In a Samsung Electronics business report released on March 12, it was revealed that the giant electronics manufacturer will begin mass production of new chips through a 4 nm 2.3-generation process. The newly established manufacturing process is set to start by the end of H1 2023, which means that mid-June would be the expected commencement date. Samsung Semiconductor has managed to produce a satisfactory yield of wafers with the new generation chipsets.

Samsung Electronics has experienced significant problems with the production of previous generation 4 nm chips, and industry insiders have been surprised by the sudden announcement of the third generation version, given rumors pointing to the Hwaseong factory struggling to reach yields at the 60% mark. Qualcomm famously dropped Samsung in favor of TSMC as a source of 4 nm chipsets in 2022, due to disappointing yield figures.Samsung Electronics and TSMC are in fierce competition with each other - the main battleground being the manufacture of advanced 4 and 5 nm chipsets. The opening and expansion of factories in North America, look to be part of ambitious expansion plans for both companies. TSMC is earmarked to mass-produce 4 nm chips at its upcoming Phoenix, Arizona plant, with operations starting in 2024. Samsung Electronics is building a 4 nm production line at its foundry plant in Taylor, Texas. The Texas factory is set to begin operations this year, and its additional production line is estimated to start producing 3rd-gen 4 nm chips in the latter half of 2024.Google's upcoming Tensor G3 SoC is rumored to be based on Samsung's third-generation 4 nm process, with further speculation that the G3 could be a spin-off version of the Exynos 2300 chipset. The Pixel 8 series of smartphones, slated to arrive in the latter half of 2023, will debut the Tensor G3 chipset. Samsung's second generation 4 nm process was used as the basis of Google's Tensor G2, which currently powers the Pixel 7 series of smartphones.