Friday, October 18th 2024

Intel Core Ultra "Arrow Lake" Desktop Processor De-lidded

Ahead of its October 23 release, PC enthusiast and Twitch streamer Madness727 released some of the first pictures of a de-lidded Core Ultra "Arrow Lake-S" desktop processor. There's no word on which processor model this is, but it shouldn't matter—all models being released this month are based on the same exact configuration of tiles of the "Arrow Lake-S," which means a Compute tile with an 8P+16E core CPU complex, a Graphics tile with 4 Xe cores, and the larger version of the breakout I/O tile that features an integrated Thunderbolt 4 controller.

Intel already released information on its Core Ultra "Arrow Lake-H" mobile processor that comes out in Q1-2025, which is shown featuring a physically smaller Compute tile that has a 6P+8E core CPU complex, a larger Graphics tile with 8 Xe cores, and a smaller breakout I/O tile. You can see where this is going for some of the cheaper Core Ultra 5 and Core Ultra 3 desktop processor models that release in Q1-2025. De-lidding is the process of removing the integrated heatspreader of a desktop processor to enable direct contact between the chip below, and the cooling solution. It is preferred by professional overclockers that use extreme cooling solutions.
Source: Madness727 (Twitter)
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27 Comments on Intel Core Ultra "Arrow Lake" Desktop Processor De-lidded

#26
AusWolf
N/AP or E wouldn't matter to me. Actually 1 p-core VS low power island of 4 e-cores, 990 pts VS 2660 CPUz, same die area 2.5 X performance.
If you think about it, e-cores are very space-efficient, but not very power-efficient, at least in current (14th) generation. This wouldn't bother me much if 1. we weren't talking about magnitudes greater power consumption and heat production than on any AMD chip, and 2. it didn't require Windows 11, Thread Director, and other software shenanigans to work properly. AMD's mixed-CCD chips (7900X3D and 7950X3D) are a no-go for me for the same reason. KISS (keep it simple, stupid) is the way to go on a desktop PC, imo.
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#27
SL2
AusWolfAt least heat is concentrated around the middle of the package, which leaves you with more surface area to dissipate it.
Apparently not middle enough
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