs and repurposed them into usable chipsets, and found that it granted more use out of their binning processes. IIRC, the original chipset maker never did get around to making functional or more competitive X500 chipsets; they just focused on B500 and A500 chipsets instead (which were mostly X400 and B400 chipsets with validated PCIe 4.0 links to the NVMe and 1st x16 slot), leaving AMD's repurposed I/O dies to handle the high-end. If I'm not misremembering as well, it had to do with full PCIe 4.0 stability.
AMD already explained why they've been using 14nm for the I/O dies in the first place; both to fulfill their amended GloFo agreement (alongside old Polaris production), and because I/O never scaled down as efficiently or well as other elements. The I/O die itself has always been the "weakest" part of Ryzen, insofar as power and heat when loaded. It's only recently that AMD seems to have improved it enough for possible 7nm, if the rumors are to go by.
More room for rgb puke
Asus marketing tech lol who cares what they say Mr. Ed and some peanut butter would be as informative
here
the chipset heatsink is located. Is it possible we haven't figured
out that the air flow from those fans alone is greater than what some
built in toy fan can do?
Same with NVMe drives... not only do you have the airflow from the
typical front fans, but often these cases have a side fan ( try and find a case
without one... not that many ) virtually right on top of the position of
the NVMe sockets...
You'd have to go back a bit to older cases with acrylic side panels or old-fashioned covered side panels that have intake/exhaust fan mounting points over the GPU/NVMe area such as the Rosewill Thor V2, or spend a fair bit more on high-end cases that add those back as a special feature, if one doesn't want some sort of open-air case.
The tiny fan is only a small part of the problem, the bigger two are the fact that most will shove high-end mobos into crappy cases, and the rarer but occasional heavy loads put on the chipset and causing it to warm up enough to need the fan for the duration of the loading.
there are quite a lot of very good <$200 B550 motherboard on the market.
We'll just have to be a bit more careful I guess... ;)